Modular fmc daughter card

Abstract

The utility model belongs to the field of circuit board, especially relate to a kind of modular FMC daughter card;A kind of modular FMC daughter card, it includes substrate and core module, the substrate is equipped with HPC connector, the edge of the core module is equipped with stamp hole, the substrate is equipped with an opening, along opening edge is equipped with the welding spot corresponding with stamp hole, and the stamp hole of core module is welded and connected with the welding spot on the substrate;The utility model adopts modular design, and core module and substrate are modularized, and core module is connected with substrate through stamp hole, when core module is damaged, only need to replace core module, reduce maintenance cost.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, and specifically relates to a modular FMC daughter card. Background Technology

[0002] Traditional FMC daughter cards mostly use an integrated PCB design, which has the following problems: 1. Difficult to maintain: Hardware upgrades or fault repairs require complete replacement, resulting in high costs; 2. Insufficient flexibility: The interfaces and functional modules are tightly coupled, making it difficult to adapt to diverse needs; 3. Processing risks: Non-professional cutting (such as changing round hole PCBs to stamp holes) can easily damage the circuit board and affect its electrical performance.

[0003] While existing technologies such as the ADS62P49 (250Msps ADC) and AD9122 (1.2Gsps DAC) FMC daughter cards offer excellent performance, they do not solve the modular design problem. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention designs a modular FMC daughter card.

[0005] The technical solution of this utility model is as follows: A modular FMC daughter card includes a base plate and a core module. The base plate is provided with an HPC connector. The edge of the core module is provided with a stamp hole. The base plate is provided with an opening and a solder point corresponding to the stamp hole is provided along the edge of the opening. The stamp hole of the core module is soldered to the solder point on the base plate.

[0006] Furthermore, the spacing between the perforations of the stamps is 1 mm, and the diameter of the perforation is 0.5 mm.

[0007] Furthermore, the core module is equipped with a main chip, as well as a clock management chip and an LDO power module connected to the main chip.

[0008] Furthermore, the substrate is also provided with 6 SMA connectors.

[0009] Furthermore, the substrate is provided with multiple balun circuits corresponding to the SMA connector.

[0010] This utility model has the following beneficial effects: 1. This utility model adopts a modular design, which modularizes the core module and the substrate. The core module and the substrate are connected through the stamp perforation. When the core module is damaged, only the core module needs to be replaced, thus reducing maintenance costs.

[0011] 2. The substrate of this utility model is compatible with different ADC / DAC core modules, supports multi-channel and high sampling configuration, and can be set with different core modules as needed to meet the user's needs, and has good flexible expansion capability. Attached Figure Description

[0012] Figure 1 These are front and back schematic diagrams of the core module of this utility model; Figure 2 These are schematic diagrams of the front and back sides of the substrate of this utility model; Figure 3 This is a schematic diagram of the actual product of this utility model; Figure 4 This is a schematic diagram of the interface of the stamp perforation of this utility model; In the diagram, 1, 2, 3, and 4 are side-mounted SMA connectors; 5 and 8 are through-hole SMA connectors; 6 is an M24C64 EEPROM chip; 7, 13, 14, 15, and 16 are balun circuits; 9 is a TXS0108EPWR level converter chip; 10 is a CVHD-950-100.000 crystal oscillator; 11 is an OT705040MJBA4SL crystal oscillator; 12 is a TXS0108EPWR level converter chip; 17 is an HPC connector; 18 is an AD9694 chip; 19 is an LMK04828 clock chip; 20, 21, 22, and 23 are GM1203 LDO power modules; and 24, 25, and 26 are EZ8603A DC-DC power modules. Detailed Implementation

[0013] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0014] It should be noted that when a component is referred to as being "set on" or "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "fixed to" another component, or "fixedly connected" to another component, the fixing method can be detachable or non-detachable. When a component is considered to be "connected" or "rotatably connected" to another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used are for illustrative purposes only and do not represent the only possible implementation.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0016] In this invention, terms such as "first," "second," and "third" are used not to represent specific quantities or orders, but merely to distinguish names.

[0017] The existing FMC daughter card adopts an integrated PCB design, in which the core module and other structures are designed on a single PCB board, making subsequent upgrades impossible and repairs difficult and costly. Therefore, the structure of the FMC daughter card needs to be redesigned.

[0018] See Figures 1 to 3 As shown, a modular FMC daughter card includes a base plate 40 and a core module 50. The base plate 40 is provided with an HPC connector 17. The edge of the core module 50 is provided with a stamp hole 500. The base plate 40 is provided with an opening 400, and a solder point 401 corresponding to the stamp hole is provided along the edge of the opening 400. The stamp hole of the core module is soldered to the solder point on the base plate.

[0019] This invention improves the structure of the FMC daughter card by integrating the chip mainly used for calculation into a core module and various connectors into a substrate. Stamp holes are provided on the edge of the core module for soldering to the solder points on the substrate, thus connecting the core module and the substrate and enabling signal transmission between them. This invention achieves high-speed signal transmission with impedance controlled at 100Ω±10%. The modular design makes core module replacement possible. On the one hand, when the core module is damaged, only that module needs to be replaced, reducing maintenance costs. On the other hand, the substrate is compatible with different ADC / DAC core modules, facilitating flexible expansion according to user needs. The openings provide space for the circuit design on the back of the control module and also meet the chip's heat dissipation requirements.

[0020] The spacing between the perforations of the stamps is 1mm, the diameter of the perforations is 0.5mm, and the edges of the perforations are smooth and free of burrs to avoid damaging the circuit.

[0021] In one embodiment of this utility model, the core module 50 is provided with a main chip 18, a clock management chip 19 and an LDO power module connected to the main chip. In this embodiment, the main chip is an AD9694 chip, and the clock management chip 19 is an LMK04828 clock chip. Figure 3The numbers 20, 21, 22, and 23 shown are GM1203LDO power modules.

[0022] The substrate is also provided with 6 SMA connectors, in this embodiment Figure 3 Figures 1, 2, 3, and 4 show side-mounted SMA connectors, while figures 5 and 8 show through-hole SMA connectors. The substrate 40 is provided with multiple balun circuits corresponding to the SMA connectors. In this embodiment... Figure 3 The numbers 7, 13, 14, 15, and 16 shown are the corresponding balun circuits, 9 is the TXS0108EPWR level conversion chip, 10 is the CVHD-950-100.000 crystal oscillator, and 11 is the OT705040MJBA4SL crystal oscillator. The substrate is also provided with DC-DC power modules. Specifically, the substrate in this embodiment is provided with 3 EZ8603A DC-DC power modules, with corresponding serial numbers 24, 25, and 26.

[0023] Figure 4 This is a design drawing for a stamp perforation of a utility model. Specifically, the stamp perforation in this embodiment has 130 pins, including digital signals, analog signals, power supply, and GND signals.

[0024] This utility model has the following beneficial effects: 1. This utility model adopts a modular design, which modularizes the core module and the substrate. The core module and the substrate are connected through the stamp perforation. When the core module is damaged, only the core module needs to be replaced, thus reducing maintenance costs.

[0025] 2. The substrate of this utility model is compatible with different ADC / DAC core modules, supports multi-channel and high sampling configuration, and can be set with different core modules as needed to meet the user's needs, and has good flexible expansion capability.

[0026] Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

Claims

1. A modular FMC daughter card, comprising a base plate and a core module, wherein the base plate is provided with an HPC connector, characterized in that: The core module has a stamp hole at its edge, and the substrate has an opening with a welding point corresponding to the stamp hole along the edge of the opening. The stamp hole of the core module is welded to the welding point on the substrate.

2. The modular FMC daughter card according to claim 1, characterized in that: The spacing between the perforations of the stamps is 1 mm, and the diameter of the perforation is 0.5 mm.

3. A modular FMC daughter card according to claim 1, characterized in that: The core module is equipped with a main chip, as well as a clock management chip and an LDO power module connected to the main chip.

4. A modular FMC daughter card according to claim 1, characterized in that: The substrate also has 6 SMA connectors.

5. A modular FMC daughter card according to claim 4, characterized in that: The substrate is provided with multiple balun circuits corresponding to the SMA connector.

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