A wrap-around label suitable for multi-chip
Patent Information
- Application Number
- CN202521870329.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-01
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-01
AI Technical Summary
本实用新型设计一种适用于多芯片的环绕式标签，以主面材为载体，搭载第一电感环、第二电感环、以及两个辐射主体，由第一电感环随主面材的绕设完成关于目标物的安装，并连接于第二电感环和两个辐射主体布局包围下形成的翻贴区，由第一电感环、第二电感环分别配合两辐射主体实现两路射频应用，获得应用下绕设检测与目标物检测的灵活组合，提高目标物绕设安装下的高效射频检测工作，并且多射频芯片搭载设计，以冗余方式保证射频应用的稳定性。
Smart Images
Figure CN224841018U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a wraparound tag suitable for multiple chips, belonging to the field of radio frequency communication technology. Background Technology
[0002] RFID, as a passive IoT identification technology, has been applied in an increasing number of scenarios. In fields such as clothing, logistics, and asset management, RFID technology is adopted due to its unique advantages such as being passive, capable of group reading, and cost-effective. Typically, an RFID antenna binds only one RFID chip to form a tag with radio frequency functionality. Furthermore, if a single chip is damaged, the entire tag becomes invalid, thus limiting the tag's durability and lifespan. In addition, the tag's shape means that it cannot generally be completely wrapped around an item for detection. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a wraparound tag suitable for multiple chips. By wrapping the tag around the target object, wraparound detection and target object detection can be flexibly realized, thereby improving the stability and efficiency of radio frequency applications.
[0004] To solve the above-mentioned technical problems, this utility model adopts the following technical solution: This utility model designs a wraparound label suitable for multiple chips, including a main surface material, a first inductor ring, a second inductor ring, and two radiating bodies affixed to the same surface of the main surface material. The second inductor ring is located in the area between the two radiating bodies, and a chip placement position is provided on the second inductor ring. The second inductor ring communicates with the two radiating bodies. One side of the area enclosed by the second inductor ring, the two radiating bodies, and the first inductor ring is defined as the flip-over area. The first inductor ring is located on the outside of the flip-over area away from the second inductor ring, and at least one chip placement position is provided on the end of the first inductor ring away from the second inductor ring. An radio frequency chip is provided on the chip placement position of the first inductor ring and at least one of the second inductor rings. As the first inductor ring wraps around a local area of the main surface material with respect to the target object, the end of the first inductor ring with the chip placement position is affixed to the flip-over area of the main surface material.
[0005] As a preferred technical solution of this utility model: the two sides of the second inductor ring are directly connected to the two radiating bodies to realize communication, or they are coupled at a distance less than a preset distance threshold to realize electromagnetic signal interaction communication.
[0006] As a preferred technical solution of this utility model: the second inductor ring is located at one of the open positions in the region between the two radiating bodies, and a local area on the second inductor ring is located outside the open position.
[0007] As a preferred technical solution of this utility model: it also includes a cover material, one side of which is connected to the side of the second inductor ring and the two radiating bodies on the main material facing away from the first inductor ring. Based on the local area of the main material where the first inductor ring is located, it is wrapped around the target object. After the end of the chip mounting position on the first inductor ring is attached to the flip-up area of the main material, the cover material is folded over and attached to the second inductor ring and the two radiating bodies.
[0008] As a preferred technical solution of this utility model: a decorative line is provided at the joint between the cover material and the main material.
[0009] As a preferred technical solution of this utility model: the end of the chip mounting position on the first inductor ring is mounted on the flip-up area of the main surface material, and the distance between the end of the chip mounting position on the first inductor ring and the second inductor ring is less than a preset distance threshold.
[0010] As a preferred technical solution of this utility model: the two radiating bodies are respectively arranged in an S-shaped wiring pattern.
[0011] As a preferred technical solution of this utility model: the two radiating bodies are axially symmetrical to each other.
[0012] As a preferred technical solution of this utility model: the outer contour of the main surface material matches the outer contour of the first inductor ring, the second inductor ring, and the overall layout area of the two radiating bodies.
[0013] The wraparound label for multi-chip devices described in this utility model, compared with the prior art, has the following technical advantages: This invention designs a wraparound label suitable for multiple chips. Using a main surface material as a carrier, it incorporates a first inductor ring, a second inductor ring, and two radiating bodies. The first inductor ring completes the installation of the target object by wrapping around the main surface material and connects to the flip-up area formed by the second inductor ring and the two radiating bodies. The first and second inductor rings, in conjunction with the two radiating bodies, enable two-way radio frequency (RF) applications, achieving a flexible combination of wrapping detection and target object detection. This improves the efficiency of RF detection under target object wrapping installation. Furthermore, the multi-RF chip design ensures the stability of RF applications through redundancy. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the unfolding of a wraparound label suitable for multiple chips; Figure 2 This is a schematic diagram of a wraparound tag application suitable for multiple chips; Figure 3 This is a schematic diagram of a wraparound label application suitable for multi-chip devices.
[0015] Among them, 1. Main surface material, 2. First inductor ring, 3. Second inductor ring, 4. Radiation body, 5. Covering surface material, 6. Cutting line, 7. Chip mounting position, 8. Target object. Detailed Implementation
[0016] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.
[0017] This invention designs a wraparound label suitable for multi-chip applications, such as... Figure 1 As shown, the specific design includes a main surface material 1, and a first inductor ring 2, a second inductor ring 3, and two radiating bodies 4 attached to the same surface of the main surface material 1. The second inductor ring 3 is located in the area between the two radiating bodies 4. A chip mounting position 7 is provided on the second inductor ring 3. The second inductor ring 3 communicates with the two radiating bodies 4. The area enclosed by the second inductor ring 3, the two radiating bodies 4, and one side of the area is defined as the flip-up area.
[0018] Regarding the layout design of the second inductor ring 3, in practical applications, such as Figure 1 As shown, the second inductor ring 3 is specifically designed to be located at one of the open openings in the area between the two radiating bodies 4, and a local area on the second inductor ring 3 is located outside the open opening. With this design, the second inductor ring 3, the two radiating bodies 4 and the second inductor ring 3 form a semi-enclosed area, which is the flip-up area.
[0019] Furthermore, regarding the communication between the second inductor ring 3 and the two radiating bodies 4, the specific design adopts two embodiments: one is to design the two sides of the second inductor ring 3 to be directly connected to the two radiating bodies 4 respectively to achieve communication; the other is to design the two sides of the second inductor ring 3 to be coupled to the two radiating bodies 4 with a distance less than a preset distance threshold to achieve electromagnetic signal interaction communication.
[0020] like Figure 1 As shown, the first inductor ring 2 is located on the outer side of the flip-up area, facing away from the second inductor ring 3. At least one chip mounting position 7 is provided on the end of the first inductor ring 2 furthest from the second inductor ring 3. In practical applications, such as... Figure 1 As shown, if the overall outer periphery of the first inductor ring 2 is shaped into a strip-like structure, it will facilitate the subsequent winding of the first inductor ring 2 around the target object 8 along with the local area of the main surface material 1. Furthermore, the strip-like structure of the first inductor ring 2 of appropriate length can be flexibly applied according to the actual situation of the winding position on the target object 8 to complete the winding of the target object 8.
[0021] like Figure 1As shown, an RF chip is disposed on the chip mounting position 7 of at least one of the first inductor rings 2 and the second inductor ring 3; as Figure 2 As shown, with the first inductor ring 2 and a partial area of the main surface material 1 surrounding the target object 8, the end of the chip mounting position 7 on the first inductor ring 2 is attached to the flip-up area of the main surface material 1, and the end of the chip mounting position 7 on the first inductor ring 2 does not contact the second inductor ring 3 or the two radiating bodies 4. This design realizes the combined application of the first inductor ring 2 and the second inductor ring 3 with the two radiating bodies 4 respectively. Furthermore, by combining different RF chip setting schemes, the following embodiments can be implemented.
[0022] In the first embodiment, an RF chip is placed at the chip placement position 7 on the first inductor ring 2, and no RF chip is placed at the chip placement position 7 on the second inductor ring 3. In this case, only the first inductor ring 2 is used in conjunction with the two radiating bodies 4 to detect the winding state of the target object 8, i.e., the continuity detection.
[0023] In the second embodiment, no radio frequency chip is set on the chip mounting position 7 on the first inductor ring 2, but a radio frequency chip is set on the chip mounting position 7 on the second inductor ring 3. In this case, only the second inductor ring 3 is used in conjunction with the two radiating bodies 4 to detect the information of the set target object 8, and to perform the functions of item identification and inventory.
[0024] In Example 3, radio frequency chips are respectively set at chip placement positions 7 on the first inductor ring 2 and chip placement positions 7 on the second inductor ring 3. Then, the first inductor ring 2, together with the two radiating bodies 4, is used to detect the winding status of the target object 8, that is, to detect the continuity. At the same time, the second inductor ring 3, together with the two radiating bodies 4, is used to detect the information of the set target object 8, thus performing the functions of item identification and inventory.
[0025] Furthermore, based on the above embodiments one and three, regarding the at least one chip mounting position 7 designed on the first inductor ring 2, a further embodiment is designed. If multiple different radio frequency chips are designed and connected on the first inductor ring 2, the first inductor ring 2, when used with two radiating bodies 4, will have near-field communication capability. This is because the radio frequency chips connected to the first inductor ring 2 are arbitrary, that is, various UHF RFID chips can be adapted without changing the size of the inductor ring, thus avoiding the trouble of frequently designing and producing antennas.
[0026] In the application of the first inductor ring 2 with two radiating bodies 4, the above design scheme further improves the design by setting the distance between the end of the chip mounting position 7 on the first inductor ring 2 and the second inductor ring 3 to be less than a preset distance threshold. That is, the distance between the two is designed. The smaller the distance between the two, the better the performance of the overall RFID tag.
[0027] Regarding the practical application of the above design for multi-chip wraparound tags, further design considerations include a cover material 5, such as... Figure 1 As shown, one side of the specific cover material 5 is connected to the area of the second inductor ring 3 and the two radiating bodies 4 on the main cover material 1, facing away from the side of the first inductor ring 2. Based on the first inductor ring 2, a local area of the main cover material 1 is wrapped around the target object 8, and the end of the chip mounting position 7 on the first inductor ring 2 is attached to the flip-up area of the main cover material 1, as shown. Figure 3 As shown, the cover material 5 is folded over and glued to the entire area of the second inductor ring 3 and the two radiating bodies 4. That is, the cover material 5 provides a covering protection for the second inductor ring 3, the two radiating bodies 4, and the ends of the chip mounting positions 7 on the first inductor ring 2.
[0028] Furthermore, regarding the design and application of the cover material 5, the connection point between the cover material 5 and the main material 1 is designed with a perforated line 6. This facilitates the folding action of the cover material 5 and makes it easy to tear the cover material 5. During the tearing process, the cover material 5 tears the second inductor ring 3, the two radiating bodies 4, and a portion of the end of the first inductor ring 2 that are attached to it. This achieves the tear detection of the designed RFID tag, and this tearing process is irreversible, ensuring the accuracy of the tear detection design.
[0029] In practical applications, such as Figure 1 As shown, the two radiating bodies 4 are further designed with S-shaped wiring, which effectively extends the length of the wiring in the radiating bodies 4, and the two radiating bodies 4 are designed to be axially symmetrical to each other; in terms of the overall appearance of the RFID tag, the outer contour of the main surface material 1 can be designed to match the outer contour of the first inductor ring 2, the second inductor ring 3, and the overall layout area of the two radiating bodies 4; and in practical applications, in order to ensure that the tag has good performance, the self-resonant frequency of the radiating body 4 is required to be within the required operating frequency range. Taking the UHF RFID band as an example, the self-resonant frequency range of the radiating body 4 is designed to be 860MHz to 960MHz.
[0030] Furthermore, in the actual use of the target object, in order to facilitate the destruction of the first inductor ring 2 surrounding the target object, the materials of the main surface material 1 and the first inductor ring 2 can be set to be fragile, such as paper substrate.
[0031] In practical applications, for example, each of the first inductor ring 2 and the second inductor ring 3 is equipped with an RF chip. First, it is necessary to identify the unique identification information of the two RF chips. Then, when the first inductor ring 2 is damaged, the RF chip on the first inductor ring 2 will fail because it cannot obtain electromagnetic energy. At this time, only the unique identification information of the RF chip on the second inductor ring 3 can be identified, and it can be known that the first inductor ring 2 has been damaged. At this time, an inventory of all target objects can be carried out to determine the total number of current items and the number of damaged items.
[0032] The above-mentioned technical solution is designed for a multi-chip wraparound label. Using a main surface material 1 as a carrier, it carries a first inductor ring 2, a second inductor ring 3, and two radiating bodies 4. The first inductor ring 2 completes the installation of the target object 8 by wrapping around the main surface material 1, and is connected to the flip-up area formed by the layout of the second inductor ring 3 and the two radiating bodies 4. The first inductor ring 2 and the second inductor ring 3, in conjunction with the two radiating bodies 4, realize two-way radio frequency applications, achieving a flexible combination of wrapping detection and target object 8 detection under application conditions. This improves the efficiency of radio frequency detection under the wrapping installation of the target object 8. Furthermore, the multi-RF chip mounting design ensures the stability of the radio frequency application in a redundant manner.
[0033] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.
Claims
1. A wraparound label suitable for multi-chip applications, characterized in that: Includes a main surface material (1), and a first inductor ring (2), a second inductor ring (3), and two radiating bodies (4) attached to the same surface of the main surface material (1). The second inductor ring (3) is located in the area between the two radiating bodies (4). A chip mounting position (7) is provided on the second inductor ring (3). The second inductor ring (3) communicates with the two radiating bodies (4). The area enclosed by the second inductor ring (3) and the two radiating bodies (4) is defined as the flip-up area. The first inductor ring (2) 2) Located on the outside of the flip-up area facing away from the second inductor ring (3), at least one chip mounting position (7) is provided on the end of the first inductor ring (2) away from the second inductor ring (3); radio frequency chips are provided on the chip mounting position (7) of the first inductor ring (2) and at least one inductor ring (3); as the main surface material (1) of the first inductor ring (2) is wrapped around the target object (8), the end of the chip mounting position (7) on the first inductor ring (2) is attached to the flip-up area of the main surface material (1).
2. The wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: The two sides of the second inductor ring (3) are directly connected to the two radiating bodies (4) to realize communication, or are coupled with a distance less than the preset distance threshold to realize electromagnetic signal interaction communication.
3. The wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: The second inductor ring (3) is located at one of the open positions in the region between the two radiating bodies (4), and a local area on the second inductor ring (3) is located outside the open position.
4. The wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: It also includes a cover material (5), one side of which is connected to the side of the second inductor ring (3) and the two radiating bodies (4) on the main material (1) facing away from the side of the first inductor ring (2). Based on the local area of the main material (1) on the first inductor ring (2) surrounding the target object (8), and the end of the chip mounting position (7) on the first inductor ring (2) is attached to the flip-up area of the main material (1), and the cover material (5) is folded over and attached to the entire area of the second inductor ring (3) and the two radiating bodies (4).
5. A wraparound tag suitable for multi-chip applications according to claim 4, characterized in that: A decorative line (6) is provided at the joint between the cover material (5) and the main material (1).
6. The wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: Based on the chip mounting position (7) on the first inductor ring (2) being mounted on the flip-up area of the main surface material (1), the distance between the chip mounting position (7) on the first inductor ring (2) and the second inductor ring (3) is less than a preset distance threshold.
7. A wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: The two radiating bodies (4) are arranged in an S-shape.
8. A wraparound tag suitable for multi-chip applications according to claim 1 or 5, characterized in that: The two radiating bodies (4) are axially symmetrical to each other.
9. A wraparound tag suitable for multi-chip applications according to claim 1, characterized in that: The outer contour of the main surface material (1) matches the outer contour of the overall layout area of the first inductor ring (2), the second inductor ring (3), and the two radiating bodies (4).