A washable RFID tag

Abstract

The utility model discloses a kind of water-washing-resistant RFID labels, comprising: label substrate;Chip is arranged on the upper surface of label substrate;Inductance ring is arranged on the upper surface of label substrate and is connected with chip;Radiating antenna is arranged on the upper surface of label substrate and is located in inductance ring connection;And the upper surface material layer, lower surface material layer for sealing package to label substrate, chip, inductance ring and radiating antenna are located in the upper and lower surfaces of label substrate;Upper stable protection body for protecting chip is arranged on the upper surface of label substrate and located in the outer circumferential side of chip;Lower stable protection body is arranged on the lower surface of label substrate and located below upper stable protection body.The utility model provides sufficient support force to chip area in washing process by upper and lower stable protection body, so that chip will not be damaged in washing process due to extrusion, bending and other factors, and then ensure that the whole RFID label performance is good.

Description

Technical Field

[0001] This utility model relates to the field of tag technology, and in particular to a water-resistant RFID tag. Background Technology

[0002] RFID, as a passive Internet of Things (IoT) identification technology, has been applied in an increasing number of scenarios. Currently, RFID tags are being used more and more in woven labels and care labels for items such as clothing, sheets, and duvet covers, thus placing increasing demands on the number of times the tags can be washed under different washing conditions.

[0003] Conventional washable labels are formed by dripping black glue onto a small PCB label to create a near-field sensing module. The sensing module is then placed on a radiating antenna made of a rigid conductor (such as iron wire). The two work together to form an RFID tag with communication capabilities through electromagnetic induction. Finally, the label is sewn together with the face material to form a complete RFID washable label.

[0004] The washable labels produced by this method are relatively hard, with a thick black adhesive layer in the middle, which cannot meet the requirements for flexibility and non-stickiness in many scenarios. In addition, since the label transmits signals through electromagnetic induction, it has a problem with low sensitivity.

[0005] Therefore, through beneficial exploration and research, the applicant has found a solution to the above problems, and the technical solution to be introduced below is the result of this research. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a water-resistant RFID tag that meets the washing requirements without reducing the performance of the RFID tag, thus addressing the shortcomings of the existing technology.

[0007] The technical problem to be solved by this utility model can be achieved by the following technical solution:

[0008] A water-resistant RFID tag, comprising:

[0009] Label substrate;

[0010] A chip disposed on the upper surface of the label substrate;

[0011] An inductor ring disposed on the upper surface of the label substrate and connected to the chip;

[0012] A radiating antenna disposed on the upper surface of the label substrate and connected to the inductor ring; and

[0013] The upper and lower material layers located on the upper and lower surfaces of the label substrate are used to seal and wrap the label substrate, chip, inductor ring and radiating antenna.

[0014] An upper stabilizing protective body for protecting the chip is provided on the upper surface of the label substrate, located on the outer periphery of the chip;

[0015] A lower stabilizing protector is disposed on the lower surface of the label substrate, below the upper stabilizing protector.

[0016] In a preferred embodiment of this utility model, the upper stabilizing protective body is a stabilizing ring with a certain thickness and hardness, and the gap between the stabilizing ring and the chip is filled with curing adhesive.

[0017] In a preferred embodiment of this invention, the thickness of the stabilizing ring is greater than the thickness of the chip.

[0018] In a preferred embodiment of this invention, the stabilizing ring is made of a non-conductive material.

[0019] In a preferred embodiment of the present invention, the upper stabilizing protector is a stabilizing sheet with a certain thickness and hardness, and a chip receiving groove is formed on the lower surface of the stabilizing sheet at the chip position, and the chip is located in the chip receiving groove.

[0020] In a preferred embodiment of this invention, the depth of the chip receiving groove is greater than the thickness of the chip.

[0021] In a preferred embodiment of this invention, the stabilizing sheet is made of a non-conductive material.

[0022] In a preferred embodiment of this utility model, the lower stabilizing protective body is a stabilizing sheet with a certain thickness and hardness.

[0023] In a preferred embodiment of this utility model, an upper double-sided adhesive layer is provided on the lower surface of the upper material layer, and a lower double-sided adhesive layer is provided on the upper surface of the lower material layer. The periphery between the upper material layer and the lower material layer is sealed by the upper and lower double-sided adhesive layers.

[0024] In a preferred embodiment of this utility model, the upper material layer and the lower material layer are made of waterproof material.

[0025] Due to the adoption of the above technical solution, the beneficial effects of this utility model are as follows: By setting upper and lower stabilizing protective bodies on the upper and lower surfaces of the tag substrate at the chip position, the upper and lower stabilizing protective bodies provide sufficient support to the chip area during the washing process, so that the chip will not be damaged by factors such as squeezing or bending during the washing process, thereby ensuring the good performance of the entire RFID tag. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a plan view of the present invention.

[0028] Figure 2 This is a longitudinal sectional view of the present invention.

[0029] Figure 3 This is a schematic diagram of another embodiment of the upper stabilizing protective body of this utility model. Detailed Implementation

[0030] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below with reference to specific illustrations.

[0031] See Figure 1 and Figure 2 The figure shows a water-resistant RFID tag, including a tag substrate 100, a chip 200, an inductor ring 300, a radiating antenna 400, an upper stabilizing protector 500a, a lower stabilizing protector 500b, an upper material layer 600a, and a lower material layer 600b.

[0032] A chip 200 is disposed on the upper surface of the label substrate 100. An inductor ring 300 is disposed on the upper surface of the label substrate 100 and connected to the chip 200. A radiating antenna 400 is disposed on the upper surface of the label substrate 100 and connected to the inductor ring 300. Compared with electromagnetic induction-based water washing, the water-washable label composed of the label substrate 100, chip 200, inductor ring 300, and radiating antenna 400 has a performance advantage because the chip 200 directly transmits signals to the antenna, and can cope with more application scenarios.

[0033] An upper stabilizing protective body 500a is disposed on the upper surface of the label substrate 100 and located on the outer periphery of the chip 200 to protect the chip 200. In this embodiment, the upper stabilizing protective body 500a is a stabilizing ring with a certain thickness and hardness, in which the chip 200 is placed. The gap between the stabilizing ring and the chip 200 is filled with curing adhesive 510a. The thickness of the stabilizing ring is greater than the thickness of the chip 200, so that the injected curing adhesive 510a can completely cover the chip 200 and does not flow to the outside of the stabilizing ring. The curing adhesive 510a is characterized by being able to transform from liquid to solid under physical or chemical action, and this transformation is irreversible, such as UV adhesive. The stabilizing ring is made of a non-conductive material and has a certain degree of hardness and deformation recovery ability, which protects the connection of the chip 200 firmly when the label is subjected to compression and bending during washing.

[0034] See Figure 3 The figure shows another embodiment of the upper stabilizing protector 500a'. The upper stabilizing protector 500a' is a stabilizing sheet with a certain thickness and hardness. A chip receiving groove 510a' is formed on the lower surface of the stabilizing sheet at the location of the chip 200, and the chip 200 is located within the chip receiving groove 510a'. The depth of the chip receiving groove 510a' is greater than the thickness of the chip 200. The stabilizing sheet is made of a non-conductive material. In this embodiment, the upper stabilizing protector 500a' does not require the use of curing adhesive; the stabilizing sheet protects the chip 200 and its surrounding area.

[0035] The lower stabilizing protector 500b is located on the lower surface of the label substrate 100 and below the upper stabilizing protector 500a, and can cover the chip 200 and its surrounding area. The lower stabilizing protector 500b is a stabilizing sheet with a certain thickness and hardness, and it can be made of non-conductive or conductive materials.

[0036] The top material layer 600a and the bottom material layer 600b are located on the upper and lower surfaces of the label substrate 100, respectively. Specifically, an upper double-sided adhesive layer 610a is disposed on the lower surface of the top material layer 600a, and a lower double-sided adhesive layer 610b is disposed on the upper surface of the bottom material layer 600b. The periphery between the top material layer 600a and the bottom material layer 600b is sealed by the upper double-sided adhesive layer 610a and the lower double-sided adhesive layer 610b, so that the top material layer 600a and the bottom material layer 600b seal and wrap the label substrate 100, the chip 200, the inductor ring 300, the radiating antenna 400, and the upper stabilizing protective body 500a and the lower stabilizing protective body 500b. The top material layer 600a and the bottom material layer 600b are made of waterproof material. The upper double-sided adhesive layer 610a and the lower double-sided adhesive layer 610b have strong adhesive force, which can prevent moisture from penetrating into the label.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A water-resistant RFID tag, comprising: Label substrate; A chip disposed on the upper surface of the label substrate; An inductor ring disposed on the upper surface of the label substrate and connected to the chip; A radiating antenna is disposed on the upper surface of the label substrate and located at the inductor ring. as well as The upper and lower material layers located on the upper and lower surfaces of the label substrate for sealing and wrapping the label substrate, chip, inductor ring, and radiating antenna; characterized in that, An upper stabilizing protective body for protecting the chip is provided on the upper surface of the label substrate, located on the outer periphery of the chip; A lower stabilizing protector is disposed on the lower surface of the label substrate, below the upper stabilizing protector.

2. The water-resistant RFID tag as described in claim 1, characterized in that, The upper stabilizing protective body is a stabilizing ring with a certain thickness and hardness, and the gap between the stabilizing ring and the chip is filled with curing adhesive.

3. The water-resistant RFID tag as described in claim 2, characterized in that, The thickness of the stabilizing ring is greater than the thickness of the chip.

4. The water-resistant RFID tag as described in claim 2, characterized in that, The stabilizing ring is made of a non-conductive material.

5. The water-resistant RFID tag as described in claim 1, characterized in that, The upper stabilizing protector is a stabilizing plate with a certain thickness and hardness. A chip receiving groove is formed on the lower surface of the stabilizing plate at the chip location, and the chip is located in the chip receiving groove.

6. The water-resistant RFID tag as described in claim 5, characterized in that, The depth of the chip accommodating groove is greater than the thickness of the chip.

7. The water-resistant RFID tag as described in claim 5, characterized in that, The stabilizer is made of a non-conductive material.

8. The water-resistant RFID tag as described in claim 1, characterized in that, The lower stabilizing protector is a stabilizing sheet with a certain thickness and hardness.

9. The water-resistant RFID tag as described in any one of claims 1 to 8, characterized in that, An upper double-sided adhesive layer is provided on the lower surface of the upper material layer, and a lower double-sided adhesive layer is provided on the upper surface of the lower material layer. The periphery between the upper material layer and the lower material layer is sealed by the upper double-sided adhesive layer and the lower double-sided adhesive layer.

10. The water-resistant RFID tag as described in claim 9, characterized in that, The upper and lower material layers are made of waterproof materials.

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