Rfid tag and product for preventing reuse of chip

Abstract

The utility model provides a kind of RFID label and commodity for preventing chip reuse, comprising: antenna, insulating layer, binding glue and chip;Antenna includes binding point and circuit, and electric connection between binding point and circuit;Insulating layer is randomly distributed on binding point;Chip has functional pin, one or more detection pins.Functional pin is electrically connected with binding point;The insulating layer is connected to the side of the chip bound to the binding point, and the other side is connected with the chip.The circuit state of the detection pin of the utility model is completely random, and is not affected by organic solvent, which greatly reduces the probability of chip reuse.

Description

Technical Field

[0001] This utility model relates to the field of anti-counterfeiting technology, specifically to an RFID tag and product that prevents the reuse of chips. Background Technology

[0002] In the application of RFID (Radio Frequency Identification) technology in anti-counterfeiting and traceability, preventing chip reuse is one of the key challenges. Traditional RFID tag chip structures have inherent design flaws. For example, counterfeiters can remove the chip from the original tag by peeling off the antenna and cleaning the conductive adhesive, then reattach it to a new antenna, resulting in chip reuse. As the carrier of data and encryption, reuse significantly weakens the anti-counterfeiting effectiveness of RFID tags. For instance, in high-end products like alcohol, the small size and high pressure resistance of the chip mean that even if the bottle cap is opened and the antenna is damaged, the chip can still be recycled and reused. Furthermore, some chips with opening detection functions cannot detect whether the tag has been opened once reused.

[0003] Existing technologies have proposed solutions to chip reuse. For example, patent document CN111178480A discloses an RFID tag and method to prevent chip reuse. This method involves adding status contacts with an insulating layer to the chip. This insulating layer can be washed away with an organic solvent. After the chip is re-bonded, the connection state of the status contacts changes, causing the chip to stop working properly. Although this solution emphasizes that the insulating layer is a solvent-soluble resin, currently no single resin can guarantee dissolution in all solvent systems. Counterfeiters can retain the insulating layer while cleaning the conductive adhesive by selecting suitable organic solvents. Once a suitable organic solvent system is found, counterfeiters can clean chips in large quantities and reuse them. Therefore, this method still carries the risk of chip reuse. Furthermore, adding an insulating layer to the chip contacts requires high processing precision and is costly. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of this utility model is to provide an RFID tag and product that prevents the reuse of chips.

[0005] An RFID tag for preventing chip reuse according to the present invention includes: an antenna, an insulating layer, a bonding adhesive, and a chip.

[0006] The antenna includes a bonding point and a circuit, and the bonding point and the circuit are electrically connected.

[0007] The insulating layer is randomly distributed at the bonding points.

[0008] The insulating layer is a single coating, multiple coatings that are partially or completely connected together, or multiple coatings that are not connected to each other.

[0009] The thickness of the insulating layer is less than or equal to 20 μm.

[0010] The chip has functional pins and one or more detection pins. The number of functional pins is two or more.

[0011] The vertical projection of the detection pin at least partially coincides with the vertical projection of the bonding point.

[0012] The functional pin is electrically connected to the binding point.

[0013] The bonding adhesive is an anisotropic conductive adhesive.

[0014] The insulating layer is connected to the bonding point on one side of the chip. The bonding adhesive is connected to the bonding point and the insulating layer on one side, and to the chip on the other side.

[0015] The functional pin and the bonding point are electrically connected via the bonding adhesive.

[0016] The insulating layer is made of UV-type ink or non-conductive solvent-based ink.

[0017] According to the present invention, a product includes the aforementioned RFID tag for preventing chip reuse, the RFID tag for preventing chip reuse being attached to the product or the product's packaging.

[0018] Compared with the prior art, the present invention has the following beneficial effects: The circuit state of the pins in this invention is completely random and unaffected by organic solvents, which greatly reduces the probability of the chip being reused. Furthermore, through mathematical probability calculation, the probability P of being reused can be calculated using the formula: when there are n detection pins, P = (1 / 2). n When there are 6 detection pins, P = (1 / 2) 6 =1 / 64; the more detection pins, the lower the probability of chip reusability. For example, when there are 10 detection pins, the reusability probability is 1 / 1024 ≈ 0.0977%. This ensures the chip's single-use capability, preventing large-scale reuse. It perfectly solves the problem of counterfeiters using organic solvents to clean chips on a large scale and reuse them in large quantities. Furthermore, the insulating layer of this invention is processed on the antenna using inkjet printing, offering advantages such as mass production, high efficiency, and low cost. Attached Figure Description

[0019] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 A perspective view of an RFID tag; Figure 2 A cross-sectional view of an RFID tag; Figure 3 This is a schematic diagram for fabricating an insulating layer. Detailed Implementation

[0020] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0021] Example 1 like Figure 1 and Figure 2 As shown, an RFID tag for preventing chip reuse includes: an antenna, an insulating layer 1, adhesive 2, and a chip 3. The antenna includes a bonding point 4 and a circuit, with the bonding point 4 and the circuit electrically connected. The bonding point 4 is the filling point of the chip 3, the location where the chip 3 is electrically connected to the RFID tag. The chip 3 has two or more functional pins 31 and one or more detection pins 32. The functional pins 31 are electrically connected to the bonding point 4 and are the pins that enable the RFID tag to function normally after being electrically connected to the antenna. The detection pins 32 serve as pins to provide circuit status detection and judgment for the chip 3. The chip 3 and the bonding point 4 are connected and conductive through the adhesive 2. The adhesive 2 is anisotropic conductive adhesive, achieving conductivity in the vertical direction and insulation in the horizontal direction, while also providing adhesion and fixation.

[0022] Insulating layer 1 is randomly distributed on bonding point 4. Insulating layer 1 is a single coating, multiple coatings partially or completely connected together, or multiple unconnected coatings. It is a material that blocks the current conduction path between any one or more detection pins 32 and bonding point 4. Figure 1 As shown, there are four detection pins 32. The insulating layer 1 is divided into two parts, left and right. The left part blocks the current conduction path of one detection pin 32, and the right part blocks the current conduction path of another detection pin 32. If the four detection pins 32 are numbered, the chip 3 can obtain a signal representing the circuit state of the four detection pins 32. The RFID tag can read and store the initial circuit state signal when it leaves the factory. As long as the chip 3 detects a change in the circuit state of the detection pins 32 later, it can determine that the chip 3 has been transferred and reused.

[0023] In this embodiment, the circuit state can be obtained by detecting the circuit state between any two detection pins, or by detecting the circuit state between a functional pin and a detection pin. The circuit state can be capacitance and / or resistance and / or inductance and / or voltage and / or current between two points, etc.

[0024] The insulating layer 1 can be any shape, such as circular or square. In order to avoid the distribution location being known due to residues of the insulating layer 1 during cleaning, the thickness of the insulating layer 1 is set to be less than or equal to 20 μm in this embodiment.

[0025] like Figure 2 As shown, in this embodiment, the insulating layer 1 is connected to the bonding point 4 on one side of the chip 3. The bonding adhesive 2 is connected to the bonding point 4 or the insulating layer 1 on one side, and to the chip 3 on the other side. This facilitates the fabrication of the insulating layer 1. In other embodiments, the insulating layer 1 can also be fabricated on the other side of the bonding adhesive 2, i.e., directly on the detection pin 32 of the chip. The functional pin 31 is directly electrically connected to the bonding point 4 via the bonding adhesive 2.

[0026] In this embodiment, the vertical projection of the detection pin 32 at least partially coincides with the vertical projection of the bonding point 4. That is, at least one detection pin 32 must be able to connect with the bonding point 4 through the bonding adhesive 2 or change the circuit state through the insulating layer 1 (in this embodiment, the circuit is broken through the insulating layer, thereby changing the current, voltage, and other states between the two). The remaining detection pins 32 located outside the vertical projection of the bonding point 4 cannot connect with the bonding point 4 regardless of whether the insulating layer 1 is blocking them, thus constituting a "misleading" situation. As long as these detection pins 32 subsequently show changes in circuit state (such as changes in on / off state, changes in current value, etc.), it can be determined that the chip 3 has been transferred for reuse.

[0027] Example 2 An anti-counterfeiting method employs the aforementioned RFID tag designed to prevent chip reuse. When the chip is bound to a binding point, due to the presence of a random insulating layer at the binding point, there is a random circuit state between the chip's detection pins and functional pins or detection pins.

[0028] When this RFID tag is first identified using an RFID identification device, the chip will detect the circuit status between each pin and store the current pin circuit status in the chip.

[0029] Each time the RFID tag is first identified by an RFID identification device, the chip will detect the circuit status between each pin and compare it with the initial status stored inside the chip. If they match, the chip will work normally. If they do not match, the chip will permanently mark the chip as abnormal and issue an instruction prompt or terminate the chip function.

[0030] Once the chip is removed from the original antenna and reattached, when the RFID tag is identified again by an RFID identification device, the chip will detect the circuit state between each pin and compare it with the initial recorded state. If any set of circuit states changes, the chip's logic circuit determines that the chip has been transferred, and the transfer record is permanently stored in the chip and cannot be modified. At the same time, the chip will display an error or terminate its function.

[0031] Therefore, even if the state of each pin circuit is the same as the first time after several rebindings, the chip still determines that it has been transferred because the transferred state is recorded in the chip.

[0032] For example, a chip has detection pins A and B. Upon initial identification after bonding, the chip automatically detects the circuit state between pin A and the functional pin (e.g., a closed circuit), the circuit state between pin A and pin B (e.g., an open circuit), and the circuit state between pin B and the functional pin (e.g., an open circuit). The detection results are recorded internally. When the chip is cleaned and rebonded, it performs the detection again, checking if the circuit state between pin A and the functional pin has changed (e.g., an open circuit), the circuit state between pin B and the functional pin has changed (e.g., a closed circuit), and the circuit state between pin A and pin B has changed (e.g., an open circuit). If the internal comparison with the initial detection results is inconsistent, the chip is determined to have been moved, and the transfer record is permanently stored in the chip. Simultaneously, when using a device to read the chip, it can display a chip malfunction or terminate the chip's function.

[0033] Example 3 A method for manufacturing an RFID tag to prevent chip reuse, comprising: 1. Preparation of insulating layer On the bonding points of antennas produced using existing standard processes, an insulating layer is printed using non-conductive UV or solvent-based inks via digital inkjet printing. Inkjet printing offers advantages such as mass production capability, high efficiency, and low cost.

[0034] like Figure 3 As shown, the ink droplet ejection outlet 51 of the digital inkjet printing equipment 5 can be controlled to randomly eject ink droplets 52 from different outlets. At the same time, the ink droplets 52 are affected by environmental factors such as air disturbance and static electricity during their fall, causing their landing points to be random. The combination of these two factors results in the random distribution of the insulating layer on the bonding point 4.

[0035] 2. Curing the insulation layer The ink printed on the bonding point 4 can be cured by UV curing or thermal curing to form an insulating layer, the specific curing method being determined by the material of the insulating layer. Each ink droplet constitutes a small insulating layer, and when multiple ink droplets connect together, they form a large insulating layer composed of multiple small insulating layers. Therefore, the insulating layer of this invention can be a single coating, multiple coatings partially or completely connected together, or multiple unconnected coatings.

[0036] UV curing is a method of curing materials in a very short time by using ultraviolet light.

[0037] The thermosetting process is a curing method that involves heating the material to cause a cross-linking reaction or solvent evaporation, resulting in the precipitation and drying of the dissolved resin.

[0038] 3. Packaged chips The chip is bonded to the antenna, whose insulation layer has been cured, using normal processes.

[0039] Example 4 This invention can be applied to any product, whereby the aforementioned RFID tag that prevents chip reuse is attached to the product or its packaging to achieve anti-counterfeiting functionality.

[0040] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] The specific embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the substantive content of this utility model. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An RFID tag for preventing chip reuse, characterized in that, include: Antenna, insulating layer (1), bonding adhesive (2) and chip (3); The antenna includes a bonding point (4) and a circuit, and the bonding point (4) and the circuit are electrically connected; The insulating layer (1) is randomly distributed on the bonding point (4); The chip (3) has functional pins (31) and one or more detection pins (32); The functional pin (31) is electrically connected to the binding point (4); The insulating layer (1) is connected to the bonding point (4) on one side of the chip (3). The bonding adhesive (2) is connected to the bonding point (4) and the insulating layer (1) on one side, and to the chip (3) on the other side.

2. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The insulating layer (1) is a single coating, multiple coatings that are partially or completely connected together, or multiple coatings that are not connected to each other.

3. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The vertical projection of the detection pin (32) at least partially coincides with the vertical projection of the binding point (4).

4. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The thickness of the insulating layer (1) is less than or equal to 20 μm.

5. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The number of the functional pins (31) is two or more.

6. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The functional pin (31) and the bonding point (4) are electrically connected by the bonding adhesive (2).

7. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The bonding adhesive (2) is an anisotropic conductive adhesive.

8. The RFID tag for preventing chip reuse according to claim 1, characterized in that, The insulating layer (1) is made of UV-type ink or non-conductive solvent-based ink.

9. A commodity, characterized in that, The RFID tag for preventing chip reuse as described in any one of claims 1-8 is attached to the product or its packaging.

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