Tool-free quick disassembly and assembly type M.2 solid state disk heat sink structure

Abstract

The utility model discloses a kind of tool-free quick disassembly and assembly type M.2 solid state disk radiator structure, comprising: radiator waistcoat, PCB, knob fixing part, positioning assembly, fixed seat and M.2 metal seat;One end of the radiator waistcoat is clamped on the fixed seat, the other end of the radiator waistcoat away from the fixed seat is fixedly connected with the positioning assembly, the radiator waistcoat cover is just above PCB, and the upper end of the PCB is provided with multiple M.2 solid state disks;One end of the PCB is clamped on the M.2 metal seat, and the other end of the PCB away from the M.2 metal seat is rotatably connected with the knob fixing part, and the knob fixing part is clamped with the positioning assembly.The utility model fixes the both ends of PCB by knob fixing part and M.2 metal seat respectively, the fixing mode of knob fixing part and PCB and the fixing mode of knob fixing part and positioning assembly are both clamped, so that quick disassembly and assembly can be realized without tool, and it is convenient and fast to operate.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a tool-free, quick-release M.2 solid-state drive heat sink structure. Background Technology

[0002] M.2 solid-state drives (SSDs) are crucial components of PCs; without them, PCs cannot boot. Considering the impact of vibrations during transport and use, the way M.2 SSDs and their heatsinks are secured is critical to performance and lifespan. Although M.2 SSDs have no mechanical parts, an unsecured interface can easily loosen or detach during computer movement, vibration, or impacts, leading to poor contact or even interface damage. A robust mounting design (such as screwless clips or screw tightening) ensures a tight fit between the heatsink and the drive, preventing poor contact and reduced heat dissipation efficiency. High-speed NVMe SSDs can reach controller chip temperatures exceeding 70°C; a loose or improperly installed heatsink may overheat, triggering speed reduction or even damaging the flash memory chips. Furthermore, a well-designed cooling structure can quickly dissipate heat, achieving a temperature difference of up to 20°C compared to a bare drive, effectively maintaining stable transfer speeds. In summary, a scientific mounting and cooling solution is a core element for ensuring the continuous and efficient operation of M.2 devices in data-intensive applications.

[0003] The mounting method for M.2 SSDs needs to consider not only the mounting of the M.2 SSD PCB, but also the mounting method of its heatsink. In order to achieve the desired heat dissipation effect, on the one hand, the heatsinks are made of large metal, which makes them very heavy; on the other hand, the M.2 SSD and the heatsink are attached together by thermal pads, and the fit is quite tight. Therefore, when the heatsink becomes loose, it will accelerate the wear and tear on the M.2 SSD and the interface terminals, and in some cases, it may even fall out. M.2 SSD mounting methods on the market include non-removable mounting and screw mounting. Non-removable mounting is mainly divided into knob-type and pull-ring type; screw mounting is mainly divided into separate type and pre-installed type. Knob type uses a plastic rotating clip; after inserting the M.2 SSD, rotating the knob secures it. Pull-ring type uses a plastic pull ring that works with the mounting hole; the pull ring is manually inserted into the hole at the end of the hard drive to complete the fixation, suitable for scenarios without a screwdriver. The disadvantage of existing non-removable mounting methods is that the reliability and strength are not high. With the intensity of vibration and long-term aging, they will gradually fail, causing them to lose their grip on the PCB. In addition, the added weight of the metal heatsink makes it difficult to secure with this design alone. Separate type requires first installing the standoffs into the corresponding holes on the motherboard according to the length of the hard drive (such as 2280, 2260, etc.), and then fixing the hard drive with screws. Pre-installed type has some motherboards with pre-installed standoffs; simply insert the hard drive and fix it with screws. The disadvantage of screw mounting is that it requires tools and cannot be done by hand; it is difficult to disassemble and assemble without a screwdriver. For reliability reasons, M.2 SSD heatsinks are generally secured with screws; some also use a quick-release mounting system with an added base plate that encases the M.2 SSD between itself and the heatsink body. However, due to the weight of the heatsink, it fails in drop tests. Currently, M.2 SSD heatsinks also suffer from inconvenient installation and removal.

[0004] Therefore, there is an urgent need for a tool-free, quick-release M.2 solid-state drive heatsink structure. Utility Model Content

[0005] In view of the above problems, this utility model is proposed to provide a tool-free, quick-release M.2 solid-state drive heatsink structure that overcomes or at least partially solves the above problems.

[0006] This utility model provides a tool-free, quick-release M.2 solid-state drive (SSD) heatsink structure. The tool-free, quick-release M.2 SSD heatsink structure includes: a heatsink heatsink, a PCB, a knob fixing component, a positioning component, a mounting base, and an M.2 metal mount. One end of the heatsink heatsink is snapped onto the mounting base, and the other end of the heatsink heatsink, away from the mounting base, is fixedly connected to the positioning component. The heatsink heatsink covers the top of the PCB, and multiple M.2 SSDs are mounted on the upper part of the PCB. One end of the PCB is snapped onto the M.2 metal mount, and the other end of the PCB, away from the M.2 metal mount, is screwed onto the knob fixing component, which engages with the positioning component.

[0007] Optionally, a thermally conductive silicone pad is provided in the gap between the heat sink and the PCB.

[0008] Optionally, the heat sink cover has a side mounting edge at one end facing the mounting base, and a positioning slot is provided on the side mounting edge, which is engaged with the mounting base.

[0009] Optionally, the fixing base includes a fixing nut and a fixing stud, the fixing stud being screwed to the fixing nut, and the positioning slot engaging with the head of the fixing stud.

[0010] Optionally, the knob fixing component includes a knob nut, a knob stud, a rotating connector, and a knob clip; the knob nut is screwed onto the knob stud, the knob nut is provided with a rotating connector, the upper end of the rotating connector is fixedly provided with a knob clip, a clearance gap is left between the knob clip and the rotating connector, the clearance gap forms a knob slot, and the end of the PCB away from the M.2 metal base is engaged in the knob slot.

[0011] Optionally, the positioning component is provided with a plurality of mounting screw holes, and the heat sink is provided with fastening screws at positions corresponding to the mounting screw holes. The mounting screw holes are screwed into the fastening screws to fix the heat sink to the positioning component.

[0012] Optionally, the positioning component has a locking through hole corresponding to the position of the knob fixing member, the knob stud passes through the locking through hole, and the cross-sectional dimension of the locking through hole is larger than the cross-sectional dimension of the knob stud.

[0013] Optionally, a support plate is provided on the side of the positioning component located at the through hole of the slot, and the support plate faces away from the PCB; a limit spring is connected to the support plate, the extension direction of the limit spring is facing the knob stud, and the limit spring abuts against the side of the knob stud.

[0014] Optionally, the heatsink heatsink has a multi-layer finned heatsink structure.

[0015] The technical solution provided in this embodiment of the utility model has at least the following technical effects or advantages: The tool-free, quick-release M.2 solid-state drive heatsink structure described in this embodiment uses a knob fixing component and an M.2 metal base to fix both ends of the PCB. The fixing method between the knob fixing component and the PCB, and the fixing method between the knob fixing component and the positioning component, are both snap-fit, thus enabling quick disassembly and assembly without the need for tools. The operation is convenient and fast. At the same time, the heatsink heatsink, which is positioned and installed with the positioning component and the fixing base to dissipate heat from the PCB, has a better heat dissipation effect.

[0016] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the tool-free, quick-release M.2 solid-state drive heatsink structure described in this utility model; Figure 2This is a schematic diagram of the structure of this utility model after the PCB is removed; Figure 3 for Figure 2 Side view; Figure 4 This is a schematic diagram of the positioning component.

[0019] Explanation of reference numerals in the attached figures: 1. Heatsink heat spreader; 2. Knob holder; 3. Positioning assembly; 4. Mounting base; 5. PCB; 6. M.2 metal mount; 11. Side mounting edge; 12. Fastening screw; 13. Positioning bayonet; 14. Thermal conductive silicone pad; 21. Knob nut; 22. Knob stud; 23. Rotating connector; 24. Knob clip; 25. Knob slot; 41. Fixing nut; 42. Fixing stud; 51. Support plate; 52. Limiting spring; 53. Mounting screw hole; 54. Through hole for positioning. Detailed Implementation

[0020] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The accompanying drawings show preferred embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0022] Unless otherwise specified, all raw materials, instruments and equipment used in this invention can be purchased from the market or prepared by existing methods.

[0023] Figure 1 This is a schematic diagram of the tool-free, quick-release M.2 solid-state drive heatsink structure described in this utility model. Figure 2 This is a schematic diagram of the structure of this utility model after removing PCB5. Figure 3 for Figure 2 See the side view. Figure 1-3As shown, the tool-free, quick-release M.2 solid-state drive heatsink structure includes a heatsink heatsink 1, a PCB 5 (Printed Circuit Board), a knob retainer 2, a positioning component 3, a mounting base 4, and an M.2 metal base 6. The lower ends of the knob retainer 2, the mounting base 4, and the M.2 metal base 6 are all soldered to the PCBA (Printed Circuit Board Assembly) motherboard, which provides physical support. One end of the heatsink heatsink 1 is snapped onto the mounting base 4, and the other end of the heatsink heatsink 1, away from the mounting base 4, is fixedly connected to the positioning component 3. The heatsink heatsink 1 covers the top of the PCB 5, and multiple M.2 solid-state drives are mounted on the upper part of the PCB 5. One end of the PCB 5 is snapped onto the M.2 metal base 6, and the other end of the PCB 5, away from the M.2 metal base 6, is screwed onto the knob retainer 2, which is snapped into the positioning component 3.

[0024] In this embodiment of the invention, a thermally conductive silicone pad 14 is provided in the gap between the heat sink 1 and the PCB 5 to improve the heat exchange effect.

[0025] Combination Figure 2-3 As shown, the heat sink 1 has a side mounting edge 11 at one end facing the fixed base 4, and a positioning slot 13 is provided on the side mounting edge 11, which is engaged with the fixed base 4.

[0026] The mounting base 4 includes a fixing nut 41 and a fixing stud 42. The fixing stud 42 is screwed to the fixing nut 41. The positioning slot 13 is engaged with the head of the fixing stud 42. The lower end of the fixing stud 42 is welded to the PCBA main board. By adjusting the screwing position of the fixing nut 41 (such as turning it up or down), the relative position between the side mounting edge 11 and the head of the fixing stud 42 can be adjusted accordingly.

[0027] The knob fixing component 2 includes a knob nut 21, a knob stud 22, a rotating connector 23, and a knob clip 24. The knob stud 22 is welded to the PCBA main board, and the knob nut 21 is screwed onto the knob stud 22. The knob nut 21 is provided with a rotating connector 23, and the upper end of the rotating connector 23 is fixedly provided with a knob clip 24. There is a clearance between the knob clip 24 and the rotating connector 23, and the clearance forms a knob slot 25. The end of the PCB 5 away from the M.2 metal base 6 is engaged in the knob slot 25.

[0028] See Figure 4 As shown, Figure 4 The diagram shows the structure of the positioning component 3. The positioning component 3 is provided with a plurality of mounting screw holes 53. The heat sink cover 1 is provided with fastening screws 12 at the positions corresponding to the mounting screw holes 53. The mounting screw holes 53 are screwed into the fastening screws 12, so that the heat sink cover 1 is fixedly connected to the positioning component 3.

[0029] The positioning component 3 has a locking through hole 54 at the position corresponding to the knob fixing component 2. The knob stud 22 passes through the locking through hole 54, and the cross-sectional dimension of the locking through hole 54 is larger than the cross-sectional dimension of the knob stud 22, so that the knob stud 22 can pass through the locking through hole 54.

[0030] A support plate 51 is provided on the side of the positioning component 3 located at the slot through hole 54, and the support plate 51 faces away from the PCB5. A limit spring 52 is connected to the support plate 51, and the extension direction of the limit spring 52 is directly opposite to the knob stud 22. In the free state, the limit spring 52 presses against the side of the knob stud 22, so that the knob stud 22 can be pressed by adjusting the compression of the limit spring 52 or the knob stud 22 can be disassembled by compressing the limit spring 52. The limit spring 52 is used to press the knob stud 22 from the side, thereby preventing the knob fixing part 2 from detaching from the PCB5.

[0031] In this embodiment of the invention, the heatsink 1 is a multi-layer finned heatsink structure, which can provide sufficient heat dissipation area for the PCB5 and the M.2 solid-state drive, ensuring that the M.2 solid-state drive maintains good heat dissipation performance.

[0032] The tool-free, quick-release M.2 solid-state drive heatsink structure described in this embodiment uses a knob fixing component 2 and an M.2 metal base 6 to fix both ends of the PCB5. The fixing method between the knob fixing component 2 and the PCB5 and the fixing method between the knob fixing component 2 and the positioning component 3 are both snap-fit, thus enabling quick disassembly and assembly without the need for tools. The operation is convenient and fast. At the same time, the heatsink cover 1, which is used to cool the PCB5, is positioned and installed with the positioning component 3 and the fixing base 4, resulting in better heat dissipation effect.

[0033] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0034] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention above. Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and it should be noted that the above embodiments are illustrative of the invention and not restrictive, and that alternative embodiments can be devised by those skilled in the art without departing from its scope.

Claims

1. A tool-free, quick-release M.2 solid-state drive heatsink structure, characterized in that, The tool-free, quick-release M.2 solid-state drive heatsink structure includes: a heatsink heatsink, a PCB, a knob retainer, a positioning component, a mounting base, and an M.2 metal mount. One end of the heatsink heatsink is snapped onto the mounting base, and the other end of the heatsink heatsink, away from the mounting base, is fixedly connected to the positioning component. The heatsink heatsink covers the top of the PCB, and multiple M.2 solid-state drives are mounted on the upper part of the PCB. One end of the PCB is snapped onto the M.2 metal mount, and the other end of the PCB, away from the M.2 metal mount, is screwed onto the knob retainer, which engages with the positioning component.

2. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 1, characterized in that: A thermally conductive silicone pad is provided in the gap between the heat sink heatsink and the PCB.

3. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 1, characterized in that: The heat sink cover has a side mounting edge at one end facing the mounting base, and a positioning slot is provided on the side mounting edge, which is engaged with the mounting base.

4. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 3, characterized in that: The fixing base includes a fixing nut and a fixing stud, the fixing stud is screwed to the fixing nut, and the positioning slot is engaged with the head of the fixing stud.

5. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 1, characterized in that: The knob fixing component includes a knob nut, a knob stud, a rotating connector, and a knob clip; the knob nut is screwed onto the knob stud, the knob nut is provided with a rotating connector, the upper end of the rotating connector is fixedly provided with a knob clip, a clearance gap is left between the knob clip and the rotating connector, the clearance gap forms a knob slot, and the end of the PCB away from the M.2 metal base is engaged in the knob slot.

6. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 5, characterized in that: The positioning component is provided with multiple mounting screw holes, and the heat sink is provided with fastening screws at the positions corresponding to the mounting screw holes. The mounting screw holes are screwed into the fastening screws to fix the heat sink to the positioning component.

7. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 5, characterized in that: The positioning component has a locking through hole corresponding to the position of the knob fixing component. The knob stud passes through the locking through hole, and the cross-sectional dimension of the locking through hole is larger than the cross-sectional dimension of the knob stud.

8. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 7, characterized in that: A support plate is provided on the side of the positioning component located at the through hole of the slot, and the support plate faces away from the PCB; a limit spring is connected to the support plate, the extension direction of the limit spring is facing the knob stud, and the limit spring abuts against the side of the knob stud.

9. The tool-free, quick-release M.2 solid-state drive heatsink structure according to claim 8, characterized in that: The heatsink heatsink has a multi-layer finned heatsink structure.

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