A memory stick testing apparatus

Abstract

The utility model discloses a kind of memory bank test equipment, for carrying out performance test to memory bank under controllable ambient temperature, memory bank test equipment includes: test host computer, test host computer is used to test memory bank, memory bank is plugged in test host computer;Temperature control module, temperature control module includes the air inlet of one end setting temperature control unit, temperature control unit includes the speed-regulating fan, heating assembly and buffer component arranged in order along first direction, buffer component is below setting temperature control area, memory bank is at least partially located in temperature control area;Under the drive of speed-regulating fan, airflow passes air inlet, speed-regulating fan, heating assembly and buffer component in order along first direction, after buffer component is guided to temperature control area, temperature control area is along the both ends of first direction and is provided with air outlet for airflow to flow out.The utility model provides memory bank test equipment, can carry out performance test to memory bank under controllable temperature, and memory bank is heated evenly, and test result is accurate.

Description

Technical Field

[0001] This utility model relates to the field of memory module testing technology, and in particular to a memory module testing device. Background Technology

[0002] In the development and production of electronic products, memory module testing is a key step in ensuring product quality and stability. Temperature is one of the important factors affecting the operating performance of memory modules, so testing the operating status of memory modules at different temperatures is an important part of memory testing.

[0003] Most existing temperature testing equipment for memory modules uses hot air heating. The specific structure is as follows: the device is equipped with an air intake assembly, and a heating unit is placed at the air inlet of the air intake assembly. During operation, the heating unit heats the incoming airflow, and the heated hot air is blown onto the memory module under test to raise the ambient temperature of the memory module, thereby completing the performance test of the memory module under high-temperature conditions. However, this type of equipment has a significant drawback: the hot air blown onto the memory module usually flows along the length of the memory module. This airflow direction creates a temperature difference between the two ends of the memory module along its length, resulting in uneven heating of the entire memory module. This leads to inaccurate test results for the high-temperature performance of the memory module, making it impossible to accurately assess the actual performance of the memory module. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a memory module testing device that can perform performance testing on memory modules under controlled temperatures, ensuring uniform heating and accurate test results.

[0005] This utility model is achieved through the following technical solution:

[0006] A memory module testing device is used to perform performance tests on multiple memory modules under a controlled ambient temperature. The memory module testing device includes:

[0007] A test host is used to test the memory module, and the memory module is plugged into the test host.

[0008] A temperature control module, comprising a temperature control unit with an air inlet at one end, the temperature control unit comprising a speed-regulating fan, a heating component and a buffer component arranged sequentially along a first direction, a temperature control area being provided below the buffer component, and the memory module being at least partially located within the temperature control area;

[0009] Driven by the speed-regulating fan, the airflow passes sequentially through the air inlet, the speed-regulating fan, the heating component, and the buffer component along the first direction, and is then guided to the temperature control area by the buffer component. The temperature control area is provided with air outlets at both ends along the first direction for the airflow to flow out.

[0010] The test host and temperature control unit are both electrically connected to the electronic control module.

[0011] Furthermore, the buffer assembly is provided with multiple air guide plates, which are inclined to the horizontal plane, and the angle between the air guide plate and the horizontal plane is in the range of 10°-50°.

[0012] Furthermore, the included angle is 30°.

[0013] Furthermore, the plurality of the air guide plates are arranged at uniform intervals along the first direction.

[0014] Furthermore, a working port is provided on the lower base plate of the temperature control unit corresponding to the temperature control area, and the memory module passes through the working port and is exposed within the temperature control area.

[0015] Furthermore, the heating assembly includes a heating element and a heat-conducting element. The heating element is housed within the cavity of the heat-conducting element and is attached to the inner wall of the cavity. The heat-conducting element is provided with multiple fins, and the airflow can pass between the multiple fins.

[0016] Furthermore, the temperature control unit is equipped with an air guide shroud, and both the heating component and the buffer component are fixedly connected to the air guide shroud.

[0017] Furthermore, along the first direction, the cross-section of the air guide shroud gradually decreases.

[0018] Furthermore, multiple air vents are formed on the lower plate of the air guide shroud, and the multiple air vents are arranged one-to-one below the multiple air guide plates. The airflow in the air guide shroud flows vertically through the air vents to the temperature control area.

[0019] Furthermore, a baffle plate is provided at the air guide port, and the baffle plate is fixedly connected to the lower plate. After the airflow comes into contact with the baffle plate, it flows over both sides of the baffle plate.

[0020] Compared with existing technologies, the advantages of this utility model are:

[0021] 1. This utility model divides the test area into multiple areas, and each test area is equipped with a corresponding temperature control unit for heating. The memory modules in each test area will not affect each other, which improves the temperature uniformity index of the memory module test environment and greatly reduces the temperature error of the test environment, which can reach ±4℃.

[0022] 2. This utility model sets up a speed-regulating fan and a temperature sensor in the temperature control unit, blows air into the temperature control unit and passes through the heating component and the test area in sequence. By cooperating with the temperature sensor to control the speed of the speed-regulating fan, the airflow speed can be controlled, thereby accurately controlling the temperature in the test area.

[0023] 3. This utility model features a flip-up temperature control module mounted on the housing, facilitating testing operations and memory module insertion.

[0024] 4. The test area in this utility model is equipped with high-temperature resistant sealing strips at both the top and bottom to ensure that the test area operates independently and stably, the ambient temperature is accurately controllable, and interference from external environmental factors is avoided.

[0025] 5. This utility model places the CPU and socket of the test motherboard on opposite sides, so that heating of the test area will not affect the heat dissipation of the CPU on the other side, and will not affect the test efficiency and accuracy.

[0026] 6. The temperature control unit in this utility model heats the airflow first through the heating component. The heated airflow is guided by the buffer component and blows onto the memory module from top to bottom. It can heat the entire memory module along its length at the same time, avoiding the problem of uneven heating of the memory module that occurs when the airflow only flows along the length direction in traditional methods. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the closed-state structure of a memory module testing device according to an embodiment of the present invention;

[0028] Figure 2 This is a partial structural diagram of a memory module testing device in its open state according to an embodiment of the present invention;

[0029] Figure 3 This is a perspective sectional view of a temperature control unit according to an embodiment of the present invention;

[0030] Figure 4 This is a cross-sectional view of a temperature control unit according to an embodiment of the present invention;

[0031] Figure 5 This is a partial perspective cross-sectional view of the temperature control unit from another perspective of an embodiment of the present invention;

[0032] Figure 6 for Figure 3 Enlarged view of section A in the middle;

[0033] Figure 7 This is an exploded view of a test host according to an embodiment of the present invention;

[0034] Figure 8This is a cross-sectional view of a test host according to an embodiment of the present invention;

[0035] Figure 9 This is a partial cross-sectional view of the test host in a closed state according to an embodiment of the utility model;

[0036] Figure 10 This is a front view of a memory module testing device according to an embodiment of the present invention;

[0037] Figure 11 This is a rear view of a memory module testing device according to an embodiment of the present invention.

[0038] Labeling Explanation: 9. Memory Module; 2. Main Body of Device; 3. Temperature Control Module; 1. Cabinet; 20. Test Host; 5. Electrical Control Module; 10. Installation Space; X1. First Direction; X2. Second Direction; 21. Test Area; 30. Temperature Control Unit; 308. Temperature Sensor; 31. Temperature Control Top Cover; 40. Nitrogen Spring; 16. Opening Handle; 309. Lower Base Plate; 309a. Working Port; 3a. Outer Shell; 300. Speed-Regulating Fan; 301. Heating Component; 303. Buffer Component; 302. Temperature... Control area; 30a, air inlet; 30b, air outlet; 311, air guide hood; 312, support component; 3b, first base plate; 3c, second base plate; 3d, connecting base plate; 312a, upper support plate; 312b, lower support plate; 309b, clearance hole; 310, ventilation hole; 311b, lower plate; 311d, opening; 311c, air guide space; 301a, heating element; 301b, heat conduction component; 301c, cavity; 301d, fin; 305, air guide plate; 311a, first air guide. 312c, Second air vent; 313, Air volume regulating plate; 313a, Adjustment hole; 313b, Baffle plate; 313c, First plate; 313d, Second plate; 317, Air direction regulating block; 200, Test mainboard; 202, Heat sink; 203, Cooling fan; 201, Housing; 207, Fixing studs; 201a, Air inlet plate; 201b, Air outlet plate; 208, Liquid cooling heat dissipation assembly; 209, Mainboard power supply; 208a, Main body; 208b, Heat pipe section; 204a, First... 1. Cover plate; 204b. Second cover plate; 205. Test port; 206. Seal; 206a. First sealing ring; 206b. Second sealing ring; 11. Front panel; 110. Control switch; 114. Status indicator light; 12. Rear panel; 120. Power interface; 120a. Temperature control interface; 120b. Host interface; 121. I / O interface; 122. Electrically controlled cooling fan; 123. Temperature control switch; 17. Foot support; 15. Door sensor switch; 150. Detection end; 151. Trigger end. Detailed Implementation

[0039] The following detailed, non-limiting description of the utility model's technical solution, in conjunction with preferred embodiments and accompanying drawings, is provided. In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0040] like Figures 1 to 2 As shown, an embodiment of the present invention provides a memory module testing device for performing performance testing on a memory module 9 under a controlled ambient temperature. The memory module testing device includes a main body 2 and a temperature control module 3. The main body 2 is used for performance testing of the memory module 9, and has slots for inserting the memory module 9. The temperature control module 3 is movably mounted on the main body 2 and can heat the memory module 9 inserted into the slot to perform high-temperature performance testing. By opening or closing the temperature control module 3, testers can easily insert the memory module 9 into the main body 2 without affecting the heating effect when the temperature control module 3 is closed. Specifically, the temperature control module 3 in the memory module testing device of this application heats the memory module 9 from top to bottom, which avoids uneven heating of the memory module 9 along its length, thus preventing inaccurate test results.

[0041] Specifically, the main body 2 of the equipment includes a housing 1, a testing host 20, and an electrical control module 5. Both the testing host 20 and the temperature control unit 30 are electrically connected to the electrical control module 5. The housing 1 is constructed of profiles and has an internal installation space 10. This installation space can be divided into a first installation space and a second installation space along the front-back direction, i.e., the first direction X1. The aforementioned testing host 20 is installed within the installation space 10 and fixed to the housing 1 with screws (not shown in the figure), with a portion of the testing host 20 located in the second installation space. The electrical control module 5 is located within the second installation space and above the testing host 20. In this embodiment, the electrical control module 5 is placed within the second installation space, employing a modular design for ease of installation and subsequent maintenance.

[0042] The aforementioned test host 20 is used to test the memory modules 9, and the test host 20 is provided with multiple test areas 21, each including multiple slots for inserting the memory modules 9. In this embodiment, a total of four test areas 21 are provided, arranged along the second direction X2, and each test area 21 is provided with eight slots evenly arranged along the second direction X2, which can achieve simultaneous testing of up to thirty-two memory modules 9.

[0043] Furthermore, the temperature control module 3 includes multiple temperature control units 30, each corresponding to one of the multiple test areas 21. These units are used to heat the memory modules 9 within their respective test areas 21. Each temperature control unit 30 also includes a temperature sensor 308 to monitor the temperature within the test area 21 during testing to ensure accurate test results. Both the test host 20 and the temperature control units 30 are electrically connected to the electronic control module 5. Each of the four temperature control units 30 can independently control the temperature of its corresponding test area 21, allowing for more precise adjustment of the test environment temperature and improving the accuracy of the test results.

[0044] Specifically, the temperature control module 3 also includes a temperature control cover 31, which is a thin-walled box shape. Four temperature control units 30 are arranged in a straight line, and the outer shell of the temperature control unit 30 is fixedly connected to the temperature control cover 31 by screws. Furthermore, the temperature control cover 31 is rotatably connected to the housing 1 via a rotating component 32, thereby enabling the temperature control units 30 to rotate. The temperature control cover 31 can rotate between a closed position and an open position. The rotating component 32 is existing technology; it is a rotatable hollow shaft. The rotating component 32 is rotatably mounted on the housing 1, and the temperature control cover 31 is fixedly connected to the rotating component 32 to achieve the rotation of the temperature control cover 31. Simultaneously, the cable of the electronic control module 5 can pass through the rotating component 32 and connect to the temperature control unit 30. When the temperature control cover 31 is in the closed position, the temperature control unit 30 is in close contact with the housing 1, and the memory module 9 is at least partially located inside the temperature control unit 30, thus being able to be heated by the temperature control unit 30. When the temperature control cover 31 is in the open position, the test area 21 is exposed, so that the user can insert the memory stick 9 into the slot.

[0045] Preferably, the memory module testing device also includes a pair of symmetrically arranged nitrogen springs 40. One end of the nitrogen spring 40 is connected to the temperature control cover 31, and the other end is connected to the housing 1. Specifically, both ends of the nitrogen spring 40 are connected by rotation, so that when the user flips open the temperature control cover 31, the nitrogen spring 40 can extend and retract synchronously, making it easier to open the temperature control cover 31, and the temperature control module 3 can be suspended in the open position to facilitate the user to insert the memory module 9.

[0046] Optionally, the temperature control cover 31 is also provided with opening handles 16 on both sides to facilitate the user to grip and open the temperature control cover 31. In addition, the lower base plate 309 of the temperature control unit 30 has a working port 309a corresponding to the temperature control area 302, and the memory module 9 can at least partially pass through the working port 309a and be exposed in the temperature control area 302.

[0047] Further reference Figures 3 to 4 The outer casing 3a of the temperature control unit 30 is generally rectangular. Inside the casing, along the first direction X1, a speed-regulating fan 300, a heating element 301, and a buffer element 303 are arranged sequentially, with a temperature control area 302 located below the buffer element 303. When the aforementioned temperature control cover 31 is in the closed position, the memory module 9 is at least partially located within the temperature control area 302. An air inlet 30a is formed at the end of the outer casing 3a near the speed-regulating fan 300. Driven by the speed-regulating fan 300, the airflow passes sequentially along the first direction X1 through the air inlet 30a, the speed-regulating fan 300, the heating element 301, and the buffer element 303, and is then guided by the buffer element 303 to the temperature control area 302, thereby heating the memory module 9 within the temperature control area 302. Furthermore, air outlets 30b are provided at both ends of the temperature control area 302 along the first direction X1 to allow airflow circulation. Meanwhile, multiple ventilation holes 310 are formed on both sides and the rear of the temperature control cover 31 to allow the hot airflow discharged from the multiple temperature control units 30 to flow out to the outside of the temperature control cover 31. In addition, refer to Figure 3 The airflow direction indicator arrow indicates that the airflow blows towards the memory module 9 from top to bottom. The airflow blows towards the memory module 9 from top to bottom, which can simultaneously heat the entire memory module 9 along its length direction, i.e., the first direction X1. This avoids the problem of uneven heating that occurs when the traditional airflow only flows along the length direction for heating.

[0048] In addition, the temperature sensor 308 is located near one of the air outlets 30b, which enables the temperature sensor 308 to detect the temperature in the test area 21 more promptly and accurately.

[0049] In detail, combined Figure 5 and Figure 6The temperature control unit 30 also includes an air guide shroud 311 and a support member 312. The support member 312 is cuboid in shape, and the aforementioned temperature control area 302 is formed within the support member 312. The lower base plate 309 of the outer casing 3a has a Z-shaped cross-section, including a first base plate 3b, a second base plate 3c with a height difference, and a connecting base plate 3d connecting the first base plate 3b and the second base plate 3c. The aforementioned working opening 309a is formed on the second base plate 3c, and the aforementioned air outlet 30b is formed on the connecting base plate 3d. The support member 312 includes an upper support plate 312a and a lower support plate 312b. The lower support plate 312b is fixed to the second base plate 3c by screws, and a clearance hole 309b is provided on the lower support plate 312b corresponding to the working opening 309a. The memory module 9 can pass through the working opening 309a and the clearance hole 309b in sequence, thus being exposed within the temperature control area 302.

[0050] Furthermore, the upper support plate 312a and the first base plate 3b are on the same horizontal plane, and the lower plate 311b of the air guide shroud 311 is simultaneously mounted on the upper support plate 312a and the first base plate 3b and fixed with screws. The air guide shroud 311 is generally conical with an opening 311d, and its cross-section gradually narrows along the first direction X1. An air guide space 311c is formed inside the air guide shroud 311, and the aforementioned heating component 301 and buffer component 303 are both disposed within the air guide space 311c and fixedly connected to the air guide shroud 311. In addition, the buffer component 303 is disposed at the narrower end of the air guide shroud 311, and the speed-regulating fan 300 is disposed near the opening 311d. This arrangement allows the airflow drawn in by the speed-regulating fan 300 to be heated and then quickly flow to the buffer component 303, and then to the temperature control zone 302 to improve heating efficiency.

[0051] More specifically, the heating assembly 301 includes a heating element 301a and a heat-conducting element 301b. The heat-conducting element 301b is fixedly connected to the air guide shroud 311 by screws. The heating element 301a is housed within a cavity 301c of the heat-conducting element 301b and is in contact with the inner wall of the cavity 301c. In this embodiment, the heat-conducting element 301b is made of aluminum and has excellent thermal conductivity. When the heating element 301a is in operation, it can transfer heat to multiple fins 301d on the heat-conducting element 301b. The airflow is heated as it passes between the multiple fins 301d.

[0052] Furthermore, the buffer assembly 303 includes multiple air guide plates 305, which are inclined to the horizontal plane so that the airflow can flow downwards after hitting the air guide plates 305. Specifically, fixing nuts are welded to both sides of the air guide plates 305. After the fixing nuts on both sides of the air guide plates 305 abut against the side walls of the air guide cover 311, the user can use screws to pass through the side walls and connect them to the corresponding fixing nuts to fix the air guide plates 305. The tilt angle of the air guide plates 305 can be adjusted by rotating them during installation. It is worth noting that the lower plate 311b of the air guide cover 311 has a first air guide port 311a, and the upper support plate 312a has a corresponding second air guide port 312c. The airflow guided by the multiple air guide plates 305 can pass through the first air guide port 311a and the second air guide port 312c in sequence and flow into the temperature control area 302, thereby heating the memory module 9 in the temperature control area 302.

[0053] Furthermore, in this embodiment, four air guide plates 305 are provided, and the four air guide plates 305 are arranged evenly at intervals along the first direction X1. This arrangement allows the airflow to be blown more evenly into the temperature control area 302, preventing the airflow from accumulating at the narrowest part of the air guide shroud 311 and then rushing into the temperature control area 302 from a single position, thereby ensuring the uniformity of the heating effect.

[0054] Optionally, the angle α between the air guide plate 305 and the horizontal plane ranges from 10° to 50°, preferably 30°. It is worth noting that in actual use, the angles of the four air guide plates 305 do not need to be consistent. The operator can adjust the angle of each air guide plate 305 according to the actual situation to ensure that the airflow of each air guide plate 305 is as consistent as possible.

[0055] Preferably, in order to further improve the heating uniformity of the memory module 9, an airflow regulating plate 313 fixedly connected to the upper support plate 312a is provided at the second air vent 312c. The airflow regulating plate 313 has four sets of regulating holes 313a corresponding one-to-one with the four air vents 305, and each set of regulating holes 313a includes multiple evenly arranged regulating holes 313a.

[0056] In addition, a baffle plate 313b is provided on the airflow regulating plate 313. The baffle plate 313b includes a first plate 313c and a second plate 313d. The first plate 313c and the second plate 313d are respectively located on both sides of the airflow regulating plate 313 and fixed with screws, with the screws passing through one of the adjustment holes 313a. By loosening the screws, the baffle plate 313b can move along the arrangement direction of the adjustment hole 313a, thereby adjusting the size of the adjustment hole 313a blocked by the baffle plate 313b, and thus adjusting the airflow. In actual use, the operator can adjust the corresponding baffle plate 313b according to the actual heating situation to ensure that the airflow at each set of adjustment holes 313a is consistent, thereby ensuring uniform heating of the memory module 9.

[0057] In addition, multiple airflow adjustment blocks 317 are provided between the buffer assembly 303 and the heating assembly 301. (See attached image for details.) Figure 3 The airflow adjustment block 317 is approximately a triangular prism and is fixed to the airflow adjustment plate 313 mentioned above by screws. The relatively turbulent airflow becomes a smoother airflow after passing through multiple airflow adjustment blocks 317, avoiding uneven heating and improving the accuracy of the test.

[0058] Further refer to 7 to Figure 8 The test host 20 includes a test motherboard 200, a heatsink 202, and a cooling fan 203. The test motherboard 200 has multiple slots on one side and a CPU on the other. The heatsink 202 is attached to the CPU, and the cooling fan 203 blows hot air out of the test host 20, thus dissipating the heat from the heatsink 202. During testing, the memory modules 9 on the test motherboard 200 need to be heated, while the CPU needs to be cooled, which conflicts with each other. Therefore, this invention places the slots and CPU on opposite sides of the test motherboard 200. A CPU cooling mechanism, namely the heatsink 202 and the cooling fan 203, is located on the side where the CPU is located to cool the CPU. This ensures good CPU cooling on the test motherboard 200 without affecting the heating of the memory modules 9 in the slots on the other side, thus guaranteeing the accuracy of the test results.

[0059] Specifically, the test host 20 includes a housing 201. Multiple fixing studs 207 are fixed inside the housing 201 with screws. The aforementioned test motherboard 200 is fixed to the fixing studs 207 with screws, thus allowing the test motherboard 200 to be "suspended" inside the housing 201, forming a heat dissipation space between it and the housing 201. An air intake plate 201a is provided on the housing 201 to allow air to enter the heat dissipation space, and an air exhaust plate 201b is provided on the side of the housing 201 away from the air intake plate 201a to allow air to exit. A cooling fan 203 is located on the side of the housing 201 near the air exhaust plate 201b, used to blow airflow out of the housing 201 to remove heat from the heatsink 202 and thus dissipate heat from the CPU.

[0060] Furthermore, the housing 201 also houses a liquid cooling component 208 and a motherboard power supply 209. The motherboard power supply 209 supplies power to the test motherboard 200, while the liquid cooling component 208 further cools the CPU. Along the first direction X1, the heatsink 202, motherboard power supply 209, cooling fan 203, and the main body 208a of the liquid cooling component 208 are arranged sequentially. Part of the heat pipe 208b of the liquid cooling component 208 is wrapped around and attached to the heatsink 202. During testing, driven by the cooling fan 203, the airflow passes sequentially along the first direction X1 through the heatsink 202, motherboard power supply 209, cooling fan 203, and the main body 208a of the liquid cooling component 208 before exiting to the outside of the housing 201, thus achieving CPU cooling.

[0061] Furthermore, the test host 20 also includes a first cover plate 204a and a second cover plate 204b. The first cover plate 204a is made of anti-static bakelite material and is placed above the test motherboard 200, providing an anti-static effect. The second cover plate 204b is placed above the motherboard power supply 209, the cooling fan 203, and the liquid cooling heat dissipation component 208 to enclose the housing 201.

[0062] In addition, further integration Figure 9 The first cover plate 204a has multiple test ports 205 corresponding to the test area 21, and the test ports 205 are surrounded by sealing elements 206. In this embodiment, the sealing element 206 includes a first sealing ring 206a and a second sealing ring 206b. When the temperature control module 3 is in the closed position, one side of the first sealing ring 206a abuts against the cover plate 204, and the other side abuts against the lower base plate 309 of the temperature control unit 30. One side of the second sealing ring 206b abuts against the cover plate 204, and the other side abuts against the test motherboard 200. The first sealing ring 206a and the second sealing ring 206b seal the test area 21, making the test environment of the memory module 9 in the test area 21 stable and not affected by external factors, thus improving the accuracy of the test results.

[0063] Further reference Figure 10 and Figure 11In this embodiment, the front panel 11 of the enclosure 1 is equipped with a host switch 110 and status indicator lights 114 electrically connected to the electronic control module 5. The host switch 110 is used to control the power supply of the test host 20. There are four groups of status indicator lights 114, each corresponding to one of the four test areas 21. Each group of status indicator lights 114 has eight lights, corresponding one-to-one with the eight slots in each test area 21, and is used to display the test status of the memory modules 9 in the corresponding slots. The rear panel 12 of the enclosure 1 is equipped with a power interface 120 and an I / O interface 121 electrically connected to the electronic control module 5. The power interface 120 includes a temperature control interface 120a and a host interface 120b, which are used for power input to the temperature control unit 30 and the test host 20, respectively. A temperature control switch 123 is provided below the temperature control interface 120a to control the power supply of the temperature control unit 30, and a host switch 110 is also provided below the host interface 120b to control the power supply of the test host 20. The IO interface 121 is used to connect IO devices or signal outputs, allowing test results to be exported to external devices for storage or retrieval. In addition, the rear panel 12 is equipped with multiple electronically controlled cooling fans 122 to dissipate heat from the electronic control module 5.

[0064] Finally, four feet 17 are installed at the bottom of the enclosure 1 to elevate the equipment, preventing water ingress or insufficient ventilation at the bottom from affecting heat dissipation. Furthermore, for safety reasons, refer to... Figure 2 The memory module testing device of this application also includes a door sensor switch 15. In this embodiment, the detection end 150 of the door sensor switch 15 is disposed on the housing 1, and the trigger end 151 is disposed on the temperature control cover 31, and the detection end 150 is electrically connected to the electronic control system 5. When the device is in the start-up state, the detection end 150 can lock the trigger end 151, preventing the temperature control cover 31 from opening, thereby avoiding safety accidents caused by human error.

[0065] During operation, the temperature control module 3 is initially in the open state, allowing the operator to insert the memory module 9 into the slot within the test area 21. After insertion, the user grasps the opening handle 16 to close the temperature control cover 31, connecting and sealing the temperature control area 302 on the temperature control unit 30 with the corresponding test area 21. Then, the aforementioned temperature control switch 123 and the two main switches 110 at the front and rear of the device are activated to begin testing. Upon activation of the temperature control switch 123, the heating element 301a and the speed-regulating fan 300 in the temperature control unit 30 are started. Driven by the speed-regulating fan 300, the airflow travels along the first direction X1, sequentially passing through the air inlet 30a, the speed-regulating fan 300, the heating element 301, and the buffer element 303, before being guided by the buffer element 303 to the temperature control area 302, thereby heating the memory module 9 within the temperature control area 302. Simultaneously, a main switch 110 is also provided on the front panel 11, allowing the user to shut down the test host 20 via the front main switch 110 when the memory module 9 needs to be replaced, facilitating operation.

[0066] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A memory module testing device for performing performance tests on multiple memory modules (9) under controlled ambient temperature, characterized in that, The memory module testing equipment includes: Test host (20), the test host (20) is used to test the memory module (9), the memory module (9) is plugged into the test host (20); Temperature control module (3), the temperature control module (3) includes a temperature control unit (30) with an air inlet (30a) at one end, the temperature control unit (30) includes a speed-regulating fan (300), a heating component (301) and a buffer component (303) arranged sequentially along a first direction (X1), a temperature control area (302) is provided below the buffer component (303), and the memory module (9) is at least partially located in the temperature control area (302); Driven by the speed-regulating fan (300), the airflow passes sequentially along the first direction (X1) through the air inlet (30a), the speed-regulating fan (300), the heating component (301), and the buffer component (303), and is then guided by the buffer component (303) to the temperature control area (302). The temperature control area (302) is provided with air outlets (30b) at both ends along the first direction (X1) for the airflow to flow out. The electronic control module (5), the test host (20), and the temperature control unit (30) are all electrically connected to the electronic control module (5).

2. The memory module testing device according to claim 1, characterized in that, The buffer assembly (303) is provided with a plurality of air guide plates (305), which are inclined to the horizontal plane and the angle (a) between the air guide plate (305) and the horizontal plane is in the range of 10°-50°.

3. The memory module testing device according to claim 2, characterized in that, The included angle (a) is 30°.

4. The memory module testing device according to claim 2, characterized in that, The multiple air guide plates (305) are arranged at equal intervals along the first direction (X1).

5. The memory module testing device according to claim 1, characterized in that, The temperature control unit (30) has a working port (309a) on its lower base plate (309) corresponding to the temperature control area (302), and the memory module (9) passes through the working port (309a) and is exposed in the temperature control area (302).

6. The memory module testing device according to claim 5, characterized in that, The heating assembly (301) includes a heating element (301a) and a heat-conducting element (301b). The heating element (301a) is housed in a cavity (301c) of the heat-conducting element (301b) and is attached to the inner wall of the cavity (301c). The heat-conducting element (301b) is provided with a plurality of fins (301d), and the airflow can pass between the plurality of fins (301d).

7. The memory module testing device according to claim 2, characterized in that, The temperature control unit (30) is provided with an air guide hood (311), and the heating component (301) and the buffer component (303) are both provided in the air guide hood (311) and fixedly connected to the air guide hood (311).

8. The memory module testing device according to claim 7, characterized in that, Along the first direction (X1), the cross-section of the air guide shroud (311) gradually decreases.

9. The memory module testing device according to claim 7, characterized in that, The temperature control unit (30) also includes a support member (312), the temperature control area (302) is formed in the support member (312), the air guide hood (311) is fixed above the support member (312), and a first air guide port (311a) is formed on the air guide hood (311), and a second air guide port (312c) is formed on the support member (312). After the airflow is guided by the buffer component (303), it passes through the first air guide port (311a) and the second air guide port (312c) in sequence and enters the temperature control area (302).

10. The memory module testing device according to claim 9, characterized in that, An air volume regulating plate (313) is provided at the second air guide (312c). The air volume regulating plate (313) is fixedly connected to the support member (312), and multiple sets of regulating holes (313a) corresponding to multiple air guide plates (305) are formed on the air volume regulating plate (313).

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