Independently heated memory die test fixture and memory die test apparatus

Abstract

The utility model discloses an independent heating's memory particle test fixture and memory particle test equipment relate to memory particle test technical field, wherein, memory particle test fixture includes base and compression unit, and base is connected with mainboard, compression unit includes mounting support and briquetting assembly, and briquetting assembly includes the briquetting and heating element of installation support, and heating element is used for heating briquetting, and briquetting is used for the memory particle on the mainboard of pressure and heating, a compression unit has at least two briquetting assemblies, and the heating element of each briquetting assembly can independently heat, and each briquetting corresponds a memory particle setting. The utility model provides technical scheme can improve the high temperature test precision of memory particle test equipment.

Description

Technical Field

[0001] This utility model relates to the field of memory chip testing technology, and in particular to an independently heated memory chip testing fixture and memory chip testing equipment. Background Technology

[0002] In related technologies, memory chip testing equipment typically includes a test fixture and heating rods. The test fixture is secured to the motherboard with multiple screws and has multiple pressure blocks, each corresponding to and pressing against multiple memory chips on the motherboard. The heating rods are mounted on the frame of the test fixture and can simultaneously heat multiple pressure blocks through heat conduction to achieve high-temperature testing of the memory chips. However, this structural design is prone to uneven temperature distribution on the heating rods and pressure blocks, resulting in significant differences in the amount of heat received by different memory chips, thus leading to low accuracy in high-temperature testing. Utility Model Content

[0003] The main purpose of this invention is to propose an independently heated memory chip testing fixture and memory chip testing equipment, which aims to improve the high-temperature testing accuracy of memory chip testing equipment.

[0004] To achieve the above objectives, the present invention proposes an independently heated memory chip testing fixture, comprising: The base connects to the motherboard; and The pressing unit includes a mounting bracket and a pressing block assembly. The pressing block assembly includes a pressing block disposed on the mounting bracket and a heating element. The heating element is used to heat the pressing block, and the pressing block is used to pressurize and heat the memory chips on the motherboard. The pressing unit has at least two pressing blocks, each pressing block having a heating element that can be heated independently, and each pressing block corresponding to a memory chip.

[0005] In one embodiment, a first side of the mounting bracket is rotatably connected to the base so that the pressing unit can rotate between an open position and a closed position, and a second side of the mounting bracket can engage with the base so that the pressing unit is constrained in the closed position.

[0006] In one embodiment, the pressing unit further includes a latch, which is rotatably disposed on the second side and includes a latching part and an operating part connected to each other. The latching part is engaged with the base, and the operating part protrudes from the top surface of the mounting bracket and is used for pressing operation.

[0007] In one embodiment, the memory chip testing fixture further includes a first elastic element, which is disposed at the hinge between the first side and the base, and is used to give the pressing unit a tendency to return to the open position.

[0008] In one embodiment, the pressing unit further includes a second elastic element. The pressing block is movably mounted on the mounting bracket along the pressing direction. The pressing block has a pressing portion that protrudes from the bottom surface of the mounting bracket. The second elastic element connects the pressing block and the mounting bracket and is used to make the pressing portion tend to move away from the mounting bracket.

[0009] In one embodiment, the pressing block is further provided with a mounting part, which is connected to the upper side of the pressing part. The mounting part is provided with a first blind hole, and the mounting bracket is provided with a second blind hole. One end of the second elastic member is inserted into the first blind hole, and the other end of the second elastic member is inserted into the second blind hole.

[0010] In one embodiment, a plurality of second elastic elements are provided, and the plurality of second elastic elements are distributed at intervals along the circumferential direction of the pressing portion.

[0011] In one embodiment, the side of the pressing block is provided with an elongated hole, the long axis of which extends along the pressing direction. The pressing unit also includes a guide pin disposed on the mounting bracket, the guide pin being slidably inserted into the elongated hole.

[0012] In one embodiment, the memory chip testing fixture has at least one pressing unit group, each pressing unit group includes two pressing unit columns distributed along a first direction, and each pressing unit column includes multiple pressing units distributed along a second direction, with the rotation axes of the two pressing unit columns in the same group being arranged away from each other.

[0013] In one embodiment, the memory chip testing fixture further includes a plurality of first circuit boards and a plurality of first conductive structures. At least two of the first circuit boards are disposed on opposite sides of the pressing unit group in a first direction. The heating element is electrically connected to the first circuit board through the first conductive structure. The first conductive structures of two pressing unit columns in the same group extend in opposite directions and are arranged across the rotation axis of the pressing unit on the side where they are located.

[0014] In one embodiment, the base includes a mounting frame and a mounting plate. The first circuit board is disposed on the mounting frame, the pressing unit is disposed on the mounting plate, the mounting plate is provided with clearance holes, and the portion of the pressing block extending into the clearance holes is used to press the memory chip. The mounting plate is detachably connected to the mounting frame, the mounting plate is fitted to the motherboard, and there is a gap between the mounting frame and the motherboard.

[0015] In one embodiment, the heating element includes a second circuit board and a heating element electrically connected to the second circuit board. The second circuit board is disposed on the heating element and attached to the pressure block. The first conductive structure includes a flexible ribbon cable and two connectors. The two connectors are respectively fixedly disposed on the first circuit board and the second circuit board, and the two ends of the flexible ribbon cable are respectively inserted into the two connectors.

[0016] In one embodiment, the side of the pressure block is provided with a first groove and a second groove that are connected to each other. The heating element is attached to the side wall of the first groove away from the second circuit board. The heating element also includes a third conductive structure, which passes through the second groove and is connected between the heating element and the second circuit board.

[0017] In one embodiment, the pressing unit further includes a temperature sensing element for measuring the temperature of the pressing block. The temperature sensing element is disposed on the lower surface of the second circuit board and is attached to the top surface of the pressing block through a heat-conducting structure.

[0018] This utility model also proposes a memory chip testing device, comprising: The housing has a storage cavity and a window communicating with the storage cavity; A cover plate, movably mounted on the window; and The aforementioned independently heated memory chip testing fixture, in which both the memory chip testing fixture and the motherboard are housed within the receiving cavity, allows at least the pressing unit to be exposed after the cover plate opens the window.

[0019] The technical solution of this utility model employs an independently operating heating element to heat a single pressing block. Each pressing block, after being heated to a certain temperature, then independently heats a memory chip, achieving independent temperature control for each memory chip. In this way, each memory chip receives essentially the same heating effect in an independent heating environment, thereby improving the accuracy of its high-temperature testing. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 A schematic diagram of an embodiment of the memory chip testing fixture provided by this utility model; Figure 2 for Figure 1 Exploded view of the embodiment shown; Figure 3 for Figure 2 The side view of a portion of the structure shows that the pressing units are all in the closed position. Figure 4 for Figure 3 The side view of a portion of the structure shows that the rightmost pressing unit is in the open position. Figure 5 for Figure 1 The diagram shown illustrates the embodiment mounted on the motherboard. Figure 6 for Figure 5 Top view of the structure shown; Figure 7 for Figure 6 Sectional view at point AA; Figure 8 for Figure 7 A magnified view of a section at point B in the middle; Figure 9 for Figure 8 The exploded view of the pressing unit, heating element, hinge seat and first elastic element shown. Figure 10 for Figure 9 Exploded view of the pressing assembly, cover and heating element shown; Figure 11 A schematic diagram of an embodiment of the memory chip testing equipment provided by this utility model.

[0022] Explanation of icon numbers: 100. Memory chip testing fixture; 110. Base; 111. Mounting frame; 112. Mounting plate; 113. Clearance hole; 114. Snap-fit ​​hole; 115. Hinge seat; 120. Pressing unit; 121. Protective cover; 122. Clearance notch; 130. Mounting bracket; 131. Second blind hole; 132. Mounting through hole; 140. Pressing block; 141. Pressing part; 142. Mounting part; 143. First blind hole; 144. Elongated hole; 145. First groove; 146. Second groove; 15 0. Heating element; 151. Second circuit board; 152. Heating element; 153. Third conductive structure; 160. Hook; 161. Snap-fit ​​part; 162. Operating part; 163. Third elastic element; 170. First conductive structure; 171. Flexible ribbon cable; 172. Connector; 191. First elastic element; 192. Second elastic element; 193. Guide pin; 194. First circuit board; 195. Second conductive structure; 196. Fourth conductive structure; 197. Temperature sensing element; 198. Pressure line; 200. Chassis; 201. Window; 210. Cover plate; 220. Motherboard; 221. Memory chip.

[0023] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] In related technologies, memory chip testing equipment typically includes a test fixture and a heating rod. The test fixture is secured to the motherboard with multiple screws and has multiple pressure blocks, each corresponding to multiple memory chips 221 on the motherboard. The heating rod is mounted on the frame of the test fixture and can simultaneously heat multiple pressure blocks through heat conduction to achieve high-temperature testing of the memory chips 221. However, this structural solution, relying solely on the heat from a single heating rod to simultaneously heat multiple pressure blocks, and on a single pressure block to simultaneously heat multiple memory chips 221, is prone to uneven temperature distribution on the heating rod and pressure blocks, resulting in significant differences in the heat received by different memory chips 221, thus leading to low accuracy in high-temperature testing. Secondly, since the pressure blocks are secured to the main body of the test fixture with multiple screws, tools are needed to remove and install the pressure blocks, making the operation cumbersome and time-consuming.

[0028] In view of this, the present invention proposes an independently heated memory chip testing fixture for use in memory chip testing equipment.

[0029] Please see Figure 1 , Figure 5 and Figure 7 In some embodiments of this utility model, the memory chip testing fixture 100 includes a base 110 and a pressing unit 120. The base 110 is connected to the motherboard 220. The pressing unit 120 includes a mounting bracket 130 and a pressing block 140 assembly. The mounting bracket 130 is movably connected to the base 110. The pressing block 140 assembly includes a pressing block 140 disposed on the mounting bracket 130 and a heating element 150. The heating element 150 is used to heat the pressing block 140. The pressing block 140 acts on the memory chip 221 on the motherboard 220.

[0030] Please see Figures 7 to 10Optionally, in some embodiments, a pressing unit 120 has at least two pressing block 140 assemblies, each of which has a heating element 150 capable of independent heating, and each pressing block 140 corresponds to a memory chip 221. That is, the independently operating heating element 150 heats one pressing block 140 individually, and then each pressing block 140, after being heated to a certain temperature, independently heats one memory chip 221, achieving independent temperature control for each memory chip 221. In this way, each memory chip 221 can receive essentially the same heating effect in an independent heating environment, thereby improving the accuracy and precision of its high-temperature testing.

[0031] It should be noted that the pressure block 140 acts on the memory chip 221 on the motherboard 220, meaning that the pressure block 140 both applies pressure to the memory chip 221 and transfers heat to the memory chip 221. That is, the pressure block 140 is used to pressurize and heat the memory chip 221. The pressure block 140 can either directly press against the memory chip 221 to apply pressure, or it can indirectly press the memory chip 221 to apply pressure through other components.

[0032] Please see Figures 2 to 4 Optionally, in some embodiments, the first side of the mounting bracket 130 is rotatably connected to the base 110, allowing the pressing unit 120 to rotate between an open position and a closed position. The second side of the mounting bracket 130 can engage with the base 110, thus constraining the pressing unit 120 to the closed position. That is, when opening the pressing unit 120, simply release the engagement between the mounting bracket 130 and the base 110, and then rotate the pressing unit 120. When closing the pressing unit 120, simply rotate the pressing unit 120, and then re-engage the mounting bracket 130 with the base 110. Thus, compared to the method of securing the pressing block 140 to the test fixture with multiple screws, this application simplifies the assembly and disassembly steps of the pressing unit 120, making operation more convenient.

[0033] Of course, in other embodiments, the mounting bracket 130 may be slidably connected to the base 110 so that the pressing unit 120 can move and switch between the open position and the closed position.

[0034] Please refer to the following: Figure 9Optionally, in some embodiments, the pressing unit 120 further includes a hook 160, which is rotatably disposed on the second side and includes a connecting engagement portion 161 and an operating portion 162. The engagement portion 161 engages with the base 110, and the operating portion 162 protrudes from the top surface of the mounting bracket 130 and is used for pressing operations. Specifically, when the pressing unit 120 is in the closed position, the engagement portion 161 can engage with the engagement hole 114 of the base 110. When the pressing unit 120 is in the open position, the engagement portion 161 is positioned away from the engagement hole 114 of the base 110.

[0035] Thus, by applying an operating force to the operating part 162, the latching part 161 can be switched between the two states of being engaged and disengaged, resulting in a simple structure that is easy to implement and operate. The operating part 162 can be tilted and extended to facilitate the application of operating force by the user.

[0036] Please see Figure 9 Optionally, in some embodiments, the latch 160 can also achieve an automatic reset function through a third elastic element 163. Specifically, the third elastic element 163 can be a ball screw, threaded onto the side of the mounting bracket 130 facing the latch 160, with its balls retractably abutting against the inner side of the latch 160, and enabling the latch 160 to have a tendency to rotate toward the engaged state.

[0037] Please see Figure 8 and Figure 9 Optionally, in some embodiments, the memory chip testing fixture 100 further includes a first elastic element 191, which is located at the hinge between the first side and the base 110 and is used to give the pressing unit 120 a tendency to return to the open position. Specifically, the base 110 also includes a hinge seat 115 mounted on the mounting plate 112, and the mounting bracket 130 is hinged to the hinge seat 115. Thus, the pressing unit 120 has the ability to automatically open by means of the first elastic element 191. When the hook 160 is released from the engagement with the base 110, the pressing unit 120 will rotate from the closed position to the open position under the action of the first elastic element 191, making the operation more convenient.

[0038] The first elastic element 191 can be a torsion spring. The base 110 is provided with a first support. The first side of the mounting bracket 130 is mounted on the first support by a pin. The torsion spring is located on the first support, and the two ends of the torsion spring abut against the first support and the mounting bracket 130 respectively.

[0039] Please see Figure 8 and Figure 9Optionally, in some embodiments, the pressing unit 120 further includes a second elastic element 192. The pressing block 140 is movably mounted on the mounting bracket 130 along the pressing direction. The pressing block 140 has a pressing portion 141 that protrudes from the bottom surface of the mounting bracket 130. The second elastic element 192 connects the pressing block 140 and the mounting bracket 130 and is used to make the pressing portion 141 tend to move away from the mounting bracket 130. That is, the design of the elastic pressing block 140 in this embodiment can not only adapt the pressing block 140 to memory chips 221 of different thicknesses, improving the adaptability and versatility of the test fixture, but also provide buffering with the help of the second elastic element 192, which can better protect the memory chips 221 compared to traditional rigid pressing.

[0040] The second elastic element 192 can be installed in various ways; for example, please refer to [reference needed]. Figure 9 In some embodiments, the pressure block 140 is further provided with a mounting portion 142, which is connected to the upper side of the pressing portion 141. The mounting portion 142 is provided with a first blind hole 143, and the mounting bracket 130 is provided with a second blind hole 131. One end of the second elastic member 192 is inserted into the first blind hole 143, and the other end of the second elastic member 192 is inserted into the second blind hole 131. This facilitates the assembly of the second elastic member 192, and the structure is simple and easy to implement.

[0041] The second elastic element 192 can be a compression spring, which is inserted through the second circuit board. The two ends of the compression spring are respectively adapted to be inserted into the first blind hole 143 and the second blind hole 131, and are guided and constrained by them, which can make the elastic deformation process of the compression spring more stable.

[0042] Please see Figure 9 and Figure 10 Optionally, in some embodiments, multiple second elastic elements 192 are provided, and the multiple second elastic elements 192 are distributed at intervals along the circumference of the pressing portion 141. In this embodiment, one pressing block 140 corresponds to four second elastic elements 192. In this way, the extension and retraction of the pressing block 140 can be made smoother and more stable.

[0043] Please see Figure 8 and Figure 9 Optionally, in some embodiments, the side of the pressing block 140 is provided with an elongated hole 144, the long axis of which extends along the pressing direction. The pressing unit 120 also includes a guide pin 193 disposed on the mounting bracket 130, the guide pin 193 being slidably inserted into the elongated hole 144. The guide pin 193 is fixedly disposed on the mounting bracket 130. When the pressing block 140 extends or retracts relative to the mounting bracket 130, the edge of the elongated hole 144 slides against the guide pin 193. At this time, the guide pin 193 plays a guiding and positioning role, making the extension and retraction of the pressing block 140 smoother and more stable.

[0044] Please see Figure 1 and Figure 2 Optionally, in some embodiments, the memory chip test fixture 100 has at least one pressing unit group, each pressing unit group including two pressing unit columns distributed along a first direction, each pressing unit column including a plurality of pressing units 120 distributed along a second direction, the rotation axes of the two pressing unit columns in the same group being arranged away from each other.

[0045] Please see Figure 2 Optionally, in this embodiment, the memory chip testing fixture 100 is provided with a total of one pressing unit group. Each pressing unit group has two columns of pressing units distributed along a first direction (the front-to-back direction in the figure), and each column of pressing units has four pressing units 120 distributed along a second direction (the left-to-right direction in the figure). Each pressing unit 120 has two pressing block 140 components distributed along the second direction (the left-to-right direction in the figure). Therefore, the memory chip testing fixture 100 has a total of eight pressing units 120 and sixteen pressing block 140 components. These eight pressing units 120 can be independently opened or closed. The opening angle of each pressing unit 120 is an obtuse angle. For example, the maximum opening angle can be set to 120° (see [reference]). Figure 4 This facilitates the handling and installation / removal of memory chips 221. Furthermore, the modular design of the lamination unit 120 facilitates its maintenance and replacement.

[0046] By arranging the rotation axes of two rows of pressing units in the same group to be far apart, that is, the rotation axis of the pressing unit 120 in the front row is located on its front side, and the rotation axis of the pressing unit 120 in the rear row is located on its rear side, the following advantages are achieved. Firstly, this allows the latches 160 of the pressing units 120 to be arranged more compactly, facilitating the operation of the latches 160 of different pressing units 120. Secondly, it ensures that the rotation axes of the pressing units 120 are far apart, preventing mutual interference when the different pressing units 120 rotate, or making it difficult for the pressing units 120 to be opened to an obtuse angle.

[0047] It should be noted that the testing fixture of this utility model has a wide range of applications, including but not limited to motherboards 220 or testing platforms integrating memory chips 221. For example, a certain stand-alone testing platform integrates sixteen DDR5 (i.e., fifth-generation double data rate memory technology, short for DDR5 SDRAM) memory chips 221. In this embodiment, the sixteen pressing blocks 140 components can independently heat these sixteen memory chips 221, that is, each pressing unit 120 can be responsible for pressing and heating two memory chips 221. Furthermore, the testing fixture of this embodiment is also compatible with common memory chip sizes such as 9×11, 9.5×11, and 10×11 (unit: mm), and supports high-temperature testing environments ranging from 25℃ to 85℃, with an accuracy of ±1℃ and a uniformity of ±3℃.

[0048] Please see Figure 2 Optionally, in some embodiments, the memory chip testing fixture 100 further includes a plurality of first circuit boards 194 and a plurality of first conductive structures 170. At least two first circuit boards 194 are disposed on opposite sides of the pressing unit group in a first direction. The heating element 150 is electrically connected to the first circuit board 194 through the first conductive structure 170. The first conductive structures 170 of two pressing unit columns in the same group extend in opposite directions and are arranged across the rotation axis of the pressing unit 120 on the same side. That is, the first conductive structure 170 of the pressing unit 120 in the front row extends forward and crosses the rotation axis of the pressing unit 120 to connect with the first circuit board 194 in the front row; the first conductive structure 170 of the pressing unit 120 in the rear row extends backward and crosses the rotation axis of the pressing unit 120 to connect with the first circuit board 194 in the rear row.

[0049] The first circuit board 194 serves as a control circuit board for controlling the operation of the heating element 150. It can be a PCB board and integrates most of the electronic components used to achieve heating of the heating element 150, including control chips, capacitors, etc. In this way, by placing the first circuit board 194 externally in the pressing unit 120, the volume of the pressing unit 120 can be reduced, and the structure of the pressing unit 120 can be made more compact.

[0050] On the other hand, by setting the first conductive structure 170 of the two pressing unit columns in the same group to extend in opposite directions and cross the rotation axis of the pressing unit 120 on the same side, the rotational movement of the pressing unit 120 can minimize the impact of the first conductive structure 170 on the first conductive structure 170, reduce the amplitude of repeated bending of the first conductive structure 170, and thus improve the service life of the first conductive structure 170.

[0051] Please see Figures 7 to 9Optionally, in some embodiments, the heating element 150 includes a second circuit board 151 and a heating element 152 electrically connected to the second circuit board 151. The second circuit board 151 is disposed on the heating element 152 and attached to the pressure block 140. The first conductive structure 170 includes a flexible ribbon cable 171 and two connectors 172. The two connectors 172 are respectively fixedly disposed on the first circuit board 194 and the second circuit board 151, and the two ends of the flexible ribbon cable 171 are respectively inserted into the two connectors 172. The flexible ribbon cable 171 can be configured as a flat structure to further reduce its influence from the rotation of the pressing unit 120.

[0052] The second circuit board 151 can be a PCB board, mainly used to fix the connector 172 and to act as a bridge to establish the electrical connection between the heating element 152 and the first circuit board 194. That is, the second circuit board 151 is essentially an adapter circuit board. Therefore, it does not need to integrate too many electronic components, which is beneficial to the miniaturization design of the pressing unit 120.

[0053] Thus, on the one hand, by designing the heating element 150 as a structure of the second circuit board 151 and the heating plate 152, the heating plate 152 can better fit the pressure block 140 and is easy to install. On the other hand, by designing the first conductive structure 170 as a structure of the flexible ribbon cable 171 and the connector 172, it is easy to realize the electrical connection between the heating element 150 and the first circuit board 194.

[0054] Please see Figure 8 and Figure 10 Optionally, in some embodiments, the side of the pressing block 140 is provided with a first groove 145 and a second groove 146 that are connected. The first groove 145 is located in the pressing part 141, and the end of the second groove 146 away from the first groove 145 penetrates through the upper surface of the pressing block 140. The heating element 152 is attached to the groove sidewall of the first groove 145 away from the second circuit board 151. The heating element 150 also includes a third conductive structure 153, which passes through the second groove 146 and connects between the heating element 152 and the second circuit board 151. The third conductive structure 153 can be two wires, that is, the heating element 152 is electrically connected to the second circuit board 151 through two wires.

[0055] Thus, on the one hand, housing the third conductive structure 153 within the second groove 146 not only protects it but also facilitates the miniaturization of the pressing unit 120. On the other hand, housing the heating element 152 within the first groove 145 and fitting it against the side wall of the first groove 145 improves the heat storage effect of the heating element 152 and the pressing block 140, and makes the temperature of the pressing block 140 more stable and uniform.

[0056] Please see Figure 8 To further improve the heat storage effect of the pressing block 140, the pressing unit 120 may optionally include a cover 121, which is fitted onto the upper surface of the pressing block 140. The cover 121 may be made of a material with superior heat insulation properties; the specific material is not limited in this application. It is understood that having the cover 121 exposed and covering the pressing block 140 can reduce the risk of burns to the user when operating the hook 160.

[0057] Please see Figure 8 and Figure 10 Optionally, in some embodiments, the pressing unit 120 further includes a temperature sensing element 197 for detecting the temperature of the pressing block 140. The temperature sensing element 197 is integrated on the lower surface of the second circuit board 151 and is attached to the top surface of the pressing block 140 via a thermally conductive structure. The temperature sensing element 197 may be a surface thermocouple probe. The mounting bracket 130 has mounting through holes 132 extending through its upper and lower surfaces. The pressing block 140 is housed within the mounting through holes 132 and partially exposed below them. The temperature sensing element 197 extends into the upper opening of the mounting through hole 132 and is attached to the pressing block 140. Thus, the first circuit board 194, using the temperature data of the pressing block 140 measured by the temperature sensing element 197, can form a closed-loop control, thereby more timely and accurately adjusting and controlling the operation of the heating element 150, and improving the precision and accuracy of high-temperature testing.

[0058] Please see Figure 1 and Figure 2 Optionally, in some embodiments, the pressing unit 120 further includes a second conductive structure 195, which is connected between two adjacent first circuit boards 194. In this embodiment, the test fixture is provided with a total of four first circuit boards 194. The two first circuit boards 194 located on the front side are connected by one second conductive structure 195, and the two first circuit boards 194 located on the rear side are connected by another second conductive structure 195. The front first circuit board 194 and the rear first circuit board 194 are connected by yet another second conductive structure 195, so that the four first circuit boards 194 are connected in series. Each first circuit board 194 is connected to four first conductive structures 170.

[0059] Please see Figure 1 and Figure 2Optionally, in some embodiments, the pressing unit 120 further includes a fourth conductive structure 196 for electrical connection with the motherboard 220. Thus, the motherboard 220 supplies power and communicates with the first circuit board 194 through the fourth conductive structure 196, and is programmed and controlled by the motherboard 220's interface. The fourth conductive structure 196 may be provided with pluggable terminals to facilitate connection or disconnection from the motherboard 220.

[0060] The second conductive structure 195 and the fourth conductive structure 196 can be in the form of wires or flexible ribbon cables 171. This application does not make any specific limitation in this regard.

[0061] Please see Figure 2 Optionally, in some embodiments, the base 110 includes a mounting frame 111 and a mounting plate 112. A pressing unit 120 is disposed on the mounting plate 112, and a first circuit board 194 is disposed on the mounting frame 111. The mounting plate 112 is provided with clearance holes 113, and the portion of the pressing block 140 extending into the clearance hole 113 is used to pressurize the memory chip 221. The clearance holes 113 and snap-fit ​​holes 114 are spaced apart on the mounting plate 112. In two adjacent pressing units 120 in the first direction, the corresponding two snap-fit ​​holes 114 and two clearance holes 113 are spaced apart along the second direction, and the two snap-fit ​​holes 114 are located between the two clearance holes 113. The width of the clearance hole 113 is greater than the width of the snap-fit ​​hole 114.

[0062] Optionally, the mounting plate 112 is detachably connected to the mounting frame 111. That is, the mounting plate 112 and the pressing unit 120 thereon can be removed from the mounting frame 111 as a separate module. For example, the mounting plate 112 can be attached to the mounting frame 111 by multiple screws. In this way, the mounting frame 111 can be replaced to accommodate different models and / or different numbers of pressing units 120. Alternatively, the same mounting frame 111 and the first circuit board 194 thereon can accommodate mounting plates 112 with different models and / or different numbers of pressing units 120.

[0063] Please see Figure 7 Optionally, in some embodiments, the mounting plate 112 is fitted onto the motherboard 220, and a gap is provided between the mounting frame 111 and the motherboard 220. Specifically, the mounting frame 111 may be attached to the upper surface of the mounting plate 112 by multiple screws. In this way, only the mounting plate 112 is in contact with the motherboard 220, allowing the mounting plate 112 to fit better onto the motherboard 220. This creates a relatively closed and independent heating environment within the clearance hole 113, thereby improving the accuracy and precision of high-temperature testing.

[0064] Please see Figure 8 and Figure 9 Optionally, in some embodiments, the cover 121 is provided with a clearance notch 122 on one side near the rotation axis of the pressing unit 120. The pressing unit 120 also includes a pressure line 198 provided in the clearance notch 122. The flexible cable 171 is clamped by the pressure line 198 and the bottom wall of the clearance notch 122 at the same time to reduce the risk of the flexible cable 171 being damaged by the rotation and pulling of the pressing unit 120.

[0065] Please see Figures 5 to 8 , Figure 11 This utility model also proposes a memory chip testing device, which includes a housing 200, a cover plate 210, and an independently heated memory chip testing fixture 100. The specific structure of the memory chip testing fixture 100 is as described in the above embodiments. Since this memory chip testing device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0066] The housing 200 has a storage cavity and a window 201 communicating with the storage cavity; a cover 210 is movably mounted on the window 201; the memory chip testing fixture 100 and the motherboard 220 are both housed within the storage cavity; after the cover 210 opens the window 201, at least the pressing unit 120 can be exposed through the window 201. Thus, by providing a movable and closable window 201, the operation and installation / removal of the memory chip 221 are facilitated.

[0067] Optionally, the cover plate 210 may be rotatably mounted on the cover body, or it may be slidably mounted on the cover body, or it may be completely detachable from the cover body (e.g., when fastened with screws). This application does not specifically limit this.

[0068] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A memory chip testing fixture with independent heating, characterized in that, include: The base connects to the motherboard; and The pressing unit includes a mounting bracket and a pressing block assembly. The pressing block assembly includes a pressing block disposed on the mounting bracket and a heating element. The heating element is used to heat the pressing block, and the pressing block is used to pressurize and heat the memory chips on the motherboard. The pressing unit has at least two pressing blocks, each pressing block having a heating element that can be heated independently, and each pressing block corresponding to a memory chip.

2. The independently heated memory chip testing fixture as described in claim 1, characterized in that, The first side of the mounting bracket is rotatably connected to the base so that the pressing unit can rotate and switch between the open position and the closed position. The second side of the mounting bracket can engage with the base so that the pressing unit is constrained in the closed position.

3. The independently heated memory chip testing fixture as described in claim 2, characterized in that, The pressing unit further includes a hook, which is rotatably disposed on the second side and includes a connecting part and an operating part. The connecting part is engaged with the base, and the operating part protrudes from the top surface of the mounting bracket and is used for pressing operation. And / or, the memory chip testing fixture further includes a first elastic element, which is disposed at the hinge between the first side and the base, and is used to give the pressing unit a tendency to return to the open position.

4. The independently heated memory chip testing fixture as described in claim 2, characterized in that, The pressing unit further includes a second elastic element. The pressing block is movably mounted on the mounting bracket along the pressing direction. The pressing block has a pressing portion that protrudes from the bottom surface of the mounting bracket. The second elastic element connects the pressing block and the mounting bracket and is used to make the pressing portion tend to move away from the mounting bracket.

5. The independently heated memory chip testing fixture as described in claim 4, characterized in that, The pressing block is also provided with a mounting part, which is connected to the upper side of the pressing part. The mounting part is provided with a first blind hole, and the mounting bracket is provided with a second blind hole. One end of the second elastic member is inserted into the first blind hole, and the other end of the second elastic member is inserted into the second blind hole. And / or, a plurality of the second elastic elements are provided, and the plurality of the second elastic elements are distributed at intervals along the circumferential direction of the pressing portion; And / or, the side of the pressing block is provided with an elongated hole, the long axis of the elongated hole extends along the pressing direction, and the pressing unit also includes a guide pin provided on the mounting bracket, the guide pin being slidably inserted into the elongated hole.

6. The independently heated memory chip testing fixture as described in claim 1, characterized in that, The memory chip testing fixture has at least one pressing unit group, each pressing unit group includes two pressing unit columns distributed along a first direction, and each pressing unit column includes multiple pressing units distributed along a second direction. The rotation axes of the two pressing unit columns in the same group are set away from each other.

7. The independently heated memory chip testing fixture as described in claim 6, characterized in that, The memory chip testing fixture also includes multiple first circuit boards and multiple first conductive structures. At least two first circuit boards are respectively disposed on opposite sides of the pressing unit group in a first direction. The heating element is electrically connected to the first circuit board through the first conductive structure. The first conductive structures of two pressing unit columns in the same group extend in opposite directions and are arranged across the rotation axis of the pressing unit on the side where they are located.

8. The independently heated memory chip testing fixture as described in claim 7, characterized in that, The heating element includes a second circuit board and a heating element electrically connected to the second circuit board. The heating element is attached to the pressure block. The first conductive structure includes a flexible ribbon cable and two connectors. The two connectors are respectively fixed on the first circuit board and the second circuit board. The two ends of the flexible ribbon cable are respectively inserted into the two connectors. And / or, the base includes a mounting frame and a mounting plate, the first circuit board is disposed on the mounting frame, the pressing unit is disposed on the mounting plate, the mounting plate is provided with clearance holes, and the portion of the pressing block extending into the clearance holes is used to press the memory chip; the mounting plate is detachably connected to the mounting frame, the mounting plate is fitted to the motherboard, and there is a gap between the mounting frame and the motherboard.

9. The independently heated memory chip testing fixture as described in claim 8, characterized in that, The side of the pressure block is provided with a first groove and a second groove that are connected. The heating element is attached to the groove side wall of the first groove away from the second circuit board. The heating element also includes a third conductive structure, which passes through the second groove and is connected between the heating element and the second circuit board. And / or, the pressing unit further includes a temperature sensing element for measuring the temperature of the pressing block. The temperature sensing element is disposed on the lower surface of the second circuit board and is attached to the top surface of the pressing block through a heat-conducting structure.

10. A memory chip testing device, characterized in that, include: The housing has a storage cavity and a window communicating with the storage cavity; A cover plate, which is movably installed over the window; as well as The independently heated memory chip testing fixture as described in any one of claims 1 to 9, wherein both the memory chip testing fixture and the motherboard are housed within the receiving cavity, and after the cover plate opens the window, at least the pressing unit can be exposed through the window.

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