Stainless steel substrate thick film non-inductive resistor

Abstract

The utility model discloses a kind of stainless steel substrate thick film non-inductive resistor, including stainless steel substrate, the top of the stainless steel substrate is equipped with dielectric layer, thick film resistor layer is equipped in the dielectric layer and is arranged in spiral structure, two electrode layers of symmetric arrangement are silk-screened on the one end of the dielectric layer, this stainless steel substrate thick film non-inductive resistor, by the design of stainless steel substrate itself has very high mechanical strength, toughness and ductility, far superior to brittle ceramic substrate, and the dielectric layer formed by first stainless steel dielectric layer and second stainless steel dielectric layer can more effectively conduct joule heat generated by thick film resistor layer, emit to environment or radiator, when thick film resistor layer is in temperature drastic change or cyclic work, thermal stress generated between different material layers is greatly reduced, effectively prevent that resistor layer cracks, falls off or separates from substrate, greatly improve the long-term reliability and stability of resistor in harsh temperature environment.

Description

Technical Field

[0001] This utility model relates to the field of resistor-related products, specifically a thick-film non-inductive resistor with a stainless steel substrate. Background Technology

[0002] In motor drive controllers and industrial equipment soft starter applications, modular design and high integration are required. Resistors need to be high-power, small-sized, and inductor-free. However, the size of existing resistors is directly proportional to their power; the higher the power, the larger the resistor size, making it difficult to integrate them into drive controllers and soft starter devices.

[0003] Existing power resistors are basically based on wire-wound resistors. Although they use a non-inductive cross-wound method, they cannot achieve complete non-inductiveness. Utility Model Content

[0004] The purpose of this invention is to provide a thick-film non-inductive resistor with a stainless steel substrate to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a stainless steel substrate thick film non-inductive resistor, comprising a stainless steel substrate, a dielectric layer on the top of the stainless steel substrate, a thick film resistor layer arranged in a spiral structure within the dielectric layer, two symmetrically arranged electrode layers screen-printed on one end of the dielectric layer, and leads soldered onto both electrode layers.

[0006] In a preferred embodiment of the present invention, the dielectric layer comprises a first stainless steel dielectric layer and a second stainless steel dielectric layer, wherein the first stainless steel dielectric layer is screen-printed on a stainless steel substrate, the thick film resistor layer is screen-printed on the first stainless steel dielectric layer, and the second stainless steel dielectric layer is screen-printed on top of the first stainless steel dielectric layer.

[0007] As a preferred embodiment of the present invention, both the first stainless steel dielectric layer and the second stainless steel dielectric layer are provided with mounting ports corresponding to the positions of the electrode layers.

[0008] As a preferred embodiment of this invention, the lead wire is a Teflon high-temperature lead wire.

[0009] As a preferred embodiment of this invention, one end of the stainless steel substrate and the dielectric layer is provided with a connecting assembly hole.

[0010] As a preferred embodiment of this invention, the thickness of the first stainless steel dielectric layer is 90 μm.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This stainless steel substrate thick-film non-inductive resistor, through the design of the stainless steel substrate itself, has extremely high mechanical strength, toughness and ductility, which is far superior to the brittle ceramic substrate. Moreover, the dielectric layer formed by the first stainless steel dielectric layer and the second stainless steel dielectric layer can more effectively conduct away the Joule heat generated by the thick film resistor layer and dissipate it to the environment or heat sink. When the temperature changes drastically or the thick film resistor layer is in cyclic operation, the thermal stress generated between different material layers is greatly reduced, which effectively prevents the resistor layer from cracking, falling off or separating from the substrate, and greatly improves the long-term reliability and stability of the resistor in harsh temperature environments.

[0013] This stainless steel substrate thick-film non-inductive resistor has a completely symmetrical conductive structure with a spiral path designed through the thick-film resistive layer. According to the right-hand screw rule, the magnetic field is determined, and the positive and negative electromagnetic fields generated by the completely symmetrical conduction completely cancel each other out, so the inductance can approach zero. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a stainless steel substrate thick film non-inductive resistor according to the present invention.

[0015] In the figure: 1. Stainless steel substrate; 2. Thick film resistor layer; 3. Electrode layer; 4. Lead wire; 5. First stainless steel dielectric layer; 6. Second stainless steel dielectric layer; 7. Mounting port; 8. Assembly hole. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0019] Please see Figure 1 An embodiment of this utility model is provided: a thick film non-inductive resistor with a stainless steel substrate 1, including a stainless steel substrate 1, a dielectric layer on the top of the stainless steel substrate 1, a thick film resistor layer 2 arranged in a spiral structure in the dielectric layer, two symmetrically arranged electrode layers 3 screen-printed on one end of the dielectric layer, and leads 4 welded on both electrode layers 3.

[0020] In this embodiment, the dielectric layer includes a first stainless steel dielectric layer 5 and a second stainless steel dielectric layer 6. The first stainless steel dielectric layer 5 is screen-printed on the stainless steel substrate 1, the thick film resistor layer 2 is screen-printed on the first stainless steel dielectric layer 5, and the second stainless steel dielectric layer 6 is screen-printed on top of the first stainless steel dielectric layer 5.

[0021] As a technical optimization of this utility model, a dense solidified layer can be formed on the upper surface of the stainless steel substrate 1.

[0022] In this embodiment, both the first stainless steel dielectric layer 5 and the second stainless steel dielectric layer 6 are provided with mounting ports 7 corresponding to the positions of the electrode layer 3.

[0023] As a technical optimization of this utility model, there is space for accommodating the electrode layer 3.

[0024] In this embodiment, lead 4 is a Teflon high-temperature lead.

[0025] As a technical optimization of this utility model, it has high temperature resistance and is suitable for power transmission and signal transmission in high temperature environments.

[0026] In this embodiment, the stainless steel substrate 1 and the dielectric layer are provided with a connecting mounting hole 8 at one end.

[0027] As a technical optimization of this utility model, it facilitates overall installation.

[0028] In this embodiment, the thickness of the first stainless steel dielectric layer 5 is 90 μm.

[0029] As a technical optimization of this utility model, the tightness is increased.

[0030] The working principle of this stainless steel substrate thick film non-inductive resistor is described in detail below: First, a stainless steel plate is used as the substrate to form a stainless steel substrate 1. Then, the first stainless steel dielectric layer is screen-printed. After the first stainless steel dielectric layer is cured, the thick film resistor layer 2 is screen-printed. The thick film resistor layer 2 has a spiral structure path design with a completely symmetrical conductive structure that goes back and forth. According to the right-hand screw rule, the magnetic field is determined. The completely symmetrical conduction generates positive and negative electromagnetic fields that completely cancel each other out, and the inductance can approach zero. After the thick film resistor layer 2 is cured, the electrode layer 3 is screen-printed. After the electrode layer 3 is cured, the first stainless steel dielectric layer 5 is screen-printed again. Then, two leads 4 are soldered to the electrode layer 3 using high-temperature tin.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A thick-film non-inductive resistor with a stainless steel substrate, comprising a stainless steel substrate (1), characterized in that: The top of the stainless steel substrate (1) is provided with a dielectric layer, and a thick film resistor layer (2) arranged in a spiral structure is provided in the dielectric layer. Two electrode layers (3) are symmetrically arranged on one end of the dielectric layer, and leads (4) are welded on both electrode layers (3).

2. The stainless steel substrate thick-film non-inductive resistor according to claim 1, characterized in that: The dielectric layer includes a first stainless steel dielectric layer (5) and a second stainless steel dielectric layer (6). The first stainless steel dielectric layer (5) is screen-printed on a stainless steel substrate (1). The thick film resistor layer (2) is screen-printed on the first stainless steel dielectric layer (5). The second stainless steel dielectric layer (6) is screen-printed above the first stainless steel dielectric layer (5).

3. A thick-film non-inductive resistor on a stainless steel substrate according to claim 2, characterized in that: Both the first stainless steel dielectric layer (5) and the second stainless steel dielectric layer (6) are provided with mounting ports (7) corresponding to the positions of the electrode layer (3).

4. A thick-film non-inductive resistor on a stainless steel substrate according to claim 1, characterized in that: The lead wire (4) is a Teflon high-temperature lead wire.

5. A thick-film non-inductive resistor on a stainless steel substrate according to claim 1, characterized in that: The stainless steel substrate (1) has a connecting mounting hole (8) at one end of the dielectric layer.

6. A thick-film non-inductive resistor on a stainless steel substrate according to claim 2, characterized in that: The thickness of the first stainless steel dielectric layer (5) is 90 μm.

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