Power conversion device and charging pile

Abstract

This application provides a power conversion device and a charging pile, belonging to the field of energy technology. The power conversion device includes magnetic components, a circuit board, a liquid cooling plate, and a heat-conducting medium. The circuit board and the liquid cooling plate are arranged opposite to each other, and the magnetic components are disposed on the surface of the circuit board facing the liquid cooling plate and are thermally connected to the liquid cooling plate through the heat-conducting medium. The magnetic components include a magnetic core, a winding, and a heat-conducting element. The magnetic core includes a central column and two end plates, with the two ends of the central column respectively connected to the two end plates. The winding is wound around the central column and electrically connected to the circuit board. The thermal conductivity of the heat-conducting element is greater than that of the magnetic core. The heat-conducting element includes a heat-conducting part of the central column and two heat-conducting plates. The heat-conducting part of the central column is thermally connected to the central column, and the two heat-conducting plates are respectively attached to the two end plates and connected to the heat-conducting part of the central column. In this way, the heat on the central column can be efficiently conducted to the heat-conducting plates through the heat-conducting part of the central column, and then efficiently conducted to the liquid cooling plate through the heat-conducting plates. Thus, the heat dissipation efficiency of the magnetic components is improved.

Description

Technical Field

[0001] This application relates to the field of energy technology, and in particular to a power conversion device and a charging pile. Background Technology

[0002] Power conversion equipment includes many magnetic components. As the power output of power conversion equipment continues to increase, the heat generated by these magnetic components also increases. Therefore, higher heat dissipation efficiency is required for these magnetic components. These magnetic components include a magnetic core and windings wound around the core.

[0003] However, the magnetic core has a relatively low thermal conductivity. Furthermore, the winding wires are covered with an insulating film, which also hinders heat dissipation from the magnetic core. This results in low heat dissipation efficiency for magnetic devices in related technologies. Utility Model Content

[0004] This application provides a power conversion device and a charging pile. In the power conversion device, the central column and end plates of the magnetic core are both in contact with heat-conducting components, resulting in high heat dissipation efficiency for the magnetic components. The technical solutions for the power conversion device and the charging pile are described below.

[0005] In a first aspect, this application provides a power conversion device. The power conversion device includes magnetic components, a circuit board, a liquid cooling plate, and a heat-conducting medium. The circuit board and the liquid cooling plate are arranged opposite to each other. The magnetic components are disposed on the surface of the circuit board facing the liquid cooling plate and are thermally connected to the liquid cooling plate through the heat-conducting medium. The magnetic components include a magnetic core, a winding, and a heat-conducting element. The magnetic core includes a central column and two end plates, with the two ends of the central column respectively connected to the two end plates. The winding is wound around the central column and electrically connected to the circuit board. The thermal conductivity of the heat-conducting element is greater than that of the magnetic core. The heat-conducting element includes a heat-conducting portion of the central column and two heat-conducting plates. The heat-conducting portion of the central column is thermally connected to the central column, and the two heat-conducting plates are respectively attached to the two end plates, and the heat-conducting plates are connected to the heat-conducting portion of the central column. The power conversion device is an uninterruptible power supply (UPS), an inverter, a rectifier, or a DC-DC converter, etc.

[0006] The technical solution provided in this application, through the aforementioned configuration, enables the magnetic device to dissipate heat via a liquid cooling plate, resulting in high heat dissipation efficiency. Furthermore, by configuring the heat-conducting part of the central pillar to be thermally connected, and by attaching the heat-conducting plate to the end plate and connecting the heat-conducting plate to the heat-conducting part of the central pillar, heat on the central pillar can be efficiently conducted to the heat-conducting plate via the central pillar's heat-conducting part, and then efficiently conducted to the liquid cooling plate via the heat-conducting plate. This further improves the heat dissipation efficiency of the magnetic device. Additionally, heat from the central pillar and end plate can also be directly and efficiently conducted to the liquid cooling plate via the heat-conducting plate.

[0007] In one implementation, the magnetic core includes two sub-cores. Each sub-core includes a sub-center post and an end plate, with one end of the sub-center post connected to the end plate. The other ends of the two sub-center posts are positioned opposite each other. The center post includes two sub-center posts. The heat-conducting component includes two sub-heat-conducting components, each corresponding to one of the two sub-cores. Each sub-heat-conducting component includes a sub-center post heat-conducting section and a heat-conducting plate, with one end of the sub-center post heat-conducting section connected to the heat-conducting plate, and the sub-center post heat-conducting section being thermally connected to the sub-center post. The center post heat-conducting section includes two sub-center post heat-conducting sections.

[0008] The technical solution provided in this application, since the magnetic core generally includes two separately set sub-magnetic cores, the heat-conducting component includes two sub-heat-conducting components, and the two sub-heat-conducting components dissipate heat from the two sub-magnetic cores respectively, which is beneficial to the processing, manufacturing and assembly of magnetic devices.

[0009] In one implementation, the heat-conducting part of the central column is attached to the outer surface of the central column and is disposed between the central column and the winding. The heat-conducting sheet is attached to the surface of the end plate facing the central column.

[0010] The technical solution provided in this application, by setting the heat-conducting plate to fit the surface of the end plate facing the central column, does not increase the length of the magnetic core, which is beneficial for high-density layout inside the power conversion device. Furthermore, the close distance between the heat-conducting plate and the hot spot of the central column (i.e., the center point of the central column, or the docking point of two sub-central columns) results in a shorter heat conduction path.

[0011] In one implementation, the heat-conducting part of the central column is cylindrical and sleeved on the central column. The heat-conducting plate has an opening, and the central column passes through the opening.

[0012] The technical solution provided in this application increases the heat conduction area between the central column and the heat-conducting cylinder by setting the central column heat-conducting part in a cylindrical shape, ensuring that all outer surfaces of the central column are in contact with the inner wall of the cylindrical heat-conducting part. Furthermore, the central column heat-conducting part is fitted onto the central column, improving the reliability of the connection between the central column heat-conducting part and the central column. Additionally, the heat-conducting plate has openings, resulting in a larger contact area between the heat-conducting plate and the surface of the end plate facing the central column, further increasing the heat conduction area between the end plate and the heat-conducting plate.

[0013] In one implementation, the thickness of the cylinder wall of the central column heat-conducting section is less than or equal to 2 mm.

[0014] In one implementation, the heat-conducting part of the central column is plate-shaped and adheres to the outer surface of the central column. In this way, heat on the central column can be efficiently conducted to the heat-conducting plate through the plate-shaped heat-conducting part.

[0015] In one implementation, the heat-conducting part of the central column is attached to the surface of the central column facing the liquid-cooled plate, and the heat-conducting sheet is attached to the portion of the end plate located between the central column and the liquid-cooled plate. In this way, the heat-conducting sheet is positioned on the heat conduction path between the central column and the liquid-cooled plate, which facilitates the heat conduction from the central column (or the heat-conducting part of the central column) to the liquid-cooled plate. Furthermore, the fact that the heat-conducting part of the central column is attached to the surface of the central column facing the liquid-cooled plate facilitates the connection between the heat-conducting part of the central column and the heat-conducting sheet.

[0016] In one implementation, the heat-conducting part of the central column is embedded in the central column and the end plate along the axial direction of the central column, and extends through the surface of the end plate facing away from the central column. The heat-conducting sheet is attached to the surface of the end plate facing away from the central column.

[0017] The technical solution provided in this application hides the heat-conducting part of the central column inside the magnetic core by embedding the central column and the end plate, thus preventing the magnetic core from becoming larger.

[0018] In one implementation, the heat-conducting component is made of ceramic or silicone. Currently, the manufacturing processes for ceramic or silicone heat-conducting components are relatively mature, making the power conversion device provided in this application easier to apply in practice.

[0019] In one implementation, the thickness of the heat-conducting sheet is less than or equal to 2 mm.

[0020] In one implementation, the thermally conductive medium is potting compound. The potting compound also serves to provide insulation between the magnetic components and the liquid cooling plate.

[0021] In one implementation, the heat-conducting part of the central column is bonded to the central column using thermally conductive adhesive, and the heat-conducting sheet is bonded to the outer surface of the end plate using thermally conductive adhesive. This improves the contact tightness and heat transfer efficiency between the heat-conducting sheet and the end plate, as well as the contact tightness and heat transfer efficiency between the heat-conducting part of the central column and the central column. The thermally conductive adhesive is a thermally conductive curing adhesive or thermally conductive gel, or other highly thermally conductive adhesive material.

[0022] Secondly, this application provides a charging pile. The charging pile includes a plurality of power conversion devices and a charging gun as described in any of the first aspects, wherein the plurality of power conversion devices are connected to the charging gun. Attached Figure Description

[0023] Figure 1 This is a heat conduction path diagram between a magnetic core and a liquid cooling plate in a related technology;

[0024] Figure 2 This is a three-dimensional schematic diagram of a magnetic device and a liquid cooling plate in related technologies;

[0025] Figure 3 This is an exploded view of a magnetic core and a heat-conducting component provided in an embodiment of this application;

[0026] Figure 4 This is a three-dimensional schematic diagram of a magnetic core and a heat-conducting component provided in an embodiment of this application;

[0027] Figure 5 This is a schematic diagram of a sub-magnetic core and a sub-heat-conducting component provided in an embodiment of this application;

[0028] Figure 6 This is a three-dimensional schematic diagram of a magnetic device and a liquid cooling plate provided in an embodiment of this application;

[0029] Figure 7 This is a heat conduction path diagram between a magnetic core and a liquid cooling plate provided in an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of another magnetic core and heat-conducting component provided in an embodiment of this application;

[0031] Figure 9 This is a schematic diagram of another magnetic core and heat-conducting component provided in an embodiment of this application;

[0032] Figure 10 This is another heat conduction path diagram between a magnetic device and a liquid cooling plate provided in an embodiment of this application;

[0033] Figure 11 This is a schematic diagram of another magnetic core and heat-conducting component provided in an embodiment of this application;

[0034] Figure 12 This is an exploded view of another magnetic core and heat-conducting component provided in an embodiment of this application;

[0035] Figure 13 This is a schematic diagram of another sub-magnetic core and sub-heat-conducting component provided in an embodiment of this application;

[0036] Figure 14 This is another heat conduction path diagram between a magnetic device and a liquid cooling plate provided in an embodiment of this application;

[0037] Figure 15 This is a schematic diagram of another magnetic core and heat-conducting component provided in an embodiment of this application.

[0038] Legend

[0039] 100. Magnetic components; 200. Circuit board; 300. Liquid cooling plate; 301. Ribs; 302. Receiving tank; 303. Coolant; 400. Thermal medium.

[0040] 1. Magnetic core; 11. Sub-core; 110. Middle post; 111. Sub-middle post; 112. End plate; 113. Side post;

[0041] 2. Windings;

[0042] 3. Heat-conducting component; 31. Sub-heat-conducting component; 310. Central column heat-conducting part; 311. Sub-central column heat-conducting part; 312. Heat-conducting sheet; 3121. Opening. Detailed Implementation

[0043] Power conversion equipment can be applied in scenarios such as energy storage systems, charging systems (such as charging piles), and photovoltaic power generation systems. Examples of power conversion equipment include uninterruptible power supplies (UPS), inverters, rectifiers, and DC-DC converters. As the power of power conversion equipment increases, the heat generated by the magnetic components within these devices also increases, as does their number. This necessitates higher heat dissipation efficiency for these magnetic components. These magnetic components can be transformers or inductors, among others.

[0044] For example, consider the application of power conversion devices in charging systems. Supercharging and fast charging greatly improve the user's charging experience, but as power density evolves to higher levels, the heat dissipation density of magnetic components within the power conversion device increases significantly. Therefore, improving the heat dissipation efficiency of magnetic components plays a crucial role in supporting the increase in power density of charging piles.

[0045] Figure 1 A partial schematic diagram of a power conversion device in the related art is shown, or a heat conduction path diagram between the magnetic core and the liquid cooling plate. Figure 2 A three-dimensional schematic diagram of a magnetic device and a liquid cooling plate is shown. (As shown) Figure 1 And refer to Figure 2 As shown, the power conversion device includes a magnetic component 100, a circuit board 200, a liquid cooling plate 300, and a heat-conducting medium 400. The circuit board 200 and the liquid cooling plate 300 are arranged opposite to each other. The side of the liquid cooling plate 300 facing the circuit board 200 has multiple ribs 301, which form a receiving groove 302 (e.g., ...). Figure 2 (As shown). The magnetic device 100 is located in the receiving tank 302 and is thermally connected to the liquid cooling plate 300 through the heat-conducting medium 400. In addition, the winding 2 of the magnetic device 100 is electrically connected to the circuit board 200. Coolant 303 flows in the liquid cooling plate 300.

[0046] like Figure 1 and Figure 2 As shown, the magnetic device 100 includes a magnetic core 1 and a winding 2. The magnetic core 1 includes a central post 110 and two end plates 112, which are respectively connected to the two ends of the central post 110. The winding 2 is wound around the central post 110. The hot spot of the magnetic core 1 (i.e., the point or position with the highest temperature in the magnetic core 1) is the center point of the central post 110 (e.g., the...). Figure 1 (The part enclosed in the dashed box). Or, to put it another way, such as... Figure 1As shown, the central column 110 includes two sub-central columns 111. The two sub-central columns 111 are joined together to form the central column 110. The hot spot is the joining point or joining position of the two sub-central columns 111.

[0047] like Figure 1 As shown, the heat conduction path between the magnetic device 100 and the liquid cooling plate 300 includes at least three paths. The first path involves heat conduction from the hot spot to the winding 2, and then via the winding 2 to the liquid cooling plate 300. The second path involves heat conduction from the hot spot along the axial direction of the central column 110 to the end plate 112, and then from the end plate 112 to the liquid cooling plate 300. The third path involves heat conduction from the hot spot along the axial direction of the central column 110 to the end plate 112, then from the end plate 112 to the partition 301, and then from the partition 301 to the liquid cooling plate 300.

[0048] The magnetic core 1 has a low thermal conductivity, for example, about 3 W / (m×K), and its thermal resistance is as high as 65%. Therefore, the thermal conductivity of the second and third thermal conduction paths mentioned above is also low. Furthermore, in some magnetic devices 100, insulating tape is wrapped around the conductors (such as film-wrapped wire) of the winding 2, which also reduces the thermal conductivity of the winding 2. Therefore, the thermal conductivity of the first thermal conduction path mentioned above is also low. All of these factors contribute to the low heat dissipation efficiency of the magnetic device 100 in the related art.

[0049] In view of the above-mentioned technical problems, this application provides a novel magnetic device 100 and a power conversion device using the magnetic device 100. The magnetic device 100 provided in this application will be described exemplarily below.

[0050] like Figures 3-15 As shown, the magnetic device 100 includes a magnetic core 1, a winding 2, and a heat-conducting component 3. The magnetic core 1 includes a central column 110 and two end plates 112, with the two ends of the central column 110 connected to the two end plates 112 respectively. The winding 2 is wound around the central column 110. The thermal conductivity of the heat-conducting component 3 is greater than that of the magnetic core 1. The heat-conducting component 3 includes a central column heat-conducting part 310 and two heat-conducting plates 312. The central column heat-conducting part 310 is thermally connected to the central column 110, and the two heat-conducting plates 312 are respectively attached to the two end plates 112, and the heat-conducting plates 312 are connected to the central column heat-conducting part 310.

[0051] The heat-conducting component 3 can be made of ceramic or silicone. The manufacturing processes for ceramic and silicone heat-conducting components are relatively mature; therefore, using ceramic or silicone as the material for the heat-conducting component 3 helps reduce costs. The thermal conductivity of the heat-conducting component 3 can be greater than 20 W / (m×K). The thickness of the heat-conducting sheet 312 can be less than or equal to 2 mm. For example, the central column heat-conducting part 310 is... Figure 3 The heat-conducting cylinder in the middle, or, for Figure 8 The heatsink in the middle, or, for Figure 12The heat-conducting pillar in the middle.

[0052] The technical solution provided in this application embodiment, by setting the central column heat-conducting part 310 to be thermally connected to the central column 110, and the heat-conducting plate 312 to be attached to the end plate 112, and the heat-conducting plate 312 to be connected to the central column heat-conducting part 310, allows the heat on the central column 110 to be efficiently conducted to the heat-conducting plate 312 via the central column heat-conducting part 310, and then efficiently conducted to the liquid cooling plate 300 via the heat-conducting plate 312. This improves the heat dissipation efficiency of the magnetic device 100. In addition, the heat on the end plate 112 can be efficiently conducted to the liquid cooling plate 300 via the heat-conducting plate 312.

[0053] In some examples, such as Figure 3 , Figure 8 and Figure 12 As shown, the magnetic core 1 includes two sub-cores 11. Each sub-core 11 includes a sub-central pillar 111 and an end plate 112, with one end of the sub-central pillar 111 connected to the end plate 112. The other ends of the two sub-central pillars 111 are arranged opposite to each other, forming a central pillar 110. The heat-conducting component 3 includes two sub-heat-conducting components 31, each corresponding to one of the two sub-cores 11. The sub-heat-conducting component 31 includes a sub-central pillar heat-conducting portion 311 and a heat-conducting plate 312. One end of the sub-central pillar heat-conducting portion 311 is connected to the heat-conducting plate 312, and the sub-central pillar heat-conducting portion 311 is thermally connected to the sub-central pillar 111. The central pillar heat-conducting portion 310 includes two sub-central pillar heat-conducting portions 311.

[0054] The technical solution provided in this application embodiment is that since the magnetic core 1 generally includes two separate sub-magnetic cores 11, the heat-conducting component 3 is provided to include two sub-heat-conducting components 31, and the two sub-heat-conducting components 31 dissipate heat from the two sub-magnetic cores 11 respectively, which facilitates the processing and manufacturing of the magnetic device 100.

[0055] Of course, in other examples, such as Figure 9 As shown, there can be only one heat-conducting element 3, and one heat-conducting element 3 is used to dissipate heat for the two sub-cores 11. The heat-conducting element 3 includes a central column heat-conducting part 310 and two heat-conducting plates 312 connected to both ends of the central column heat-conducting part 310. The central column heat-conducting part 310 is in contact with both sub-central columns 111.

[0056] This application embodiment does not limit the attachment position of the heat-conducting sheet 312 on the end plate 112. In some examples, such as Figures 3-5 and Figures 8-9 As shown, the heat-conducting plate 312 is attached to the side of the end plate 112 facing the central column 110. This does not increase the volume of the magnetic core 1, which is beneficial for high-density layout inside the power conversion device. Furthermore, the heat-conducting plate 312 is close to the hot spot of the central column 110 (i.e., the center point of the central column 110, or the docking point of the two sub-central columns 111), resulting in a shorter heat conduction path. In other examples, such as... Figure 11 and Figure 12 As shown, the heat-conducting sheet 312 is attached to the side of the end plate 112 facing away from the central column 110.

[0057] The central column heat-conducting part 310 (or sub-central column heat-conducting part 311) provided in this application embodiment includes three implementation methods. The following are exemplary descriptions of these three implementation methods.

[0058] (1) In some examples, such as Figures 3-5 As shown, the central column heat-conducting part 310 (or sub-central column heat-conducting part 311) is cylindrical and sleeved on the central column 110. The winding 2 is wound around the central column heat-conducting part 310. The heat-conducting plate 312 adheres to the surface of the end plate 112 facing the central column 110 and is connected to one end of the central column heat-conducting part 310. The cylindrical central column heat-conducting part 310 can be referred to as a heat-conducting cylinder, and the cross-sectional shape of the heat-conducting cylinder is circular, elliptical, or rectangular (e.g., ...). Figure 4 and Figure 5 (As shown) or a square, etc., with the specific cross-sectional shape being the same as that of the central column 110. The wall thickness of the heat-conducting cylinder is ≤2mm.

[0059] The technical solution provided in this application embodiment, by setting a heat-conducting cylinder sleeved on the central column 110, allows heat on the central column 110 to be efficiently conducted to the end plate 112 and the heat-conducting plate 312 via the heat-conducting cylinder. Furthermore, since the heat-conducting cylinder is sleeved on the central column 110, the inner wall of the heat-conducting cylinder is in contact with all outer surfaces of the central column 110, resulting in a large heat conduction area between the central column 110 and the heat-conducting cylinder. Additionally, the heat-conducting cylinder sleeved on the central column 110 improves the reliability of the connection between the heat-conducting cylinder and the central column 110.

[0060] In some examples, such as Figure 3 As shown, the heat-conducting plate 312 has an opening 3121 through which the central column 110 passes. In this way, the contact area between the heat-conducting plate 312 and the outer surface of the end plate 112 facing the central column 110 is larger, which increases the heat conduction area between the end plate 112 and the heat-conducting plate 312.

[0061] In some examples, such as Figure 3 and Figure 4 As shown, the heat-conducting component 3 includes two sub-heat-conducting components 31. Each sub-heat-conducting component 31 includes a heat-conducting cylinder and a heat-conducting plate 312, with one end of the heat-conducting cylinder connected to the heat-conducting plate 312. The two heat-conducting cylinders are respectively sleeved on the two sub-central columns 111. For example, the two heat-conducting cylinders abut against each other.

[0062] Figure 6 A schematic diagram of the magnetic device 100 provided in the embodiment of this application in the receiving groove 302 of the liquid cooling plate 300 is shown. Figure 7 A schematic diagram of the heat conduction path between the magnetic device 100 and the liquid cooling plate 300 is shown. Figure 7 As shown by the dashed arrow, the heat from the hot spot is efficiently conducted through the heat-conducting cylinder to the heat-conducting plate 312, and then efficiently conducted through the heat-conducting plate 312 to the liquid cooling plate 300. This improves the heat dissipation efficiency of the magnetic device 100.

[0063] (2) In some examples, such as Figure 8 and Figure 9 As shown, the central column heat-conducting part 310 (or the sub-central column heat-conducting part 311) is sheet-shaped and adheres to the outer surface of the central column 110. The heat-conducting sheet 312 adheres to the surface of the end plate 112 facing the central column 110 and is connected to the central column heat-conducting part 310. The sheet-shaped central column heat-conducting part 310 can be referred to as the second heat-conducting sheet. For example, the thickness of the second heat-conducting sheet is ≤2mm.

[0064] The technical solution provided in this application embodiment enables the heat on the central column 110 to be efficiently conducted to the end plate 112 and the heat-conducting sheet 312 by setting the second heat-conducting sheet to be attached to the central column 110.

[0065] In some examples, such as Figure 8 As shown, the heat-conducting component 3 includes two sub-heat-conducting components 31. Each sub-heat-conducting component 31 includes a second heat-conducting plate and a heat-conducting plate 312, with one end of the second heat-conducting plate connected to the heat-conducting plate 312. The two second heat-conducting plates are respectively attached to the two sub-central pillars 111. Wherein, as... Figure 8 As shown, each sub-heat conductor 31 is L-shaped. Exemplarily, two second heat conductors abut against each other.

[0066] In other examples, such as Figure 9 As shown, there is one heat-conducting component 3, which includes a second heat-conducting sheet and two heat-conducting sheets 312. The two ends of the second heat-conducting sheet are respectively connected to the two heat-conducting sheets 312. The second heat-conducting sheet is attached to the two sub-central columns 111.

[0067] Figure 10 A schematic diagram of the heat conduction path between the magnetic device 100 and the liquid cooling plate 300 is shown. Figure 10 As shown by the dashed arrow, the heat from the hot spot can be efficiently conducted from the second heat-conducting sheet to the heat-conducting sheet 312, and then efficiently conducted from the heat-conducting sheet 312 to the liquid cooling plate 300. This improves the heat dissipation efficiency of the magnetic device 100.

[0068] In some examples, such as Figure 10 As shown, the portion of the end plate 112 located between the central column 110 and the liquid cooling plate 300 is bonded to the heat-conducting sheet 312. Wherein, as... Figure 10As shown, since the heat on the magnetic core 1 is mainly conducted to the liquid cooling plate 300, the portion of the end plate 112 located between the central column 110 and the liquid cooling plate 300 is designed to be in contact with the heat-conducting sheet 312. This positions the heat-conducting sheet 312 along the heat conduction path from the central column 110 to the liquid cooling plate 300, which is beneficial for maximizing the heat conduction function of the heat-conducting sheet 312 and improving the heat dissipation efficiency of the magnetic device. Correspondingly, as... Figure 10 As shown, the second heat-conducting sheet is attached to the surface of the central column 110 facing the liquid cooling plate 300.

[0069] (3) In some examples, such as Figure 12 and Figure 13 As shown, the central column heat-conducting part 310 (or the sub-central column heat-conducting part 311) is columnar. The central column heat-conducting part 310 is embedded in the central column 110 and the end plate 112 along the axial direction of the central column 110, and penetrates the surface of the end plate 112 facing away from the central column 110. The heat-conducting plate 312 is attached to the surface of the end plate 112 facing away from the central column 110. The columnar central column heat-conducting part 310 can be referred to as a heat-conducting column.

[0070] The technical solution provided in this application embodiment, by embedding heat-conducting pillars in the magnetic core 1, enables the heat on the central pillar 110 to be efficiently conducted to the end plate 112 and the heat-conducting sheet 312 via the heat-conducting pillars. In addition, by embedding the heat-conducting pillars inside the magnetic core 1, the heat-conducting pillars are hidden inside the magnetic core 1, and the volume of the magnetic core 1 will not increase.

[0071] In some examples, such as Figure 12 As shown, the heat-conducting component 3 includes two sub-heat-conducting components 31. Each sub-heat-conducting component 31 includes a heat-conducting pillar and a heat-conducting plate 312, with one end of the heat-conducting pillar connected to the heat-conducting plate 312. The two heat-conducting pillars are respectively embedded in two sub-magnetic cores 11. Wherein, as... Figure 12 As shown, each sub-heat conductor 31 is T-shaped.

[0072] In some examples, such as Figure 12 and Figure 13 As shown, the heat-conducting pillar also penetrates the surface of the sub-pillar 111 facing away from the end plate 112. For example, two heat-conducting pillars abut against each other.

[0073] Figure 14 A schematic diagram of the heat conduction path between the magnetic device 100 and the liquid cooling plate 300 is shown. Figure 14 As shown by the dashed arrow, the heat from the hot spot can be efficiently conducted to the heat-conducting plate 312 via the heat-conducting column, and then efficiently conducted to the liquid cooling plate 300 via the heat-conducting plate 312.

[0074] This application does not limit the connection method between the heat-conducting component 3 and the magnetic core 1. In some examples, the heat-conducting part 310 of the central column is bonded to the central column 110 with thermally conductive adhesive. The heat-conducting sheet 312 is bonded to the end plate 112 with thermally conductive adhesive. This improves the contact tightness and heat conduction efficiency between the heat-conducting component 3 and the central column 110 or end plate 112. The heat-conducting component is a thermally conductive curing adhesive or thermally conductive gel, or other highly thermally conductive adhesive material.

[0075] The embodiments of this application do not limit the shape of the magnetic core 1. In some examples, such as Figures 3-14 As shown, the magnetic core 1 includes a central post 110 and end plates 112 located at both ends of the central post 110. In other examples, such as Figure 15 As shown, the magnetic core 1 is an E-type magnetic core, and the magnetic core 1 also includes two side posts 113. The two ends of the two side posts 113 are respectively connected to two end plates 112, and the middle post 110 is arranged between the two side posts 113.

[0076] Among them, for Figure 15 The magnetic core 1 shown is designed to reduce the influence of the side posts 113 on the arrangement of the heat-conducting plates 312, such as... Figure 15 As shown, the heat-conducting sheet 312 is attached to the surface of the end plate 112 facing away from the central column 110. Additionally, the heat-conducting component 3 may also include a heat-conducting pillar embedded in the central column 110. In some other examples, the heat-conducting pillar may also be embedded in the side pillar 113. Of course, the heat-conducting sheet 312 may also be attached to other outer surfaces of the end plate 112, and the heat-conducting portion 310 of the central column may also take other forms. That is, the first and second technical solutions described above may also be used, and this application embodiment does not specifically limit these methods.

[0077] This application also provides a power conversion device, such as... Figure 7 , Figure 10 and Figure 14 As shown, the power conversion device includes the aforementioned magnetic component 100, circuit board 200, liquid cooling plate 300, and heat-conducting medium 400. Circuit board 200 and liquid cooling plate 300 are arranged opposite each other. Magnetic component 100 is disposed on the side of liquid cooling plate 300 facing circuit board 200 and is thermally connected to liquid cooling plate 300 via heat-conducting medium 400. The winding 2 of magnetic component 100 is electrically connected to circuit board 200. The power conversion device can be a UPS, inverter, rectifier, or DC-DC converter, etc.

[0078] In some examples, such as Figure 7 , Figure 10 and Figure 14 As shown, the liquid cooling plate 300 has multiple ribs 301 on the side facing the circuit board 200, and the multiple ribs 301 form a receiving groove 302. The magnetic device 100 is located in the receiving groove 302.

[0079] In some examples, such as Figure 7 , Figure 10 and Figure 14 As shown, the thermally conductive medium 400 is a potting compound, which fills the receiving groove 302. The magnetic device 100 can be thermally connected to the liquid cooling plate 300 through the potting compound. Additionally, the potting compound also serves as insulation, preventing electrical connection between the magnetic device 100 and the liquid cooling plate 300. Of course, in some other examples, the receiving groove 302 may not be filled with potting compound. For example, the thermally conductive medium 400 may be an insulating thermally conductive pad, which is disposed between the magnetic device 100 and the liquid cooling plate 300.

[0080] This application also provides a charging pile. The charging pile includes a power conversion device and a charging gun, with the power conversion device connected to the charging gun. Exemplarily, the power conversion device is used to convert alternating current (AC) to direct current (DC).

[0081] In some examples, there are multiple power conversion devices, and these multiple power conversion devices are electrically connected to the charging gun.

[0082] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A power conversion device, characterized in that, The power conversion device includes magnetic components (100), a circuit board (200), a liquid cooling plate (300), and a heat-conducting medium (400); The circuit board (200) and the liquid cooling plate (300) are arranged opposite to each other. The magnetic device (100) is disposed on the surface of the circuit board (200) facing the liquid cooling plate (300) and is thermally connected to the liquid cooling plate (300) through the thermally conductive medium (400). The magnetic device (100) includes a magnetic core (1), a winding (2), and a heat-conducting component (3); The magnetic core (1) includes a central column (110) and two end plates (112). The two ends of the central column (110) are respectively connected to the two end plates (112). The winding (2) is wound around the central column (110) and electrically connected to the circuit board (200). The thermal conductivity of the heat-conducting component (3) is greater than that of the magnetic core (1). The heat-conducting component (3) includes a central column heat-conducting part (310) and two heat-conducting plates (312). The central column heat-conducting part (310) is thermally connected to the central column (110). The two heat-conducting plates (312) are respectively attached to the two end plates (112), and the heat-conducting plates (312) are connected to the central column heat-conducting part (310).

2. The power conversion device according to claim 1, characterized in that, The magnetic core (1) includes two sub-cores (11), each of the sub-cores (11) includes a sub-center post (111) and an end plate (112), one end of the sub-center post (111) is connected to the end plate (112), and the other ends of the two sub-center posts (111) are arranged opposite to each other, wherein the center post (110) includes two sub-center posts (111); The heat-conducting component (3) includes two sub-heat-conducting components (31), which correspond one-to-one with the two sub-magnetic cores (11). Each sub-heat-conducting component (31) includes a sub-central column heat-conducting part (311) and a heat-conducting plate (312). One end of the sub-central column heat-conducting part (311) is connected to the heat-conducting plate (312). The sub-central column heat-conducting part (311) is thermally connected to the sub-central column (111). The central column heat-conducting part (310) includes two sub-central column heat-conducting parts (311).

3. The power conversion device according to claim 1 or 2, characterized in that, The heat-conducting part (310) of the central column is attached to the outer surface of the central column (110) and is disposed between the central column (110) and the winding (2); The heat-conducting sheet (312) is attached to the surface of the end plate (112) facing the central column (110).

4. The power conversion device according to claim 3, characterized in that, The heat-conducting part (310) of the central column is cylindrical and is sleeved on the central column (110); The heat-conducting sheet (312) has an opening (3121), and the central column (110) passes through the opening (3121).

5. The power conversion device according to claim 4, characterized in that, The thickness of the cylinder wall of the central column heat-conducting part (310) is less than or equal to 2 mm.

6. The power conversion device according to claim 3, characterized in that, The heat-conducting part (310) of the central column is in the shape of a sheet and is attached to the outer surface of the central column (110).

7. The power conversion device according to claim 6, characterized in that, The heat-conducting part (310) of the central column is attached to the surface of the central column (110) facing the liquid cooling plate (300), and the heat-conducting sheet (312) is attached to the part of the end plate (112) located between the central column (110) and the liquid cooling plate (300).

8. The power conversion device according to claim 1 or 2, characterized in that, The heat-conducting part (310) of the central column is embedded in the central column (110) and the end plate (112) along the axial direction of the central column (110), and penetrates the surface of the end plate (112) facing away from the central column (110); The heat-conducting sheet (312) is attached to the surface of the end plate (112) facing away from the central column (110).

9. The power conversion device according to any one of claims 1-8, characterized in that, The heat-conducting component (3) is made of ceramic or silicone.

10. The power conversion device according to any one of claims 1-9, characterized in that, The thickness of the heat-conducting sheet (312) is less than or equal to 2 mm.

11. A charging pile, characterized in that, The charging pile includes a plurality of power conversion devices and a charging gun as described in any one of claims 1-10, wherein the plurality of power conversion devices are connected to the charging gun.

Images