A recessed mounting ultra-thin film capacitor

CN224841530UActive Publication Date: 2026-10-09NISTRONICS JIANGXI
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Patent Information

Application Number
CN202522031522.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-22
Publication Date
2026-10-09
Estimated Expiration
2035-09-22

AI Technical Summary

Technical Problem

[0003]为了解决上述现有薄膜电容器只能贴着PCB板进行安装,占用的空间至少是要超过产品体积,不利于小型化,以及超薄型的需求的问题,本实用新型提供了一种沉孔安装的超薄型薄膜电容

Benefits of technology

[0005]与现有技术相比,本实用新型的有益效果为:本实用新型通过在电容本体两端设计一个台阶,相应的PCB板上设置安装孔洞,可以使电容本体进行沉孔安装,可以提高空间利用率,同时可以压缩高度空间,可以有效的解决TV板的超薄型,小型化的需求,同时保证其可靠性不会受到影响,可大幅满足市场需求,提供视觉体检。

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Abstract

The utility model discloses a kind of ultra-thin film capacitors of counterbore installation, including PCB board and capacitor body, the both sides of the capacitor body are provided with step part, for embedding the mounting hole of the setting on PCB board, to reduce the height of capacitor body upper surface distance PCB board;Several pins are provided on the capacitor body, and pin hole is correspondingly provided on the PCB board.The utility model designs a step at the both ends of capacitor body, and the mounting hole is set on the corresponding PCB board, so that the capacitor body can be counterbore installed, the space utilization can be improved, the height space can be compressed, the demand of ultra-thin TV board, miniaturization can be effectively solved, while ensuring that its reliability is not affected, market demand can be greatly met, and visual physical examination is provided.
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Description

Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, and in particular to an ultra-thin thin film capacitor with countersunk hole mounting. Background Technology

[0002] Because TVs are becoming increasingly thinner, the thickness requirements for various components are also decreasing, and the internal space is becoming very compact. For products with a pin pitch ≥15mm, our current thickness limit for film capacitors is around 5mm. Further reducing the thickness is extremely difficult to produce due to equipment limitations; even custom-made equipment is difficult to operate, and the volume cannot be changed. Typical product shapes are as follows... Figure 5 Installation method as follows Figure 4 It can only be installed directly onto the PCB board, taking up at least more space than the product volume, which is not conducive to miniaturization and the need for ultra-thin designs. Utility Model Content

[0003] To address the problem that existing film capacitors can only be mounted on a PCB board, occupying at least more space than the product volume, which is not conducive to miniaturization and the demand for ultra-thin designs, this invention provides an ultra-thin film capacitor with countersunk hole mounting.

[0004] To achieve the above objectives, this utility model provides the following technical solution: An ultra-thin film capacitor with countersunk hole mounting includes a PCB board and a capacitor body. Both sides of the capacitor body are provided with stepped portions for embedding mounting holes provided on the PCB board, so as to reduce the height of the upper surface of the capacitor body from the PCB board. The capacitor body is provided with a plurality of pins, and the PCB board is provided with corresponding pin holes.

[0005] Compared with the prior art, the beneficial effects of this utility model are as follows: By designing a step at both ends of the capacitor body and setting mounting holes on the corresponding PCB board, the capacitor body can be countersunk, which can improve space utilization and reduce height space. This can effectively solve the needs of ultra-thin and miniaturized TV boards, while ensuring that its reliability is not affected. It can greatly meet market demand and provide visual inspection. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the installation method according to an embodiment of the present utility model; Figure 2 This is a three-dimensional structural diagram of an embodiment of the present utility model; Figure 3 This is a three-dimensional structural diagram of the PCB board according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the three-dimensional structure of an existing capacitor body; Figure 5 This is a schematic diagram of the installation method for the existing capacitor body.

[0007] In the diagram: 1. PCB board, 101. Pin hole, 102. Mounting hole, 2. Capacitor body, 201. Stepped section, 3. Pin. Detailed Implementation

[0008] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0009] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0010] like Figures 1 to 3 As shown, this utility model embodiment includes a PCB board 1 and a capacitor body 2. Both sides of the capacitor body are provided with stepped portions 201 for embedding the mounting holes 102 provided on the PCB board 1, so as to reduce the height of the upper surface of the capacitor body 2 from the PCB board 1. The capacitor body 2 is provided with a plurality of pins 3, and the PCB board 1 is provided with corresponding pin holes 101.

[0011] like Figure 4 and 5 As shown, in existing systems, the capacitor body 2 is mounted against the surface of the PCB board 1, resulting in a relatively high distance between its upper surface and the PCB board 1. In this embodiment, the capacitor body 2 and the PCB board 1 are mounted as follows: Figure 1 As shown, the stepped portions 201 on both sides of the capacitor body 2 are inserted into the mounting holes 102 provided on the PCB board 1, so that the capacitor body 2 is installed in a recessed manner. This allows part of the capacitor body 2 to be hidden under the PCB board 1, greatly reducing the space utilization rate above the PCB board 1, thereby realizing the miniaturization and ultra-thinness of the customer product.

[0012] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A countersunk hole mounted ultrathin film capacitor, characterized in that: The device includes a PCB board and a capacitor body. Both sides of the capacitor body are provided with stepped portions for embedding mounting holes provided on the PCB board, so as to reduce the height of the upper surface of the capacitor body from the PCB board. The capacitor body is provided with several pins, and the PCB board is provided with corresponding pin holes.