A protective cover for a device pin and a capacitor assembly

Abstract

This utility model relates to a protective cover for device pins, comprising a substrate, a cover wall extending from a first side of the substrate away from the first side, and a plurality of protrusions disposed on a second side of the substrate; the first side of the substrate faces away from the second side of the substrate; a plurality of mounting holes are formed on the substrate; each protrusion faces a mounting hole and is hollow to avoid device pins passing through the mounting hole; the plurality of protrusions form a heat dissipation channel on the second side of the substrate. Because each protrusion of the protective cover for device pins of this utility model faces a mounting hole and is hollow to avoid device pins passing through the mounting hole, the device pins can be protected; and because the plurality of protrusions form a heat dissipation channel on the second side of the substrate, it is beneficial for device heat dissipation. This utility model also relates to a capacitor assembly including the protective cover for device pins.

Description

Technical Field

[0001] This utility model relates to device protection for charging modules, and more specifically, to a protective cover for device pins and a capacitor assembly including the protective cover for the device pins. Background Technology

[0002] To ensure the long-term reliable operation of the components inside the charging module, the component pins need to be protected. This is typically done by potting resin to cover the pins, and due to limitations in the potting process, the entire pin surface is sometimes covered. Because the potting layer is relatively thick, this results in poor heat dissipation for the components. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a protective cover for device pins, which can protect the device pins while forming a heat dissipation channel to facilitate heat dissipation of the device.

[0004] The technical solution adopted by this utility model to solve its technical problem is as follows: constructing a protective cover for device pins, including a substrate, a cover wall extending from a first side of the substrate away from the first side, and a plurality of protrusions disposed on a second side of the substrate; the first side of the substrate faces away from the second side of the substrate; a plurality of mounting holes are formed on the substrate; each protrusion faces a mounting hole and is hollow to avoid device pins passing through the mounting hole; the plurality of protrusions form a heat dissipation channel on the second side of the substrate.

[0005] In the protective cover for the device pins of the present invention, the plurality of protrusions are distributed along the length and width directions of the substrate, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate.

[0006] In the protective cover for the device pins of the present invention, the cover wall includes a first sidewall and a second sidewall extending along the length direction of the substrate, and a third sidewall and a fourth sidewall extending along the width direction of the substrate, wherein the first sidewall and the second sidewall are perpendicular to the third sidewall and the fourth sidewall. The first sidewall and the second sidewall are provided with card interfaces for engaging the device mounting plate; The third and fourth sidewalls are provided with clips for limiting the mounting plate of the device.

[0007] In the protective cover for the device pins described in this utility model, an L-shaped support plate is provided on the outside of the card interface for raising the protective cover for the device pins.

[0008] In the protective cover for the device pins of the present invention, a positioning post for positioning the device mounting plate is provided on the first side of the substrate.

[0009] In the protective cover for the device pins of the present invention, the device mounting plate includes a plate body and a plurality of electronic devices mounted on a first side of the plate body. The pins of the electronic devices pass through the plate body and are mounted in the mounting holes. The plurality of protrusions correspond one-to-one with the pins of the electronic devices, and each protrusion avoids the pin of its corresponding electronic device.

[0010] When implementing the protective cover for the device pins described in this utility model, before potting the device mounting plate, the protective cover for the device pins of this utility model is first installed on the first side of the device mounting plate, and then potting is performed on the second side of the device mounting plate. Since each protrusion of the protective cover for the device pins of this utility model is aligned with a mounting hole and is hollow to avoid device pins passing through the mounting hole, the device pins can be protected. Furthermore, since the multiple protrusions form a heat dissipation channel on the second side of the substrate, it is beneficial for device heat dissipation.

[0011] The technical problem to be solved by this utility model is to provide a capacitor assembly that can form a heat dissipation channel while protecting the capacitor pins, thereby facilitating heat dissipation of the device.

[0012] The technical solution adopted by this utility model to solve its technical problem is: to construct a capacitor assembly, including a plate, a plurality of capacitors mounted on a first side of the plate, and a protective cover for the device pins mounted on a second side of the plate; the first side of the plate faces away from the second side of the plate. The protective cover for the device pins includes a substrate, a cover wall extending from a first side of the substrate toward the board body, and a plurality of protrusions disposed on a second side of the substrate; the first side of the substrate faces away from the second side of the substrate; a plurality of mounting holes are formed on the substrate; the pins of each capacitor pass through the board body and are mounted in a mounting hole, and each protrusion corresponds to a mounting hole and avoids the pins in the mounting hole. The plurality of protrusions are distributed along the length and width directions of the substrate, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate.

[0013] In the capacitor assembly of this utility model, the cover wall includes a first sidewall and a second sidewall extending along the length direction of the substrate, and a third sidewall and a fourth sidewall extending along the width direction of the substrate, wherein the first sidewall and the second sidewall are perpendicular to the third sidewall and the fourth sidewall. The first sidewall and the second sidewall are provided with card interfaces for engaging the plate body; The third and fourth sidewalls are provided with buckles for limiting the plate.

[0014] In the capacitor assembly described in this utility model, an L-shaped support plate is provided on the outer side of the card interface for raising the protective cover of the device pins; a positioning post is provided on the first side of the substrate for positioning the plate body.

[0015] In implementing the capacitor assembly of this utility model, before potting, a protective cover for the device pins is first installed on one side of the board, and then potting is performed on the other side of the board. Since each protrusion is directly opposite a mounting hole and is hollow to avoid the capacitor pins passing through the mounting hole, the capacitor pins can be protected. Furthermore, since the multiple protrusions form a heat dissipation channel on the second side of the substrate, it is beneficial for the device to dissipate heat. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a first-angle view of a preferred embodiment of the protective cover for the device pins of this utility model; Figure 2 This is a second-angle view of a preferred embodiment of the protective cover for the device pins of this utility model; Figure 3 This is a first-angle view of a preferred embodiment of the capacitor assembly of this utility model; Figure 4 This is a second-angle view of a preferred embodiment of the capacitor assembly of this utility model; Figure 5 This is a schematic diagram of the assembly of a preferred embodiment of the capacitor assembly of this utility model; Figure 6 This is a cross-sectional view showing the position of the capacitor pins of the capacitor assembly of this utility model. Figure 7 This is a cross-sectional view of the snap-fit ​​position of the capacitor assembly of this utility model. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0018] Figure 1 This is a first-angle view of a preferred embodiment of the protective cover 100 for the device pins of this utility model. Figure 2 This is a second-angle view of a preferred embodiment of the protective cover 100 for the device pins of this utility model. (See image below.) Figures 1-2The protective cover 100 for device pins of this utility model includes a substrate 110, a cover wall 120 extending from a first side of the substrate 110 away from the first side, and a plurality of protrusions 140 disposed on a second side of the substrate 110. The first side of the substrate 110 faces away from the second side of the substrate 110. A plurality of mounting holes 130 are formed on the substrate 110; each protrusion 140 faces a mounting hole 130 and is hollow to avoid device pins passing through the mounting hole 130; the plurality of protrusions 140 form a heat dissipation channel on the second side of the substrate 110.

[0019] The protective cover for the device pins of this invention is installed on the first side of the device mounting plate before potting with adhesive, and then potting is performed on the second side of the device mounting plate. Since each protrusion faces a mounting hole and is hollow to avoid device pins passing through the mounting hole, the protective cover for the device pins of this invention can protect the device pins. Furthermore, since the multiple protrusions form a heat dissipation channel on the second side of the substrate, the protective cover for the device pins of this invention facilitates heat dissipation of the device.

[0020] Further as Figures 1-2 As shown, the plurality of protrusions 140 are distributed along the length and width directions of the substrate, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate.

[0021] Further as Figures 1-2 As shown, the cover wall 120 includes a first sidewall 121 and a second sidewall 122 extending along the length direction of the substrate 110, and a third sidewall 123 and a fourth sidewall 124 extending along the width direction of the substrate 110. The first sidewall 121 and the second sidewall 122 are perpendicular to the third sidewall 123 and the fourth sidewall 124. The first sidewall 121 and the second sidewall 122 are provided with a card interface 125 for engaging the device mounting plate. The third sidewall 123 and the fourth sidewall 124 are provided with a buckle 126 for limiting the device mounting plate.

[0022] It should be noted that the shape and position of the card interface 125 depend on the shape and position of the device mounting plate, as long as they can engage with each other. To ensure that the potting compound flows well on the device mounting plate after potting, an L-shaped support plate 127 for raising the protective cover 100 of the device pins can be provided on the outside of the card interface 125. In a preferred embodiment of this invention, two L-shaped support plates 127 are provided. In other preferred embodiments of this invention, more numbers and / or other shapes of support plates can be provided. In addition, any suitable shape of buckle 126 can be used to limit the device mounting plate.

[0023] The first side surface of the substrate 110 is provided with positioning posts 111 for positioning the device mounting plate. In this utility model, the device mounting plate can be a circuit board for mounting any electronic device that requires potting. For example, the device mounting plate includes a board body and a plurality of electronic devices mounted on the first side surface of the board body. The pins of the electronic devices pass through the board body and are mounted into the mounting holes 130. The plurality of protrusions 140 correspond one-to-one with the pins of the electronic devices, and each protrusion avoids the pin of its corresponding electronic device.

[0024] In a preferred embodiment of this invention, the protective cover for the device pins is preferably a one-piece molded plastic protective cover. In another preferred embodiment, the device mounting plate is a capacitor mounting plate, which, after the protective cover for the device pins is mounted, forms a capacitor assembly. We will use the capacitor assembly for further explanation later.

[0025] Figure 3 This is a first-angle view of a preferred embodiment of the capacitor assembly of this utility model. Figure 4 This is a second-angle view of a preferred embodiment of the capacitor assembly of this utility model. Figure 5 This is a schematic diagram of the assembly of a preferred embodiment of the capacitor assembly of this utility model. Figure 6 This is a cross-sectional view showing the position of the capacitor pins of the capacitor assembly of this utility model. Figure 7 This is a cross-sectional view of the snap-fit ​​position of the capacitor assembly of this utility model.

[0026] like Figures 3-7 As shown, the capacitor assembly 200 of this utility model includes a plate 210, a plurality of capacitors 220 mounted on a first side of the plate 210, and a protective cover 100 for device pins mounted on a second side of the plate 210; the first side of the plate 210 faces away from the second side of the plate 210.

[0027] The protective cover 100 for the device pins includes a substrate 110, a cover wall 120 extending from a first side of the substrate 110 toward the plate 210, and a plurality of protrusions 140 disposed on a second side of the substrate 110; the first side of the substrate 110 faces away from the second side of the substrate 110; a plurality of mounting holes 130 are formed on the substrate 110; the pin 221 of each capacitor 220 passes through the plate 210 and is mounted in a mounting hole 130, and each protrusion 140 corresponds to a mounting hole 130 and avoids the pin 221 in the mounting hole 130; the plurality of protrusions 140 are distributed along the length and width directions of the substrate 110, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate 110.

[0028] The cover wall 120 includes a first sidewall 121 and a second sidewall 122 extending along the length direction of the substrate 110, and a third sidewall 123 and a fourth sidewall 124 extending along the width direction of the substrate 110. The first sidewall 121 and the second sidewall 122 are perpendicular to the third sidewall 123 and the fourth sidewall 124. The first sidewall 121 and the second sidewall 122 are provided with a locking interface for engaging the plate body 210. The third sidewall 123 and the fourth sidewall 124 are provided with a latch 126 for limiting the plate body 210. An L-shaped support plate 127 for raising the protective cover 100 of the device pins is provided on the outside of the locking interface 126. A positioning post 111 for positioning the plate body 210 is provided on the first side surface of the substrate 110.

[0029] In this preferred embodiment, after the capacitor 220 is soldered to the board 210, it is assembled onto the protective cover 100 of the device pins. The protective cover 100 is positioned by its positioning posts 111 and secured to the board 210 by its clips 126. The L-shaped support plate 127 is used to elevate the protective cover 100 of the device pins, ensuring good flow of potting compound after the entire capacitor assembly is soldered onto the motherboard. The protrusions 140 are used to avoid obstruction after the capacitor pins 221 are soldered; the staggered design of the protrusions 140 forms airflow channels.

[0030] In this capacitor assembly, before potting, protective covers for the device leads are first installed on one side of the board, and then potting is performed on the other side. Since each protrusion faces a mounting hole and is hollow to avoid obstructing the capacitor leads passing through the mounting hole, the capacitor leads are protected. Furthermore, because the multiple protrusions form a heat dissipation channel on the second side of the substrate, heat dissipation is facilitated. In addition, potting on the other side of the board ensures protection on both the capacitor lead side and the insertion side of the board.

[0031] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A protective cover for device pins, characterized in that, The device includes a substrate, a cover wall extending from a first side of the substrate away from the first side, and a plurality of protrusions disposed on a second side of the substrate; the first side of the substrate faces away from the second side of the substrate; a plurality of mounting holes are formed on the substrate; each protrusion faces a mounting hole and is hollow to avoid device pins passing through the mounting hole; the plurality of protrusions form a heat dissipation channel on the second side of the substrate.

2. The protective cover for the device pins according to claim 1, characterized in that, The plurality of protrusions are distributed along the length and width directions of the substrate, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate.

3. The protective cover for the device pins according to claim 2, characterized in that, The cover wall includes a first sidewall and a second sidewall extending along the length direction of the substrate, and a third sidewall and a fourth sidewall extending along the width direction of the substrate, wherein the first sidewall and the second sidewall are perpendicular to the third sidewall and the fourth sidewall. The first sidewall and the second sidewall are provided with card interfaces for engaging the device mounting plate; The third and fourth sidewalls are provided with clips for limiting the mounting plate of the device.

4. The protective cover for the device pins according to claim 3, characterized in that, An L-shaped support plate is provided on the outside of the card interface to raise the protective cover of the device pins.

5. The protective cover for the device pins according to claim 3, characterized in that, The first side of the substrate is provided with positioning posts for positioning the device mounting plate.

6. The protective cover for the device pins according to claim 3, characterized in that, The device mounting plate includes a plate body and a plurality of electronic devices mounted on a first side of the plate body. The pins of the electronic devices pass through the plate body and are mounted in the mounting holes. The plurality of protrusions correspond one-to-one with the pins of the electronic devices, and each protrusion avoids the pin of its corresponding electronic device.

7. A capacitor assembly, characterized in that, It includes a board body, multiple capacitors mounted on a first side of the board body, and protective covers for device pins mounted on a second side of the board body; the first side of the board body faces away from the second side of the board body. The protective cover for the device pins includes a substrate, a cover wall extending from a first side of the substrate toward the board body, and a plurality of protrusions disposed on a second side of the substrate; the first side of the substrate faces away from the second side of the substrate; a plurality of mounting holes are formed on the substrate; the pins of each capacitor pass through the board body and are mounted in a mounting hole, and each protrusion corresponds to a mounting hole and avoids the pins in the mounting hole. The plurality of protrusions are distributed along the length and width directions of the substrate, thereby forming a plurality of heat dissipation channels distributed along the length direction of the substrate.

8. The capacitor assembly according to claim 7, characterized in that, The cover wall includes a first sidewall and a second sidewall extending along the length direction of the substrate, and a third sidewall and a fourth sidewall extending along the width direction of the substrate, wherein the first sidewall and the second sidewall are perpendicular to the third sidewall and the fourth sidewall. The first sidewall and the second sidewall are provided with card interfaces for engaging the plate body; The third and fourth sidewalls are provided with buckles for limiting the plate.

9. The capacitor assembly according to claim 8, characterized in that, An L-shaped support plate is provided on the outer side of the card interface to raise the protective cover of the device pins; a positioning post is provided on the first side of the substrate to position the plate.

Images