Metal skeleton key core with enhanced heat dissipation
Patent Information
- Application Number
- CN202522371180.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-11-07
AI Technical Summary
部分设计虽采用金属材料以期改善散热，但结构较为单一，缺乏有效的热传导路径和散热面积，热量仍容易积聚
[0013]1.本实用新型中，在金属基板上冲压形成多个底部与背光模组直接接触的加强筋，并将金属基板作为主要的散热载体，背光模组产生的热量能够快速传导至金属基板，并通过具有较大表面积的加强筋进行散热，相邻加强筋之间形成的散热间隙，促进了键芯内部空气的微循环，结合了传导散热和空气对流散热两种模式，显著提升了整体的散热效率，有效避免了热量积聚，加强筋不仅用于散热，同时也显著增强了金属基板的结构强度和刚性，提升了产品的耐用性和手感稳定性；
Smart Images
Figure CN224841614U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of key core technology, specifically a metal skeleton key core with enhanced heat dissipation. Background Technology
[0002] As a common computer input device, the core component of a keyboard is the keycaps. With keyboards becoming thinner, lighter, and more backlit, the internal space of the keycaps is becoming increasingly compact, leading to more prominent heat dissipation issues. This is especially true in keyboards with backlight modules, where the light-emitting elements (such as LEDs) generate heat during operation. If this heat cannot be dissipated in time, it will accumulate inside the keycaps. Prolonged high-temperature operation not only accelerates the light decay of the backlight module, shortening its lifespan, but may also affect the electrical performance of the contacts on the conductive film, and even cause the overall keyboard temperature to rise, impacting the user experience.
[0003] Existing bond core structures mostly employ plastic skeletons or simple metal substrates, which have limited heat dissipation capabilities. While some designs utilize metal materials to improve heat dissipation, their structures are relatively simple, lacking effective heat conduction paths and heat dissipation areas, making it easy for heat to accumulate. Furthermore, the confined internal space of the bond core and poor airflow further restrict heat dissipation efficiency. Utility Model Content
[0004] To overcome the shortcomings of the prior art, the purpose of this utility model is to provide a metal skeleton key core that enhances heat dissipation.
[0005] The technical solution adopted by this utility model is as follows: a metal skeleton key core with enhanced heat dissipation, including a keycap, a conductive film, a metal substrate and a backlight module arranged from top to bottom, wherein the metal substrate has a plurality of reinforcing ribs stamped from top to bottom along its length direction, the bottom of the reinforcing ribs is attached to the upper surface of the backlight module, a heat dissipation gap for air circulation is formed between two adjacent reinforcing ribs, and the upper and lower surfaces of the metal substrate are respectively coated with a radiation heat dissipation coating and a thermally conductive coating.
[0006] In a preferred embodiment, the radiation heat dissipation coating is made of nano-scale rare earth element oxides, and the thickness of the heat dissipation coating is 10~15nm.
[0007] In a preferred embodiment, the thermally conductive coating is made of thermally conductive silicone grease, and the thickness of the thermally conductive coating is 20~45nm.
[0008] In a preferred embodiment, the conductive film is printed with a plurality of conductive contacts, and a corresponding metal spring is encapsulated on the conductive film above the conductive contacts.
[0009] In a preferred embodiment, a corresponding groove is provided on the metal substrate above the reinforcing rib.
[0010] In a preferred embodiment, a scissor leg is further provided between the keycap and the conductive film, and a through hole corresponding to the metal spring is opened at the center of the scissor leg.
[0011] In a preferred embodiment, the metal substrate and the keycap are provided with connecting ribs for connecting the scissor legs at opposite ends, and the conductive film and the metal substrate are provided with light-transmitting holes corresponding to the light-emitting positions in the backlight module.
[0012] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0013] 1. In this utility model, multiple reinforcing ribs with their bottoms in direct contact with the backlight module are stamped on a metal substrate, and the metal substrate is used as the main heat dissipation carrier. The heat generated by the backlight module can be quickly conducted to the metal substrate and dissipated through the reinforcing ribs with a large surface area. The heat dissipation gap formed between adjacent reinforcing ribs promotes the micro-circulation of air inside the core. Combining the two modes of conduction heat dissipation and air convection heat dissipation, the overall heat dissipation efficiency is significantly improved, and heat accumulation is effectively avoided. The reinforcing ribs not only serve to dissipate heat, but also significantly enhance the structural strength and rigidity of the metal substrate, improving the durability and feel stability of the product.
[0014] 2. In this utility model, coatings with different functions are respectively provided on the upper and lower surfaces of the metal substrate. The thermally conductive coating on the lower surface can reduce the contact thermal resistance and ensure that heat is efficiently introduced from the backlight module into the metal substrate. The heat dissipation coating on the upper surface can enhance the heat dissipation capacity of the metal substrate to the surrounding environment, thus achieving a synergistic heat dissipation effect. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the entire utility model;
[0016] Figure 2 for Figure 1 A simplified schematic diagram of the three-dimensional structure of a localized explosion.
[0017] Figure 3 This is a simplified schematic diagram of the three-dimensional structure of the metal substrate in this utility model;
[0018] Figure 4 This is a simplified schematic diagram of the layered structure of the metal substrate in this utility model.
[0019] Marked in the image:
[0020] 100-Metal skeleton key core;
[0021] 110-Keycaps, 120-Scissor-switch switches, 130-Conductive film, 140-Metal substrate, 150-Backlight module, 160-Heat dissipation coating, 170-Temperature conductive coating;
[0022] 131 - Metal spring, 132 - Conductive contact;
[0023] 141-Connecting rib, 142-Groove, 143-Reinforcing rib, 144-Light-transmitting hole, 145-Heat dissipation gap. Detailed Implementation
[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0025] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0027] A metal skeleton key core with enhanced heat dissipation, as shown in the reference. Figure 1-4The system includes, from top to bottom, a keycap 110, a conductive film 130, a metal substrate 140, and a backlight module 150. The metal substrate 140 has multiple reinforcing ribs 143 stamped from top to bottom along its length. The bottom of each reinforcing rib 143 is in contact with the upper surface of the backlight module 150. A heat dissipation gap 145 for airflow is formed between adjacent reinforcing ribs 143. Multiple reinforcing ribs 143 with their bottoms in direct contact with the backlight module 150 are stamped on the metal substrate 140, which serves as the primary heat dissipation carrier. The heat generated by the backlight module 150 can be quickly conducted to the metal substrate 140 and dissipated through the reinforcing ribs 143 with a large surface area. The heat dissipation gap 145 formed between adjacent reinforcing ribs 143 promotes the micro-circulation of air inside the core. Combining the two modes of conduction heat dissipation and air convection heat dissipation, it significantly improves the overall heat dissipation efficiency and effectively avoids heat accumulation. In addition, the reinforcing ribs 143 not only serve to dissipate heat, but also significantly enhance the structural strength and rigidity of the metal substrate 140, improving the durability and tactile stability of the product.
[0028] In this embodiment, please refer to Figure 4 As shown, the upper and lower surfaces of the metal substrate 140 are coated with a heat dissipation coating 160 and a thermally conductive coating 170, respectively. The heat dissipation coating 160 is made of nano-scale rare earth element oxides and has a thickness of 10~15nm. The thermally conductive coating 170 is made of thermally conductive silicone grease and has a thickness of 20~45nm. Different functional coatings are set on the upper and lower surfaces of the metal substrate 140. The thermally conductive coating 160 on the lower surface can reduce the contact thermal resistance and ensure that heat is efficiently transferred from the backlight module 150 to the metal substrate 140. The heat dissipation coating 160 on the upper surface can enhance the radiative heat dissipation capability of the metal substrate 140 to the surrounding environment, thus achieving a synergistic heat dissipation effect.
[0029] Among them, nano-scale rare earth element oxides are made of materials with high thermal conductivity and infrared emissivity, such as carbon nanotubes and spinel metal oxides, and no specific restrictions are imposed here.
[0030] In this embodiment, please refer to Figure 2 As shown, the conductive film 130 has multiple conductive contacts 132 printed on it. Above the conductive contacts 132, a corresponding metal spring 131 is encapsulated on the conductive film 130. The metal spring 131 is preferably a wavelet. The thickness of the wavelet is less than that of the silicone key. Integrating the wavelet on the conductive film 130 can further reduce the thickness of the key core and the keyboard product, which can meet the ultra-thin design of the keyboard product.
[0031] In this embodiment, please refer to Figure 3As shown, a corresponding groove 142 is provided on the metal substrate 140 above the reinforcing rib 143. After stamping, the thickness of the two ends of the groove 142 and the bottom surface of the metal substrate 140 is reduced, which can reduce the heat dissipation path of the metal substrate 140 and improve the heat dissipation effect.
[0032] In this embodiment, please refer to Figure 2 and Figure 3 As shown, a scissor-switch 120 is also provided between the keycap 110 and the conductive film 130. The center of the scissor-switch 120 has a through hole corresponding to the metal spring 131. The addition of the scissor-switch 120 allows the user to get a good smooth feel no matter where the keycap 110 is pressed, and also improves the quietness of pressing the key.
[0033] In this embodiment, please refer to Figure 2 and Figure 3 As shown, the metal substrate 140 and the keycap 110 are both provided with connecting ribs 141 for connecting the scissor-switch feet 120. The conductive film 130 and the metal substrate 140 are both provided with light-transmitting holes 144 corresponding to the light-emitting positions in the backlight module 150. The connecting ribs 141 ensure the stability of the scissor-switch feet 120 and ensure the key feel. The light-transmitting holes ensure the realization of the backlight function and can also be used as ventilation holes for better heat dissipation.
[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A metal skeleton key core with enhanced heat dissipation, characterized in that, The device includes a keycap, a conductive film, a metal substrate, and a backlight module arranged from top to bottom. The metal substrate has multiple reinforcing ribs formed by stamping from top to bottom along its length. The bottom of the reinforcing ribs is attached to the upper surface of the backlight module. A heat dissipation gap for air circulation is formed between two adjacent reinforcing ribs. The upper and lower surfaces of the metal substrate are coated with a heat dissipation coating and a heat-conducting coating, respectively.
2. The enhanced heat dissipation metal skeleton key core as described in claim 1, characterized in that: The heat dissipation coating is made of nano-scale rare earth element oxides, and the thickness of the heat dissipation coating is 10~15nm.
3. The enhanced heat dissipation metal skeleton key core as described in claim 2, characterized in that: The thermally conductive coating is made of thermally conductive silicone grease, and the thickness of the thermally conductive coating is 20~45nm.
4. The enhanced heat dissipation metal skeleton key core as described in claim 1, characterized in that: The conductive film is printed with multiple conductive contacts, and a corresponding metal spring is encapsulated on the conductive film above each conductive contact.
5. The enhanced heat dissipation metal skeleton key core as described in claim 4, characterized in that: The reinforcing rib has a corresponding groove on the metal substrate above it.
6. The enhanced heat dissipation metal skeleton key core as described in claim 5, characterized in that: A scissor-shaped pin is provided between the keycap and the conductive film, and a through hole corresponding to the metal spring is opened at the center of the scissor-shaped pin.
7. The enhanced heat dissipation metal skeleton key core as described in claim 6, characterized in that: Both the metal substrate and the keycap have connecting ribs for connecting the scissor legs at their opposite ends, and both the conductive film and the metal substrate have light-transmitting holes corresponding to the light-emitting positions in the backlight module.