Device package structure and electronic product

Abstract

The application provides a device packaging structure and electronic product, the device packaging structure comprises a substrate, a printed circuit board and a connecting part connected between the substrate and the printed circuit board; the substrate comprises a first conductor layer, a second conductor layer, a third conductor layer, a fourth conductor layer and a dielectric layer between every two adjacent conductor layers; the second conductor layer is grounded; the third conductor layer and the fourth conductor layer each comprise a metal frame, the edge of the metal frame is connected with the second conductor layer through a first through hole; the fourth conductor layer further comprises a metal sheet, the metal sheet is located in the metal frame in the fourth conductor layer; the metal sheet is connected with the second conductor layer through at least one second through hole; the third conductor layer further comprises a transmission line, the transmission line, the metal sheet, the second through hole and the second conductor layer form a planar inverted F antenna structure.

Description

Technical Field

[0001] This application relates to the field of semiconductor device technology, and in particular to a device packaging structure and electronic product. Background Technology

[0002] Millimeter-wave waveguide packaging offers advantages such as low loss and low cost. Among these, patch antennas, which are directly printed on a substrate, have become a mainstream method due to their simple design and mature manufacturing process. However, the narrow bandwidth of this type of packaging is limited by the narrow-band characteristics of patch antennas. To achieve a wider bandwidth, the existing technology mainly uses increasing the substrate thickness. This method can increase the bandwidth, but it also increases the cost. In addition, a thicker substrate increases the drilling diameter and reduces the processing precision. Utility Model Content

[0003] To address the existing technical problems, this application provides a device packaging structure and electronic product that can increase transmission bandwidth without increasing substrate thickness.

[0004] In a first aspect, embodiments of this application provide a device packaging structure, including: a substrate, a printed circuit board, and a connection portion connecting the substrate and the printed circuit board; the substrate includes a first conductor layer, a second conductor layer, a third conductor layer, a fourth conductor layer, and a dielectric layer located between every two adjacent conductor layers; the second conductor layer is grounded; the third conductor layer and the fourth conductor layer each include a metal frame, the edge of the metal frame being connected to the second conductor layer through a first via; the fourth conductor layer further includes a metal sheet located within the metal frame in the fourth conductor layer; the metal sheet is connected to the second conductor layer through at least one second via; the third conductor layer further includes a transmission line, and the transmission line, the metal sheet, the second via, and the second conductor layer constitute a planar inverted-F antenna structure.

[0005] In a second aspect, an electronic product is provided, including the device packaging structure described in any embodiment of this application.

[0006] In the device packaging structure provided in the above embodiments, the third conductor layer and the fourth conductor layer each include a metal frame, the edge of which is connected to the second conductor layer through a first via. The fourth conductor layer also includes a metal sheet located within the metal frame. The metal sheet is connected to the second conductor layer through at least one second via. The third conductor layer also includes a transmission line. The transmission line, the metal sheet, the second via, and the second conductor layer constitute a planar inverted-F antenna structure. Thus, the cavity formed by the metal frame and the first via constitutes an equivalent waveguide. The metal sheet located in the equivalent waveguide on the fourth conductor layer, the via connecting the metal sheet to the second conductor layer (which serves as a reference ground), and the transmission line feeding the metal sheet together form a planar inverted-F antenna (PIFA). Compared to patch antennas, PIFA has a wider bandwidth, does not require increased substrate thickness, reduces costs, and improves processing accuracy.

[0007] The electronic products provided in the above embodiments belong to the same concept as the corresponding packaging structure embodiments, and thus have the same technical effects as the corresponding packaging structure embodiments, which will not be repeated here. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the device packaging structure in one embodiment of this application; Figure 2 This is a schematic diagram showing the position of the bare die in one embodiment of this application; Figure 3 This is a cross-sectional view along the wide side direction of the device package structure with wide-side direct-connection power supply in one embodiment of this application; Figure 4 This is a cross-sectional view of the device package structure with wide-side direct-connection power supply in one embodiment of this application along the narrow-side direction; Figure 5 This is a top view of the device package structure with wide-side direct-connection power supply in one embodiment of this application; Figure 6 This is a cross-sectional view along the narrow side direction of the device package structure with narrow-side direct-connection power supply in one embodiment of this application; Figure 7 This is a top view of the device package structure with narrow-edge direct-connect power supply in one embodiment of this application; Figure 8 This is a cross-sectional view along the wide side direction of the device package structure with wide-side coupling feeding in one embodiment of this application; Figure 9 This is a cross-sectional view of the device package structure with wide-side coupling and feeding in one embodiment of this application along the narrow side direction; Figure 10This is a cross-sectional view along the narrow side direction of the device package structure with narrow-side coupling feeding in one embodiment of this application.

[0009] Explanation of reference numerals in the attached figures 1. Substrate; 11. First conductor layer; 12. Second conductor layer; 13. Third conductor layer; 131. First metal frame; 14. Fourth conductor layer; 141. Second metal frame; 15. Dielectric layer; 2. Printed circuit board; 21. Waveguide interface; 3. Connector; 51. First through hole; 52. Second through hole; 53. Third through hole; 6. Metal sheet; 7. Transmission line; 8. Bare die. Detailed Implementation

[0010] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0011] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of this application will be provided in conjunction with the accompanying drawings. The described embodiments should not be considered as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] In the following description, the phrase "some embodiments" refers to a subset of all possible embodiments. It should be noted that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0013] In the following description, the terms "first," "second," and "third" are used merely to distinguish similar objects and do not represent a specific ordering of the objects. It is understood that "first," "second," and "third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0014] like Figure 1 As shown, one embodiment of this application provides a device packaging structure, including: a substrate 1, a printed circuit board 2, and a connection portion 3 connecting the substrate 1 and the printed circuit board 2; The substrate 1 includes a first conductor layer 11, a second conductor layer 12, a third conductor layer 13, a fourth conductor layer 14, and a dielectric layer 15 located between every two adjacent conductor layers; the second conductor layer 12 is grounded; The third conductor layer 13 and the fourth conductor layer 14 each include a metal frame, and the edge of the metal frame is connected to the second conductor layer 12 through the first through hole 51; The fourth conductor layer 14 also includes a metal sheet 6, which is located within a metal frame in the fourth conductor layer 14; the metal sheet 6 is connected to the second conductor layer 12 through at least one second through hole 52; the third conductor layer 13 also includes a transmission line 7, which constitutes a planar inverted F antenna structure.

[0015] Here, the metal frame may include a first metal frame 131 and a second metal frame 141. The third conductor layer 13 and the fourth conductor layer 14 each include a metal frame, which means that the third conductor layer 13 includes a first metal frame 131 and the fourth conductor layer 14 includes a second metal frame 141.

[0016] In one embodiment, such as Figure 2 As shown, the device package structure may also include a die 8, which is located on the substrate 1, for example, on the first conductor layer 11. The die 8 can be connected to the transmission line 7 for transmitting electromagnetic wave signals through the transmission line 7. For example, the die 8 can be fixedly connected to the substrate 1 by metal bumps and electrically connected to the transmission line 7 through the metal bumps and the traces in the substrate 1.

[0017] The die 8 may contain components and the circuit structure containing those components. These components or circuit structure may be connected to the transmission line 7, for example, through metal bumps and traces in the substrate 1. The die 8 receives electromagnetic wave signals through the transmission line 7 and / or transmits electromagnetic wave signals through the transmission line 7.

[0018] In one embodiment, the device packaging structure can be a millimeter-wave waveguide packaging structure. The printed circuit board (PCB) 2 can include a waveguide interface 21 for transmitting electromagnetic waves. The edge of the waveguide structure 21 is aligned with the edge of the metal frame, for example, with the inner edge of the metal frame, where the inner edge is the edge of the rectangular region forming the middle, i.e., the inner region. The connection part 3 can be a solder ball, gold ball, copper pillar, or other type, and there can be one or more connection parts 3 between the substrate 1 and the printed circuit board 2.

[0019] In one embodiment, the substrate 1 includes a conductor layer and a dielectric layer 15. The conductor layer includes at least a first conductor layer 11, a second conductor layer 12, a third conductor layer 13, and a fourth conductor layer 14, with a dielectric layer 15 between every two adjacent conductor layers. The conductor layer may contain a metallic structure for providing electrical connections.

[0020] In one embodiment, the substrate 1 is located above the printed circuit board 2, and the conductor layers in the substrate 1 can be, from top to bottom, a first conductor layer 11, a second conductor layer 12, a third conductor layer 13 and a fourth conductor layer 14, that is, the fourth conductor layer 14 is closest to the printed circuit board 2.

[0021] In one embodiment, the first conductor layer 11 is designated as layer L1, and can be a routing layer, such as for peripheral circuit routing. The second conductor layer 12 is designated as layer L2, and can be grounded to serve as a reference ground. The third conductor layer 13 is designated as layer L3, and the fourth conductor layer 14 is designated as layer L4. Each of the third conductor layer 13 and the fourth conductor layer 14 includes a metal frame; for example, the third conductor layer 13 contains a first metal frame 131, and the fourth conductor layer 14 contains a second metal frame 141.

[0022] In one embodiment, the metal frame is made of a metallic conductor. The metal frame may be a conductor layer with a rectangular region in the middle, and this rectangular region is made of a non-metallic material. The rectangular regions in the middle of the first metal frame 131 and the second metal frame 141 are aligned, and the two rectangular regions together form an open metal cavity.

[0023] In one embodiment, the first metal frame 131 in the third conductor layer 13 and the second metal frame 141 in the fourth conductor layer 14 can be aligned, for example, the edges of the two metal frames are perfectly aligned in the vertical direction. The vertical direction is the direction in which the substrate 1 and the printed circuit board 2 are stacked. The edge of the first metal frame 131 may have an opening, through which the transmission line 7 is routed to the top of the metal sheet 6.

[0024] In one embodiment, Figure 1 This is a cross-sectional view of the above-described device package structure along a first direction perpendicular to the direction. The first direction can be the length direction of the transmission line 7, for example, as shown below. Figure 5 As shown, when the transmission line 7 is positioned on the long side of the metal sheet 6, i.e., close to one of the long sides of the metal sheet 6, the length direction of the transmission line 7, i.e., the first direction, is the direction of the short side of the metal sheet 6.

[0025] In one embodiment, the vias (VIAs) in the substrate 1 include a first via 51, a second via 52, and a third via 53, all of which can be metal vias. A first via 51 can be used to connect a first metal frame 131 in the third conductor layer 13, a second metal frame 141 in the fourth conductor layer 14, and a second conductor layer 12. For example, multiple points on the edge of the second metal frame 141 in the fourth conductor layer 14 are respectively connected to the points on the edge of the first metal frame 131 and the second conductor layer 12 through the first via 51.

[0026] In one embodiment, connection to the second conductor layer 12 may refer to connection to a metal structure in the second conductor layer 12, wherein the metal structure in the second conductor layer 12 is grounded.

[0027] In one embodiment, the metal sheet 6 is located within the metal frame of the fourth conductor layer 14, specifically within the rectangular region formed by the edge of the second metal frame 141. Here, the edge can refer to the inner edge. The inner edge of the first metal frame 131 can form the same rectangular region; for example, the edges of the two rectangular regions can be aligned, meaning the inner edges of the first metal frame 131 and the second metal frame 141 are aligned. The center of the metal sheet 6 can coincide with the center of the second metal frame 141, or it can coincide with the center of this internal region. The edge of the metal sheet 6 can be obtained by proportionally reducing the edge of the metal frame, thereby achieving efficient power feeding.

[0028] In one embodiment, the edge of the metal sheet 6 can be rectangular, wherein the size of one pair of sides can be 1 / 4 of the operating wavelength corresponding to the operating mode of the packaging structure. For example, the size of the long or short side of the edge of the metal sheet 6 is 1 / 4 of the aforementioned operating wavelength. The size of the other pair of sides can be any value that does not exceed the edge of the metal frame, for example, the other pair of sides can be the short side, etc.

[0029] In one embodiment, the metal sheet 6 can be located in the middle of the fourth conductor layer 14, and the transmission line 7 can be laid from one side of the third conductor layer 13 into the first metal frame 131 to form a direct connection or coupled connection with the metal sheet 6. The first end of the transmission line 7, as the end that feeds the metal sheet 6, can be close to one side of the metal sheet 6. For example, when the metal sheet 6 is rectangular, it can be close to the long side or short side of the metal sheet 6.

[0030] In one embodiment, the transmission line 7, the metal sheet 6, the second through hole 52, and the second conductor layer 12 constitute a planar inverted-F antenna structure. This can refer to the transmission line 7, the metal sheet 6, the second through hole 52, and the second conductor layer 12 forming an inverted-F shape on the cross-section along the long side and / or short side of the metal sheet 6, thereby forming a planar inverted-F antenna structure (PIFA).

[0031] In one embodiment, the metal sheet 6 can also be connected to the transmission line 7 through the third through-hole 53, for example, to the first end of the transmission line 7, thereby forming a direct feed. Alternatively, the metal sheet 6 may not be connected to the transmission line 7, thereby forming a coupled feed.

[0032] Thus, the cavity formed by the metal frame and the first through hole 51 constitutes an equivalent waveguide, and the metal sheet 6 located in the equivalent waveguide on the fourth conductor layer 14, the through hole connecting the metal sheet 6 to the second conductor layer 12 which serves as a reference ground, and the transmission line 7 fed between the metal sheet 6 together form a PIFA structure. Compared with patch antennas, it has a wider bandwidth, does not require increasing the thickness of the substrate 1, reduces costs, and can improve processing accuracy.

[0033] In some embodiments, the edge of the metal sheet 6 is a rectangle obtained by proportionally reducing the edge of the metal frame.

[0034] In one embodiment, the metal sheet 6 can be made of the same material as the metal frame.

[0035] In one embodiment, the metal frame is rectangular, the edge of the metal sheet 6 is also rectangular, and the center of the metal sheet 6 coincides with the center of the area formed by the metal frame, for example, with the center of the internal area formed by the second metal frame 141.

[0036] In one embodiment, the edge can refer to the inner edge.

[0037] In one embodiment, the edge of the metal sheet 6 is a rectangle obtained by proportionally reducing the edge of the metal frame. This can refer to the ratio of the long side of the metal sheet 6 to the long side of the metal frame being equal to the ratio of the short side of the metal sheet 6 to the short side of the metal frame. The metal frame here can be either the first metal frame 131 or the second metal frame 141.

[0038] Thus, the metal frame in the third conductor layer 13 and the metal frame in the fourth conductor layer 14, through the first through hole 51 and the opening metal cavity formed by the second conductor layer 12, can serve as an equivalent waveguide structure. The metal sheet 6 is located in the middle of the equivalent waveguide structure and is proportionally related to the opening of the cross section of the equivalent waveguide structure, which can improve the matching effect between the metal sheet 6 and the waveguide and improve the transmission efficiency.

[0039] In some embodiments, the edge of the metal sheet 6 includes a pair of long sides and a pair of short sides; The first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, and the first end is the end that is fed by the metal sheet 6.

[0040] In one embodiment, the edge of the metal sheet 6 is rectangular, for example, a rectangle with the same shape as the metal frame but scaled down proportionally. The length of the longer side is greater than the length of the shorter side. The metal frame here can be either the first metal frame 131 or the second metal frame 141.

[0041] In one embodiment, when the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, the length direction of the transmission line 7 can be perpendicular to the long side and parallel to the short side. The first end of the transmission line 7 being close to the long side can mean that the vertical projection of the first end onto the fourth conductor layer 14 is located on the long side, or that the distance from the vertical projection of the first end onto the fourth conductor layer 14 to the long side is less than the distance to other edges of the metal sheet 6.

[0042] In one embodiment, the vertical projection of the first end of the transmission line 7 onto the fourth conductor layer 14 may be located at the midpoint of the nearest long side, or the vertical projection of the first end onto the fourth conductor layer 14 and the perpendicular line from the nearest long side intersect the long side at the midpoint of the long side.

[0043] In one embodiment, the first end of the transmission line 7 may be connected to the long side near the metal sheet 6, for example, through the third through hole 53, or it may not be connected.

[0044] In one embodiment, the first end of the transmission line 7 is close to a long side of the metal sheet 6, which can form a feed with the wide side of the waveguide. The waveguide can refer to the waveguide interface 21 in the printed circuit board 2. The waveguide interface 21 can include a wide side and a narrow side, with the wide side corresponding to the long side of the metal sheet 6 and the narrow side corresponding to the short side of the metal sheet 6.

[0045] In some embodiments, the edge of the metal sheet 6 includes a pair of long sides and a pair of short sides; The first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, and the first end is the end that is fed by the metal sheet 6.

[0046] In one embodiment, when the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, the length direction of the transmission line 7 can be perpendicular to the short side and parallel to the long side. The first end of the transmission line 7 being close to the short side can mean that the vertical projection of the first end onto the fourth conductor layer 14 is located on the short side, or that the distance from the vertical projection of the first end onto the fourth conductor layer 14 to the short side is less than the distance to other edges of the metal sheet 6.

[0047] In one embodiment, the vertical projection of the first end of the transmission line 7 onto the fourth conductor layer 14 may be located at the midpoint of the nearest short side, or the vertical projection of the first end onto the fourth conductor layer 14 may intersect the short side at the midpoint of the short side with the perpendicular line from the nearest short side.

[0048] In one embodiment, the first end of the transmission line 7 may be connected to the short side near the metal sheet 6, for example, through the third through hole 53, or it may not be connected.

[0049] In one embodiment, the first end of the transmission line 7 is close to a short side of the metal sheet 6, which can form a feed to the narrow side of the waveguide. The waveguide can refer to the waveguide interface 21 in the printed circuit board 2. The waveguide interface 21 can include a wide side and a narrow side, with the wide side corresponding to the long side of the metal sheet 6 and the narrow side corresponding to the short side of the metal sheet 6.

[0050] Thus, one end of the transmission line 7 corresponds to the long or short side of the metal sheet 6, and the long or short side is fed to the metal sheet 6, thereby forming a wide-side feeding mode or a narrow-side feeding mode of the waveguide structure, improving applicability.

[0051] In some embodiments, the metal sheet 6 is connected to the first end of the transmission line 7 through the third through hole 53, forming a direct power supply between the metal sheet 6 and the transmission line 7.

[0052] In one embodiment, the third through hole 53 is also a metal through hole.

[0053] In one embodiment, when the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, the metal sheet 6 is connected to the first end of the transmission line 7 through the third through hole 53, such as... Figure 3 and 4 The figures shown are cross-sectional views of the above-mentioned device packaging structure along the first and second directions, respectively. Figure 3 This is a cross-sectional view along the first direction, i.e., the long side direction of metal sheet 6, which is also the wide side direction of the waveguide. Figure 4 This is a cross-sectional view along the second direction perpendicular to the first direction, i.e., the direction of the short side of metal sheet 6. The direction of the short side of metal sheet 6 is the direction of the narrow side of the waveguide. At this time, the transmission line 7 and the waveguide interface form a wide-side direct-connection feed.

[0054] In one embodiment, when the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, such as Figure 5 The image shown is a top view of the above-described device package structure along the vertical direction. The number of first through-holes 51 and second through-holes 52 can both be one or more. The metal sheet 6 is connected to the first end of the transmission line 7 through a third through-hole 53. The connection point on the metal sheet 6 with the third through-hole 53 can be located on a long side of the edge of the metal sheet 6, or the connection point on the metal sheet 6 with the third through-hole 53 can be close to a long side of the edge of the metal sheet 6.

[0055] In one embodiment, the connection point on the metal sheet 6 with the third through hole 53 can be located at the midpoint of a long side of the edge of the metal sheet 6, or the perpendicular line from the connection point on the metal sheet 6 with the nearest long side intersects the long side at the midpoint of the long side.

[0056] In one embodiment, when the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, such as Figure 6 The figure shows a cross-sectional view along the first direction, i.e., the direction of the short side of metal sheet 6.

[0057] In one embodiment, when the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, such as Figure 7 The image shows a top view of the above-described device package structure along the vertical direction. The metal sheet 6 is connected to the first end of the transmission line 7 through the third through-hole 53. The connection point on the metal sheet 6 to the third through-hole 53 can be located on a short side of the edge of the metal sheet 6, or the connection point on the metal sheet 6 to the third through-hole 53 can be located near a short side of the edge of the metal sheet 6. In this case, the transmission line 7 and the waveguide interface 21 form a narrow-edge direct-connection power supply.

[0058] In one embodiment, the connection point on the metal sheet 6 with the third through hole 53 can be located at the midpoint of a short side of the edge of the metal sheet 6, or the perpendicular line from the connection point on the metal sheet 6 with the nearest short side intersects the short side at the midpoint of the short side.

[0059] Thus, the metal sheet 6 and the transmission line 7 are connected through a metal through-hole, thereby forming a direct power supply method between the metal sheet 6 and the transmission line 7.

[0060] In some embodiments, the metal sheet 6 and the first end of the transmission line 7 are fed through coupling via the dielectric layer 15.

[0061] In one embodiment, the metal sheet 6 is not connected to the first end of the transmission line 7 through a via, thereby forming a coupled power supply based on the dielectric layer 15 between the third conductor layer 13 and the fourth conductor layer 14.

[0062] In one embodiment, when the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, such as Figure 8 and 9 The figures shown are cross-sectional views of the above-mentioned device packaging structure along the first and second directions, respectively. Figure 8 This is a cross-sectional view along the first direction, i.e., the long side of metal sheet 6. Figure 9 This is a cross-sectional view along the second direction perpendicular to the first direction, i.e., the direction of the short side of the metal sheet 6. At this time, the transmission line 7 and the waveguide interface 21 form a wide-side coupled feed.

[0063] In one embodiment, when the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, such as Figure 5 The image shown is a top view of the above-mentioned device package structure along the vertical direction. The metal sheet 6 is coupled and fed to the first end of the transmission line 7. The vertical projection of the first end of the transmission line 7 onto the metal sheet 6 can be located on a long side of the edge of the metal sheet 6, or the vertical projection of the first end of the transmission line 7 onto the metal sheet 6 can be close to a long side of the edge of the metal sheet 6.

[0064] In one embodiment, the vertical projection position of the first end of the transmission line 7 on the metal sheet 6 can be located at the midpoint of a long side of the edge of the metal sheet 6, or the vertical projection position of the first end of the transmission line 7 on the metal sheet 6 intersects the long side with a perpendicular line close to the long side at the midpoint of the long side.

[0065] In one embodiment, when the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, such as Figure 10 The figure shows a cross-sectional view along the first direction, i.e., the short side direction of the metal sheet 6. At this time, the transmission line 7 and the waveguide interface 21 form a narrow-side coupled feed.

[0066] In one embodiment, when the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, such as Figure 7 The image shown is a top view of the above-mentioned device packaging structure along the vertical direction. The metal sheet 6 is coupled and fed to the first end of the transmission line 7. The vertical projection of the first end of the transmission line 7 onto the metal sheet 6 can be located on a short side of the edge of the metal sheet 6, or the vertical projection of the first end of the transmission line 7 onto the metal sheet 6 can be close to a short side of the edge of the metal sheet 6.

[0067] In one embodiment, the vertical projection position of the first end of the transmission line 7 on the metal sheet 6 can be located at the midpoint of a short side of the edge of the metal sheet 6, or the vertical projection position of the first end of the transmission line 7 on the metal sheet 6 intersects the short side with a perpendicular line close to the short side at the midpoint of the short side.

[0068] In this way, no metal through-hole connection is required between the metal sheet 6 and the transmission line 7, thus forming a coupled power supply method between the metal sheet 6 and the transmission line 7.

[0069] In some embodiments, the printed circuit board 2 includes a waveguide interface 21; the edge of the waveguide interface 21 is aligned with the edge of the metal frame.

[0070] In one embodiment, the edge of the waveguide interface 21 is aligned with the edges of the metal frame in the third conductor layer 13 and the metal frame in the fourth conductor layer 14, so that the equivalent waveguide structure formed by the metal frames in the third conductor layer 13 and the fourth conductor layer 14 can be aligned with the waveguide interface 21 in the PCB, which is beneficial to improving transmission efficiency.

[0071] In one embodiment, the vertical projection area of ​​the metal sheet 6 on the printed circuit board 2 is located at the center of the waveguide interface 21. For example, the center of the vertical projection area of ​​the metal sheet 6 on the printed circuit board 2 coincides with the center of the waveguide interface 21.

[0072] In one embodiment, the edge of the waveguide interface 21 includes a wide side and a narrow side, the wide side corresponding to the long side of the metal sheet 6, and the narrow side corresponding to the short side of the metal sheet 6. When the first end of the transmission line 7 is close to one of the long sides of the metal sheet 6, the transmission line 7 and the waveguide interface 21 form a wide-side feeding configuration. When the first end of the transmission line 7 is close to one of the short sides of the metal sheet 6, the transmission line 7 and the waveguide interface 21 form a narrow-side feeding configuration.

[0073] In one embodiment, the metal sheet 6 is located in the central region of the metal frame on the fourth conductor layer 14.

[0074] In one embodiment, the geometric center of the metal sheet 6 coincides with the geometric center of the metal frame on the fourth conductor layer 14 and with the geometric center of the metal frame on the third conductor layer 13.

[0075] In one embodiment, the area of ​​the metal sheet 6 is less than the proportion of the area formed by the metal frame to a preset value, such as 60%, 55% or 50%, to avoid the metal sheet 6 occupying too large an area in the waveguide structure, resulting in poor feeding effect.

[0076] Thus, the metal sheet 6 is located in the center region of the equivalent waveguide structure in the substrate 1 and the waveguide interface 21 in the PCB, which can better provide power and improve transmission efficiency.

[0077] In some embodiments, the connection portion 3 is located between the fourth conductor layer 14 and the printed circuit board 2, and does not overlap with the vertical projection area corresponding to the metal frame.

[0078] In one embodiment, the vertical projection area corresponding to the metal frame is equivalent to the area corresponding to the waveguide interface 21 in the PCB.

[0079] In one embodiment, the connecting part 3 may be a solder ball. The connecting part 3 does not overlap with the vertical projection area corresponding to the metal frame. This means that the connecting part 3 is located outside the vertical projection area corresponding to the metal frame, and the distance from the center point of the solder ball to any edge of the metal frame is greater than or equal to the diameter of the solder ball.

[0080] This application also provides an electronic product including the device packaging structure described in any of the foregoing embodiments.

[0081] Here, "electronic products" can refer to a die, a chip, or other types of devices, circuits, or equipment that include the aforementioned packaging structure.

[0082] As one possible implementation, this embodiment provides a PIFA waveguide packaging structure, which mainly comprises three parts: 1. Substrate 1, named L1, L2, L3, and L4 from top to bottom; L1 is the wiring layer, L2 is the reference ground, and L3 and L4 contain a rectangular frame, i.e., a metal frame. The edge of the rectangular metal frame is connected to the L2 layer through metal vias, forming an open metal cavity. The open metal cavity is equivalent to a waveguide structure. Inside the open metal cavity, a rectangular conductor sheet (i.e., metal sheet 6) is printed on the L4 layer and located in the middle of the open metal cavity. The rectangular conductor sheet has one or more metal vias connected to the L2 layer. On the opposite side of this metal via, there is a metallized via connected to the transmission line 7 located on the L3 layer. The transmission line 7, the rectangular metal sheet containing the ground via, and the reference ground form a PIFA structure. 2. PCB containing equivalent waveguide vias (i.e., waveguide interface 21); 3. Solder balls connecting the PCB and the equivalent waveguide of substrate 1.

[0083] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0084] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A device packaging structure, characterized in that, include: A substrate, a printed circuit board, and a connection portion connecting the substrate and the printed circuit board; The substrate includes a first conductor layer, a second conductor layer, a third conductor layer, a fourth conductor layer, and a dielectric layer located between every two adjacent conductor layers; the second conductor layer is grounded; The third conductor layer and the fourth conductor layer each include a metal frame, and the edge of the metal frame is connected to the second conductor layer through a first through hole; The fourth conductor layer further includes a metal sheet located within a metal frame in the fourth conductor layer; the metal sheet is connected to the second conductor layer through at least one second through-hole. The third conductor layer also includes a transmission line, and the transmission line, the metal sheet, the second through hole, and the second conductor layer constitute a planar inverted F antenna structure.

2. The structure according to claim 1, characterized in that, The edge of the metal sheet is a rectangle obtained by proportionally reducing the edge of the metal frame.

3. The structure according to claim 1, characterized in that, The edge of the metal sheet includes a pair of long sides and a pair of short sides; The first end of the transmission line is close to one of the long sides of the metal sheet, and the first end is the end that is fed to the metal sheet.

4. The structure according to claim 1, characterized in that, The edge of the metal sheet includes a pair of long sides and a pair of short sides; The first end of the transmission line is close to one of the short sides of the metal sheet, and the first end is the end that is fed to the metal sheet.

5. The structure according to claim 3 or 4, characterized in that, The metal sheet is connected to the first end of the transmission line through a third through hole, forming a direct power supply between the metal sheet and the transmission line.

6. The structure according to claim 3 or 4, characterized in that, The metal sheet is fed to the first end of the transmission line via coupling through the dielectric layer.

7. The structure according to claim 1, characterized in that, The printed circuit board includes: a waveguide interface; The edge of the waveguide interface is aligned with the edge of the metal frame.

8. The structure according to claim 7, characterized in that, The metal sheet is located in the central region of the metal frame in the fourth conductor layer.

9. The structure according to claim 1, characterized in that, The connection portion is located between the fourth conductor layer and the printed circuit board, and does not overlap with the vertical projection area corresponding to the metal frame.

10. An electronic product, characterized in that, The device packaging structure includes any one of claims 1 to 9.

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