A millimeter wave antenna and radar system

Abstract

The embodiment of the application relates to the technical field of communication, and discloses a millimeter wave antenna and a radar system, the millimeter wave antenna comprises a substrate, a waveguide structure, a tin overflow prevention isolation unit and a tin breakage prevention reinforcing unit, the waveguide structure is arranged on the substrate, the waveguide structure comprises a first antenna component and a second antenna component, the first antenna component and the second antenna component are oppositely arranged to form a waveguide assembly, the tin overflow prevention isolation unit surrounds the waveguide assembly, and the tin breakage prevention reinforcing unit is arranged between the first antenna component and the second antenna component. In the above manner, the embodiment of the application can reduce the tin breakage probability, and even if local tin is broken, the connection strength and performance stability can still be maintained.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a millimeter-wave antenna and a radar system. Background Technology

[0002] With the rapid adoption of millimeter-wave radar technology in fields such as autonomous driving (e.g., collision avoidance detection, adaptive cruise control), millimeter-waveguide antennas, as core components of radar systems, have become crucial for industry competition in terms of performance stability and production economics. Currently, the mainstream millimeter-waveguide antennas in the industry adopt the "plastic metallization solution," which involves forming a waveguide structure through metallization treatment of the plastic substrate surface and connecting the upper and lower waveguide components through welding processes.

[0003] In the process of implementing the embodiments of this application, the inventors discovered that: at present, during the welding process of the upper and lower waveguide structures, it is very easy for solder overflow (solder overflows into the waveguide functional area) or solder breakage (discontinuous solder connection) to occur, which directly leads to changes in the internal state of the waveguide channel, and the antenna performance (such as reflection coefficient, gain, radiation pattern) deteriorates sharply and has poor consistency. Utility Model Content

[0004] The main technical problem solved by this application is to provide a millimeter-wave antenna that uses an anti-overflow solder isolation unit to enclose the waveguide assembly. This physical isolation confines the solder paste to non-critical areas, preventing contamination of the waveguide channel even if overflow occurs. This reduces the risk of "overflowing solder means scrap" in traditional solutions. The anti-solder breakage enhancement unit is located between the first and second antenna assemblies. Through a partitioned reinforcement design, it reduces the probability of solder breakage and maintains connection strength and performance stability even if there is local solder breakage.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: to provide a millimeter-wave antenna, including a substrate, a waveguide structure, an anti-overflow solder isolation unit, and an anti-solder breakage enhancement unit. The waveguide structure is disposed on the substrate, and the waveguide structure includes a first antenna assembly and a second antenna assembly. The first antenna assembly and the second antenna assembly are disposed opposite to each other to form a waveguide assembly. The anti-overflow solder isolation unit surrounds the waveguide assembly, and the anti-solder breakage enhancement unit is disposed between the first antenna assembly and the second antenna assembly.

[0006] Optionally, the anti-solder breakage enhancement unit includes a first solder-blocking component, and the waveguide structure further includes a first radiating portion, the first radiating portion being disposed on the first antenna component, and the first solder-blocking component surrounding the first radiating portion.

[0007] Optionally, the anti-solder breakage enhancement unit includes a second solder-blocking component, and the waveguide structure further includes a second radiating portion, which is disposed on the first antenna component, and the second solder-blocking component surrounds the second radiating portion.

[0008] Optionally, the first solder blocking assembly includes a plurality of first solder blocking elements, and the plurality of first solder blocking pillars are uniformly arranged around the first radiating portion.

[0009] Optionally, the millimeter-wave antenna further includes a choke assembly disposed between the first radiating part and the second radiating part.

[0010] Optionally, the anti-overflow solder isolation unit includes a first isolation component and a second isolation component, and the waveguide assembly includes a first waveguide channel and a second waveguide channel. One end of the first waveguide channel is connected to the first radiating part, and one end of the second waveguide channel is connected to the second radiating part. The first isolation component surrounds the first waveguide channel, and the second isolation component surrounds the second waveguide channel.

[0011] Optionally, the first antenna assembly includes a first surface and a second surface disposed opposite to each other, the first surface having a groove for accommodating the anti-overflow solder isolation unit.

[0012] Optionally, the waveguide assembly and the anti-overflow solder isolation unit are integrally formed.

[0013] Optionally, the anti-solder breakage enhancement unit includes a third solder barrier assembly, and the millimeter-wave antenna further includes a feeding assembly, the feeding assembly being electrically connected to the waveguide assembly, and the third solder barrier assembly being disposed on the feeding assembly.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide a radar system including any of the above-mentioned millimeter-wave antennas.

[0015] This application provides a millimeter-wave antenna, including a substrate, a waveguide structure, an anti-overflow solder isolation unit, and an anti-solder breakage enhancement unit. The waveguide structure is disposed on the substrate and includes a first antenna assembly and a second antenna assembly. The first antenna assembly and the second antenna assembly are arranged opposite to each other to form a waveguide assembly. The anti-overflow solder isolation unit surrounds the waveguide assembly, and the anti-solder breakage enhancement unit is disposed between the first antenna assembly and the second antenna assembly. By setting the anti-overflow solder isolation unit to surround the waveguide assembly, the solder paste is restricted to non-critical areas through physical isolation. Even if overflow occurs, it will not contaminate the waveguide channel, reducing the risk of "overflow means scrap" in traditional solutions. The anti-solder breakage enhancement unit is disposed between the first antenna assembly and the second antenna assembly. Through a partitioned reinforcement design, it reduces the probability of solder breakage. Even if there is local solder breakage, the connection strength and performance stability can still be maintained. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0017] Figure 1 This is a schematic diagram of a millimeter-wave antenna according to an embodiment of this application; Figure 2 This is an exploded view of the millimeter-wave antenna according to an embodiment of this application; Figure 3 This is a partial structural schematic diagram of the millimeter-wave antenna according to an embodiment of this application; Figure 4 This is a gain diagram of the millimeter-wave antenna according to an embodiment of this application.

[0018] The reference numerals in the detailed embodiments are as follows: 100, millimeter-wave antenna; 10, substrate; 20, waveguide structure; 21, first antenna assembly; 201, first surface; 22, second antenna assembly; 23, first radiating part; 24, second radiating part; 25, waveguide assembly; 30, anti-overflow solder isolation unit; 31, first isolation element; 32, second isolation element; 40, anti-solder breakage enhancement unit; 41, first solder barrier assembly; 401, first solder barrier element; 42, second solder barrier assembly; 50, choke assembly. Detailed Implementation

[0019] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0021] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0022] This embodiment provides a millimeter-wave antenna with an operating frequency range of 76-77 GHz, suitable for applications such as autonomous driving millimeter-wave radar and industrial radar.

[0023] Please refer to this embodiment. Figure 1 and Figure 2 The millimeter-wave antenna 100 includes a substrate 10, a waveguide structure 20, an anti-overflow solder isolation unit 30, and an anti-solder breakage enhancement unit 40.

[0024] The substrate 10 is made of FR-4 epoxy board material, which provides stability and protection, ensuring the overall structural strength and electromagnetic compatibility. A waveguide structure 20 is disposed on the substrate 10, including a first antenna assembly 21 and a second antenna assembly 22. The first antenna assembly 21 and the second antenna assembly 22 are arranged opposite each other to form a waveguide assembly. Both the first antenna assembly 21 and the second antenna assembly 22 are manufactured using LCP (liquid crystal polymer) material through injection molding, followed by metallization treatment, with copper and nickel plating on the surface to form a conductive layer. The waveguide structure 20 also includes a first radiating section 23, which is disposed on the first antenna assembly 21. The first radiating section 23 includes first radiating holes, which are arranged in an array and are responsible for the transmission and reception of millimeter-wave energy. A choke assembly 50 is provided around the first radiating section 23 to limit surface current diffusion and reduce electromagnetic interference between the array units of each radiating section. An anti-overflow solder isolation unit 30 surrounds the waveguide assembly 25, isolating the soldering area of ​​the waveguide assembly from the inside of the waveguide channel, limiting the range of solder paste flow, and preventing overflow solder from contaminating the channel. The anti-solder breakage enhancement unit 40 is disposed between the first antenna assembly 21 and the second antenna assembly 22. This embodiment structurally solves the problems of solder overflow and breakage through the design of the anti-solder overflow isolation unit 30 and the anti-solder breakage enhancement unit 40. The anti-solder overflow isolation unit 30 physically isolates the solder paste to non-critical areas, avoiding the performance degradation caused by solder overflow in traditional solutions. The first solder-blocking assembly 41 reduces the probability of solder breakage and improves connection reliability through a partitioned reinforcement design. Even if localized solder breakage occurs, the anti-solder breakage enhancement unit 40 can still maintain connection strength and performance stability.

[0025] Please combine Figure 4Through the above technical solution, the millimeter-wave antenna 100 achieves an antenna gain of 12.38 dBi, a sidelobe suppression better than -21 dB, and a radiation efficiency of 0.034 dB in the 76 GHz band. Its performance indicators are stable and unaffected by welding defects, and the production yield has been increased from less than 60% in the traditional solution to more than 90%.

[0026] Please see Figure 2 The waveguide structure 20 includes a first radiating section 23 and a second radiating section 24, both of which are disposed on the first antenna assembly 21. The first radiating section 23 includes a first radiating aperture, and the second radiating section 24 includes a second radiating aperture. The first and second radiating apertures are arranged in an array and are responsible for the transmission and reception of millimeter-wave energy. The anti-solder breakage enhancement unit 40 includes a first solder blocking assembly 41 and a second solder blocking assembly 42. The first solder blocking assembly 41 surrounds the first radiating section 23, and the second solder blocking assembly 42 surrounds the second radiating section 24. The first solder blocking assembly 41 includes a plurality of first solder blocking elements 401, which are uniformly distributed around the first radiating aperture. The second solder blocking assembly 42 includes a plurality of second solder blocking elements, which are uniformly distributed around the second radiating aperture. Preferably, the first solder blocking elements 401 and the second solder blocking elements are both cylindrical structures integrally formed with the second antenna assembly 22.

[0027] The millimeter-wave antenna 100 also includes a choke assembly 50 disposed between the first radiating portion 23 and the second radiating portion 24. The choke assembly 50 includes a choke slot, which is used to limit the diffusion of surface current between the first radiating portion 23 and the second radiating portion 24, reduce electromagnetic interference between array elements, and improve the isolation of the antenna array.

[0028] In this embodiment, the waveguide structure 20 includes multiple independent radiating sections, each with a radiating aperture responsible for transmitting and receiving millimeter-wave energy in a specific area. Correspondingly, multiple choke components 50 are configured between and around the radiating sections, forming a choke slot network. These multiple radiating sections enable spatial diversity and beamforming functions for the millimeter-wave antenna 100. Through the coordinated operation of multiple radiating sections, the millimeter-wave antenna 100 can achieve higher gain and more precise beam control, meeting the technical requirements of 76-77 GHz band millimeter-wave radar for detection accuracy and coverage.

[0029] In this embodiment, the waveguide assembly is welded using laser welding, with solder paste applied to the welding areas corresponding to the first solder barrier 41 and the second solder barrier 42. The first solder barrier 401 and the second solder barrier, supported by pillars, enhance the deformation resistance of the resonant cavities of the first radiating part 23 and the second radiating part 24. This embodiment further improves the structural stability of multiple radiating elements in the antenna array by adding the second solder barrier 42. The choke assembly 50 effectively improves the electromagnetic isolation performance between the first radiating part 23 and the second radiating part 24, reduces mutual coupling interference between adjacent radiating parts, and improves the overall performance consistency of the millimeter-wave antenna 100. The distribution of multiple choke assemblies 50 provides more complete electromagnetic isolation performance. Each choke assembly 50 effectively reduces mutual coupling interference between array elements by limiting the diffusion of surface current between different radiating parts. This arrangement reduces electromagnetic influence between adjacent radiating parts, ensures the independence and performance consistency of each radiating part, and improves the overall pattern stability and sidelobe suppression effect of the millimeter-wave antenna 100.

[0030] Please continue reading. Figure 3 The anti-overflow solder isolation unit 30 includes a first isolation element 31 and a second isolation element 32, and the waveguide assembly 25 includes a first waveguide channel 251 and a first waveguide channel 252.

[0031] One end of the first waveguide channel 251 is connected to the first radiating part 23, and one end of the second waveguide channel 252 is connected to the second radiating part 24. The first isolator 31 surrounds the first waveguide channel 251, and the second isolator 32 surrounds the second waveguide channel 252. One end of the first waveguide channel 251 is connected to the first radiating part 23, realizing the transmission of millimeter-wave signals to the first radiating part 23. One end of the second waveguide channel 252 is connected to the second radiating part 24, realizing the transmission of millimeter-wave signals to the second radiating part 24. The first waveguide channel 251 and the second waveguide channel 252 respectively constitute independent signal transmission paths. The first isolator 31 surrounds the first waveguide channel 251, and the second isolator 32 surrounds the second waveguide channel 252. The first isolator 31 and the second isolator 32 are respectively arranged along the corresponding waveguide channels to form a continuous isolation strip structure.

[0032] In the embodiments of this application, please refer to the following: Figure 2The first antenna assembly 21 includes a first surface 201 and a second surface (not shown) disposed opposite to each other. The first surface 201 has a groove (not shown) for accommodating the anti-overflow solder isolation unit 30. The first isolation member 31 is integrally injection molded with the second antenna assembly 22 using LCP material, and its height is flush with the mating surface of the first antenna assembly 21 and the second antenna assembly 22. The second isolation member 32 has the same material and dimensions. The first antenna assembly 21 has pre-reserved grooves (not shown) at corresponding positions of the first isolation member 31 and the second isolation member 32 to ensure a tight physical barrier is formed during soldering.

[0033] In the soldering process, solder paste is applied to the soldering areas outside the first isolator 31 and the second isolator 32, respectively. The first isolator 31 restricts the flow of solder paste in the first waveguide channel area, and the second isolator 32 restricts the flow of solder paste in the second waveguide channel area. Even if solder overflow occurs, the solder paste will only overflow in the area outside the corresponding isolator and will not contaminate other waveguide channels across the region.

[0034] This embodiment achieves independent protection for different waveguide channels through the partitioned isolation design of the first isolator 31 and the second isolator 32. When a welding defect occurs in a certain area, its impact is confined to the corresponding isolation area and will not spread to other waveguide channels, ensuring the independence of each radiating element in the antenna array and the reliability of the overall system. The partitioned isolation scheme further improves production yield and product consistency.

[0035] In this embodiment, the waveguide assembly and the anti-overflow solder isolation unit 30 are integrally formed. The anti-overflow solder isolation unit 30 is formed simultaneously during the injection molding of the second antenna assembly 22, and the anti-overflow solder isolation strip is completely fused with the waveguide channel wall at the molecular level. The integral molding process eliminates the seams and gaps between the isolation strip and the waveguide wall in traditional assembly methods, forming a continuous and seamless isolation barrier. The integral structure is completed using a single injection molding process, and the mold design includes the waveguide channel cavity and the isolation strip cavity. LCP material fills both the waveguide structure 20 and the isolation strip area simultaneously during injection molding, and forms an integral structure after cooling and solidification. The height and width of the isolation strip are precisely controlled in the mold to ensure the fitting accuracy with the mating surface of the first antenna assembly 21. The anti-overflow solder reinforcement unit 40 is disposed between the first antenna assembly 21 and the second antenna assembly 22, providing structural reinforcement. The integral molding process achieves seamless integration of the anti-overflow solder isolation unit 30 and the waveguide assembly, eliminating assembly errors and the risk of poor contact. The improved overall structural integrity further enhances the reliability of the isolation effect, while simplifying the production process and reducing manufacturing costs. The one-piece molded structure exhibits higher stability and consistency during welding, providing process assurance for mass production.

[0036] In this embodiment, the anti-solder breakage enhancement unit 40 includes a third solder barrier component (not shown), and the millimeter-wave antenna 100 also includes a feeding component (not shown). The feeding component is electrically connected to the waveguide component, and the third solder barrier component is disposed on the feeding component.

[0037] The feed assembly is electrically connected to the waveguide assembly, enabling the coupling and transmission of external signals to the waveguide assembly. The feed assembly includes a feed structure, which is located in the docking area of ​​the first antenna assembly 21 and the second antenna assembly 22, forming a signal input interface. A third tin-blocking assembly is disposed on the feed assembly. The third tin-blocking assembly includes a feed enhancement post, which is located at the center of the feed structure. The feed enhancement post is a cylindrical structure and is integrally injection molded with the second antenna assembly 22.

[0038] The first antenna assembly 21 has a positioning hole (not shown) at the corresponding position of the feed enhancement post, and the diameter of the positioning hole matches that of the feed enhancement post. During soldering, the feed enhancement post passes through the first antenna assembly 21 and the second antenna assembly 22, and the soldering pressure is concentrated on the feed enhancement post to prevent the surrounding solder paste from overflowing due to pressure. The feed enhancement post bears the main mechanical stress, protecting the electrical connection stability of the feed area.

[0039] The inclusion of a third-stage solder assembly addresses the technical issue of solder breakage in the feed area, a region prone to pressure concentration. The feed reinforcement pillar, by bearing the primary mechanical load, ensures the reliability of the electrical connection between the feed assembly and the waveguide assembly, while simultaneously preventing solder overflow risks to surrounding areas caused by soldering pressure. This structural optimization of the feed area guarantees the stability and consistency of millimeter-wave signal transmission.

[0040] This application provides a millimeter-wave antenna 100, including a substrate 10, a waveguide structure 20, an anti-overflow solder isolation unit 30, and an anti-solder breakage enhancement unit 40. The waveguide structure 20 is disposed on the substrate 10 and includes a first antenna assembly 21 and a second antenna assembly 22. The first antenna assembly 21 and the second antenna assembly 22 are arranged opposite to each other to form a waveguide assembly. The anti-overflow solder isolation unit 30 surrounds the waveguide assembly, and the anti-solder breakage enhancement unit 40 is disposed between the first antenna assembly 21 and the second antenna assembly 22. By setting the anti-overflow solder isolation unit 30 to surround the waveguide assembly, the solder paste is restricted to non-critical areas through physical isolation. Even if overflow occurs, it will not contaminate the waveguide channel, reducing the risk of "overflowing solder means scrap" in traditional solutions. The anti-solder breakage enhancement unit 40 is disposed between the first antenna assembly 21 and the second antenna assembly 22. Through a partitioned reinforcement design, the probability of solder breakage is reduced, and even if there is local solder breakage, the connection strength and performance stability can still be maintained.

[0041] This application also provides a radar system, including the millimeter-wave antenna 100 described above. For specific embodiments of the radar system, please refer to the millimeter-wave antenna 100 described above, which will not be repeated here.

[0042] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A millimeter-wave antenna, characterized in that, include: substrate; A waveguide structure is disposed on the substrate, the waveguide structure including a first antenna assembly and a second antenna assembly, the first antenna assembly and the second antenna assembly being disposed opposite to each other to form a waveguide assembly; An anti-overflow solder isolation unit surrounds the waveguide assembly; The anti-solder breakage enhancement unit is disposed between the first antenna assembly and the second antenna assembly.

2. The millimeter-wave antenna according to claim 1, characterized in that, The anti-soldering enhancement unit includes a first solder-blocking component. The waveguide structure further includes a first radiating part, which is disposed on the first antenna assembly, and the first tin-blocking assembly surrounds the first radiating part.

3. The millimeter-wave antenna according to claim 2, characterized in that, The anti-soldering enhancement unit includes a second solder-blocking assembly. The waveguide structure further includes a second radiating part, which is disposed on the first antenna assembly, and the second tin-blocking assembly surrounds the second radiating part.

4. The millimeter-wave antenna according to claim 2, characterized in that, The first solder blocking component includes a plurality of first solder blocking elements, and the plurality of first solder blocking pillars are uniformly arranged around the first radiating portion.

5. The millimeter-wave antenna according to claim 3, characterized in that, The millimeter-wave antenna also includes a choke assembly disposed between the first radiating part and the second radiating part.

6. The millimeter-wave antenna according to claim 3, characterized in that, The anti-overflow solder isolation unit includes a first isolation element and a second isolation element. The waveguide assembly includes a first waveguide channel and a second waveguide channel. One end of the first waveguide channel is connected to the first radiating part, and one end of the second waveguide channel is connected to the second radiating part. The first isolator surrounds the first waveguide channel, and the second isolator surrounds the second waveguide channel.

7. The millimeter-wave antenna according to claim 1, characterized in that, The first antenna assembly includes a first surface and a second surface disposed opposite to each other, the first surface having a groove for accommodating the anti-overflow solder isolation unit.

8. The millimeter-wave antenna according to claim 1, characterized in that, The waveguide assembly and the anti-overflow solder isolation unit are integrally formed.

9. The millimeter-wave antenna according to claim 1, characterized in that, The anti-soldering enhancement unit includes a third solder-blocking assembly. The millimeter-wave antenna also includes a feeding component, which is electrically connected to the waveguide component, and the third tin-blocking component is disposed on the feeding component.

10. A radar system, characterized in that, Including the millimeter-wave antenna as described in any one of claims 1-9.

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