Memory module plugging mechanism
Patent Information
- Application Number
- CN202522308495.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-10-31
AI Technical Summary
人工手动安装时,存在安装效率低,内存条安装不到位的情况
1.本申请的内存条插拔机构,包括安装架、内存条组件和行程控制组件。其中内存条组件包括安装座和内存条转板;行程控制组件包括下压气缸、行程标定件和控制器,安装座通过下压气缸驱动滑动安装于安装架,内存条转板安装于安装座,以构成内存条的安装载体。实现安装座带动内存条插接于服务器主板的内存条卡槽。本申请的内存条插拔机构能替代人工手动插接内存条,以减少人员工作量,提高测试效率。另外,为了保证安装座的下插行程的精度,提高内存条的安装精度。通过设置行程标定件,其包括位置标定件和感应件;位置标定件安装于安装架,且其与控制器电性连接,感应件安装于安装座,且其一端朝标定件延伸,以形成感应端,实现实时感应安装座的下压行程,通过位置标定件以预设下压气缸的下压行程,以保证安装座与服务器主板的内存条卡槽精准对位和内存条转板安装精度,提高测试稳定性。
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Figure CN224842756U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a memory module insertion and removal mechanism, belonging to the field of testing equipment technology. Background Technology
[0002] As a core component of a computer system, the server motherboard plays a crucial role in connecting and coordinating key components such as the CPU, memory, storage devices, and expansion cards. Server motherboard testing has an irreplaceable role in computer manufacturing, quality control, and repair services. With the rapid development of computer technology, server motherboards are becoming increasingly integrated and their circuit designs more complex, making server motherboard fault diagnosis and performance evaluation more specialized and systematic. Server motherboard functional testing is a comprehensive verification process of the server motherboard's hardware, software, and system functions, aiming to ensure its stability, compatibility, and performance meet the demands of high-load operation.
[0003] Existing testing equipment for server motherboards relies on manual installation of memory modules. Due to the large number and tight arrangement of memory slots on motherboards, manual installation is inefficient and prone to misalignment, resulting in low testing efficiency and poor stability. Therefore, a memory module insertion / removal mechanism is needed to address the problems of low efficiency, high workload, and poor stability associated with manual memory module installation in current server motherboard testing. Utility Model Content
[0004] The purpose of this invention is to provide a memory module insertion and removal mechanism to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a memory module insertion / removal mechanism, comprising a mounting bracket, a memory module assembly, and a stroke control assembly. The memory module assembly includes a mounting base and a memory module rotating plate. The stroke control assembly includes a pressing cylinder, a stroke calibration component, and a controller. The mounting base is radially slidably mounted on the mounting bracket, and the memory module rotating plate is mounted on the mounting base for mounting memory modules. The pressing cylinder is fixedly mounted on the mounting bracket, and its power end is connected to the mounting base. The stroke calibration component includes a position calibration component and a sensing component. The position calibration component is mounted on the mounting bracket and electrically connected to the controller. The sensing component is mounted on the mounting base, and one end of it extends toward the calibration component to form a sensing end. The pressing cylinder is electrically connected to the controller.
[0006] Specifically, the mounting base is equipped with several guide posts at intervals; the mounting frame has guide holes at corresponding positions to the guide posts; the mounting base is slidably mounted on the mounting frame by fitting the guide posts into the guide holes.
[0007] Specifically, the mounting base has several memory module mounting slots evenly spaced apart for installing memory module adapters.
[0008] Specifically, several pre-pressure floating plates are installed at the bottom of the mounting base away from the mounting bracket. The position of the pre-pressure floating plate is consistent with the memory slot of the motherboard, and the pre-pressure floating plate has a positioning groove at the position corresponding to the memory slot opening. When the pre-pressure floating plate abuts against the motherboard, the pre-pressure floating plate abuts against the memory slot, and the positioning groove is aligned with the memory slot opening.
[0009] Specifically, a spring is pressed between the preloaded floating plate and the mounting base.
[0010] Specifically, a limit block is installed at the bottom of the mounting base away from the mounting bracket to limit the downward stroke of the mounting base.
[0011] Specifically, the power end of the downward pressing cylinder is a cylinder rod, and a connecting plate is fixedly installed at the end of the cylinder rod. The connecting plate and the mounting base are fixedly connected. A compression spring is sleeved on the outside of the cylinder rod. One end of the compression spring is connected to the cylinder body of the downward pressing cylinder, and the other end is connected to the connecting plate.
[0012] Specifically, the controller includes a control board and a central leakage solenoid valve; the central leakage solenoid valve is electrically connected to the control board, and the pressure cylinder is connected to the central leakage solenoid valve.
[0013] Specifically, the position calibration component includes a position slide groove and a position calibration rod; the position slide groove is electrically connected to the control board, and the position calibration rod is slidably installed in the slide groove; the sensing end of the sensing component is provided with a sensing slot, and the sensing slot is sleeved on the outside of the position calibration rod.
[0014] Specifically, there are two stroke calibration parts, and the positions of the calibration rods of the two stroke calibration parts are different to form a first calibration position and a second calibration position.
[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. The memory module insertion / removal mechanism of this application includes a mounting bracket, a memory module assembly, and a travel control component. The memory module assembly includes a mounting base and a memory module adapter plate; the travel control component includes a pressing cylinder, a travel calibration component, and a controller. The mounting base is slidably mounted on the mounting bracket via the pressing cylinder, and the memory module adapter plate is mounted on the mounting base, thus forming the mounting carrier for the memory module. This enables the mounting base to drive the memory module into the memory module slot on the server motherboard. The memory module insertion / removal mechanism of this application can replace manual insertion of memory modules, reducing workload and improving testing efficiency. Furthermore, to ensure the accuracy of the mounting base's insertion travel, the installation accuracy of the memory module is improved. By setting up a stroke calibration component, which includes a position calibration component and a sensing component, the position calibration component is installed on the mounting bracket and is electrically connected to the controller. The sensing component is installed on the mounting base, with one end extending toward the calibration component to form a sensing end, thereby realizing real-time sensing of the downward stroke of the mounting base. The downward stroke of the downward cylinder is preset by the position calibration component to ensure accurate alignment between the mounting base and the memory slot of the server motherboard and the installation accuracy of the memory module adapter, thereby improving test stability.
[0016] 2. Based on the foregoing, the mounting base of this application is equipped with guide posts, and the mounting bracket is provided with guide holes, so that the guide posts are fitted into the guide holes, so that when the mounting base is pressed down, the pressing action can be guaranteed to have stable guidance, thereby improving the accuracy of the alignment between the memory module adapter and the memory module slot.
[0017] 3. Based on the foregoing, the mounting base of this application is equipped with several memory module mounting slots to improve the efficiency of installing multiple memory module mounting plates at one time.
[0018] 4. Building upon the foregoing, the mounting base of this application is equipped with a pre-pressure floating plate at its bottom. This allows for precise positioning of the pre-pressure floating plate against the memory slots on the server motherboard when the mounting base is pressed down, preventing misalignment of the memory module adapter and improving testing accuracy. Furthermore, a spring is installed between the pre-pressure floating plate and the mounting base. After testing, when the mounting base resets, the pre-pressure floating plate uses the spring's elasticity to hold the server motherboard in place, preventing displacement of the server motherboard during memory module adapter reset and facilitating proper separation of the memory module adapter and memory slots.
[0019] 5. Based on the foregoing, a limit block is installed at the bottom of the mounting base away from the mounting bracket to limit the downward stroke of the mounting base. This is to control the downward stroke of the mounting base through the limiting action of the limit block, and to prevent the memory module converter board from being excessively pressed down and damaging the server motherboard.
[0020] 6. Based on the foregoing, the power end of the pressing cylinder in this application is a cylinder rod, and a connecting plate is fixedly installed at the end of the cylinder rod. The connecting plate and the mounting base are fixedly connected. A compression spring is sleeved on the outer side of the cylinder rod. The controller includes a control board and a central leakage solenoid valve; the central leakage solenoid valve is electrically connected to the control board, and the pressing cylinder is connected to the central leakage solenoid valve. This allows the control board to control the central leakage solenoid valve, thereby controlling the stroke of the pressing cylinder. The number of stroke calibration components in this application is two, and the positions of the calibration rods of the two stroke calibration components are different, forming a first calibration position and a second calibration position. By presetting the two calibration positions, the pressing stroke of the pressing cylinder is controlled to be two strokes. The first calibration position can be preset to the memory module plate pressing down to the memory module slot opening. After it reaches the position, the pressing cylinder is controlled to continue pressing down to drive the memory module plate to press down into the memory module slot. It can effectively ensure that the memory module adapter board and the memory module slot are accurately aligned and inserted into place, avoiding the situation where misalignment and further pressing could damage the server motherboard interface.
[0021] 7. Based on the foregoing, the position calibration component of this application includes a position slide groove and a position calibration rod; the position slide groove is electrically connected to the control board, and the position calibration rod is slidably installed within the slide groove. This allows for adaptive preset calibration positions based on the testing requirements of different server motherboard specifications, thereby improving product compatibility. Compared to traditional position sensor components, the position calibration component of this application has a simple structure, low cost, convenient debugging, and high testing efficiency. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the memory module insertion and removal mechanism in this embodiment; Figure 2 This is a front view of the memory module insertion and removal mechanism in this embodiment; Figure 3 This is a bottom view of the memory module insertion and removal mechanism in this embodiment; Figure 4 This is a schematic diagram of the pre-pressure floating plate of the memory module insertion and removal mechanism in this embodiment.
[0023] In the diagram: 1. Mounting bracket; 2. Memory module assembly; 3. Stroke control assembly; 4. Mounting base; 5. Memory module rotating plate; 6. Pressing cylinder; 7. Position calibration component; 8. Memory module; 9. Connecting plate; 10. Compression spring; 12. Sensor; 13. Guide column; 14. Preload floating plate; 15. Limit block; 16. Control board; 70. Position groove; 71. Position calibration rod. Detailed Implementation
[0024] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.
[0025] Please see Figures 1-4 This embodiment discloses a memory module insertion and removal mechanism, including a mounting bracket 1, a memory module assembly 2, and a stroke control assembly 3. The memory module assembly includes a mounting base 4 and a memory module rotating plate 5. The stroke control assembly includes a pressing cylinder 6, a stroke calibration component, and a controller. The mounting base 4 is radially slidably mounted on the mounting bracket 1, and the memory module rotating plate 5 is mounted on the mounting base 4 for mounting memory modules 8. In this embodiment, the pressing cylinder 6 is fixedly mounted on the mounting bracket 1. The power end of the pressing cylinder is a cylinder rod, and a connecting plate 9 is fixedly mounted on the end of the cylinder rod. The connecting plate and the mounting base are fixedly connected. A compression spring 10 is sleeved on the outside of the cylinder rod. One end of the compression spring is connected to the cylinder body of the pressing cylinder, and the other end is connected to the connecting plate. The stroke calibration component includes a position calibration component 7 and a sensing component 12. The position calibration component is mounted on the mounting bracket and is electrically connected to the controller. The sensing component is mounted on the mounting base, and one end of it extends toward the calibration component to form a sensing end. The pressing cylinder is electrically connected to the controller.
[0026] In this embodiment, four guide posts 13 are installed at intervals on the mounting base; guide holes are opened at corresponding positions of the mounting bracket and the guide posts; the mounting base is slidably mounted on the mounting bracket by fitting the guide posts into the guide holes. In this embodiment, the mounting base is evenly distributed with several memory module adapter mounting slots for installing memory module adapters.
[0027] Preferably, in this embodiment, two pre-pressure floating plates 14 are installed at the bottom of the mounting base away from the mounting bracket. The pre-pressure floating plates are aligned with the memory slots on the motherboard, and positioning grooves are provided on the pre-pressure floating plates at positions corresponding to the openings of the memory slots. When the pre-pressure floating plates abut against the motherboard, they abut against the memory slots, with the positioning grooves aligned with the openings of the memory slots. A spring (not shown) is also provided between the pre-pressure floating plates and the mounting base.
[0028] Furthermore, in this embodiment, a limit block 15 is installed at the bottom of the mounting base away from the mounting bracket to limit the downward stroke of the mounting base.
[0029] In addition, the controller in this embodiment includes a control board 16 and a central leakage solenoid valve (not shown); the central leakage solenoid valve is electrically connected to the control board, and the pressing cylinder is connected to the central leakage solenoid valve. The position calibration component 7 in this embodiment includes a position slide groove 70 and a position calibration rod 71; the position slide groove is electrically connected to the control board, and the position calibration rod is slidably installed within the slide groove; the sensing end of the sensing component has a sensing slot, and the sensing slot is sleeved on the outside of the position calibration rod. Furthermore, this embodiment has two stroke calibration components, and the positions of the calibration rods of the two stroke calibration components are different, forming a first calibration position and a second calibration position.
[0030] Working Principle: In this embodiment, when using the memory module insertion / removal mechanism, the operator first determines the first and second pressing strokes of the pressing cylinder based on the specifications of the server motherboard under test and the dimensions of the memory module slots. Then, the operator adjusts the position of the two stroke calibration levers to preset the pressing stroke of the pressing cylinder. Finally, the memory module is installed and connected to the memory module adapter board, and the server motherboard is then installed on the test board below the memory module insertion / removal mechanism, thus completing the component installation and debugging before testing.
[0031] During testing, the control board first controls the venting solenoid valve to connect the air inlet and outlet of the pressing cylinder, causing the cylinder rod to float. Under the weight of the mounting base, the cylinder rod falls freely, pushing the mounting base downwards towards the server motherboard. The first part to contact the server motherboard is the pre-pressure floating plate, which then aligns with the memory module slots on the motherboard, completing the alignment of the memory module adapter plate with the memory module slots. The mounting base continues to press down, compressing the spring between the pre-pressure floating plate and the mounting base. As the mounting base presses down further, the compression spring on the cylinder rod is compressed until the mounting base is completely free-falling onto the server motherboard, at which point the memory module adapter plate and the memory module slot openings are aligned. During this process, as the mounting bracket is pressed down, the sensing slot of one of the two stroke calibration components will contact the position calibration rod at the first calibration position. That is, the control board senses that the mounting bracket has reached the first calibration position. Then, the control board controls the solenoid valve to activate the pressing cylinder. The pressing cylinder drives the cylinder rod downwards, pushing the mounting bracket down to the second calibration position, inserting the memory module adapter into the memory module slot, completing the insertion process. Then, the server motherboard is tested using testing equipment. After the test is completed, the pressing cylinder resets, causing the mounting bracket to reset. At this time, the pre-pressurized floating plate, under the elastic force of the spring, will still resist the server motherboard, preventing displacement of the server motherboard during the removal of the memory module adapter, ensuring proper separation of the memory module adapter from the memory module slot.
[0032] The embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. For those skilled in the art, after learning the contents of the present invention, several equivalent changes and substitutions can be made without departing from the principle of the present invention. These equivalent changes and substitutions should also be considered to fall within the protection scope of the present invention.
Claims
1. A memory module insertion / removal mechanism, comprising a mounting bracket, a memory module assembly, and a travel control assembly, characterized in that: The memory module assembly includes a mounting base and a memory module mounting plate; the stroke control assembly includes a pressing cylinder, a stroke calibration component, and a controller; the mounting base is radially slidably mounted on the mounting frame, and the memory module mounting plate is mounted on the mounting base for mounting memory modules; the pressing cylinder is fixedly mounted on the mounting frame, and its power end is connected to the mounting base; the stroke calibration component includes a position calibration component and a sensing component; the position calibration component is mounted on the mounting frame and is electrically connected to the controller, the sensing component is mounted on the mounting base, and one end of it extends toward the calibration component to form a sensing end; the pressing cylinder is electrically connected to the controller.
2. The memory module insertion and removal mechanism according to claim 1, characterized in that: The mounting base is provided with a number of guide posts at intervals; the mounting frame is provided with guide holes at positions corresponding to the guide posts; the mounting base is slidably mounted on the mounting frame by means of the guide posts being sleeved in the guide holes.
3. The memory module insertion and removal mechanism according to claim 1, characterized in that: The mounting base is evenly spaced with several memory module mounting slots for mounting memory module adapters.
4. The memory module insertion and removal mechanism according to claim 1, characterized in that: Several pre-pressure floating plates are installed at the bottom of the mounting base away from the mounting bracket. The pre-pressure floating plates are aligned with the memory slots on the motherboard, and positioning grooves are provided on the pre-pressure floating plates at positions corresponding to the openings of the memory slots. When the pre-pressure floating plates abut against the motherboard, they abut against the memory slots, and the positioning grooves are aligned with the openings of the memory slots.
5. The memory module insertion and removal mechanism according to claim 4, characterized in that: A spring is pressed between the preloaded floating plate and the mounting base.
6. The memory module insertion and removal mechanism according to claim 1, characterized in that: A limit block is installed at the bottom of the mounting base away from the mounting frame to limit the downward stroke of the mounting base.
7. The memory module insertion and removal mechanism according to claim 1, characterized in that: The power end of the downward pressing cylinder is a cylinder rod, and a connecting plate is fixedly installed at the end of the cylinder rod. The connecting plate and the mounting base are fixedly connected. A compression spring is sleeved on the outside of the cylinder rod. One end of the compression spring is connected to the cylinder body of the downward pressing cylinder, and the other end is connected to the connecting plate.
8. The memory module insertion and removal mechanism according to claim 7, characterized in that: The controller includes a control board and a central leakage solenoid valve; the central leakage solenoid valve is electrically connected to the control board, and the pressure cylinder is connected to the central leakage solenoid valve.
9. The memory module insertion and removal mechanism according to claim 8, characterized in that: The position calibration component includes a position slide groove and a position calibration rod; the position slide groove is electrically connected to the control board, and the position calibration rod is slidably installed in the slide groove; the sensing end of the sensing component is provided with a sensing slot, and the sensing slot is sleeved on the outside of the position calibration rod.
10. The memory module insertion and removal mechanism according to claim 9, characterized in that: The number of stroke calibration components is two, and the positions of the calibration rods of the position calibration components of the two stroke calibration components are different, so as to form a first calibration position and a second calibration position.