High-efficiency laser video acquisition device

Abstract

The utility model relates to a kind of high-efficiency laser video acquisition devices, belong to optical technology field.It mainly includes device base, laser main body, radiator base plate, deformable heat-conducting pad, guide plate and spring assembly.Device base is equipped with central sink, and laser main body is fixed by positioning pin.Top cover is installed on the device base upper side by bolt group, and guide plate is symmetrically fixed in the top cover periphery and is equipped with guide slot.Radiator base plate is slidably installed in guide slot by pin shaft, and is located above laser main body.Radiator base plate lower surface is bonded with deformable heat-conducting pad, and its surface evenly distributes conical micro-bump array.Spring assembly includes compression spring, threaded column and pressure adjusting nut, and realizes dynamic pressure adjustment.The utility model solves the technical problems of poor contact, high thermal resistance, low heat dissipation efficiency and poor reliability of the existing laser heat dissipation structure.

Description

Technical Field

[0001] This utility model belongs to the field of optical technology, specifically relating to a high-efficiency laser video acquisition device. Background Technology

[0002] As a core component of modern optical detection and imaging systems, the performance stability of laser video acquisition devices directly depends on the operating temperature control of the laser. During continuous operation of a high-power laser, if the heat generated by the laser diode cannot be dissipated in time, the junction temperature of the device will rise, not only reducing laser output power and beam quality but also significantly shortening the device's lifespan. In existing technologies, laser heat dissipation generally employs a passive cooling method where the heat sink is in direct contact with the laser, using thermal grease or thermal pads to fill the tiny gaps at the contact surface to improve heat conduction efficiency.

[0003] However, in practical applications, it has been found that traditional heat dissipation structures suffer from significant contact problems. Because lasers undergo minute deformations during operation, conventional heat sinks, using rigid connections, cannot dynamically adapt to these deformations, resulting in an actual contact area of ​​only 40% to 50% of the theoretical area. Industry test data shows that when there are gaps larger than 0.05mm at the contact surface, thermal resistance increases by 30% to 50%, significantly reducing heat dissipation efficiency. Existing solutions often use increased pre-tightening force, but this can lead to excessive stress on the laser package, causing microcracks and creating new reliability risks. The mainstream heat dissipation structure for laser video acquisition devices on the market typically uses a direct planar pressure method, where the heat sink is directly pressed onto the laser surface using screws. This structure performs well in static laboratory tests, but in actual working environments, due to factors such as vibration and temperature cycling, the contact pressure distribution becomes uneven, with excessive pressure at some contact points and minute gaps in other areas. The heat dissipation problem is particularly pronounced when the laser power exceeds 5W, manifesting as increased fluctuations in laser output power and deterioration of the beam pattern. While existing technologies employ liquid cooling solutions, these are complex in structure, expensive, and unsuitable for miniaturized laser video acquisition devices. Therefore, the heat dissipation structures of existing laser video acquisition devices suffer from poor contact, high thermal resistance, low heat dissipation efficiency, and poor reliability. Utility Model Content

[0004] In order to overcome the problems in the prior art, this utility model provides a high-efficiency laser video acquisition device to solve the technical problems of poor contact, high thermal resistance, low heat dissipation efficiency and poor reliability of the laser heat dissipation structure in the prior art.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: A high-efficiency laser video acquisition device mainly includes a device base, which has a central recessed groove. A laser body is fixedly installed in the central recessed groove by positioning pins. It also includes a heat sink substrate, a deformable thermal conductive pad, a guide plate, and a spring assembly. A top cover is bolted to the top of the device base. The guide plate is symmetrically fixed around the top cover, and a guide groove is provided on the top of the guide plate. The heat sink substrate is slidably installed in the guide groove around its perimeter by pins and is located above the laser body. The deformable thermal conductive pad is bonded to the lower surface of the heat sink substrate with an adhesive backing layer. A uniformly distributed array of conical micro-bumps is distributed on the surface of the deformable thermal conductive pad facing the laser body. The spring assembly includes a compression spring, a threaded post, and a pressure adjusting nut. The bottom end of the threaded post passes through the central through hole of the radiator substrate and is clearance-fitted with it. The top end of the threaded post is fixed to the inner wall of the top cover and is threadedly connected to the pressure adjusting nut on the inner side of the top cover. The compression spring is sleeved outside the threaded post and located between the radiator substrate and the top cover. The bottom end of the compression spring abuts against the upper surface of the radiator substrate, and the top end abuts against the bottom of the pressure adjusting nut.

[0006] Optionally, the array of conical micro-bumps in the deformable thermal pad is arranged in a hexagonal pattern.

[0007] Optionally, the diameter of a single microbump in the conical microbump array is 0.3 mm, the height is 0.1 mm, and the array spacing is 1.2 mm.

[0008] Optionally, the cone angle of the tapered micro-protrusion is 30° to 45°.

[0009] Optionally, the thickness of the deformable thermal pad is 0.8 mm to 1.2 mm.

[0010] Optionally, the adhesive backing layer is made of pressure-sensitive adhesive material with a thermal conductivity of not less than 3.0 W / (m·K).

[0011] Optionally, the guide plate is symmetrically fixed to the perimeter of the bottom of the top cover by countersunk screws.

[0012] Optionally, a temperature sensor mounting hole is provided in the central recess of the device base, and the temperature sensor mounting hole is located directly below the bottom of the laser body.

[0013] Optionally, heat dissipation fins are integrated on the upper surface of the heat sink substrate. Optionally, the device base and the top cover are made of aerospace-grade aluminum alloy or copper alloy.

[0014] The beneficial effects of this utility model are: This invention effectively solves the problem of poor contact in laser heat dissipation structures through its unique structural design. Specifically, the array of conical micro-bumps on the surface of the deformable thermal pad transforms traditional surface contact into controllable point contact, and, in conjunction with a spring loading system, achieves dynamic pressure adjustment. When the micro-bumps undergo elastic deformation, the actual contact area of ​​the contact surface is significantly increased, greatly reducing interfacial thermal resistance. The guide groove design of the guide plate allows the heat sink to generate minute rotational freedom during thermal deformation, avoiding stress concentration caused by rigid connections and protecting the laser packaging structure. The radial expansion effect generated by the conical micro-bumps under pressure enhances the microscopic fit with the laser surface, resulting in a more uniform heat flow distribution. The pressure adjusting nut allows for precise control of the preload, adapting to the heat dissipation requirements of lasers with different power levels. The overall structure is compact, requiring no additional power source, and is particularly suitable for space-constrained laser video acquisition devices. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is the front view of the present invention.

[0017] Figure 3 For the present utility model in Figure 2 A magnified view of a portion of point A in the middle.

[0018] Figure 4 This is a partially enlarged schematic diagram of the spring assembly of this utility model.

[0019] Figure 5 This is a schematic diagram of the device base structure of this utility model.

[0020] Figure 6 This is a schematic diagram of the conical micro-bump array structure of this utility model.

[0021] Explanation of reference numerals in the attached drawings: 1. Device base; 2. Central recess; 3. Positioning pin; 4. Laser body; 5. Heat sink substrate; 6. Deformable thermal pad; 7. Conical micro-bump array; 8. Guide plate; 9. Guide groove; 10. Pin; 11. Top cover; 12. Bolt assembly; 13. Compression spring; 14. Threaded post; 15. Pressure adjusting nut; 16. Temperature sensor mounting hole. Detailed Implementation

[0022] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of those skilled in the art.

[0023] Please see Figures 1 to 6This utility model provides a high-efficiency laser video acquisition device, the overall structure of which is designed to achieve effective heat dissipation of the laser body 4. The device includes a base 1 serving as an overall support structure, a central recess 2 for accommodating the laser body 4, a positioning pin 3 for fixing the laser body 4, and the laser body 4 itself. Furthermore, the heat dissipation structure includes a heat sink base 5, a deformable thermally conductive pad 6, a guide plate 8, a pin 10, a top cover 11, and a spring assembly. The spring assembly includes a compression spring 13, a threaded post 14, and a pressure adjusting nut 15.

[0024] Specifically, the device base 1 has a rectangular plate structure, and its main material is aerospace-grade aluminum alloy or copper alloy with excellent thermal conductivity. The surface is precision-machined, for example, using CNC milling, and then anodized to improve corrosion resistance and surface hardness. The overall dimensions of the device base 1 are, for example, 150 mm in length, 100 mm in width, and 20 mm in thickness. A central recess 2 is integrally formed in the center of the upper surface of the device base 1. The central recess 2 has a rectangular concave structure with a depth of, for example, 10 mm. Its length and width precisely match the outer dimensions of the laser body 4, for example, 40 mm in length and 30 mm in width, forming a tightly fitting installation space. Several blind holes for mounting positioning pins 3 are provided at the bottom of the central recess 2. The laser body 4 is typically a rectangular encapsulated structure, for example, 38 mm in length, 28 mm in width, and 25 mm in height. It is mainly composed of a metal shell encapsulating a laser diode and has a high heat power density. The laser body 4 is precisely fixed in the central recess 2 by several positioning pins 3. The positioning pin 3 is a cylindrical pin structure, for example, 2 mm in diameter and 8 mm in length, made of hardened tool steel with high hardness and wear resistance. The positioning pin 3 is press-fitted into the blind hole of the device base 1 and the corresponding positioning hole at the bottom of the laser body 4, ensuring that the laser body 4 is firmly and accurately positioned within the central recess 2, preventing displacement or vibration during operation. A temperature sensor mounting hole 16 is also machined at the bottom of the central recess 2 of the device base 1. The temperature sensor mounting hole 16 is a cylindrical blind hole, for example, 3 mm in diameter and 8 mm deep, used to accommodate a miniature temperature sensor to monitor the temperature of the bottom area of ​​the laser body 4 in real time. Several threaded through holes are symmetrically distributed around the periphery of the device base 1, such as the four corners, for installation with the bolt group 12 of the top cover 11.

[0025] The top cover 11 is a rectangular plate structure with dimensions similar to the device base 1. It is also made of aerospace-grade aluminum alloy or copper alloy and undergoes anodizing treatment. The overall dimensions of the top cover 11 are, for example, 150 mm in length, 100 mm in width, and 15 mm in thickness. The top cover 11 is mounted on top of the device base 1 via a bolt assembly 12. The bolt assembly 12 consists of several high-strength internal hexagon countersunk bolts, for example, M4 bolts, made of stainless steel. The bolt assembly 12 passes through the corresponding countersunk holes on the top cover 11 and is screwed into the corresponding threaded holes on the device base 1, achieving a secure and detachable mechanical connection between the top cover 11 and the device base 1.

[0026] Four guide plates 8 are provided, each with an L-shaped or C-shaped cross-section, and are made of stainless steel sheet by precision stamping or CNC machining, providing good structural strength and rigidity. The thickness of the guide plates 8 is, for example, 2 mm. The guide plates 8 are symmetrically fixed to the bottom of the top cover 11 around its perimeter using countersunk screws. Each guide plate 8 has an integrally formed guide groove 9 on its top, i.e., the side facing the interior of the device. The guide groove 9 is a vertical, elongated groove, for example, 20 mm long, 3 mm wide, and 2 mm deep, with a smooth inner surface that has been finely polished to reduce frictional resistance. The structure of the guide groove 9 allows it to guide the mating heat sink substrate 5 while allowing a certain degree of sliding freedom.

[0027] The heat sink substrate 5 has a flat plate structure, made of, for example, high-purity oxygen-free copper or thermally conductive aluminum alloy, with dimensions of, for example, 45 mm in length, 35 mm in width, and 5 mm in thickness. The heat sink substrate 5 is located directly above the laser body 4, maintaining a predetermined distance from the top surface of the laser body 4. At the center of each perimeter of the heat sink substrate 5, there is a through hole with a diameter of, for example, 2 mm. Each through hole contains an interference-fitted pin 10. The pin 10 has a cylindrical pin structure, for example, a diameter of 1.8 mm and a length of 15 mm, made of stainless steel, with chamfered ends for easy assembly. The other end of the pin 10 extends into and slides within a guide groove 9 above the guide plate 8, allowing the heat sink substrate 5 to move vertically relative to the top cover 11 and to rotate slightly in the horizontal plane. This sliding connection method, through the movement of the pin 10 within the guide groove 9, allows the heat sink base plate 5 to make slight adaptive adjustments when affected by thermal expansion and contraction, avoiding stress concentration caused by rigid constraints, thereby protecting the structural integrity of the entire heat dissipation assembly. A central through-hole for the threaded post 14 is located at the center of the heat sink base plate 5. The diameter of this through-hole has a clearance fit with the outer diameter of the threaded post 14, for example, a radial clearance of 0.1 mm to 0.2 mm, ensuring that the threaded post 14 can smoothly pass through the heat sink base plate 5. This clearance fit allows the heat sink base plate 5 to swing slightly when affected by thermal expansion and contraction, preventing jamming. Heat dissipation fins are integrally integrated onto the upper surface of the heat sink base plate 5. The heat dissipation fins are typically in the form of parallel plates or combs, for example, with a height of 10 mm, a thickness of 0.5 mm, and a fin spacing of 1.5 mm. They are connected to the heat sink base plate 5 body through precision extrusion or welding processes to significantly increase the contact area with the surrounding air and enhance convective heat transfer.

[0028] The deformable thermal pad 6 has a sheet-like structure, for example, composed of a composite of a silicone-based elastic material with high thermal conductivity and ceramic or metal microparticles, exhibiting excellent thermal conductivity and good elastic deformation capability. The thickness of the deformable thermal pad 6 is between 0.8 mm and 1.2 mm, for example, 1.0 mm. The dimensions of the deformable thermal pad 6 match the dimensions of the lower surface of the heat sink substrate 5, for example, 45 mm in length and 35 mm in width. The back side of the deformable thermal pad 6, that is, the side that contacts the heat sink substrate 5, is bonded to the lower surface of the heat sink substrate 5 by an adhesive layer. The adhesive layer uses a pressure-sensitive adhesive material with a thermal conductivity of not less than 3.0 W / (m·K) to ensure a tight and highly thermally conductive connection between the deformable thermal pad 6 and the heat sink substrate 5. For example, a thermally conductive pressure-sensitive adhesive containing silver or copper particles can be used. If the adhesive layer uses a thermally conductive pressure-sensitive adhesive with a silver content ≥60%, the coating thickness is 0.05±0.01 mm. Before bonding, the lower surface of the heat sink substrate 5 is cleaned with acetone and subjected to plasma activation treatment (power 100W, treatment time 120 seconds). The bonding and curing pressure is 0.2-0.5 MPa, the curing temperature is 80℃±5℃, and the holding time is 30 minutes. The deformable thermal pad 6 has a uniformly distributed array of conical micro-bumps 7 on the surface facing the laser body 4. The tapered microbumps 7 are made of silicone rubber-based composite material with an elastic modulus of 0.5-2.0 MPa and a compression set ≤10% (ASTM D395 test method). The tapered microbump array 7 is arranged in a close hexagonal pattern, optimizing the number of point contacts and the uniformity of distribution per unit area. Each individual tapered microbump 7 in the array has precise geometric dimensions, with a base diameter of, for example, 0.3 mm and a height of, for example, 0.1 mm. The array spacing between adjacent microbumps is, for example, 1.2 mm. This spacing is chosen to ensure that under external pressure, the microbumps do not excessively interfere with each other while maintaining sufficient contact point density. The cone angle of the tapered microbumps 7 is between 30° and 45°, for example, 35°. When subjected to axial pressure, the apex of this conical structure preferentially contacts the surface of the laser body 4. As the pressure increases, the cone gradually undergoes elastic deformation and expands radially in all directions (under a 50N preload, a single micro-protrusion generates 30%-50% compressive strain, achieving radial expansion through the Poisson effect of the material, with the expansion amount controlled within the range of a diameter increase of 0.05-0.10mm). This gradually transforms the initial point contact into a larger surface contact, significantly increasing the actual contact area and significantly reducing the thermal interface resistance. The spring assembly includes a compression spring 13, a threaded post 14, and a pressure adjusting nut 15. The threaded post 14 is a solid cylindrical rod structure, for example, made of high-strength stainless steel, with a diameter of, for example, 4 mm and a length of, for example, 40 mm. The bottom end of the threaded post 14 penetrates the central through-hole of the heat sink substrate 5 and maintains a clearance fit with the through-hole to ensure its free sliding. The top end of the threaded post 14 is fixed to the inner wall of the top cover 11 by threads or a press-fit, making it perpendicular to the plane of the top cover 11.The top portion of the threaded post 14 has external threads. The pressure adjusting nut 15 is a cylindrical nut structure with a knurled outer edge, made of, for example, brass or stainless steel, and its internal threads precisely match the external threads at the top of the threaded post 14, for example, M4 specification. The pressure adjusting nut 15 is threaded onto the top portion of the threaded post 14, and the pressure adjusting nut 15 is located in the inner space of the top cover 11, with its bottom facing the radiator base plate 5. The compression spring 13 has a helical cylindrical structure, made of, for example, high-elasticity stainless steel spring wire, with an outer diameter of, for example, 10 mm, a free height of, for example, 25 mm, and a spring stiffness of, for example, 10 N / mm. The compression spring 13 is sleeved on the outside of the threaded post 14 and arranged coaxially. The bottom end of the compression spring 13 abuts against the upper surface of the radiator base plate 5, and the top end of the compression spring 13 abuts against the bottom plane of the pressure adjusting nut 15. By rotating the pressure adjusting nut 15, the axial position of the pressure adjusting nut 15 on the threaded post 14 can be changed, thereby adjusting the pre-compression of the compression spring 13. This allows for precise control of the downward preload applied by the compression spring 13 to the heat sink substrate 5. For example, each 15° rotation can change the preload by approximately 0.5N, and this preload is transmitted to the top surface of the laser body 4 through the heat sink substrate 5 and the deformable thermal pad 6. This enables dynamic adjustment of the heat dissipation contact pressure to adapt to the heat dissipation requirements of lasers with different power under different operating conditions, ensuring that the deformable thermal pad 6 and the laser body 4 always maintain the best contact state and heat conduction efficiency.

[0029] The working principle of this invention is as follows: When the laser body 4 is powered on, its internal laser diode generates a large amount of heat, which is conducted to the surroundings through the metal shell of the laser body 4. The upward-conducted heat first reaches the top surface of the laser body 4. At this time, under the pre-tightening force provided by the spring assembly, the array of conical micro-bumps 7 on the deformable thermal pad 6 makes close contact with the surface of the laser body 4. In the initial contact stage, the tips of the conical micro-bumps 7 first form point contact with the surface of the laser body 4. As the pre-tightening force continues to act, the conical micro-bumps 7 undergo elastic deformation, and the contact area gradually expands, changing from point contact to surface contact, effectively reducing the contact thermal resistance. The heat is conducted to the heat sink substrate 5 through the deformable thermal pad 6 body. The heat dissipation fins on the heat sink substrate 5 accelerate the dissipation of heat to the surrounding environment by increasing the contact area with the air. At the same time, the downward-conducted heat is conducted to the device base 1 through the contact surface between the bottom of the laser body 4 and the device base 1. The device base 1, as an auxiliary heat dissipation structure, absorbs and dissipates some heat through the heat capacity effect of its large-volume metal material. Throughout the operation, the miniature temperature sensor inside the temperature sensor mounting hole 16 monitors the bottom temperature of the laser body 4 in real time, providing feedback information for the adjustment of the heat dissipation system. When the laser power changes or the ambient temperature changes, the preload of the compression spring 13 can be changed by adjusting the pressure adjusting nut 15, thereby optimizing the contact pressure between the deformable thermal pad 6 and the laser body 4, ensuring optimal heat dissipation under different operating conditions. The sliding fit structure between the guide plate 8 and the pin 10 allows the heat sink base plate 5 to make slight adaptive adjustments under thermal expansion and contraction, avoiding component deformation or damage caused by thermal stress and ensuring the long-term stable operation of the heat dissipation system.

[0030] In a specific application example, this high-efficiency laser video acquisition device is used in an industrial laser video inspection system. This system uses a 50W semiconductor laser as its light source. In continuous operation mode, the laser body 4 generates approximately 30W of heat. Using a traditional heat dissipation structure, the operating temperature of the laser body 4 rapidly rises to over 85°C at an ambient temperature of 25°C, leading to unstable laser output power, decreased beam quality, and in severe cases, triggering overheat protection and shutdown. With the heat dissipation structure of this invention, the preload of the compression spring 13 is set to 50N by adjusting the pressure adjusting nut 15. At this point, the conical micro-bump array 7 on the deformable thermal pad 6 forms a uniform and tight contact with the surface of the laser body 4. Under the same operating conditions, the operating temperature of the laser body 4 stabilizes within the range of 45°C to 50°C, with temperature fluctuations less than ±2°C. The heat dissipation fins on the heat sink substrate 5 can effectively dissipate most of the heat under natural convection conditions, eliminating the need for an additional forced air cooling device. The device base 1 serves as an auxiliary heat dissipation path, handling approximately 30% of the total heat dissipation. The entire heat dissipation system maintains stable heat dissipation performance even after 8 hours of continuous operation, with laser output power fluctuations controlled within ±1% and beam quality parameter M² maintained below 1.2. This application example demonstrates that this invention can effectively solve the heat dissipation problem of high-power lasers in video acquisition applications, ensuring stable operation of the laser within its optimal temperature range and improving the reliability and lifespan of the entire video acquisition system.

[0031] In another application example, the device was integrated into a portable laser video scanning device. Due to space constraints, large heat sinks or fan cooling systems could not be installed. Using the compact heat dissipation structure of this invention, a heat dissipation test was conducted on a 30W laser at an ambient temperature of 35°C. By precisely adjusting the pressure adjusting nut 15, the preload of the compression spring 13 was optimized to 40N, achieving optimal contact between the deformable thermal pad 6 and the laser body 4. Test results showed that during 4 hours of continuous operation, the temperature of the laser body 4 remained below 55°C, far below its maximum allowable operating temperature of 75°C. The heat dissipation fins of the heat sink substrate 5 exchange heat with the outside air through ventilation holes on the device casing, while the device base 1 provides auxiliary heat dissipation through contact with other metal components inside the device. The entire heat dissipation system achieves highly efficient heat dissipation performance within a limited space, ensuring stable operation of the portable device in high-temperature environments.

[0032] This utility model's high-efficiency laser video acquisition device achieves effective control of the laser's operating temperature through a multi-path heat dissipation design, an adjustable contact pressure mechanism, and an adaptive structural design. The tight fit between the device base 1 and the bottom of the laser body 4 provides a downward heat dissipation path, while the combination of the heat sink substrate 5 and the deformable thermal conductive pad 6 forms the main upward heat dissipation path, creating a dual-path heat dissipation structure. The pressure adjustment function of the spring assembly allows for precise control of the contact pressure according to actual heat dissipation needs, ensuring optimal heat conduction efficiency under different operating conditions. The sliding fit structure between the guide plate 8 and the pin shaft 10 effectively alleviates stress problems caused by thermal expansion and contraction, ensuring the long-term reliability of the heat dissipation system. This comprehensive heat dissipation solution is particularly suitable for temperature-sensitive high-power laser video acquisition applications, maintaining laser operating stability and lifespan while ensuring effective heat dissipation.

[0033] During the operation of the entire high-efficiency laser video acquisition device, the laser body 4 generates a large amount of heat. This heat is first conducted upwards and downwards through the top surface of the laser body 4 and the contact between its bottom and the device base 1. The upwardly conducted heat is conducted through the interface between the deformable thermal pad 6 and the tapered micro-bump array 7 between the laser body 4 and the deformable thermal pad 6. Under the action of the adjustable preload provided by the spring assembly, the tapered micro-bump array 7 on the deformable thermal pad 6 makes close contact with the surface of the laser body 4 and undergoes elastic deformation, transforming the initial point contact into a larger micro-surface contact, effectively reducing the contact thermal resistance. Then, the heat is conducted to the heat sink substrate 5 through the deformable thermal pad 6 body. The heat sink substrate 5 efficiently dissipates the heat into the surrounding air through the integrated heat dissipation fins. At the same time, the device base 1 also undertakes part of the heat dissipation task through its own material properties and contact with the bottom of the laser body 4. The sliding fit between the guide plate 8 and the pin 10 ensures that the heat sink substrate 5 can make slight free adjustments when subjected to thermal stress, avoiding unnecessary stress concentration. The adjustable preload provided by the pressure regulating nut 15 allows for fine-tuning according to actual heat dissipation requirements, further optimizing heat dissipation. The entire structure is compact, and the components work together to form an efficient, stable, and reliable laser heat dissipation system.

[0034] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of this utility model.

Claims

1. A high-efficiency laser video acquisition device, comprising a device base (1), wherein the device base (1) is provided with a central recess (2), and a laser body (4) is fixedly installed in the central recess (2) by a positioning pin (3); characterized in that, It also includes a top cover (11), a heat sink base plate (5), a deformable thermal pad (6), a guide plate (8), and a spring assembly; the top cover (11) is mounted above the device base (1) by bolts (12); the guide plate (8) is symmetrically fixed around the top cover (11), and the top of the guide plate (8) is provided with a guide groove (9); the heat sink base plate (5) is slidably mounted in the guide groove (9) around the periphery by pins (10), and is located above the laser body (4); the deformable thermal pad (6) is bonded to the lower surface of the heat sink base plate (5) by an adhesive backing layer, and the deformable thermal pad (6) is evenly distributed on the surface of the laser body (4) facing the laser body (4). It has a tapered micro-bump array (7); the spring assembly includes a compression spring (13), a threaded post (14) and a pressure adjusting nut (15); the bottom end of the threaded post (14) passes through the central through hole of the radiator substrate (5) and is clearance-fitted with it; the top end of the threaded post (14) is fixed to the inner wall of the top cover (11) and is threadedly connected to the pressure adjusting nut (15) on the inner side of the top cover (11); the compression spring (13) is sleeved outside the threaded post (14) and located between the radiator substrate (5) and the top cover (11); the bottom end of the compression spring (13) abuts against the upper surface of the radiator substrate (5) and the top end abuts against the bottom of the pressure adjusting nut (15).

2. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The array (7) of the conical micro-bumps of the deformable thermal pad (6) is arranged in a hexagonal pattern.

3. The high-efficiency laser video acquisition device according to claim 2, characterized in that, The diameter of a single microbump in the conical microbump array (7) is 0.3 mm, the height is 0.1 mm, and the array spacing is 1.2 mm.

4. The high-efficiency laser video acquisition device according to claim 2 or 3, characterized in that, The cone angle of the cone micro-bumps in the cone micro-bump array (7) is 30° to 45°.

5. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The thickness of the deformable thermal pad (6) is 0.8 mm to 1.2 mm.

6. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The adhesive backing layer uses a pressure-sensitive adhesive material with a thermal conductivity of not less than 3.0 W / (m·K).

7. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The guide plate (8) is symmetrically fixed to the bottom of the top cover (11) around the perimeter by countersunk screws.

8. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The device base (1) has a temperature sensor mounting hole (16) in the central groove (2), which is located directly below the bottom of the laser body (4).

9. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The upper surface of the heat sink substrate (5) is integrated with heat dissipation fins.

10. The high-efficiency laser video acquisition device according to claim 1, characterized in that, The base (1) and the top cover (11) of the device are made of aerospace-grade aluminum alloy or copper alloy.

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