A heat dissipation air duct structure of a power electronic device grid-connected cabinet

Abstract

A kind of heat dissipation air duct structure of power electronic device grid-connected cabinet, comprising: being arranged in the door panel of grid-connected cabinet, air cavity component, fan assembly;Air cavity component is the box structure with front opening, rear opening and first air inlet, front opening is sealed tightly to the one end of the setting device terminal of power electronic device, device terminal is located in air cavity component, and conductive row is worn first air inlet and is overlapped on device terminal, ventilation hole is opened in door panel, and ventilation hole and rear opening are sealed connection, fan assembly is provided with fan, second air inlet and first air outlet, and second air inlet is sealed with ventilation hole Connection.The heat dissipation air duct structure of power electronic device grid-connected cabinet of the utility model forms the closed heat dissipation air duct specially for the device terminal and the conductive row overlap joint of grid-connected cabinet in air cavity component, door panel and fan assembly, realizes accurate efficient heat dissipation, and heat dissipation efficiency is high, and heat dissipation effect is good.

Description

Technical Field

[0001] This utility model relates to the field of power electronic equipment technology, and in particular to a heat dissipation duct structure for a grid-connected cabinet for power electronic equipment. Background Technology

[0002] As power electronics technology advances towards higher power and higher density, the power ratings of various converters, inverters, and other equipment are continuously increasing, leading to increasingly significant heat generation issues. Within the grid-connected cabinets of power electronic equipment, the contact points between power device terminals and busbars become localized high-temperature hotspots due to contact resistance and the skin effect. Existing cooling ducts often employ an overall ventilation design, resulting in dispersed airflow paths that fail to effectively cool these critical heat-generating components. This leads to low heat dissipation efficiency, easily causing device overheating failures or even equipment damage, severely impacting the reliability of high-power power electronic equipment.

[0003] Therefore, there is an urgent need to provide a heat dissipation duct structure for grid-connected power electronic equipment cabinets with good heat dissipation performance. Utility Model Content

[0004] The purpose of this utility model is to avoid the shortcomings of the prior art and provide a heat dissipation duct structure for grid-connected power electronic equipment cabinets with high heat dissipation efficiency and good heat dissipation effect, thereby solving the above-mentioned technical problems.

[0005] This application provides a heat dissipation duct structure for a grid-connected cabinet of power electronic equipment, used to dissipate heat at the junction of device terminals and conductive busbars inside the grid-connected cabinet. The structure includes: a door panel of the grid-connected cabinet; a duct assembly disposed inside the grid-connected cabinet and attached to the door panel; and a fan assembly disposed outside the grid-connected cabinet and attached to the door panel. The duct assembly is a box structure with a front opening, a rear opening, and a first air inlet. The front opening is sealed and attached to the end of the power electronic equipment where the device terminals are located. The device terminals are located inside the duct assembly. The conductive busbar passes through the first air inlet and overlaps the device terminals. A ventilation hole is provided on the door panel, and the ventilation hole and the rear opening are sealed together. The fan assembly is provided with a fan, a second air inlet, and a first air outlet, and the second air inlet is sealed together with the ventilation hole.

[0006] Preferably, the rear opening, the ventilation hole, and the second air inlet are located at the same horizontal position.

[0007] More preferably, the rear opening, the ventilation hole, and the second air inlet have the same shape and size.

[0008] Preferably, the number of the first air inlets is two or more, and the first air inlets are respectively disposed at the upper end and the lower end of the air cavity assembly.

[0009] In another preferred embodiment, the number of the first air inlets is two or more, and the first air inlets are respectively located on the left and right sides of the air cavity assembly.

[0010] Preferably, the device terminals include three-phase device terminals, and the power electronic device is further provided with a partition that separates the three device terminals. The partition divides the interior of the air cavity assembly into three independent small air cavities. The rear opening is connected to the three small air cavities respectively. The three-phase device terminals are respectively disposed in the corresponding small air cavities. Each small air cavity at the upper end of the air cavity assembly is provided with a first air inlet at a corresponding position.

[0011] Preferably, the first air inlet is rectangular.

[0012] Preferably, the first air outlet is located at the upper end of the fan assembly.

[0013] Preferably, a grille is provided at the first air outlet of the aforementioned fan assembly.

[0014] Preferably, the ventilation holes are circular or polygonal.

[0015] Compared with existing technologies, this invention has the following advantages: The front opening of the air cavity assembly in the heat dissipation duct structure of the power electronic equipment grid-connected cabinet is sealed tightly against one end of the power electronic equipment's device terminals; the ventilation holes of the door panel and the rear opening of the air cavity assembly are sealed together; and the second air inlet of the fan assembly is sealed together with the ventilation holes of the door panel. This forms a highly directional, sealed heat dissipation duct specifically targeting the core heat-generating area—the junction of the device terminals and conductor bars—within the grid-connected cabinet. This targeted design completely changes the inefficiency of traditional overall ventilation modes, achieving precise and efficient heat dissipation.

[0016] When the fan is turned on, the fan's suction creates a negative pressure within the air chamber. The cooler air inside the grid-connected cabinet is drawn into the air chamber assembly through the first air inlet. This negative pressure ensures that the cool air is actively and fully drawn in. The cool air absorbs the heat generated at the device terminals and conductor busbar connections, becoming hot air and completing an effective heat exchange process. The hot air enters the fan assembly through the first air outlet, ventilation holes, and the second air inlet. The sealed air duct ensures that all the heat-carrying air is directed to the fan assembly, preventing heat retention. Finally, the hot air is exhausted from the fan assembly's first air outlet to the outside of the cabinet, efficiently removing heat from the device terminals and conductor busbar connections. This process continues, achieving a highly efficient active heat dissipation cycle with high heat dissipation efficiency and excellent heat dissipation effect.

[0017] This utility model's power electronic equipment grid-connected cabinet features a dedicated heat dissipation duct structure for the device terminals and conductor busbar connections. Through a unique cavity structure design, the cooling airflow is forcibly guided and concentrated through the terminal connection area, where heat generation is most severe, achieving targeted forced air cooling. This significantly increases the airflow velocity and volume in this critical hotspot area, fundamentally improving its heat dissipation capacity and significantly enhancing its efficiency. This heat dissipation duct structure effectively controls the operating temperature of key components, reducing the risk of device performance degradation, accelerated aging, and even failure due to localized overheating. It extends the equipment's lifespan and effectively improves the operational reliability and long-term stability of the power electronic grid-connected cabinet. Attached Figure Description

[0018] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention.

[0019] Figure 1 This is a schematic diagram of the heat dissipation air duct structure of a grid-connected cabinet for power electronic equipment according to this utility model; Figure 2 This is a schematic diagram of the heat dissipation duct structure of a grid-connected cabinet for power electronic equipment, showing the configuration of device terminals and conductive bars. Figure 3 yes Figure 2 A schematic diagram of the decomposed structure; Figure 4 This is a schematic diagram of the heat dissipation air duct structure of a power electronic equipment grid-connected cabinet according to the present invention, showing the configuration of device terminals and conductive bars in the air cavity assembly. Figure 5 This is a schematic diagram of the heat dissipation duct structure of a grid-connected cabinet for power electronic equipment of this utility model, without showing the door panel, and with the rear opening, ventilation hole and second air inlet located at the same horizontal position. Figure 6 This is a schematic diagram of the heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to this utility model, without showing the door panel and with the rear opening located above the second air inlet. Detailed Implementation

[0020] The present invention will be further described in conjunction with the following embodiments and accompanying drawings: This application provides a heat dissipation airflow structure for a grid-connected cabinet for power electronic equipment, such as... Figures 1 to 6As shown, a device for heat dissipation at the junction of device terminals 11 and conductive busbars 12 in a grid-connected cabinet for power electronic equipment includes: a door panel 13 installed in the grid-connected cabinet, a vent assembly 14 installed inside the grid-connected cabinet and attached to the door panel 13, and a fan assembly 15 installed outside the grid-connected cabinet and attached to the door panel 13. The vent assembly 14 is a box structure with a front opening 16, a rear opening 17 and a first air inlet 18. The front opening 16 is sealed and attached to one end of the power electronic equipment 10 where the device terminals 11 are located. The device terminals 11 are located inside the vent assembly 14. The conductive busbars 12 pass through the first air inlet 18 and overlap the device terminals 11. The door panel 13 has ventilation holes 19, which are sealed to the rear opening 17. The fan assembly 15 has a fan 20, a second air inlet 21 and a first air outlet 22, which are sealed to the ventilation holes 19.

[0021] The power electronic device 10 can be a power device such as a wind power converter or inverter, which are existing technologies.

[0022] The air cavity assembly 14 is a box structure with a front opening 16, a rear opening 17 and a first air inlet 18. The front opening 16 is sealed and tightly attached to one end of the device terminal 11 of the power electronic device 10. This ensures that the cooling airflow is strictly guided and concentrated through the area of ​​the device terminal 11 where the heat is most severe, avoiding airflow leakage and significantly improving the heat dissipation efficiency and airflow utilization at the junction of the device terminal 11 and the conductive busbar 12.

[0023] The device terminal 11 is located inside the air cavity assembly 14, so that the heat-generating core is directly wrapped in the forced air cooling environment, which is conducive to the efficient removal of heat.

[0024] The conductive busbar 12 passes through the first air inlet 18 and overlaps the device terminal 11. This structure not only ensures the reliability of the electrical connection, but also exposes the heat-generating section of the conductive busbar 12 to the heat dissipation channel, thus achieving direct cooling of the conductive busbar 12.

[0025] Ventilation holes 19 are provided on the door panel 13. The ventilation holes 19 and the rear opening 17 are sealed together. This sealed connection effectively prevents leakage of cooling airflow in the critical transmission path, ensures the stability of air pressure and air volume, and improves the cooling efficiency of the entire air duct system. The fan 20 assembly 15 is equipped with a fan 20, a second air inlet 21, and a first air outlet 22. The second air inlet 21 is sealed together with the ventilation holes 19, forming a complete, sealed, and efficient heat dissipation air duct. This ensures the orderly flow of airflow from intake to exhaust, maximizing the heat dissipation effect.

[0026] The front opening 16 of the air cavity assembly 14 of the power electronic equipment grid-connected cabinet of this utility model is sealed and tightly attached to one end of the power electronic equipment 10 where the device terminal 11 is located. The ventilation hole 19 of the door panel 13 and the rear opening 17 of the air cavity assembly 14 are sealed and connected. The second air inlet 21 of the fan assembly 20 is sealed and connected to the ventilation hole 19 of the door panel 13. That is, the air cavity assembly 14, the door panel 13 and the fan assembly 20 form a highly directional and sealed heat dissipation air duct specifically for the core heat-generating area where the device terminal 11 and the conductor bar 12 overlap in the grid-connected cabinet. This targeted design completely changes the problem of low efficiency of the traditional overall ventilation mode and achieves precise and efficient heat dissipation.

[0027] When the fan 20 is turned on, a negative pressure is created in the air cavity due to the suction effect of the fan 20. The cooler air (cold air) inside the grid-connected cabinet is drawn into the air cavity assembly 14 through the first air inlet 18. The negative pressure effect ensures that the cold air is actively and fully drawn in. After absorbing the heat concentrated at the junction of the device terminals 11 and the conductive busbar 12, the cold air becomes hot air, completing an effective heat exchange process. The hot air enters the fan 20 assembly 15 through the first air outlet 22, the ventilation hole 19, and the second air inlet 21. The sealed air duct ensures that all the air carrying heat is directed to the fan 20 assembly 15, with no heat retention. Finally, the hot air is discharged from the first air outlet 22 of the fan 20 assembly 15 to the outside of the cabinet under the action of the fan 20, thus efficiently removing the heat from the junction of the device terminals 11 and the conductive busbar 12. This process continues, achieving a highly efficient active heat dissipation cycle with high heat dissipation efficiency and good heat dissipation effect.

[0028] The heat dissipation duct structure of this utility model's power electronic equipment grid-connected cabinet features a dedicated independent heat dissipation duct at the junction of the device terminals 11 and the conductive busbars 12. Through a unique cavity structure design, the cooling airflow is forcibly guided and concentrated through the terminal junction area where heat generation is most severe, achieving targeted forced air cooling. This significantly increases the air velocity and volume in this critical hotspot area, fundamentally improving its heat dissipation capacity and significantly enhancing its heat dissipation efficiency. This heat dissipation duct structure effectively controls the operating temperature of critical components, reducing the risk of device performance degradation, accelerated aging, and even failure due to localized overheating. It extends the equipment's service life and effectively improves the operational reliability and long-term stability of the power electronic grid-connected cabinet.

[0029] Better, such as Figures 1 to 5 As shown, the rear opening 17, the ventilation hole 19, and the second air inlet 21 are located at the same horizontal level. This aligned design ensures smooth airflow, minimizes pressure loss and turbulence caused by airflow deflection and abrupt changes, helps maintain stable air pressure and airflow, and improves the working efficiency and overall heat dissipation performance of the fan 20.

[0030] Further, preferably, such as Figures 1 to 5 As shown, the rear opening 17, the ventilation hole 19, and the second air inlet 21 have the same shape and size. The uniformity of the interface shape and size further optimizes airflow, eliminates wind resistance caused by changes in cross-section, ensures that airflow passes through the entire transmission path efficiently and smoothly, reduces energy loss, and improves the system's heat dissipation efficiency.

[0031] Better, such as Figures 1 to 5 As shown, there are two or more first air inlets 18, which are respectively located at the upper and lower ends of the air cavity assembly 14. The multiple air inlets arranged vertically can guide airflow from different directions to converge and wash over the heating element, increasing the contact area with the heating region and improving cooling uniformity, avoiding localized cooling dead zones. This is particularly suitable for heat dissipation of conductive busbars 12 with a large vertical extension. Specifically, depending on the installation position and layout, the conductive busbars 12 can be inserted into the air cavity assembly 14 from the upper and lower first air inlets 18 respectively. Alternatively, all conductive busbars 12 can be inserted into the air cavity assembly 14 from either the upper or lower first air inlets 18.

[0032] Alternatively, the number of first air inlets 18 is two or more, with the first air inlets 18 respectively located on the left and right sides of the air cavity assembly 14. The placement of air inlets on both sides provides layout flexibility, adapting to different cabinet space constraints and device arrangement methods, ensuring an effective cooling airflow path can be formed in various installation environments.

[0033] Better, such as Figures 1 to 4 As shown, the device terminals 11 include three-phase device terminals 11. The power electronic device 10 is also provided with a partition 23 that separates the three device terminals 11. The partition 23 divides the interior of the air cavity assembly 14 into three independent small air cavities 24. The rear opening 17 connects to the three small air cavities 24 respectively. The three-phase device terminals 11 are respectively disposed in the corresponding small air cavities 24. Each small air cavity 24 at the upper end of the air cavity assembly 14 is provided with a first air inlet 18 at the corresponding position. By using the partition 23 to form mutually isolated parallel small air cavities 24, an independent and balanced cooling environment can be provided for the three-phase circuit, avoiding thermal interference between phases and ensuring the consistency of heat dissipation of each phase. At the same time, the design of the small air cavities 24 can maintain the airflow velocity in each channel, further improving the overall heat dissipation efficiency.

[0034] Better, such as Figures 1 to 3 As shown, Figures 1 to 6 As shown, the first air inlet 18 is rectangular. The rectangular opening is particularly suitable for the flat conductive bar 12 to pass through, which can ensure sufficient ventilation cross-sectional area while forming a good fit with the shape of the conductive bar 12, reducing ineffective ventilation space and improving the air duct sealing and air volume utilization rate.

[0035] Better, such as Figures 1 to 3 As shown, the first air outlet 22 is located at the upper end of the fan 20 assembly 15. The air outlet being located at the upper end conforms to the natural law of hot air moving upward, which helps to reduce exhaust resistance, assists in the smoother discharge of hot air, reduces the load on the fan 20, and prevents hot air from accumulating above the equipment and causing secondary heating.

[0036] Better, such as Figures 1 to 3 As shown, a grille 25 is provided at the first air outlet 22 of the fan 20 assembly 15. The grille 25 serves a safety protection function, preventing foreign objects or personnel's fingers from accidentally entering the fan 20. At the same time, it can also guide the airflow direction to a certain extent, reduce turbulence, and has little impact on wind resistance.

[0037] Better, such as Figure 3 The ventilation opening 19 shown is circular, but it can also be other shapes available in the prior art, such as polygons. Circular ventilation openings 19 are easy to manufacture and match well with the shapes of many standard fan interfaces 20, facilitating a sealed connection. Allowing other shapes (such as polygons) provides design flexibility to accommodate different installation interfaces and optimize space utilization.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A heat dissipation duct structure for a grid-connected cabinet for power electronic equipment, characterized in that, For heat dissipation at the junction of device terminals and conductive busbars inside a grid-connected cabinet for power electronic equipment, the assembly includes: a door panel of the grid-connected cabinet, a vent assembly inside the grid-connected cabinet and attached to the door panel, and a fan assembly outside the grid-connected cabinet and attached to the door panel; the vent assembly is a box structure with a front opening, a rear opening, and a first air inlet; the front opening is sealed and attached to the end of the power electronic equipment where the device terminals are located, the device terminals are located inside the vent assembly; the conductive busbar passes through the first air inlet and overlaps the device terminals; the door panel has ventilation holes, the ventilation holes and the rear opening are sealed and connected; the fan assembly has a fan, a second air inlet and a first air outlet, the second air inlet and the ventilation holes are sealed and connected.

2. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The rear opening, the ventilation hole, and the second air inlet are located at the same horizontal position.

3. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 2, characterized in that: The rear opening, the ventilation hole, and the second air inlet have the same shape and size.

4. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The number of first air inlets is two or more, and the first air inlets are respectively located at the upper and lower ends of the air cavity assembly.

5. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The number of first air inlets is two or more, and the first air inlets are respectively located on the left and right sides of the air cavity assembly.

6. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 4, characterized in that: The device terminals include three-phase device terminals. The power electronic device is also provided with a partition that separates the three device terminals. The partition divides the interior of the air cavity assembly into three independent small air cavities. The rear opening is connected to the three small air cavities respectively. The three-phase device terminals are respectively disposed in the corresponding small air cavities. Each of the small air cavities at the upper end of the air cavity assembly is provided with a first air inlet at a corresponding position.

7. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The first air inlet is rectangular.

8. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The first air outlet is located at the upper end of the fan assembly.

9. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: A grille is provided at the first air outlet of the fan assembly.

10. The heat dissipation duct structure of a grid-connected cabinet for power electronic equipment according to claim 1, characterized in that: The ventilation holes are circular or polygonal.

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