A reactive power compensation controller

Abstract

The utility model discloses a kind of reactive compensation controllers, including controller box, floating shelf, PCB mainboard and vibration damper, controller box surface is provided with I / O interface, I / O interface is electrically connected with PCB mainboard by flexible connecting piece, floating shelf is installed in the upper and lower sides of controller box inner chamber and forms flexible fixation with PCB mainboard, vibration damper includes the positioning box fixed in the inner side of controller box and the bearing fixed in the bottom of PCB mainboard, bearing bottom end is equipped with column pin, and the outer periphery of column pin is connected with several flexible columns and is set in positioning box.The floating shelf is composed of floating support foot, fixed foot, floating block and several reed, and the two ends of the reed are respectively connected with floating support foot and fixed foot.The structure realizes the floating support, flexible connection and multidimensional vibration buffering of PCB mainboard, improves the operation stability and electrical connection reliability of equipment under vibration condition.The utility model is suitable for controller equipment with higher requirements for anti-vibration and structural reliability in complex power environment.

Description

Technical Field

[0001] This utility model relates to the field of power equipment technology, specifically a reactive power compensation controller. Background Technology

[0002] Reactive power compensation controllers are important devices for reactive power regulation and power quality optimization in power systems, and are widely used in high-voltage power grids, smart substations, and industrial power distribution systems. These controllers typically contain a high-density printed circuit board (PCB) and multiple external interface modules. They operate in complex environments and are susceptible to vibration, shock, electromagnetic interference, and other factors. Therefore, their structural design requires good mechanical stability and electrical reliability.

[0003] In existing technologies, most PCB motherboards adopt a rigid support structure, which is directly fixed to the controller housing or base. Although this rigid fixing method is easy to install, it is very easy to transmit external vibration or mechanical impact directly to the motherboard body during equipment operation or transportation, resulting in problems such as micro-cracks in solder joints, component detachment, and interface damage, which seriously affect the stable operation and service life of the controller.

[0004] To alleviate these problems, some controllers have attempted to add elastic pads or vibration-damping rubber components around the motherboard to reduce the impact on it. However, these structures are often localized and have limited effectiveness, failing to create true spatial floating support or multi-directional buffering structures, resulting in unstable vibration reduction. Furthermore, traditional connections between the motherboard and external I / O interfaces often employ rigid soldering or pin headers, lacking strain absorption capabilities and prone to issues such as solder joint cracking and signal interruption due to structural deformation or thermal expansion and contraction.

[0005] Furthermore, existing designs often neglect the independent design of bottom vibration isolation structures for the impact transmission path at the bottom of the motherboard, lacking a systematic and coordinated anti-interference solution. This results in technical bottlenecks such as contact failure, vibration transmission, and reduced lifespan for the controller under conditions of long-term operation, high-frequency vibration, and rapid switching.

[0006] Therefore, there is an urgent need for a reactive power compensation controller with a floating support structure, bottom vibration damping components, and a flexible electrical connection mechanism to improve the controller's vibration suppression capability, electrical connection reliability, and operational stability from a structural perspective, adapting to the changing environments of complex power grids and industrial sites. Utility Model Content

[0007] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0008] Therefore, the technical solution adopted by this utility model is: a reactive power compensation controller, including: a controller box, a PCB motherboard, a floating frame, a vibration damper and an I / O interface, etc. The functions of each structure are clear and the connection is reliable, forming an integrated composite structure of vibration reduction and buffering and flexible electrical connection.

[0009] In a preferred example, a PCB motherboard is mounted in the center of the controller box's interior cavity, and the upper and lower sides of the motherboard are connected to the inner wall of the controller box via symmetrically arranged floating frames. The floating frame includes floating support feet, fixed feet, floats, and several springs connecting the two. The floating support feet are connected to the motherboard, the fixed feet are connected to the controller box, and the floats are provided with flexible spring support in the center.

[0010] Specifically, the floating frame structure provides the PCB motherboard with buffer space for vertical swinging, avoiding stress concentration caused by structural vibration and improving the motherboard's shock resistance during operation.

[0011] In a preferred example, a vibration damper is provided at the bottom of the controller box. The vibration damper includes a positioning box, a support, a pin, and flexible pillars. The support is fixed to the bottom of the PCB motherboard, the pin extends vertically and is movably inserted into the positioning box, and multiple circumferentially distributed flexible pillars are provided around the pin to provide multi-dimensional buffering.

[0012] Specifically, when the equipment is subjected to vertical vibration or impact, the pins undergo slight displacement under the constraint of the flexible column, achieving buffering and energy dissipation, effectively enhancing the vibration reduction capability of the bottom support, and further improving the operational stability of the controller.

[0013] In a preferred example, the PCB motherboard and the I / O interface are electrically connected via a flexible connector, which consists of two side mounts and several staggered electrode plates to adapt to the stability of the electrical connection under vibration.

[0014] Specifically, the flexible connection structure can maintain the integrity of the electrical connection under thermal expansion and contraction or micro-displacement conditions, avoiding electrical failures caused by solder joint stress damage or loosening during insertion and removal, thereby ensuring the continuity and reliability of communication or control signals.

[0015] In a preferred embodiment, four floating brackets are arranged symmetrically in pairs on the upper and lower sides of the PCB motherboard. Mounting gaps are provided between the floating brackets and the motherboard, and between the fixed brackets and the controller box.

[0016] Specifically, this structure allows the motherboard to exhibit a certain degree of floating behavior in three-dimensional space, enabling it to absorb impact energy from multiple directions, thereby improving the overall system's anti-disturbance stability and making it suitable for high-vibration or outdoor operating scenarios.

[0017] In a preferred example, the reed adopts a flexible spring structure, and through-hole grooves are formed on the surface of the reed to increase the structural deformation capacity and flexible adjustment performance.

[0018] Specifically, this structural design enables the floating frame to have better rigid-flexible coordination performance, providing stable and reliable mainboard support under dynamic vibration or continuous deformation conditions.

[0019] In a preferred example, the flexible column adopts a rubber column structure, which is evenly distributed around the outer periphery of the column pin, and an movable gap is left between the column pin and the positioning box.

[0020] Specifically, the flexible column forms an elastic limiting path between the pin and the positioning box, effectively creating a recoverable buffer loop to prevent the pin from losing control due to vibration.

[0021] In summary, this utility model, through its integrated design of a flexible floating support for the main board, a bottom buffer and vibration damping structure, and a flexible contact mechanism for electrical connections, not only improves the controller's resistance to shock, disturbances, and electrical connection stability during operation, but also has the advantages of simple structure, low cost, and high reliability. It is particularly suitable for reactive power compensation applications in environments with high electrical intensity and high mechanical interference.

[0022] The beneficial effects achieved by this utility model are as follows:

[0023] 1. In this utility model, the PCB motherboard is installed inside the controller box in a flexible support manner through a floating frame. The floating frame adopts a multi-level elastic component structure (including floats, springs, floating bearing feet and fixed feet, etc.), which effectively absorbs mechanical vibration and structural displacement generated during operation, improves the structural stability of the motherboard, avoids stress concentration damage, and significantly enhances the controller's impact resistance and service life.

[0024] 2. In this utility model, by setting a vibration damper assembly consisting of a flexible column, a pin, and a positioning box, the dynamic vibration isolation function of the bottom of the motherboard is realized. The flexible column provides circumferential elastic support between the pin and the positioning box, and together with the flexible connector, it forms a multi-level vibration reduction system, which not only improves the vibration attenuation capability of the whole structure in complex operating environments, but also ensures the stability and long-term reliability of electrical connections. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present utility model;

[0026] Figure 2 This is a schematic diagram of a PCB motherboard mounting structure according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the I / O interface and its surface flexible connector structure according to an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the floating frame and vibration damper structure according to one embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the internal structure of the positioning box according to an embodiment of the present invention.

[0030] Figure label:

[0031] 100. Controller box; 110. PCB motherboard; 120. I / O interface; 121. Pins; 122. Flexible connector;

[0032] 200. Floating frame; 210. Floating support foot; 220. Fixed foot; 230. Float block; 240. Spring;

[0033] 300, Vibration damper; 310, Positioning box; 320, Bearing seat; 330, Flexible column; 321, Column pin. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0035] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0036] The following describes, with reference to the accompanying drawings, some embodiments of a reactive power compensation controller provided by this utility model.

[0037] Combination Figures 1-5 As shown, the present invention provides a reactive power compensation controller, including a controller box 100, a floating frame 200, a PCB motherboard 110, an I / O interface 120, and a vibration damper 300.

[0038] The controller box 100 serves as the outer casing of the entire unit, and its interior contains structural components for mounting and supporting the PCB motherboard 110. The PCB motherboard 110, as the control core, is fixed in the middle of the inner cavity of the controller box 100.

[0039] The controller box 100 has an I / O interface 120 fixedly mounted on its surface. The I / O interface 120 has several pins 121 for external signal or power input / output connections. The ends of each pin 121 are electrically connected to the PCB motherboard 110 via a flexible connector 122. The flexible connector 122 includes a base fixed to the surface of the pins 121 on both sides, and several electrode pieces located between the bases on both sides. The electrode pieces are arranged in an alternating pattern to achieve flexible electrical connection and avoid solder joint damage or conduction failure due to structural strain or vibration.

[0040] Floating frames 200 are provided on both the upper and lower sides of the PCB motherboard 110. The floating frames 200 are symmetrically distributed on both sides and fixedly connected to the upper and lower inner walls of the controller box 100. Each floating frame 200 includes a floating support foot 210, a fixed foot 220, a float block 230, and several springs 240. The float block 230 is disposed between the floating support foot 210 and the fixed foot 220, and springs 240 are installed on both sides of it. One end of each spring 240 is connected to the float block 230, and the other end is connected to the surface of the floating support foot 210 and the fixed foot 220, respectively. The floating support foot 210 is fixed to the surface of the PCB motherboard 110, and the fixed foot 220 is fixed to the inner wall surface of the controller box 100, thereby achieving flexible support for the PCB motherboard 110.

[0041] In specific implementation, a gap is provided between the floating support foot 210 and the inner wall of the controller box 100, and a gap is also provided between the fixed foot 220 and the PCB main board 110, to realize the floating and swinging function of the PCB main board 110. Multiple springs 240 are arranged perpendicularly to each other on both sides of the float block 230, and the multiple springs in each group of springs 240 are parallel to each other to provide multi-directional elastic support. Each spring 240 is a flexible spring structure with through-hole grooves on its surface to improve deformation compliance and vibration damping performance.

[0042] A vibration damper 300 is installed at the bottom of the PCB motherboard 110 to provide dynamic vertical buffering. The vibration damper 300 includes a positioning box 310 fixed to the bottom inner side of the controller box 100 and a support 320 fixed to the bottom surface of the PCB motherboard 110. A pin 321 is provided at the bottom end of the support 320, and the pin 321 is movably sleeved on the inner side of the positioning box 310. Several flexible columns 330 are connected to the outer periphery of the pin 321. The flexible columns 330 are flexible rubber column structures, evenly arranged in a circumferential direction along the outer periphery of the pin 321, and the flexible columns 330 are fixed to the inner side of the positioning box 310. An movable gap is provided between the pin 321 and the positioning box 310 to allow the pin 321 to absorb vibration energy through the deformation of the flexible columns 330 during small displacement, forming a good vertical buffering and vibration reduction effect.

[0043] During installation, four floating frames 200 are used, and they are divided into two groups. The two floating frames 200 in each group are arranged symmetrically about the center point of the PCB motherboard 110 on one side. The two groups of floating frames 200 are located on the upper and lower sides of the PCB motherboard 110, respectively, thus forming a three-dimensional flexible support system.

[0044] In summary, the PCB motherboard 110 achieves flexible multi-directional support in the controller box 100 through the floating frame 200, and forms a vertical elastic vibration reduction channel at its bottom through the vibration damper 300. At the same time, it forms an electrical connection buffer with the I / O interface 120 through the flexible connector 122. The three work together to effectively improve the controller's shock resistance, electrical connection reliability and structural stability in complex operating environments.

[0045] Working principle and usage process of this utility model:

[0046] This utility model provides a reactive power compensation controller that, through the coordinated design of a multi-stage vibration reduction structure, flexible electrical connection components, a floating support mechanism for the PCB motherboard, and a spatial vibration isolation module, effectively improves the vibration resistance, connection reliability, and electrical performance stability of the electrical module during operation. Its core principles include the following aspects:

[0047] Flexible electrical connection and I / O interface buffering mechanism: The I / O interface 120 is provided with several pins 121, which are electrically connected to the PCB motherboard 110 through a flexible connector 122. The flexible connector 122 contains multiple staggered electrode plates, which can provide a certain amount of deformation when subjected to mechanical impact or structural displacement, effectively mitigating the risk of damage to the motherboard solder joints and signal paths caused by external force transmission.

[0048] PCB motherboard multi-point floating support principle: The PCB motherboard 110 is connected to the upper and lower inner walls of the controller box 100 through four sets of floating frames 200. The floating frame consists of floating support feet 210, fixed feet 220, floating blocks 230, and springs 240. The springs on both sides of the floating blocks are connected to the floating support feet and fixed feet respectively, forming a flexible support structure, which allows the PCB motherboard to float and swing under slight vibrations or thermal expansion and contraction, avoiding stress concentration caused by rigid connections.

[0049] Dynamic vibration isolation and vibration dissipation mechanism: The vibration damper 300 consists of a positioning box 310, a bearing 320, and a pin 321. The bottom end of the pin is inserted into the positioning box, and several flexible columns 330 are sleeved on the outer periphery. During operation, when the controller box 100 as a whole vibrates, the flexible columns absorb energy by cooperating with the pin, realizing bottom buffering and vibration dissipation of the system, thereby improving the vibration reduction capability and operational stability of the entire structure.

[0050] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0051] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A reactive power compensation controller, characterized in that, include: The controller box (100), the floating frame (200), and the PCB motherboard (110) and vibration damper (300) fixed inside the controller box (100) are provided. The controller box (100) has an I / O interface (120) fixedly mounted on its surface. The I / O interface (120) has several pins (121) on its surface, and each pin (121) has a flexible connector (122) at its end for flexible connection with the surface of the PCB motherboard (110). The floating frame (200) is fixed inside the controller box (100). The upper and lower sides of the cavity are fixedly connected to the upper and lower sides of the PCB motherboard (110), respectively; the vibration damper (300) includes a positioning box (310) fixed inside the controller box (100) and a support (320) fixed to the bottom surface of the PCB motherboard (110). The bottom end of the support (320) is provided with a pin (321) that is movably sleeved inside the positioning box (310). A plurality of flexible columns (330) are connected to the outer periphery of the pin (321). The flexible columns (330) are fixed inside the positioning box (310). The floating frame (200) includes: a floating foot (210), a fixed foot (220), a float (230), and springs (240) fixed to both sides of the float (230). The other end of the springs (240) is connected to the surface of the floating foot (210) and the fixed foot (220), respectively. The floating foot (210) and the fixed foot (220) are fixed to the surface of the PCB motherboard (110) and the inner wall surface of the controller box (100), respectively.

2. The reactive power compensation controller according to claim 1, characterized in that, The flexible column (330) is a flexible rubber column structure, and the flexible column (330) is evenly arranged in a circumferential direction along the outer periphery of the pin (321); there is an movable gap between the outer periphery of the pin (321) and the inner side of the positioning box (310).

3. The reactive power compensation controller according to claim 1, characterized in that, The floating frame (200) is symmetrically distributed on the upper and lower sides of the PCB motherboard (110), and there are gaps between the floating support foot (210) and the inner wall of the controller box (100) and between the fixed foot (220) and the PCB motherboard (110) for the floating swing of the PCB motherboard (110).

4. The reactive power compensation controller according to claim 1, characterized in that, The springs (240) are divided into two groups and arranged perpendicularly to each other on both sides of the float (230). The springs (240) on both sides of the float (230) are connected to the surfaces of the float foot (210) and the fixed foot (220) respectively. Each group of springs (240) is arranged in parallel to each other.

5. The reactive power compensation controller according to claim 1, characterized in that, The spring (240) is a flexible spring structure, and each spring (240) has through-hole grooves on its surface to improve the flexibility and strain capacity of the spring.

6. The reactive power compensation controller according to claim 1, characterized in that, The number of floating frames (200) is four, and they are divided into two groups. The two floating frames (200) in each group are arranged symmetrically about the center point of the PCB motherboard (110) on one side. The two groups of floating frames (200) are located on the upper and lower sides of the PCB motherboard (110) respectively.

7. The reactive power compensation controller according to claim 1, characterized in that, The flexible connector (122) includes a fixed base fixed to the surface of the two pole feet (121) and a plurality of electrode plates located between the two fixed bases. The electrode plates are arranged in an alternating manner for flexible connection and signal transmission.

Images