Wireless charging mechanism and charging device

Abstract

The application discloses a wireless charging mechanism and a charging device, and relates to the technical field of charging equipment. In the application, a shell assembly has a charging surface for placing an electronic device; a heat-conducting support is arranged in the shell assembly; a wireless charging coil is arranged in the shell assembly and located on the side of the heat-conducting support facing the charging surface; a wireless charging mainboard is arranged in the shell assembly and located on the side of the heat-conducting support away from the wireless charging coil, the wireless charging mainboard is electrically connected with the wireless charging coil, and the wireless charging mainboard is used for controlling the wireless charging coil to charge the electronic device; and the heat-conducting support is used for dissipating heat of the wireless charging coil and the wireless charging mainboard. The application sets the heat-conducting support between the wireless charging coil and the wireless charging mainboard, so that the heat-conducting support can absorb the heat generated by the wireless charging coil and the wireless charging mainboard, thereby reducing the overall heat of the wireless charging mechanism and improving the heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of charging equipment technology, and in particular to a wireless charging mechanism and charging device. Background Technology

[0002] During wireless charging, the charger generates a lot of heat. This heat accumulates between the electronic device and the charger, which not only affects the safety of charging but also the charging efficiency. Utility Model Content

[0003] This application provides a wireless charging mechanism, comprising: a housing assembly having a charging surface for placing an electronic device; a heat-conducting bracket disposed within the housing assembly; a wireless charging coil disposed within the housing assembly and located on the side of the heat-conducting bracket facing the charging surface; and a wireless charging motherboard disposed within the housing assembly and located on the side of the heat-conducting bracket away from the wireless charging coil. The wireless charging motherboard is electrically connected to the wireless charging coil and is used to control the wireless charging coil to charge the electronic device. The heat-conducting bracket is used to dissipate heat from the wireless charging coil and the wireless charging motherboard.

[0004] In some embodiments, the wireless charging mechanism further includes a heat dissipation stack disposed between the wireless charging coil and the heat-conducting bracket.

[0005] In some embodiments, the heat dissipation stack includes at least one of a graphene layer and a thermally conductive silicone layer; wherein the graphene layer is located between the thermally conductive silicone layer and the wireless charging coil.

[0006] In some embodiments, the wireless charging mechanism further includes a shielding layer disposed between the wireless charging motherboard and the heat-conducting bracket, the shielding layer being used to transfer the heat generated by the wireless charging motherboard to the heat-conducting bracket.

[0007] In some embodiments, the shielding layer comprises conductive cloth.

[0008] In some embodiments, the heat-conducting bracket includes: a heat-conducting plate disposed between the wireless charging coil and the wireless charging motherboard; and a mounting bracket disposed at the edge of the heat-conducting plate and mounted on the housing assembly.

[0009] In some embodiments, at least one of the surfaces of the mounting bracket and the inner surface of the housing assembly is provided with a heat dissipation coating.

[0010] In some embodiments, the heat dissipation coating includes a plastic heat dissipation coating.

[0011] In some embodiments, the housing assembly includes: a mounting housing with a heat dissipation coating on its inner surface, the heat-conducting bracket, the wireless charging coil, and the wireless charging motherboard disposed within the mounting housing; and a cover plate covering the mounting housing and having the charging surface.

[0012] In some embodiments, the wireless charging mechanism further includes: a heat dissipation bracket disposed within the housing assembly and located on the side of the wireless charging motherboard opposite to the heat conduction bracket; and a slide rail slidably connected between the heat dissipation bracket and the housing assembly, capable of sliding inward or outward along the sliding direction into the housing assembly.

[0013] In some embodiments, the slide rail has a wire hole that connects the inside and outside of the housing assembly and is used for routing circuit wires.

[0014] In some embodiments, the housing assembly has heat dissipation holes, and the wire through holes cooperate with the heat dissipation holes to form a heat dissipation channel.

[0015] In some embodiments, the wireless charging mechanism further includes a heat dissipation stack disposed between the wireless charging motherboard and the heat dissipation bracket.

[0016] This application provides a charging device, including: a pedestal charging mechanism; and the aforementioned wireless charging mechanism, disposed on the pedestal charging mechanism, wherein the pedestal charging mechanism is connected to the wireless charging mechanism and supplies power to the wireless charging mechanism.

[0017] In some embodiments, the charging device further includes: a slide rail member, which is rotatably connected to the pedestal charging mechanism and is rotatable about a rotation axis; and the slide rail member is slidably connected to the wireless charging mechanism and is slidable inward or outward along a sliding direction into the wireless charging mechanism.

[0018] In some embodiments, the slide rail has a wire hole that connects the pedestal charging mechanism and the wireless charging mechanism. The wireless charging mechanism has a circuit trace passing through the wire hole. The circuit trace connects the pedestal charging mechanism and the wireless charging mechanism. One end of the wire hole that connects to the pedestal charging mechanism also connects to the outside of the pedestal charging mechanism.

[0019] In some embodiments, the end of the wire hole that connects to the pedestal charging mechanism is located on the side of the slide rail that is away from the charging surface.

[0020] The beneficial effects of this application are as follows: by setting a heat-conducting bracket between the wireless charging coil and the wireless charging motherboard, the heat generated by the wireless charging coil and the wireless charging motherboard can be absorbed by the heat-conducting bracket, thereby reducing the overall heat of the wireless charging mechanism and improving the heat dissipation effect. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the charging device in some embodiments of this application;

[0023] Figure 2 for Figure 1 A schematic diagram of the charging device in the illustrated embodiment from another perspective;

[0024] Figure 3 for Figure 1 The illustrated embodiment is a schematic diagram of the charging device in use for charging electronic devices.

[0025] Figure 4 for Figure 3 The illustrated embodiment shows another usage state diagram when the charging device is charging an electronic device;

[0026] Figure 5 for Figure 4 The illustrated embodiment shows the charging device in use when charging an electronic device from another perspective.

[0027] Figure 6 for Figure 1 Exploded view of the charging device in some embodiments shown;

[0028] Figure 7 for Figure 1 Cross-sectional view of the wireless charging mechanism in some embodiments shown in the illustration;

[0029] Figure 8 for Figure 7 An exploded view of the wireless charging mechanism in the illustrated embodiment;

[0030] Figure 9 for Figure 8 An exploded view of the heat dissipation bracket and slide rail components in the embodiment shown;

[0031] Figure 10 for Figure 9The illustrated embodiment shows a partial structural diagram of the cooperation between the fixing member and the slide rail member in some embodiments.

[0032] Figure 11 for Figure 10 A partial structural schematic diagram of the fixing member and slide rail member in the embodiment shown from another perspective;

[0033] Figure 12 for Figure 10 A cross-sectional view of a portion of the structure when the fixing member and the slide rail are engaged in the embodiment shown;

[0034] Figure 13 for Figure 9 Cross-sectional view of the locking component in some embodiments shown in the illustration;

[0035] Figure 14 for Figure 8 Exploded view of the wireless charging module in some embodiments shown in the illustration;

[0036] Figure 15 for Figure 1 An exploded view of the pedestal charging mechanism in some embodiments shown in the illustration;

[0037] Figure 16 for Figure 1 Cross-sectional view of the pedestal charging mechanism in some embodiments shown in the illustration;

[0038] Figure 17 for Figure 15 A schematic diagram of the inner shell in the illustrated embodiment from another perspective;

[0039] Figure 18 for Figure 15 Exploded views of the outer casing in some embodiments shown in the illustration;

[0040] Figure 19 for Figure 15 The schematic diagram of the motherboard module in some embodiments is shown in the example.

[0041] Figure 20 for Figure 15 The schematic diagrams shown in the embodiments illustrate the structure of the motherboard module and the counterweight when they are combined in some embodiments.

[0042] Figure 21 for Figure 19 Exploded view of the motherboard module in some embodiments shown;

[0043] Figure 22 for Figure 21 An exploded view of the motherboard module in the illustrated embodiment from another perspective;

[0044] Figure 23 for Figure 21 The schematic diagram of the middle frame in the illustrated embodiment from another perspective. Detailed Implementation

[0045] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0046] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0047] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0048] Furthermore, in some embodiments, a technical feature is described, which may be used in conjunction with another technical feature, or even with multiple technical features, in this embodiment. However, the structure and function of this technical feature, if clearly and reasonably described, should not be affected or limited by other technical features in this embodiment, but can be further applied to other embodiments that include this technical feature, so that the technical feature described in other embodiments can also be combined with at least part of the structure and / or at least part of the function of the technical feature described in this embodiment. The new embodiments formed thereby should also fall within the scope of protection of this application.

[0049] This application describes a charging device. The charging device can be used to charge electronic devices. For example, the charging device and the electronic device are electrically connected via a charging cable, such as a data cable, enabling the charging device to charge the electronic device. Alternatively, the charging device can transfer energy to the electronic device via electromagnetic induction, enabling the charging device to wirelessly charge the electronic device.

[0050] In some embodiments, the charging device may have a built-in battery, serving as a power source. Alternatively, the charging device may be electrically connected to an external power source, allowing the external power source to charge the electronic device.

[0051] In some embodiments, the electronic device may be a mobile phone, watch, computer, or other device with a built-in battery that is well known to those skilled in the art. The specific selection and use of the electronic device can be based on the needs of those skilled in the art, and a charging device may be used for power supply, which will not be elaborated further. Of course, in some scenarios, the electronic device may not have a built-in battery.

[0052] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , Figure 1 The following are schematic diagrams of the charging device in some embodiments of this application. Figure 2 for Figure 1 The schematic diagram of the charging device in the illustrated embodiment is shown from another perspective. Figure 3 for Figure 1 The illustrated embodiment is a schematic diagram of the charging device in use for charging electronic devices. Figure 4 for Figure 3 The illustrated embodiment presents another usage state diagram of the charging device when charging an electronic device. Figure 5 for Figure 4 The illustrated embodiment shows the charging device in use from another perspective when charging an electronic device. Figure 6 for Figure 1The illustrated embodiment shows an exploded view of the charging device in some embodiments. The charging device 100 may include a wireless charging mechanism 101 and a pedestal charging mechanism 102. The wireless charging mechanism 101 may be mounted on the pedestal charging mechanism 102. The pedestal charging mechanism 102 may support and mount the wireless charging mechanism 101. The pedestal charging mechanism 102 may be electrically connected to the wireless charging mechanism 101 to supply power to the wireless charging mechanism 101. The wireless charging mechanism 101 may transfer energy to the electronic device 200 via electromagnetic induction, enabling the wireless charging mechanism 101 to wirelessly charge the electronic device 200. The pedestal charging mechanism 102 may be electrically connected to the electronic device 200 via a charging cable, such as a data cable, enabling the pedestal charging mechanism 102 to charge the electronic device 200. In some embodiments, the pedestal charging mechanism 102 may only supply power to the wireless charging mechanism 101 without charging the electronic device 200. In some embodiments, the wireless charging mechanism 101 may be used independently without cooperating with the pedestal charging mechanism 102. That is, the pedestal charging mechanism 102 may be omitted. In some embodiments, the wireless charging mechanism 101 may have a built-in battery, serving as a power source. Alternatively, the wireless charging mechanism 101 may be electrically connected to an external power source, allowing the external power source to charge the electronic device 200 via the wireless charging mechanism 101. In some embodiments, the pedestal charging mechanism 102 may be used independently without cooperating with the wireless charging mechanism 101. That is, the wireless charging mechanism 101 may be omitted. In some embodiments, the pedestal charging mechanism 102 may have a built-in battery, serving as a power source. Alternatively, the pedestal charging mechanism 102 may be electrically connected to an external power source, allowing the external power source to charge the electronic device 200 via the pedestal charging mechanism 102. In some embodiments, the pedestal charging mechanism 102 may have a built-in battery, serving as a power source, and be electrically connected to the wireless charging mechanism 101 to supply power to the wireless charging mechanism 101. Alternatively, the pedestal charging mechanism 102 may be electrically connected to an external power source, allowing the external power source to supply power to the wireless charging mechanism 101 via the pedestal charging mechanism 102, further enabling the wireless charging mechanism 101 to charge the electronic device 200.

[0053] Please see Figure 7 and Figure 8 , Figure 7 for Figure 1 The wireless charging mechanism 101 shown in the embodiment is a cross-sectional view in some embodiments. Figure 8 for Figure 7An exploded view of the wireless charging mechanism 101 in the illustrated embodiment. The wireless charging mechanism 101 may include a housing assembly 10, a slide rail member 20 mounted on the housing assembly 10, and a wireless charging module 30 mounted within the housing assembly 10. The housing assembly 10 may support various structures within the wireless charging mechanism 101, such as the slide rail member 20 and the wireless charging module 30. The slide rail member 20 may be used to connect the housing assembly 10 and the pedestal charging mechanism 102, thereby connecting the wireless charging mechanism 101 and the pedestal charging mechanism 102. The wireless charging module 30 may be disposed within the housing assembly 10 to transfer energy to the electronic device 200 via electromagnetic induction, enabling the wireless charging mechanism 101 to wirelessly charge the electronic device 200. In some embodiments, the slide rail member 20 may be omitted when the wireless charging mechanism 101 does not need to be connected to the pedestal charging mechanism 102. Of course, the slide rail component 20 can not only connect the wireless charging mechanism 101 and the tabletop charging mechanism 102, but also enable the wireless charging mechanism 101 to be installed and fixed on structures such as tables, walls, chairs, and beds that users can choose according to their needs. That is, the slide rail component 20 can be fixed on structures such as tables, walls, chairs, and beds that users can choose according to their needs.

[0054] The wireless charging mechanism 101, such as the housing assembly 10, may have a charging surface 1001, which can be used to place the electronic device 200. In some scenarios, when the electronic device 200 is placed on the charging surface 1001, it can be positioned opposite to the wireless charging module 30, thereby enabling the wireless charging module 30 to wirelessly charge the electronic device 200 using electromagnetic induction.

[0055] The housing assembly 10 may include a mounting housing 11, a cover plate 12 covering the mounting housing 11, and a heat dissipation bracket 13 disposed inside the mounting housing 11. The mounting housing 11, as the main structure of the housing assembly 10, serves to support and mount the various structures within the wireless charging mechanism 101. The cover plate 12 may have a charging surface 1001 for placing the electronic device 200. The heat dissipation bracket 13 may be disposed inside the mounting housing 11 to dissipate heat from the wireless charging mechanism 101, such as the wireless charging module 30. Of course, the heat dissipation bracket 13 may also facilitate the mounting of the slide rail member 20 on the mounting housing 11. In some embodiments, the heat dissipation bracket 13 may be omitted. In some embodiments, the heat dissipation bracket 13 may not be part of the housing assembly 10, but may be part of the slide rail member 20.

[0056] The housing assembly 10, such as the mounting housing 11, may have heat dissipation holes 1002 to dissipate heat from the wireless charging mechanism 101, such as the wireless charging module 30. The heat dissipation holes 1002 allow for internal and external communication between the wireless charging mechanism 101, such as the housing assembly 10, thus achieving heat dissipation. In some embodiments, the heat dissipation holes 1002 may be located on opposite sides of the wireless charging mechanism 101, such as the housing assembly 10. In some embodiments, the heat dissipation holes 1002 may be located on both sides of the slide rail member 20, thereby effectively preventing the slide rail member 20 from blocking the heat dissipation holes 1002 and improving the heat dissipation effect.

[0057] The housing assembly 10, such as the mounting housing 11, may have a sliding hole 1003 to facilitate the passage of the slide rail member 20. In some scenarios, the slide rail member 20 can move out of the housing assembly 10, such as the mounting housing 11, through the sliding hole 1003, or can move inward from the sliding hole 1003 into the housing assembly 10, such as the mounting housing 11. In some scenarios, the slide rail member 20 can extend out of the housing assembly 10, such as the mounting housing 11, through the sliding hole 1003, or can retract into the housing assembly 10, such as the mounting housing 11, through the sliding hole 1003. In some embodiments, the slide rail member 20 can slide in the extending direction of the sliding hole 1003. That is, the sliding hole 1003 can extend in the sliding direction of the slide rail member 20.

[0058] In some embodiments, the housing assembly 10, such as the mounting housing 11, is provided with a heat-dissipating coating. This coating absorbs heat generated by the wireless charging mechanism 101, such as the wireless charging module 30, based on its thermal conductivity, and further conducts the heat to the outside of the housing assembly 10, such as the mounting housing 11, thereby achieving heat dissipation. In some embodiments, the heat-dissipating coating can also modify the thermal conductivity of the housing assembly 10, such as the mounting housing 11, improving the heat dissipation effect. In some embodiments, the heat-dissipating coating is provided on the inner surface of the housing assembly 10, such as the mounting housing 11.

[0059] In some embodiments, the heat dissipation coating may be a plastic heat dissipation coating, which may be a functional coating applied to the surface of a plastic substrate. By optimizing the thermal conductivity and surface radiation characteristics of the plastic substrate, efficient heat dissipation of the plastic substrate can be achieved, while also taking into account additional properties such as protection and insulation. That is, the housing assembly 10, for example, the mounting housing 11, may be made of plastic material.

[0060] The heat dissipation bracket 13 can be installed inside the mounting housing 11 and can be located on the side of the wireless charging module 30 opposite to the charging surface 1001 to dissipate heat from the wireless charging mechanism 101, such as the wireless charging module 30. In some embodiments, the heat dissipation bracket 13 may not have a heat dissipation function. In some embodiments, the heat dissipation bracket 13 can cooperate with the mounting housing 11 to form a sliding hole 1004 so that the slide rail member 20 can pass through. In some scenarios, the slide rail member 20 can move out of the housing assembly 10, such as the mounting housing 11, from the sliding hole 1004, and can move into the housing assembly 10, such as the mounting housing 11, from the sliding hole 1003. In some scenarios, the slide rail member 20 can extend out of the housing assembly 10, such as the mounting housing 11, from the sliding hole 1004, and can retract into the housing assembly 10, such as the mounting housing 11, from the sliding hole 1004. In some embodiments, the slide rail member 20 can slide in the extending direction of the sliding hole 1004. That is, the sliding hole 1004 can extend in the sliding direction of the slide rail member 20. In some embodiments, the sliding hole 1004 may be disposed opposite to the sliding hole 1003 for communication, so that the slide rail member 20 passes through both the sliding hole 1003 and the sliding hole 1004 simultaneously. In some embodiments, the heat dissipation bracket 13 may be part of the mounting housing 11. In some embodiments, the heat dissipation bracket 13 may be integrally formed with the mounting housing 11. In some embodiments, the sliding hole 1004 is disposed on the heat dissipation bracket 13. In some embodiments, the sliding hole 1004 is disposed on the mounting housing 11.

[0061] In some embodiments, a heat dissipation coating is provided on the heat dissipation bracket 13. This coating absorbs heat generated by the wireless charging mechanism 101, such as the wireless charging module 30, based on its thermal conductivity, and further conducts the heat to the outside of the housing assembly 10, such as the mounting housing 11, through the heat dissipation bracket 13, thus achieving a heat dissipation function. In some embodiments, the heat dissipation coating can also modify the thermal conductivity of the heat dissipation bracket 13, improving the heat dissipation effect. In some embodiments, the heat dissipation bracket 13 may also be made of plastic. In some embodiments, the heat dissipation bracket 13 may also be made of a thermally conductive metal component. In some embodiments, the heat dissipation coating is provided on the outer surface of the heat dissipation bracket 13.

[0062] Please see Figure 9 , Figure 9 for Figure 8The exploded view shown in the embodiment illustrates the engagement of the heat dissipation bracket 13 with the slide rail component 20. The sliding hole 1004 may include a first hole segment 1005 and a second hole segment 1006 connected to each other. The first hole segment 1005 and the second hole segment 1006 engage, allowing the slide rail component 20 to pass through them. In some embodiments, the cross-sectional area of ​​the first hole segment 1005 is smaller than the cross-sectional area of ​​the second hole segment 1006. When the first hole segment 1005 and the second hole segment 1006 engage, the slide rail component 20 can be limited, effectively preventing it from sliding completely from the second hole segment 1006 into the first hole segment 1005, ensuring that the slide rail component 20 is partially located within the second hole segment 1006. In some embodiments, the first hole segment 1005 connects to the second hole segment 1006 and the housing assembly 10, for example, the exterior of the housing 11. In some embodiments, the first hole segment 1005 is connected to the sliding hole 1003 to communicate with the housing assembly 10, for example, the exterior of the mounting housing 11, through the sliding hole 1003.

[0063] In some embodiments, the second hole segment 1006 may be provided with a limiting portion 131 to limit the slide rail member 20, effectively preventing the slide rail member 20 from sliding into the housing assembly 10, such as the mounting housing 11, from the second hole segment 1006. In some embodiments, the limiting portion 131 may be provided on the housing assembly 10, such as the mounting housing 11. In some embodiments, the limiting portion 131 may be omitted.

[0064] Please see Figure 7 , Figure 8 and Figure 9 The slide rail component 20 may be located on the side of the wireless charging module 30 opposite to the charging surface 1001. In some embodiments, the slide rail component 20 may be installed within the sliding hole 1003. In some embodiments, the slide rail component 20 may be installed within the sliding hole 1004.

[0065] The slide rail component 20 may include a fixing member 21, a slide rail component 22, and a locking assembly 23. The fixing member 21 can be used to fix the pedestal charging mechanism 102 or any structure described in the above embodiments that can be selected by the user based on their needs. The slide rail component 22 can be slidably connected to the housing assembly 10, for example, mounting housing 11, and can slide inward or outward along the sliding direction. The fixing member 21 can be rotatably connected to the slide rail component 22 outside the housing assembly 10, for example, mounting housing 11, to rotate about a rotation axis. The locking assembly 23 can abut against the slide rail component 22 to limit the slide rail component 22, effectively preventing the slide rail component 22 from sliding inward or outward along the sliding direction. When the slide rail component 22 slides, the locking assembly 23 can slide on the abutment surface 221 of the slide rail component 22.

[0066] In some embodiments, the sliding direction may be set at an acute angle to the rotation axis. In some embodiments, the sliding direction may be perpendicular to the rotation axis.

[0067] The slide rail component 20 allows the wireless charging mechanism 101 to rotate around the rotation axis, and can extend in the sliding direction away from the rotation axis and shorten in the sliding direction towards the rotation axis, thereby adjusting the position of the housing component 10, such as the mounting housing 11, and adjusting the position of the wireless charging module 30.

[0068] The fastener 21 can be connected to the pedestal charging mechanism 102 or the structure described in the above embodiments that can be selected by the user based on their needs by welding, screwing, snapping, bonding or other connection methods known to those skilled in the art, which will not be elaborated here.

[0069] See Figure 9 , Figure 10 and Figure 11 , Figure 10 for Figure 9 The diagram shown illustrates the partial structure of the fastener 21 and slide rail 22 in some embodiments. Figure 11 for Figure 10 The illustrated embodiment shows a partial structural diagram of the fixing member 21 and the slide rail member 22 from another perspective. The fixing member 21 may be provided with a rotating shaft 211 to be rotatably connected to the slide rail member 22 and to be able to rotate along the rotation axis.

[0070] Please see Figure 12 , Figure 12 for Figure 10The illustrated embodiment shows a partial structural cross-section of the fastener 21 and slide rail 22 when they mate. The rotating shaft 211 may have a first mating surface 2111 to mate with the slide rail 22, enabling damped rotation between the fastener 21, for example, the rotating shaft 211, and the slide rail 22. In some embodiments, the first mating surface 2111 is a plane parallel to the rotation axis; however, it can also be other types of surfaces, such as curved surfaces or irregular surfaces. In some embodiments, on a reference plane perpendicular to the rotation axis, the arc a defined by the first mating surface 2111 with the rotation axis as its center is 0-60°. The first mating surface 2111 provides damping to the rotating shaft 211, which is perceptible to the user, thus improving the user experience. Furthermore, in some scenarios, the first mating surface 2111 allows the user to remove the force when rotating the rotating shaft 211, enabling the rotating shaft 211 to reset based on damping. For example, in the above embodiment, when the arc a is 0-60°, the damping rotation angle between the fixing member 21, such as the rotating shaft 211, and the slide rail member 22 is 0-30°, which is half of the arc a in the above embodiment. Of course, the arc a in the above embodiment can also be other, and is not limited to the embodiments listed here. In some embodiments, the damping rotation angle between the fixing member 21, such as the rotating shaft 211, and the slide rail member 22 can be 0, 5°, 10°, 15°, or 20°, etc.

[0071] Please see Figure 11 The fixing member 21, such as the rotating shaft 211, may have a stroke fitting part 212 to limit the slide rail member 22, so that the relative rotation angle between the slide rail member 22 and the fixing member 21, such as the rotating shaft 211, is within the range of 0-80°.

[0072] Please see Figure 9 The slide rail 22 is slidably connected between the heat dissipation bracket 13 and the housing assembly 10, such as the mounting housing 11, and can slide in or out of the housing assembly 10, such as the mounting housing 11, along the sliding direction. In some embodiments, the slide rail 22 may pass through the sliding hole 1004 to extend out of the housing assembly 10, such as the mounting housing 11, and may retract into the housing assembly 10, such as the mounting housing 11, from the sliding hole 1004. In some embodiments, the slide rail 22 may pass through the sliding hole 1003 (e.g., ... Figure 7 (As shown).

[0073] The slide rail 22 may have an abutment surface 221 extending in the sliding direction to cooperate with the locking component 23, such that the locking component 23 abuts against the abutment surface 221 to limit the slide rail 22 and maintain the length of the slide rail component 20 extending from the sliding hole 1004 to the housing assembly 10, for example, the mounting housing 11, to ensure the stability of the wireless charging mechanism 101.

[0074] When the slide rail 22 slides, the locking component 23 can slide on the slide rail 22, for example, the abutment surface 221.

[0075] In some embodiments, the abutment surface 221 has a plurality of recessed areas 2211 arranged along the sliding direction for engaging with the locking component 23. For example, the locking component 23 can slide along the abutment surface 221 and engage when it slides into the recessed area 2211. The recessed areas 2211 reduce the difficulty of the locking component 23 sliding into the recessed area 2211 and increase the difficulty of the locking component 23 sliding out of the recessed area 2211, thereby achieving the engagement of the locking component 23. For example, when a user operates the wireless charging mechanism 101, the locking component 23 can slide along the abutment surface 221 and easily slide into the recessed area 2211. When the user increases the force, the locking component 23 can be driven to slide out of the recessed area 2211. When the locking component 23 slides into the recessed area 2211, the user removes the force, which will make the slide rail 22 and the fixing component 21 remain relatively stable due to the restriction of the recessed area 2211.

[0076] In some embodiments, the recessed area 2211 has a concave surface 2212 to engage when the locking component 23 abuts against the concave surface 2212. The concave surface 2212 allows the recessed area 2211 to be a groove, thereby engaging when the locking component 23 abuts against the groove. The concave surface 2212 may be the groove wall surface of the groove. In some embodiments, to enable the locking component 23 to slide into and out of the recessed area 2211, the concave surface 2212 may be a curved surface. In some embodiments, the concave surface 2212 may be an arcuate surface.

[0077] In some embodiments, the arrangement of multiple recessed areas 2211 can enable multi-level adjustment of the length of the slide rail member 20 extending beyond the housing assembly 10, such as the mounting housing 11, to meet the user's needs.

[0078] Please see Figure 9 , Figure 10 , Figure 11 and Figure 12 The slide rail component 22 may have an elastically bent portion 222. The elastically bent portion 222 may be bent around the side periphery of the fixing member 21, such as the rotating shaft 211, and is capable of rotating relative to the fixing member 21, such as the rotating shaft 211, about a rotation axis. The provision of the elastically bent portion 222 can increase the abutment force on the side periphery of the fixing member 21, such as the rotating shaft 211, thereby achieving damped rotation between the fixing member 21, such as the rotating shaft 211, and the slide rail component 22, such as the elastically bent portion 222. In some embodiments, the elastically bent portion 222 may apply an elastic preload to the side periphery of the fixing member 21, such as the rotating shaft 211, based on elastic deformation.

[0079] Please see Figure 11The slide rail component 22, for example, the elastically bent portion 222, may have a stroke limiting portion 2221 to limit the fixing member 21, for example, the rotating shaft 211, so that the relative rotation angle range between the slide rail component 22, for example, the elastically bent portion 222, and the fixing member 21, for example, the rotating shaft 211, is 0-80°. In some embodiments, the stroke limiting portion 2221 may cooperate with the stroke mating portion 212 to achieve the limiting, so that the relative rotation angle range between the slide rail component 22, for example, the elastically bent portion 222, and the fixing member 21, for example, the rotating shaft 211, is 0-80°. For example Figure 11 In this configuration, the travel limiting portion 2221 is located between the travel mating portions 212 and can abut against the travel mating portions 212 during rotation to achieve a limiting effect. For example, the travel limiting portion 2221 cooperates with the travel mating portions 212 to abut or separate the slide rail member 22 (e.g., the elastically bent portion 222) and the fixing member 21 (e.g., the rotating shaft 211) within a relative rotation angle range of 0-80°. In some embodiments, when the slide rail member 20 (e.g., the fixing member 21) is fixed on the pedestal charging mechanism 102, the rotation range of the wireless charging mechanism 101 (e.g., the slide rail member 22) relative to the pedestal charging mechanism 102 can be 0-80°.

[0080] It is understood that the positions of the stroke limiting part 2221 and the stroke matching part 212 can be interchanged, and are not limited to the embodiments listed herein.

[0081] In some embodiments, the slide rail 22, for example, the elastically bent portion 222, may have a second mating surface 2222 to cooperate with the fixing member 21, for example, the rotating shaft 211, to achieve damped rotation between the fixing member 21, for example, the rotating shaft 211 and the slide rail 22. In some embodiments, the second mating surface 2222 is a plane parallel to the rotation axis; of course, it can also be other types of surfaces, such as curved surfaces or irregular surfaces. In some embodiments, on a reference plane perpendicular to the rotation axis, the arc b defined by the second mating surface 2222 with the rotation axis as the center is 0-60°. The provision of the second mating surface 2222 allows the rotating shaft 211 to have damping, which can be perceived by the user, thereby improving the user experience. Moreover, in some scenarios, the provision of the second mating surface 2222 can also allow the user to remove the force when rotating the slide rail 22, for example, the elastically bent portion 222, so that the slide rail 22, for example, the elastically bent portion 222, can be reset based on damping. For example, in the above embodiments, when the arc b is 0-60°, the damping rotation angle between the slide rail 22 (e.g., the elastic bending portion 222) and the fixing member 21 (e.g., the rotating shaft 211) is 0-30°, which is half of the arc b in the above embodiments. Of course, the arc b in the above embodiments can also be other than those listed herein. In some embodiments, the damping rotation angle between the slide rail 22 (e.g., the elastic bending portion 222) and the fixing member 21 (e.g., the rotating shaft 211) can be 0, 5°, 10°, 15°, or 20°, etc.

[0082] In some embodiments, when the slide rail 22, for example, the elastically bent portion 222, and the fixing member 21, for example, the rotating shaft 211, rotate, the first matching surface 2111 may match and be opposite to the second matching surface 2222, or may be misaligned and separated.

[0083] In some embodiments, when the first matching surface 2111 and the second matching surface 2222 are misaligned and separated, the elastic deformation of the elastic bending portion 222 can be increased, thereby further increasing the elastic preload applied by the slide rail component 22, such as the elastic bending portion 222, to the side circumferential surface of the fixing component 21, such as the rotating shaft 211, and achieving damped rotation.

[0084] In some embodiments, the slide rail member 22, for example, the elastic bending portion 222, can rotate about the rotation axis relative to the fixing member 21, for example, the rotating shaft 211, and can rotate to a position where the first matching surface 2111 and the second matching surface 2222 are matched and opposite, or a position where the first matching surface 2111 and the second matching surface 2222 are misaligned and separated. When the slide rail member 22, for example, the elastic bending portion 222, applies an elastic preload to the side circumferential surface of the rotating shaft 211 when the first matching surface 2111 and the second matching surface 2222 are misaligned and separated, the elastic preload applied to the side circumferential surface of the rotating shaft 211 is greater than the elastic preload applied to the side circumferential surface of the rotating shaft 211 when the first matching surface 2111 and the second matching surface 2222 are matched and opposite.

[0085] Please see Figure 12 The first matching surface 2111 and the second matching surface 2222 are in a matching relative position. When the slide rail 22 rotates counterclockwise, for example, the elastic bending portion 222, the slide rail 22, for example, the elastic bending portion 222, adapts to the change in the side circumferential dimensions of the elastic bending portion 222 and the fixing member 21, and the elastic deformation increases. As a result, the elastic preload applied to the side circumferential surface of the fixing member 21, for example, the rotating shaft 211, increases until the first matching surface 2111 and the second matching surface 2222 are in a matching separated position, at which point the elastic preload applied to the side circumferential surface of the fixing member 21, for example, the rotating shaft 211, is at its maximum.

[0086] In some embodiments, when the slide rail member 20, such as the fixing member 21, is fixed to the pedestal charging mechanism 102, during the rotation of the wireless charging mechanism 101, such as the slide rail member 22, relative to the pedestal charging mechanism 102, the first mating surface 2111 and the second mating surface 2222 are in a mating opposite position when the wireless charging mechanism 101 abuts against the pedestal charging mechanism 102. In a further embodiment, rotating the wireless charging mechanism 101, such as the slide rail member 22, can achieve damped rotation.

[0087] Understandably, the first mating surface 2111 can be referred to as the second mating surface, and the second mating surface 2222 can also be referred to as the first mating surface. For example, the inner surface of the elastic bending portion 222 that contacts the side circumferential surface of the rotating shaft 211 has a first mating surface. The side circumferential surface of the rotating shaft 211 has a second mating surface that matches and opposes the first mating surface.

[0088] Please see Figure 9 The slide rail 22 may have a limiting protrusion 223. The limiting portion 131 may cooperate with the first hole segment 1005 to limit the limiting protrusion 223 within the second hole segment 1006. For example, when the slide rail 22 slides within the sliding hole 1004, the limiting protrusion 223 may slide between the limiting portion 131 and the first hole segment 1005. In some embodiments, the method for limiting the slide rail 22 to slide within the sliding hole 1004 is not limited to the embodiments listed herein, and other methods may also be used, which will not be elaborated upon.

[0089] In some embodiments, the slide rail 22 may have a through hole 2201, which can connect the inside and outside of the housing assembly 10, such as the mounting housing 11. The through hole 2201 can be used to run circuit traces. The circuit traces can be connected to the wireless charging mechanism 101, such as the wireless charging module 30, to supply power to the wireless charging mechanism 101, such as the wireless charging module 30. In some embodiments, since one end of the through hole 2201 is connected to the outside of the housing assembly 10, such as the mounting housing 11, and the other end is connected to the inside of the housing assembly 10, such as the mounting housing 11, it can cooperate with the heat dissipation hole 1002 to form a heat dissipation channel. Furthermore, hot air flows out from the heat dissipation hole 1002, causing the air pressure inside the housing assembly 10, such as the mounting housing 11, to decrease, and external air can enter the housing assembly 10, such as the mounting housing 11, through the through hole 2201 to balance the air pressure inside the housing assembly 10, such as the mounting housing 11.

[0090] In some embodiments, the through hole 2201 can connect the wireless charging mechanism 101 and the pedestal charging mechanism 102. The wireless charging mechanism 101 may have circuit traces passing through the through hole 2201, thereby enabling the wireless charging mechanism 101, for example, the wireless charging module 30, to connect with the pedestal charging mechanism 102. In some embodiments, please refer to Figure 5 The end of the wire hole 2201 that connects to the base charging mechanism 102 is also connected to the outside of the base charging mechanism 102, thereby allowing external air to enter the heat dissipation channel. In some embodiments, the end of the wire hole 2201 that connects to the base charging mechanism 102 may be located on the side of the slide rail 22 away from the charging surface 1001.

[0091] Please see Figure 9The locking component 23 is set on the heat dissipation bracket 13, for example, on the first hole segment 1005. Of course, it can also be set in other positions of the sliding hole 1004, or even in other parts of the heat dissipation bracket 13 or other parts of the mounting housing 11. It only needs to be set inside the wireless charging mechanism 101.

[0092] The locking component 23 can abut against the slide rail 22, for example, the abutment surface 221, based on elastic deformation. When the slide rail 22 slides within the sliding hole 1004, the locking component 23 slides on the slide rail 22, for example, the abutment surface 221. When the locking component 23 slides into the recessed area 2211, the locking component 23 can extend based on elastic deformation, and can extend to abut against the recessed area 2211, for example, the concave surface 2212. When the locking component 23 slides out of the recessed area 2211, the locking component 23 can undergo elastic deformation, and then retract and extend.

[0093] When the locking component 23 is located within the recessed area 2211, the locking component 23 can limit the relative position of the slide rail 22 and the wireless charging mechanism 101, and the relative position of the housing assembly 10, for example, the mounting housing 11. For example, when the locking component 23 slides out of the recessed area 2211, it is necessary to overcome the elastic deformation of the locking component 23. Therefore, if the force applied by the user cannot overcome the elastic deformation of the locking component 23, the locking component 23 cannot slide out of the recessed area 2211.

[0094] Please see Figure 13 , Figure 13 for Figure 9 The illustrated embodiment shows a cross-sectional view of the locking assembly 23 in some embodiments. The locking assembly 23 may include a support member 231, an elastic member 232, and an abutment member 233. The support member 231 can be used to support and mount the elastic member 232 and the abutment member 233. The elastic member 232 may be disposed between the support member 231 and the abutment member 233, and can drive the abutment member 233 to move based on elastic deformation. The abutment member 233 can abut against the slide rail member 22, for example, the abutment surface 221, under the action of the elastic member 232. When the slide rail member 22 slides, the abutment member 233 can slide on the slide rail member 22, for example, the abutment surface 221.

[0095] In some embodiments, the support member 231 allows the locking assembly 23 to be a module, facilitating integral mounting on the heat sink bracket 13 or other structures of the housing assembly 10. However, in other embodiments, the support member 231 may be omitted, allowing the elastic member 232 and the abutment member 233 to be mounted on the heat sink bracket 13 or other structures of the housing assembly 10. In some embodiments, the support member 231 may also be part of the heat sink bracket 13 or housing assembly 10, for example, other structures, and not part of the locking assembly 23.

[0096] The elastic element 232 may be made of a material capable of elastic deformation. In some embodiments, the elastic element 232 may be a spring, or other materials, which will not be elaborated further.

[0097] The abutment member 233 may have a curved surface 2331 that abuts against the slide rail member 22, such as the abutment surface 221, so that the abutment member 233 can slide into the recessed area 2211 and slide out of the recessed area 2211 with the cooperation of the curved surface 2331. In some embodiments, the curved surface 2331 may match the concave surface 2212.

[0098] Understandably, when the abutment member 233 has elastic deformation, the elastic member 232 can be omitted. In some embodiments, the abutment member 233 may be made of a material capable of elastic deformation. For example, springs, silicone pillars, etc., will not be described in detail.

[0099] In addition, in some embodiments, the location of the locking component 23 and the location of the abutment surface 221 can be interchanged, and are not limited to the embodiments listed herein.

[0100] In some embodiments, the fixing member 21 may be fixed within the pedestal charging mechanism 102. In some embodiments, the fixing member 21 may be part of the pedestal charging mechanism 102, such that the pedestal charging mechanism 102 and the slide rail member 22 are engaged by the fixing member 21 engaging with the slide rail member 22, or in a similar manner. Furthermore, in some embodiments, the wireless charging mechanism 101, for example, the slide rail member 22, is rotatably connected to the pedestal charging mechanism 102, for example, the fixing member 21, and is capable of rotating about a rotation axis. The slide rail member 22 is slidably connected to the wireless charging mechanism 101, for example, the housing assembly 10, and is capable of sliding in or out of the wireless charging mechanism 101, for example, the housing assembly 10, along a sliding direction. Furthermore, in a further embodiment, the slide rail member 22 may also be part of the pedestal charging mechanism 102, such that the pedestal charging mechanism 102 and the wireless charging mechanism 101 are engaged by the locking member 23 engaging with the slide rail member 22, or in a similar manner.

[0101] Please see Figure 8 and Figure 14 , Figure 14 for Figure 8 The illustrated embodiment shows an exploded view of the wireless charging module 30 in some embodiments. The wireless charging module 30 may be disposed within the housing assembly 10, such as the mounting housing 11, for wirelessly charging the electronic device 200. In some embodiments, the wireless charging module 30 may be located between the cover plate 12 and the heat dissipation bracket 13.

[0102] The wireless charging module 30 may include a heat-conducting bracket 31, a wireless charging coil 32, and a wireless charging motherboard 33. The heat-conducting bracket 31 can support and mount the wireless charging coil 32 and the wireless charging motherboard 33, and may also support other structures, which will not be elaborated further. The wireless charging coil 32 may be located on the side of the heat-conducting bracket 31 facing the charging surface 1001. The wireless charging motherboard 33 may be located on the side of the heat-conducting bracket 31 away from the wireless charging coil 32. The wireless charging motherboard 33 can be electrically connected to the wireless charging coil 32 and is used to control the wireless charging coil 32 to charge the electronic device 200. The heat-conducting bracket 31 can be used to dissipate heat from the wireless charging coil 32, and also to dissipate heat from the wireless charging motherboard 33. In some embodiments, the wireless charging motherboard 33 may be disposed within the pedestal charging mechanism 102, rather than within the wireless charging mechanism 101.

[0103] In some embodiments, the heat-conducting bracket 31 may also be provided with the heat dissipation coating described in the above embodiments.

[0104] The heat-conducting bracket 31 may be made of a thermally conductive material, such as a metal structure. In some embodiments, the heat-conducting bracket 31 may be installed within the housing assembly 10, such as the mounting housing 11. In some embodiments, the heat-conducting bracket 31 may include a mounting bracket 311 mounted on the housing assembly 10, such as the mounting housing 11, and a heat-conducting plate 312 disposed on the mounting bracket 311. In some embodiments, the mounting bracket 311 may be disposed at the edge of the heat-conducting plate 312 to support the heat-conducting plate 312. In some embodiments, the heat-conducting plate 312 may be disposed between the wireless charging coil 32 and the wireless charging motherboard 33 to dissipate heat between the wireless charging coil 32 and the wireless charging motherboard 33. In some embodiments, the mounting bracket 311 may be made of a thermally conductive material, such as a metal structure; of course, other types of materials may be used in other embodiments. In some embodiments, the surface of the mounting bracket 311 may be provided with the heat-dissipating coating described in the above embodiments to improve heat dissipation. In some embodiments, the heat-conducting plate 312 may be made of a thermally conductive material, such as a metal structure.

[0105] In some embodiments, to improve heat dissipation, the wireless charging module 30 may further include a heat dissipation stack 34 disposed between the wireless charging coil 32 and the heat-conducting support 31, such as the heat-conducting plate 312. The heat dissipation stack 34 improves the efficiency of heat conduction from the wireless charging coil 32 to the heat-conducting support 31, thereby improving heat dissipation. In some embodiments, the heat dissipation stack 34 may include a thermally conductive silicone layer 341, utilizing its high thermal conductivity for heat dissipation. In some embodiments, the heat dissipation stack 34 may include a graphene layer 342, utilizing its high thermal conductivity and thermal radiation for heat dissipation. In some embodiments, the thermally conductive silicone layer 341 may be located between the graphene layer 342 and the heat-conducting support 31, such as the heat-conducting plate 312. In some embodiments, the heat dissipation stack 34 may also be stacked using materials well-known to those skilled in the art, depending on the heat dissipation requirements; the number of stacked layers is not limited.

[0106] In some embodiments, to effectively prevent the wireless charging coil 32 from affecting the wireless charging motherboard 33, the wireless charging module 30 may further include a shielding layer 35 disposed between the wireless charging motherboard 33 and the heat-conducting bracket 31, such as the heat-conducting plate 312. In some embodiments, the shielding layer 35 may be made of metal or other materials, and the specific design can be determined according to the needs of those skilled in the art, without further details. Of course, when selecting materials, the properties of the materials will also be considered to ensure that the shielding layer 35 has a heat dissipation effect, thereby conducting heat from the wireless charging motherboard 33 to the heat-conducting bracket 31, such as the heat-conducting plate 312. In some embodiments, the shielding layer 35 may include conductive cloth.

[0107] In some embodiments, to enable the electronic device 200 to be mounted on the wireless charging mechanism 101, such as the charging surface 1001, the wireless charging mechanism 101, such as the wireless charging module 30, may include a magnetic connector 36. The magnetic connector 36 can be magnetically connected to the electronic device 200, so that the electronic device 200 is fixed on the wireless charging mechanism 101, such as the charging surface 1001, for easy disassembly. For example, the magnetic connector 36 may be a magnetic material, such as a magnet, to connect the electronic device 200 by adsorption. For example, the magnetic connector 36 may be an iron product, and the electronic device 200 may have a magnetic material, such as a magnet, thereby achieving adsorption connection. Of course, to enable the electronic device 200 to be mounted on the wireless charging mechanism 101, such as the charging surface 1001, other connection methods may be used, and it is not limited to the embodiments listed herein. Therefore, in some embodiments, the magnetic connector 36 may be omitted. In some embodiments, the magnetic connector 36 may be disposed within the housing assembly 10, such as the mounting housing 11. In some embodiments, the magnetic connector 36 may be disposed on the heat-conducting bracket 31. In some embodiments, the magnetic connector 36 may be disposed around the wireless charging coil 32.

[0108] In some embodiments, the wireless charging motherboard 33 is disposed between the heat dissipation bracket 13 and the heat conduction bracket 31, such as the heat conduction plate 312, so that the heat dissipation bracket 13 can also dissipate heat from the wireless charging motherboard 33. In some embodiments, the wireless charging motherboard 33 can be connected to the desktop charging mechanism 102, for example, through the circuit wiring in the above embodiments.

[0109] Please see Figure 7 The wireless charging coil 32 generates heat during operation, which is then conducted to the heat-conducting bracket 31 (e.g., heat-conducting silicone layer 341, graphene layer 342) via the heat dissipation layer 34. The wireless charging motherboard 33 also generates heat during operation, which is conducted to the heat-conducting bracket 31 (e.g., heat-conducting plate 312) via the shielding layer 35. The heat-conducting bracket 31 (e.g., heat-conducting plate 312) homogenizes the heat, and heat dissipation occurs through the heat-conducting bracket 31 (e.g., mounting bracket 311) and the housing assembly 10 (e.g., mounting housing 11). The heat-dissipating coating on the heat-conducting bracket 31 and the housing assembly 10 absorbs heat and radiates heat outwards from the housing assembly 10 (e.g., mounting housing 11).

[0110] The heat from the wireless charging motherboard 33 can also be transferred to the heat dissipation bracket 13 for further heat equalization, increasing the heat capacity of the wireless charging mechanism 101. The heat dissipation bracket 13 can further transfer heat to the locking components 23, such as the fixing member 21, the slide rail member 22, etc., achieving heat dissipation through the locking components 23, such as the fixing member 21, the slide rail member 22, etc. In some embodiments, in order to achieve heat dissipation, a heat dissipation stack 34 as described in the above embodiment can also be provided between the wireless charging motherboard 33 and the heat dissipation bracket 13.

[0111] The pedestal charging mechanism 102 can support and mount the wireless charging mechanism 101. In some embodiments, the wireless charging mechanism 101 can be mounted above the pedestal charging mechanism 102, thereby allowing the wireless charging mechanism 101 to rotate on the pedestal charging mechanism 102 towards or away from it, for example, about a rotation axis. When the wireless charging mechanism 101 rotates to its limit position towards the pedestal charging mechanism 102 (i.e., the wireless charging mechanism 101 abuts against the pedestal charging mechanism 102), the charging surface 1001 can be located on the side of the wireless charging mechanism 101 away from the pedestal charging mechanism 102. The wireless charging mechanism 101 can extend away from the rotation axis in the sliding direction and shorten towards the rotation axis in the sliding direction. In some embodiments, the wireless charging mechanism 101 is connected to the pedestal charging mechanism 102 via the slide rail member 20 in the above embodiments.

[0112] Please see Figure 15 and Figure 16 , Figure 15 for Figure 1 The illustrated embodiment shows an exploded view of the pedestal charging mechanism 102 in some embodiments. Figure 16 for Figure 1 The illustrated embodiment shows a cross-sectional view of the pedestal charging mechanism 102 in some embodiments. The pedestal charging mechanism 102 may include a housing assembly 40 and a motherboard module 50 disposed within the housing assembly 40. The housing assembly 40 may have a mounting cavity 4001 for mounting the motherboard module 50. The motherboard module 50 may be electrically connected to the wireless charging mechanism 101, such as the wireless charging module 30, to power the wireless charging module 30. Of course, the motherboard module 50 may also enable the pedestal charging mechanism 102 to power the electronic device 200. In some embodiments, the wireless charging motherboard 33 may be part of the motherboard module 50, thereby enabling the motherboard module 50 to control the wireless charging module 30, such as the wireless charging coil 32. In some embodiments, circuit traces may extend into the housing assembly 40 and connect to the motherboard module 50. In some embodiments, locking components 23, such as fasteners 21, may be fixed within the housing assembly 40.

[0113] Please see Figure 1 , Figure 2 and Figure 15 The top of the charging mechanism 102, such as the housing assembly 40, may have a receiving groove 4002 for accommodating the wireless charging mechanism 101, such as the housing assembly 10, to accommodate at least a portion of the wireless charging mechanism 101, thereby enabling the charging device 100 to be folded and stored. In some embodiments, the wireless charging mechanism 101 can be rotated about a rotation axis to rotate until at least a portion of the wireless charging mechanism 101 is located in the receiving groove 4002, or it can be rotated until the wireless charging mechanism 101 is completely located outside the receiving groove 4002. Moreover, when the wireless charging mechanism 101 is at least partially located within the receiving groove 4002, it is closest to the rotation axis, thereby enabling the wireless charging mechanism 101 to be folded and stored.

[0114] Please see Figure 1 When the wireless charging mechanism 101 is at least partially located within the receiving groove 4002, the heat dissipation hole 1002 communicates with the receiving groove 4002 and may be partially located outside the receiving groove 4002 to avoid heat accumulation within the receiving groove 4002. In some embodiments, the heat dissipation hole 1002 may also be entirely located outside the receiving groove 4002.

[0115] Please see Figure 5 The wire hole 2201 is connected to the receiving groove 4002, which can reduce the wire hole 2201 from being exposed in the user's field of vision, thereby improving the appearance of the charging device 100. In addition, it can also achieve heat dissipation.

[0116] In some embodiments, when the wireless charging mechanism 101 is at least partially located within the receiving groove 4002, the first mating surface 2111 and the second mating surface 2222 are mated opposite each other. Consequently, when the wireless charging mechanism 101 rotates outward from the receiving groove 4002 about the rotation axis, the slide rail member 20 will dampen the rotation.

[0117] Please see Figure 3 When the wireless charging mechanism 101 is at least partially located within the receiving slot 4002, the electronic device 200 can be placed on the wireless charging mechanism 101, for example, the charging surface 1001, for charging. See also... Figure 4 and Figure 5 The wireless charging mechanism 101 is located outside the receiving slot 4002. The electronic device 200 can be placed on the wireless charging mechanism 101, for example, the charging surface 1001, for charging. In addition, the angle of the sliding rail component 20 can be adjusted to change the distance between the wireless charging mechanism 101 and the electronic device 200 to suit different users and better meet their different needs, thereby improving the user experience.

[0118] Please see Figure 6 and Figure 15 The housing assembly 40 may include a main housing 41 and a top cover 42. The top cover 42 may be mounted on top of the main housing 41 and may be used to support the wireless charging mechanism 101. In some embodiments, the main housing 41 and the top cover 42 may be spaced apart to minimize heat transfer, thereby making it difficult for heat from the charging mechanism 102, such as the motherboard module 50, to be transferred through the main housing 41 to the top cover 42, and further to the wireless charging mechanism 101. Additionally, it may also make it difficult for heat from the wireless charging mechanism 101, such as the wireless charging module 30, to be transferred through the top cover 42 to the main housing 41, and further to the charging mechanism 102. In some embodiments, the top cover 42 may have a receiving groove 4002 to receive the wireless charging mechanism 101. In some embodiments, a locking component 23, such as a fixing member 21, may be fixed to the main housing 41. In some embodiments, the top of the main housing 41 may have a mounting groove 4501, and the top cover 42 may be placed on top of the main housing 41 to cover the mounting groove 4501. In some embodiments, the top cover 42 may be recessed into the mounting groove 4501 to form the mounting groove 4501. Furthermore, the mounting groove 4501 may be at least partially disposed within the mounting groove 4501, and the top cover 42 may be at least partially located within the mounting groove 4501. In some embodiments, the locking assembly 23, such as the fixing member 21, may be fixed to the groove sidewall of the mounting groove 4501. In some embodiments, the fixing member 21 may be part of the main housing 41, and the locking assembly 23, such as the slide rail 22, may be rotatably connected to the groove sidewall of the mounting groove 4501.

[0119] In some embodiments, to effectively prevent heat transfer, the housing assembly 40 may include a thermal insulation layer 43 disposed between the main housing 41 and the top cover 42. In some embodiments, the thermal insulation layer 43 may be located within a mounting groove 4501. In some embodiments, the thermal insulation layer 43 may be made of a heat-insulating material, such as porous particulate materials (e.g., expanded vermiculite), foamed materials (containing organic foams such as polyurethane, inorganic foams such as foamed cement, and hybrid foams), and heat-reflective materials (e.g., metallized films). In some embodiments, the thermal insulation layer 43 may be thermal insulation cotton.

[0120] In some embodiments, to effectively prevent heat transfer, the housing assembly 40 may include a heat insulation layer 43 disposed between the main housing 41 and the top cover 42. In some embodiments, the heat insulation layer 43 may be located within the mounting groove 4501. In some embodiments, the heat insulation layer 43 may be disposed on top of the motherboard module 50 and may be spaced apart from the motherboard module 50. In some embodiments, the heat insulation layer 43 may be made of a heat-insulating material, such as porous particulate materials (e.g., expanded vermiculite), foamed materials (containing organic foams such as polyurethane, inorganic foams such as foamed cement, and mixed foams), and heat-reflective materials (e.g., metallized film). In some embodiments, the heat insulation layer 43 may be heat-insulating cotton. It is understood that the placement of the heat insulation layer 43 can be adjusted, and it only needs to be disposed on top of the housing assembly 40. In some embodiments, the heat insulation layer 43 may be part of the main housing 41.

[0121] In some embodiments, to effectively dissipate heat from the charging mechanism 102, such as the motherboard module 50, the housing assembly 40 may include a top heat dissipation layer 44 disposed between the main housing 41 and the top cover 42. The top heat dissipation layer 44 can absorb heat from the motherboard module 50 and also provide radiative heat dissipation. In some embodiments, the top heat dissipation layer 44 may be disposed on top of the motherboard module 50 and may be spaced apart from the motherboard module 50. In some embodiments, the top heat dissipation layer 44 may be a coating or a sheet-like structure. In some embodiments, the top heat dissipation layer 44 may be a graphene layer. In some embodiments, the top heat dissipation layer 44 may be located on the side of the heat insulation layer 43 facing away from the top cover 42. In some embodiments, the top heat dissipation layer 44 may be disposed within the mounting groove 4501. It is understood that the position of the top heat dissipation layer 44 can be adjusted; it only needs to be disposed on top of the housing assembly 40. In some embodiments, the top heat dissipation layer 44 may also be made of other thermally conductive materials, which can be selected according to the needs of those skilled in the art, and will not be elaborated further. In some embodiments, the top heat dissipation layer 44 may be part of the main housing 41.

[0122] Please see Figure 15The main housing 41 may include an inner housing 45 and an outer housing 46. A mounting cavity 4001 may be disposed within the inner housing 45, and the outer housing 46 may be disposed outside the inner housing 45. The outer housing 46 enhances the aesthetic appearance of the pedestal charging mechanism 102. The cooperation between the inner housing 45 and the outer housing 46 facilitates the processing and assembly of the pedestal charging mechanism 102.

[0123] In some embodiments, to effectively dissipate heat from the charging mechanism 102, such as the motherboard module 50, the main housing 41 may further include a heat dissipation layer 47 disposed between the inner housing 45 and the outer housing 46. The heat dissipation layer 47 can absorb heat from the motherboard module 50 and also provide radiative heat dissipation. Additionally, the heat dissipation layer 47 can achieve a uniform heat distribution. The heat dissipation layer 47 ensures a low temperature for the outer housing 46, preventing the user from perceiving excessive heat when touching it, thus facilitating portability. In some embodiments, the heat dissipation layer 47 surrounds the motherboard module 50 and may be spaced apart from it. In some embodiments, the heat dissipation layer 47 may be a coating or a sheet-like structure. In some embodiments, the heat dissipation layer 47 may be a graphene sheet. It is understood that the position of the heat dissipation layer 47 can be adjusted; it only needs to be disposed on the side periphery of the housing assembly 40. In some embodiments, the heat dissipation layer 47 may also be made of other thermally conductive materials, and specific choices can be made according to the needs of those skilled in the art, without further details. In some embodiments, the heat dissipation layer 47 may be part of the main housing 41. In some embodiments, the heat dissipation layer 47 may be part of the outer casing 46.

[0124] Please see Figure 15 The inner shell 45 can be used to mount the motherboard module 50. In some embodiments, the inner shell 45 may include a shell body 451 and a bottom cover 452. The shell body 451 and the bottom cover 452 are connected to form a mounting cavity 4001. In some embodiments, the mounting cavity 4001 may be disposed on the inner shell 45, for example, the shell body 451. In some embodiments, the top cover 42 may be part of the inner shell 45, for example, the shell body 451. In some embodiments, the mounting groove 4501 may be disposed on the inner shell 45, for example, the shell body 451. In some embodiments, the top heat dissipation layer 44 may be part of the inner shell 45, for example, the shell body 451. In some embodiments, the heat insulation layer 43 may be part of the inner shell 45, for example, the shell body 451. In some embodiments, the chassis heat dissipation layer 47 may be part of the inner shell 45, for example, the shell body 451.

[0125] Please see Figure 15 and Figure 17 , Figure 17 for Figure 15The illustrated embodiment shows a schematic diagram of the inner shell 45 from another perspective. For example, the shell body 451 of the inner shell 45 has a groove 4502 on its side circumferential surface to facilitate the installation of the motherboard module 50 within the inner shell 45 when it is inserted into the groove 4502. In some embodiments, the groove 4502 is the mounting cavity 4001 in the above embodiment. In some embodiments, the inner shell 45 can be slidably connected to the motherboard module 50 at the groove 4502, allowing the motherboard module 50 to slide into or out of the groove 4502 for convenient installation. In some embodiments, a slide rail 4511 can be provided on the side wall of the groove 4502 to facilitate slidable connection with the motherboard module 50. The motherboard module 50 can then be mounted on the slide rail 4511 and slid along the extending direction of the slide rail 4511, allowing for convenient installation by sliding into or out of the groove 4502. Understandably, when the groove 4502 is in close contact with the motherboard module 50 at least partially, so that the motherboard module 50 can slide into or out of the groove 4502, a slide can be formed. This slide is not limited to the slides listed herein and the slide 4511 shown in the attached diagram.

[0126] In some embodiments, the bottom of the groove 4502 is provided with a mounting hole 4504 to mate with the motherboard module 50. In other embodiments, the mounting hole 4504 may also be provided at other locations on the inner shell 45, such as the shell body 451, as long as it communicates with the mounting cavity 4001.

[0127] Please see Figure 15 and Figure 16 The bottom cover 452 is connected to the shell body 451. Furthermore, in some embodiments, the surface of the bottom cover 452 can serve as part of the inner surface of the mounting cavity 4001. Furthermore, in some embodiments, the surface of the bottom cover 452 can also serve as part of the groove wall surface of the recess 4502. Furthermore, in a further embodiment, a slide rail 4521 can be provided on the bottom cover 452 to facilitate sliding connection with the motherboard module 50. Therefore, the motherboard module 50 can be mounted on the slide rail 4511, sliding along the extending direction of the slide rail 4521, sliding into or out of the recess 4502, thus achieving convenient installation of the motherboard module 50. Furthermore, in some embodiments, the slide rail 4511 can be omitted. In some embodiments, the motherboard module 50 can also extend into the inner shell 45, such as the shell body 451, from the location where the bottom cover 452 is provided, to achieve installation.

[0128] In some embodiments, the bottom cover 452 may be provided with a vent 4503 communicating with the groove 4502, so that outside air can enter the groove 4502 for heat dissipation. That is, the bottom of the housing assembly 40, such as the inner shell 45, is provided with a vent 4503 communicating with the mounting cavity 4001. In some embodiments, the vent 4503 may cooperate with the mounting cavity 4001 and the mounting hole 4504 to form a heat dissipation channel. For example, gas can enter from the vent 4503, absorb the heat of the motherboard module 50, and then be discharged from the mounting hole 4504.

[0129] In some embodiments, the bottom cover 452 can be connected and cooperate with the shell body 451 to fix the outer shell 46.

[0130] In some embodiments, to improve the stability of the pedestal charging mechanism 102, the housing assembly 40, such as the inner housing 45, may also be provided with a counterweight 453. In some embodiments, the counterweight 453 is located at the bottom of the motherboard module 50. In some embodiments, the counterweight 453 may be disposed on the bottom cover 452. In some embodiments, the counterweight 453 may be provided with a slide rail 4531 to facilitate sliding connection with the motherboard module 50. The motherboard module 50 can then be mounted on the slide rail 4531, sliding along the extending direction of the slide rail 4511, sliding into or out of the groove 4502, thus facilitating the installation of the motherboard module 50. Furthermore, in some embodiments, the slide rail 4511 may be omitted. Furthermore, in some embodiments, the slide rail 4521 may be omitted.

[0131] In some embodiments, the bottom cover 452 may be an integral structure with the shell body 451.

[0132] The outer shell 46 can be disposed on the outside of the inner shell 45 to cover the groove 4502, thereby forming the mounting cavity 4001.

[0133] Please see Figure 15 and Figure 18 , Figure 18 for Figure 15 The illustrated embodiment shows an exploded view of the outer casing 46 in some embodiments. The outer casing 46 may be disposed around the side periphery of the inner casing 45, such as the casing body 451, and may cover the recess 4502 to form a mounting cavity 4001 at the recess 4502. In some embodiments, please refer to... Figure 16 When the shell body 451 is connected to the bottom cover 452, the outer shell 46 can be clamped, for example, by clamping the outer shell 46 from both the top and bottom, so that the outer shell 46 is fixed to the side periphery of the inner shell 45, for example, the shell body 451. In a further embodiment, the heat dissipation layer 47 of the casing can be sandwiched between the outer shell 46 and the inner shell 45, for example, the shell body 451.

[0134] Please see Figure 15 and Figure 18The main housing 41, such as the outer shell 46, may be provided with a clearance groove 4601 and a light-transmitting cover plate 461 disposed within the clearance groove 4601. The light-transmitting cover plate 461 can enhance the appearance of the main housing 41, such as the outer shell 46. The clearance groove 4601 allows the surface of the light-transmitting cover plate 461 to be flush with the surface of the main housing 41, such as the outer shell 46, further enhancing the appearance of the main housing 41, such as the outer shell 46. Of course, in other embodiments, the clearance groove 4601 may be omitted. The bottom of the clearance groove 4601 may be provided with mounting holes 4602, mounting holes 4604, etc., communicating with the main housing 41, such as the mounting cavity 4001, to cooperate with the motherboard module 50. Of course, in other embodiments, the bottom of the clearance groove 4601 may also be provided with a button hole 4603 to cooperate with the motherboard module 50. In some embodiments, the clearance groove 4601 may be provided corresponding to the groove 4502. Furthermore, in a further embodiment, the mounting holes 4602, 4604, and button holes 4603 can communicate with the groove 4502, thereby engaging with the motherboard module 50 placed within the groove 4502. In some embodiments, the light-transmitting cover 461 may be omitted.

[0135] In some embodiments, mounting hole 4604 may cooperate with mounting hole 4605 to form mounting hole 1010 communicating with the inside and outside of main housing 41.

[0136] In some embodiments, the light-transmitting cover plate 461 may block the mounting hole 4602. In some embodiments, the light-transmitting cover plate 461 may be provided with a mounting hole 4605 communicating with the mounting hole 4604. In some embodiments, the light-transmitting cover plate 461 may be provided with a button hole 4606 communicating with the button hole 4603.

[0137] In some embodiments, the main housing 41, such as the outer shell 46, may have a button 462 disposed within a button hole 4603. In some embodiments, the button 462 may also be disposed within a button hole 4606. In some embodiments, the main housing 41, such as the outer shell 46, is provided with a spring piece 463 connected to the wall of the button hole 4603. The button 462 can be connected to the spring piece 463, thereby allowing the button 462 to be reset based on the elastic deformation of the spring piece 463, improving the user experience of operating the button 462. In some embodiments, the spring piece 463 may also be disposed on the wall of the button hole 4606.

[0138] In some embodiments, the mounting hole 4604 may also be provided at other locations on the main housing 41, such as the outer casing 46. For example, the mounting hole 4604 may be disposed opposite to the mounting hole 4504 and communicate with it, thereby forming a mounting hole 1010 that communicates the inside and outside of the main housing 41.

[0139] Please see Figure 19 , Figure 20 , Figure 21 and Figure 22 , Figure 19 for Figure 15 The schematic diagram of the motherboard module 50 in some embodiments shown is illustrated below. Figure 20 for Figure 15 The diagram shows the structure of the motherboard module 50 and the counterweight 453 in some embodiments. Figure 21 for Figure 19 The diagram shown is an exploded view of the motherboard module 50 in some embodiments. Figure 22 for Figure 21 The illustrated embodiment shows an exploded view of the motherboard module 50 from another perspective. The motherboard module 50 may include a mid-frame 51, circuit boards (e.g., a first circuit board 52 and a second circuit board 53), and protective shells (e.g., a first protective shell 54 and a second protective shell 55). The first circuit board 52 and the second circuit board 53 are located on opposite sides of the mid-frame 51. The first protective shell 54 and the second protective shell 55 are located on opposite sides of the mid-frame 51. When the first protective shell 54 and the second protective shell 55 are connected to the mid-frame 51, they can be fixed. In some embodiments, the first protective shell 54 may be located on the side of the circuit board, such as the first circuit board 52, facing away from the mid-frame 51, thereby fixing the circuit board, such as the first circuit board 52, when the first protective shell 54 is connected to the mid-frame 51. In some embodiments, the circuit board, such as the first circuit board 52, may be sandwiched between the first protective shell 54 and the mid-frame 51. In some embodiments, the second protective shell 55 may be located on the side of the circuit board, such as the second circuit board 53, facing away from the mid-frame 51, thereby fixing the circuit board, such as the second circuit board 53, when the second protective shell 55 is connected to the mid-frame 51. In some embodiments, a circuit board, such as a second circuit board 53, may be sandwiched between the second protective housing 55 and the middle frame 51.

[0140] In some embodiments, the mid-frame 51, the first protective shell 54, and the second protective shell 55 cooperate to form a motherboard housing for mounting circuit boards such as the first circuit board 52, the second circuit board 53, etc. That is, the motherboard module 50 may include the motherboard housing and the circuit board mounted on the motherboard housing. In some embodiments, the circuit board may be the wireless charging motherboard 33 in the above embodiments, or may include the wireless charging motherboard 33 in the above embodiments.

[0141] The middle frame 51 may be located between the first protective shell 54 and the second protective shell 55, and connected to the first protective shell 54 and the second protective shell 55 respectively. In some embodiments, the middle frame 51 may be omitted, thereby allowing the first protective shell 54 and the second protective shell 55 to be connected and engaged by the middle frame 51 to the first protective shell 54 or by the middle frame 51 to the second protective shell 55. This allows the first protective shell 54 and the second protective shell 55 to be located on both sides of the circuit board, fixing the circuit board between the first protective shell 54 and the second protective shell 55.

[0142] Please see Figure 21 , Figure 22 and Figure 23 , Figure 23 for Figure 21 The illustrated embodiment shows a schematic diagram of the middle frame 51 from another perspective. The middle frame 51 can be in the form of a ring, and when it is used with circuit boards such as the first circuit board 52 and the second circuit board 53, it can accommodate electronic components on the circuit boards such as the first circuit board 52 and the second circuit board 53.

[0143] In some embodiments, a second connector 511 may be provided on the middle frame 51 to be detachably connected to the protective shell, such as the first protective shell 54 or the second protective shell 55, by means of snap-fit, screw-fit, or connection method known to those skilled in the art. In some embodiments, the second connector 511 may be a locking block to snap-fit ​​with the protective shell, such as the first protective shell 54 or the second protective shell 55.

[0144] In some embodiments, a second notch 5101 may be provided on the middle frame 51 to cooperate with a protective shell, such as a first protective shell 54 or a second protective shell 55, to form a mounting hole 5001. In some embodiments, the mounting hole 5001 may connect the inside and outside of the motherboard module 50. In some embodiments, the mounting hole 5001 may be correspondingly provided with the mounting hole 1010. In some embodiments, the mounting hole 5001 may also be provided on the motherboard housing.

[0145] It is understood that the location of the mounting hole 5001 can be set according to requirements and is not limited to the embodiments listed herein.

[0146] In some embodiments, a second notch 5102 may be provided on the middle frame 51 to cooperate with the protective shell, such as the first protective shell 54 or the second protective shell 55, to form an assembly hole 5001.

[0147] In some embodiments, the outer surface of the mid-frame 51 may have a display bracket 512. Furthermore, in a further embodiment, the motherboard module 50 may also include a display screen 56. The display screen 56 may be mounted on the display bracket 512.

[0148] In some embodiments, the display screen 56 may be installed within the mounting hole 4602. Furthermore, in a further embodiment, the display screen 56 may be shielded by a light-transmitting cover 461, allowing light emitted from the display screen 56 to pass through the cover 461. It is understood that the location of the display screen 56 can be configured as needed. It is sufficient that the display screen 56 is located on the side circumferential surface of the charging mechanism 102, such as the housing assembly 40. Of course, it can also be located in other positions, which will not be elaborated further.

[0149] Please see Figure 4The display screen 56 is disposed on the side peripheral surface of the charging mechanism 102, such as the housing assembly 40. In some embodiments, the display screen 56 is disposed inside the light-transmitting cover 461. In some embodiments, the display screen 56 is disposed within the mounting hole 4602.

[0150] Please see Figure 4 When the wireless charging mechanism 101 moves relative to the pedestal charging mechanism 102, the electronic device 200 mounted on the wireless charging mechanism 101 can be made to not obstruct the display screen 56 through the cooperation of the slide rail component 20, so that the user can observe the information displayed on the display screen 56 while using the electronic device 200.

[0151] In some embodiments, the display screen 56 may be located on the same side of the receiving groove 4002 as the fixing member 21, and then, with the cooperation of the slide rail member 20, the electronic device 200 may extend toward the side of the pedestal charging mechanism 102 closer to the display screen 56, and may still be located above the display screen 56, so as not to obstruct the display screen 56.

[0152] In some embodiments, the display screen 56 is configured to correspond to the portion of the housing 46 that blocks the recess 4502.

[0153] In some embodiments, the display bracket 512 may be located outside the first protective shell 54 and the second protective shell 55, thereby supporting the installation of the display screen 56.

[0154] Understandably, the location of the display screen 56 can be changed based on requirements. For example, the display screen 56 can be located on a protective casing, such as a first protective casing 54 or a second protective casing 55. For example, the display screen 56 can be located on the motherboard casing. For example, the display screen 56 may not be part of the motherboard module 50, but rather as part of the housing assembly 40, such as the outer casing 46.

[0155] Please see Figure 23 A third connector 5121 is provided on the side of the display bracket 512 near the protective housing, such as the first protective housing 54 and the second protective housing 55, to allow for detachable connection with the protective housing, such as the first protective housing 54 and the second protective housing 55, via snap-fit, screw-fit, or other connection methods known to those skilled in the art. This enhances the connection stability of the motherboard housing and also strengthens the support for the display 56. In some embodiments, the third connector 5121 may be a latching block to snap into the protective housing, such as the first protective housing 54 and the second protective housing 55.

[0156] Please see Figure 21 and Figure 22The protective shell, such as the first protective shell 54, may be provided with a first notch 5401 to cooperate with the middle frame 51 to form an assembly hole 5001. In some embodiments, the first notch 5401 may be disposed opposite to the second notch 5101 to cooperate in forming the assembly hole 5001.

[0157] In some embodiments, the protective shell, such as the first protective shell 54, may be provided with a first connector 541 for detachable connection with the middle frame 51, such as the second connector 511, by means of snap-fit, screw-fit, or other connection methods known to those skilled in the art. In some embodiments, the first connector 541 may have a structure with a slot or hole for snap-fit ​​with the middle frame 51, such as the second connector 511.

[0158] In some embodiments, the protective shell, such as the first protective shell 54, may be provided with a first connector 542 for detachable connection with the middle frame 51, such as the third connector 5121, by snap-fit, screw-fit, or other connection methods known to those skilled in the art. In some embodiments, the first connector 542 may have a structure with a slot or hole for snap-fit ​​with the middle frame 51, such as the third connector 5121.

[0159] Please see Figure 21 and Figure 22 The protective shell, such as the second protective shell 55, may be provided with a first notch 5501 to cooperate with the middle frame 51 to form an assembly hole 5001. In some embodiments, the first notch 5501 may be disposed opposite to the second notch 5102 to cooperate in forming the assembly hole 5001.

[0160] In some embodiments, the protective shell, such as the second protective shell 55, may be provided with a first connector 551 for detachable connection with the middle frame 51, such as the second connector 511, by means of snap-fit, screw-fit, or other connection methods known to those skilled in the art. In some embodiments, the first connector 541 may have a structure with a slot or hole for snap-fit ​​with the middle frame 51, such as the second connector 511.

[0161] In some embodiments, the protective shell, such as the second protective shell 55, may be provided with a first connector 552 for detachable connection with the middle frame 51, such as the third connector 5121, via snap-fit, screw-fit, or other connection methods known to those skilled in the art. In some embodiments, the first connector 552 may have a structure with a slot or hole for snap-fit ​​with the middle frame 51, such as the third connector 5121.

[0162] In some embodiments, the protective housing, such as the first protective housing 54 and the second protective housing 55, may have an air inlet 5002 and an air outlet 5003. Both the air inlet 5002 and the air outlet 5003 are connected to the interior of the motherboard module 50, allowing gas from the mounting cavity 4001 to enter the motherboard module 50 through the air inlet 5002 and exit through the air outlet 5003, thereby dissipating heat from the motherboard module 50, such as the circuit board. In some embodiments, the air outlet 5003 is closer to the top of the housing assembly 40 than the air inlet 5002 to guide the flow of gas between the air inlet 5002 and the air outlet 5003. In some embodiments, gas can enter the mounting cavity 4001 from the housing assembly 40, for example, through the air vent 4503, further enter the motherboard module 50 through the air inlet 5002, and then enter the mounting cavity 4001 again through the air outlet 5003, achieving heat dissipation. In some embodiments, the air inlet 5002 may be located adjacent to the air duct 4503.

[0163] It is understandable that the air inlet 5002 and air outlet 5003 can also be located in other positions on the motherboard module 50, and there are no restrictions here. For example, the air inlet 5002 and air outlet 5003 can be located on the motherboard housing. For example, the air inlet 5002 and air outlet 5003 can be located on the middle frame 51. For example, the air inlet 5002 and air outlet 5003 can be located between the protective shell, such as the first protective shell 54 or the second protective shell 55, and the middle frame 51. For example, the first protective shell 54, the middle frame 51, and the second protective shell 55 are used to provide the air inlet 5002 and air outlet 5003.

[0164] Please see Figure 21 and Figure 22 The circuit board, for example, the first circuit board 52, is disposed between the first protective shell 54 and the middle frame 51, such that the first protective shell 54 and the middle frame 51 respectively abut against the opposite sides of the circuit board, for example, the first circuit board 52, so as to fix the circuit board, for example, the first circuit board 52, when the first protective shell 54 and the middle frame 51 are connected by the first connector 541 and the second connector 511.

[0165] In some embodiments, the circuit board, such as the first circuit board 52, may be provided with a fixing hole 5201, so that the first connector 541 passes through the fixing hole 5201 and is located on the side of the circuit board, such as the first circuit board 52, away from the first protective shell 54, and is further connected to the second connector 511; or the second connector 511 passes through the fixing hole 5201 and is located on the side of the circuit board, such as the first circuit board 52, away from the middle frame 51, and is further connected to the first connector 541.

[0166] In some embodiments, a connection port 521 may be provided on a circuit board, such as a first circuit board 52. In some embodiments, the connection port 521 may be a charging port; of course, other types of interfaces may also be provided based on the needs of those skilled in the art. In some embodiments, the connection port 521 may be located within a mounting hole 1010. In some embodiments, the connection port 521 may be located within a mounting hole 5001. In some embodiments, the connection port 521 may be located within both the mounting hole 1010 and the mounting hole 5001. In some embodiments, based on the arrangement of the mounting hole 5001, the connection port 521 may be located within a first notch 5401 and a second notch 5101.

[0167] In some embodiments, to dissipate heat from the motherboard module 50, the mounting hole 1010 and the assembly hole 5001 can cooperate to form a heat dissipation channel, making full use of the gap between the connection port 521 and the mounting hole 1010 and the assembly hole 5001 for heat dissipation. For example, gas can flow out of the housing assembly 40 through the gap between the connection port 521 and the mounting hole 1010.

[0168] In some embodiments, gas may enter the mounting cavity 4001 from the housing assembly 40, for example, the vent 4503, and further gas may flow out of the housing assembly 40 from the gap between the connection port 521 and the mounting hole 1010.

[0169] In some embodiments, gas can enter the mounting cavity 4001 from the housing assembly 40, for example, the air inlet 4503, and further enter the motherboard module 50 from the air inlet 5002, and then flow out to the outside of the housing assembly 40 from the gap between the connection port 521 and the mounting hole 5001.

[0170] In some embodiments, the number of connection ports 521 is numerous, but there may be at least one. In a further embodiment, the connection port 521 may be exposed at least on the surface of the pedestal charging mechanism 102, for example, through the mounting hole 1010.

[0171] Please see Figure 21 and Figure 22 The circuit board, such as the second circuit board 53, is disposed between the second protective shell 55 and the middle frame 51, such that the second protective shell 55 and the middle frame 51 respectively abut against the opposite sides of the circuit board, such as the second circuit board 53, so as to fix the circuit board, such as the second circuit board 53, when the second protective shell 55 and the middle frame 51 are connected by the first connector 551 and the second connector 511.

[0172] In some embodiments, the circuit board, such as the second circuit board 53, may be provided with a fixing hole 5301, so that the first connector 551 passes through the fixing hole 5301 and is located on the side of the circuit board, such as the second circuit board 53, away from the second protective shell 55, and is further connected to the second connector 511; or the second connector 511 passes through the fixing hole 5301 and is located on the side of the circuit board, such as the second circuit board 53, away from the middle frame 51, and is further connected to the first connector 551.

[0173] In some embodiments, a connection port 531 may be provided on a circuit board, such as a second circuit board 53. In some embodiments, the connection port 531 may be a charging port; of course, other types of interfaces may also be provided based on the needs of those skilled in the art. In some embodiments, the connection port 531 may be located within a mounting hole 1010. In some embodiments, the connection port 531 may be located within a mounting hole 5001. In some embodiments, the connection port 521 may be located within both the mounting hole 1010 and the mounting hole 5001. In some embodiments, based on the arrangement of the mounting hole 5001, the connection port 521 may be located within a first notch 5501 and a second notch 5102.

[0174] In some embodiments, to dissipate heat from the motherboard module 50, the mounting hole 1010 and the assembly hole 5001 can cooperate to form a heat dissipation channel, making full use of the gap between the connection port 531 and the mounting hole 1010 and the assembly hole 5001 for heat dissipation. For example, gas can flow out of the housing assembly 40 through the gap between the connection port 531 and the mounting hole 1010. For example, gas can flow out of the housing assembly 40 through the gap between the connection port 531 and the assembly hole 5001.

[0175] In some embodiments, the number of connection ports 531 is numerous, but there may be at least one. In a further embodiment, the connection port 531 may be exposed at least on the surface of the pedestal charging mechanism 102, for example, through the mounting hole 1010.

[0176] It is understood that the connection port in the above embodiments can be a port electrically connected to the electronic device 200 and can supply power to the electronic device 200; that is, the connection port may include a charging port. Of course, in some cases, the connection port may also include a signal input interface, a video signal output interface, or a USB signal interface, etc. In some embodiments, the video signal may include a DP signal, an HDMI signal, or a VGA signal, etc. In some embodiments, the video signal output interface may include a DP signal interface, an HDMI signal interface, or a VGA signal interface, etc. In some embodiments, the USB signal may include a USB 2.0 signal, a USB 3.0 signal, a USB 3.1 signal, a USB 3.2 signal, or a USB 4.0 signal, etc. In some embodiments, the USB signal interface may include a card reader interface, a network interface, a USB flash drive interface, or a hard drive interface, etc. In some embodiments, the signal input interface can be connected to an electronic device such as a computer or mobile phone for signal transmission.

[0177] In some embodiments, based on the configuration of the motherboard housing, such as the mid-frame 51, the first circuit board 52 and the second circuit board 53 are arranged side by side. To achieve efficient resource utilization, the first circuit board 52 and the second circuit board 53 can be connected via a board-to-board connector.

[0178] In some embodiments, the first circuit board 52 or the second circuit board 53 may be omitted.

[0179] In some embodiments, the motherboard housing allows a portion of the circuit board, such as the first circuit board 52 or the second circuit board 53, to be exposed. This allows the motherboard module 50 to contact the main housing 41, such as vias 4511, 4521, and 4531, achieving a sliding connection. The circuit board 52 or 53 is then mounted on the main housing 41 vias 4511, 4521, and 4531. In some embodiments, the sliding direction of the circuit board 52 or 53 relative to the main housing 41 vias 4511, 4521, and 4531 can be the extension direction of the circuit board 52 or 53, i.e., the direction of extension of the circuit board plane. Of course, other sliding directions are also possible, and can be adjusted according to the configuration of the motherboard module 50, which will not be elaborated further. Other methods can also be used to achieve the sliding connection between the motherboard module 50 and the main housing 41, and are not limited to the embodiments listed herein.

[0180] In some embodiments, the middle frame 51 is configured to ensure sufficient distance between the first circuit board 52 and the second circuit board 53, effectively mitigating the impact of excessive temperature on the two circuit boards. In some embodiments, the distance between the first circuit board 52 and the second circuit board 53 is greater than or equal to 13 mm to reduce the impact of excessive temperature.

[0181] Please see Figure 19 The motherboard module 50, for example, has a circuit board on which a button 561 connected to the button 462 is provided. In some embodiments, the button 561 may also be provided on the display bracket 512. In some embodiments, the button 561 is provided on the first circuit board 52. In some embodiments, the button 561 is provided on the second circuit board 53. In some embodiments, the button 561 may pass through a button hole 4603. In some embodiments, the button 561 may pass through a button hole 4606.

[0182] In some embodiments, to achieve heat dissipation for the motherboard module 50, a motherboard heat dissipation layer may be provided on the outer surface of the motherboard module 50. In some embodiments, the motherboard heat dissipation layer may be provided on the outer surface of the motherboard housing. In some embodiments, the motherboard heat dissipation layer may be provided on the outer surface of the first protective shell 54. In some embodiments, the motherboard heat dissipation layer may be provided on the outer surface of the second protective shell 55. Of course, the motherboard heat dissipation layer may also be provided inside the motherboard module 50, for example, on the inner surface of the motherboard housing, the inner surface of the first protective shell 54, or the inner surface of the second protective shell 55.

[0183] In some embodiments, the motherboard heat dissipation layer is configured such that the chassis heat dissipation layer 47 and the motherboard heat dissipation layer are spaced apart.

[0184] In some embodiments, the motherboard heat dissipation layer can be configured as described above, referring to the heat dissipation stack 34, heat dissipation coating, chassis heat dissipation layer 47, and top heat dissipation layer 44. Alternatively, other thermally conductive materials can be used, which will not be elaborated further. In some embodiments, the motherboard heat dissipation layer may include a graphene heat dissipation layer.

[0185] In some embodiments, to achieve heat dissipation for the motherboard module 50, the motherboard housing of the motherboard module 50 may be made of a thermally conductive material, thereby dissipating heat from the motherboard module 50. For example, a first protective shell 54 may be used for heat dissipation based on its material composition. Similarly, a second protective shell 55 may be used for heat dissipation based on its material composition.

[0186] In some embodiments, to reduce electromagnetic interference to the circuit board, the motherboard housing of the motherboard module 50 may be made of an electromagnetically shielding material, such as a metal material, a material with a shielding coating, or other materials, thereby providing electromagnetic shielding for the motherboard module 50. For example, a first protective shell 54 may be used for electromagnetic shielding based on its material composition. For example, a second protective shell 55 may be used for electromagnetic shielding based on its material composition.

[0187] Please see Figure 16A heat-generating chip 5010 may be disposed on the circuit board, such as the first circuit board 52 or the second circuit board 53. To better dissipate heat from the heat-generating chip 5010, the heat-generating chip 5010 on the circuit board, such as the first circuit board 52 or the second circuit board 53, may be connected to the motherboard housing, such as the first protective shell 54 or the second protective shell 55, via a heat conductor 5011. In some embodiments, the heat conductor 5011 may be made of thermally conductive silicone or other materials that can conduct heat from the heat-generating chip 5010 into the protective shell; further details are omitted.

[0188] Please see Figure 16 The circuit board in the motherboard module 50 serves as the primary heat source, generating heat. For example, heat generated by the heating chip 5010 can be transferred to the protective shell via a heat conductor 5011 or through air. The protective shell can evenly distribute the heat, lowering the temperature. The motherboard heat dissipation layer on the protective shell further absorbs and conducts the heat. Then, the casing heat dissipation layer 47 further receives the heat, evenly distributes it through its large heat dissipation area, and then evenly conducts the heat away, resulting in a lower temperature on the outer casing 46. Additionally, heat flows towards the top of the casing assembly 40. The top heat dissipation layer 44 provides insulation and conduction, preventing heat buildup on the top of the casing assembly 40. The top heat dissipation layer 44 absorbs the heat and then radiates it away, further reducing the temperature of the top of the casing assembly 40. Therefore, the charging device 100 has excellent heat dissipation, reducing body surface temperature for easier handling and operation, thus improving the user experience.

[0189] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A wireless charging mechanism, characterized in that, The wireless charging mechanism includes: A housing assembly having a charging surface for housing electronic devices; A heat-conducting bracket is disposed within the housing assembly; A wireless charging coil is disposed within the housing assembly and located on the side of the heat-conducting bracket facing the charging surface; A wireless charging motherboard is disposed within the housing assembly and located on the side of the heat-conducting bracket opposite to the wireless charging coil. The wireless charging motherboard is electrically connected to the wireless charging coil and is used to control the wireless charging coil to charge the electronic device. The heat-conducting bracket is used to dissipate heat from the wireless charging coil and the wireless charging motherboard.

2. The wireless charging mechanism according to claim 1, characterized in that, The wireless charging mechanism also includes a heat dissipation stack disposed between the wireless charging coil and the heat-conducting bracket.

3. The wireless charging mechanism according to claim 2, characterized in that, The heat dissipation stack includes at least one of two layers: a graphene layer and a thermally conductive silicone layer. The graphene layer is located between the thermally conductive silicone layer and the wireless charging coil.

4. The wireless charging mechanism according to claim 1, characterized in that, The wireless charging mechanism also includes a shielding layer disposed between the wireless charging motherboard and the heat-conducting bracket, the shielding layer being used to transfer the heat generated by the wireless charging motherboard to the heat-conducting bracket.

5. The wireless charging mechanism according to claim 4, characterized in that, The shielding layer includes conductive cloth.

6. The wireless charging mechanism according to claim 1, characterized in that, The heat-conducting support includes: A heat-conducting plate is disposed between the wireless charging coil and the wireless charging motherboard; The mounting bracket is located at the edge of the heat-conducting plate and is mounted on the housing assembly.

7. The wireless charging mechanism according to claim 6, characterized in that, A heat dissipation coating is provided on at least one of the two surfaces of the mounting bracket and the inner surface of the housing assembly.

8. The wireless charging mechanism according to claim 7, characterized in that, The heat dissipation coating includes a plastic heat dissipation coating.

9. The wireless charging mechanism according to claim 7, characterized in that, The housing assembly includes: The mounting housing has a heat dissipation coating on its inner surface, and the heat-conducting bracket, the wireless charging coil, and the wireless charging motherboard are disposed inside the mounting housing. A cover plate, which is disposed on the mounting housing, has the charging surface.

10. The wireless charging mechanism according to claim 1, characterized in that, The wireless charging mechanism also includes: A heat dissipation bracket is disposed inside the housing assembly and located on the side of the wireless charging motherboard opposite to the heat conduction bracket; A slide rail is slidably connected between the heat dissipation bracket and the housing assembly, and can slide inward or outward along the sliding direction of the housing assembly.

11. The wireless charging mechanism according to claim 10, characterized in that, The slide rail has a wire hole that connects the inside and outside of the housing assembly and is used for routing circuit wires.

12. The wireless charging mechanism according to claim 11, characterized in that, The housing assembly has heat dissipation holes, and the wire through hole cooperates with the heat dissipation holes to form a heat dissipation channel.

13. The wireless charging mechanism according to claim 10, characterized in that, The wireless charging mechanism also includes a heat dissipation stack disposed between the wireless charging motherboard and the heat dissipation bracket.

14. A charging device, characterized in that, include: Seat-mounted charging mechanism; The wireless charging mechanism according to any one of claims 1-13 is disposed on the pedestal charging mechanism, the pedestal charging mechanism being connected to the wireless charging mechanism and supplying power to the wireless charging mechanism.

15. The charging device according to claim 14, characterized in that, The charging device further includes: The slide rail is rotatably connected to the pedestal charging mechanism and can rotate around a rotation axis. The slide rail is also slidably connected to the wireless charging mechanism and can slide inward or outward along the sliding direction.

16. The charging device according to claim 15, characterized in that, The slide rail has a wire hole that connects the pedestal charging mechanism and the wireless charging mechanism. The wireless charging mechanism has a circuit trace that passes through the wire hole and connects the pedestal charging mechanism and the wireless charging mechanism. One end of the wire hole that connects to the pedestal charging mechanism also connects to the outside of the pedestal charging mechanism.

17. The charging device according to claim 16, characterized in that, The end of the wire hole that connects to the pedestal charging mechanism is located on the side of the slide rail that is away from the charging surface.

Images