A charging device with PFC inductor

Abstract

The utility model relates to a kind of PFC inductance charging devices with, including upper cover body, lower cover body, circuit board, heat dissipation component and heat conduction component, upper cover body and lower cover body detachably connected to form cavity, circuit board, heat dissipation component and heat conduction component are located in cavity;Circuit board includes AC plate and DC plate, DC plate is vertically inserted on AC plate, AC plate is equipped with PFC circuit and DCDC boost circuit;Heat conduction component includes the several heat-conducting silica gels of being arranged in the both sides of circuit board, and heat dissipation component includes the several radiating fins of being arranged in the one side of heat-conducting silica gel;The side of heat-conducting silica gel is fixedly connected with the side of radiating fin, the other side of heat-conducting silica gel is abutted with circuit board surface, the other side of radiating fin is abutted with the inner wall of upper cover body, and radiating fin is equipped with the fixed leg of being fixedly connected with circuit board.The realization promotes heat dissipation efficiency, makes temperature rise stable, and can long time high-power continuous output.

Description

Technical Field

[0001] This utility model relates to the field of power adapters, and in particular to a charging device with PFC inductor. Background Technology

[0002] With the widespread use of electronic devices, users' needs for chargers are becoming increasingly diverse. Currently, chargers on the market have relatively limited functions, typically only supporting charging low-power devices such as mobile phones. However, when users need to charge tablets, laptops, or other high-power digital devices, existing chargers often cannot provide sufficient power output, and may even fail to function properly due to device compatibility issues.

[0003] Meanwhile, existing chargers have significant shortcomings in high-power output scenarios (such as 140W, 28V / 5A). Due to limitations in heat dissipation design or internal circuitry, chargers are prone to triggering power reduction protection mechanisms due to temperature rise during prolonged high-load operation, resulting in decreased charging efficiency and failing to meet users' fast charging needs. Furthermore, existing high-power chargers are typically bulky and poorly portable, making them inconvenient for daily carrying and use. Utility Model Content

[0004] Therefore, it is necessary to provide a charging device with PFC inductor to address the problem that the charging efficiency of a charger is easily reduced due to temperature rise when it operates under high load for a long time.

[0005] In a first aspect, the present invention provides a charging device with PFC inductor, comprising an upper cover, a lower cover, a circuit board, a heat dissipation component, and a heat conduction component. The upper cover and the lower cover are detachably connected to form a cavity, and the circuit board, the heat dissipation component, and the heat conduction component are disposed within the cavity. The circuit board comprises an AC board and a DC board, the DC board being vertically inserted into the AC board, and the AC board being provided with a PFC circuit and a DC-DC boost circuit. The thermal conductive component includes a plurality of thermally conductive silicone pads disposed on both sides of the circuit board, and the heat dissipation component includes a plurality of heat sinks disposed on one side of the thermally conductive silicone pads; one side of the thermally conductive silicone pads is fixedly connected to one side of the heat sinks, the other side of the thermally conductive silicone pads abuts against the surface of the circuit board, the other side of the heat sinks abuts against the inner wall of the upper cover, and the heat sinks are provided with fixing feet that are fixedly connected to the circuit board.

[0006] In some embodiments, the thermally conductive silicone includes an upper thermally conductive silicone and a lower thermally conductive silicone, the heat sink includes a first heat sink, a second heat sink, and a third heat sink, the upper thermally conductive silicone is disposed between the first heat sink and the front side of the AC board, the lower thermally conductive silicone is disposed between the second heat sink and the back side of the AC board, and the third heat sink is disposed between components on the back side of the AC board.

[0007] In some embodiments, the inner wall of the upper cover is provided with a guide groove, and the edge of the circuit board is mounted in the guide groove.

[0008] In some embodiments, a plurality of insulating sheets are also included, the insulating sheets being disposed between the heat sink and the thermally conductive silicone or between the thermally conductive silicone and the circuit board.

[0009] In some embodiments, a U-shaped base is also included, wherein the inner side of the U-shaped base is provided with a plurality of side anti-slip strips and a plurality of bottom anti-slip strips, the inner wall of the U-shaped base abuts against the heat sink, and the inner bottom of the U-shaped base abuts against one edge of the circuit board.

[0010] In some embodiments, an AC plug is provided on one side of the AC panel, and the AC plug is fixedly connected to the lower cover.

[0011] In some embodiments, the DC board includes a first USB-C port, a first SOC chip, a first buck circuit, and a first capacitor filter circuit. The input terminal of the first SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the first SOC chip is connected to the input terminal of the first buck circuit, the output terminal of the first buck circuit is connected to the input terminal of the first capacitor filter circuit, and the output terminal of the first capacitor filter circuit is connected to the first USB-C port. The maximum output power of the first USB-C port is 140W.

[0012] In some embodiments, the DC board includes a second USB-C port, a second SOC chip, a second buck circuit, and a second capacitor filter circuit. The input terminal of the second SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the second SOC chip is connected to the input terminal of the second buck circuit, the output terminal of the second buck circuit is connected to the input terminal of the second capacitor filter circuit, and the output terminal of the second capacitor filter circuit is connected to the second USB-C port. The maximum output power of the second USB-C port is 100W.

[0013] In some embodiments, the DC board includes a third USB-C port, a third SOC chip, a third buck circuit, and a third capacitor filter circuit. The input terminal of the third SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the third SOC chip is connected to the input terminal of the third buck circuit, the output terminal of the third buck circuit is connected to the input terminal of the third capacitor filter circuit, and the output terminal of the third capacitor filter circuit is connected to the third USB-C port. The maximum output power of the third USB-C port is 65W.

[0014] In some embodiments, the DC board is further provided with a USBA port, and a switch control circuit is provided between the output terminal of the third capacitor filter circuit and the input terminal of the USBA port. The maximum output power of the USBA port is 22.5W.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: The upper and lower covers form a sealed cavity, with the internal AC board integrating PFC and DC-DC boost circuits, and the DC board vertically inserted to achieve a compact layout. Thermally conductive silicone is tightly attached to the heat-generating components on the circuit board, efficiently transferring heat to the heat sink. The heat sink is fixed to the circuit board by fixing feet and tightly abuts against the inner wall of the upper cover, forming a heat dissipation path of circuit board-thermal conductive silicone-heat sink-outer shell. This allows the heat generated by high-power components such as PFC inductors to be quickly dissipated to the environment through the outer shell, improving heat dissipation efficiency and achieving stable temperature rise, enabling continuous high-power output for a long time. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a PFC inductive charging device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal circuit board structure of the PFC inductive charging device shown in an embodiment of the present invention; Figure 3 This is an exploded view structural diagram of an embodiment of the present invention with a PFC inductive charging device. Figure 4 This is a schematic diagram of the structure of the upper cover body shown in an embodiment of the present utility model; Figure 5 This is a schematic diagram of the DC-DC conversion output circuit of the first USB-C port shown in an embodiment of the present invention; Figure 6 This is a schematic diagram of the DC-DC conversion output circuit of the second USB-C port shown in an embodiment of the present invention; Figure 7 This is a schematic diagram of the DC-DC conversion output circuit of the third USBC port and USBA port shown in an embodiment of the present invention. Detailed Implementation

[0017] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0018] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] See Figure 1 This utility model embodiment illustrates a charging device with PFC inductor, comprising an upper cover 1, a lower cover 2, a circuit board 3, a heat dissipation component 4, and a heat conduction component 5. The upper cover 1 and the lower cover 2 are detachably connected to form a cavity, and the circuit board 3, the heat dissipation component 4, and the heat conduction component 5 are disposed within the cavity. The circuit board 3 includes an AC board 31 and a DC board 32, with the DC board 32 vertically inserted into the AC board 31. The AC board 31 is provided with a PFC circuit and a DC-DC boost circuit. The thermal conductive component 5 includes a plurality of thermally conductive silicone pads disposed on both sides of the circuit board 3, and the heat dissipation component 4 includes a plurality of heat sinks disposed on one side of the thermally conductive silicone pads; one side of the thermally conductive silicone pads is fixedly connected to one side of the heat sinks, the other side of the thermally conductive silicone pads abuts against the surface of the circuit board 3, and the other side of the heat sinks abuts against the inner wall of the upper cover 1, and the heat sinks are provided with fixing feet fixedly connected to the circuit board 3.

[0021] In this embodiment, thermally conductive silicone is tightly attached to the heat-generating element of the circuit board, efficiently transferring heat to the heat sink. The heat sink is mechanically locked to the circuit board by fixing feet, and a three-dimensional heat conduction path is achieved by utilizing the contact surface of the housing. Finally, the heat is transferred to the inner wall of the upper cover 1 through the heat sink, and heat dissipation is completed through natural convection between the metal shell and the air. This improves the overall power density and space utilization, ensures the PFC circuit to operate stably in high-temperature environments, extends the life of the devices, and enables the device to support higher power output by optimizing heat dissipation efficiency.

[0022] It should be noted that the PFC circuit and DC-DC boost circuit can be known general-purpose PFC circuits and DC-DC boost circuits; the heat sink is preferably an aluminum sheet; the AC board may also include known general-purpose circuits such as EMI filter circuit, output rectification filter circuit, overcurrent protection circuit, overvoltage protection circuit, overtemperature protection circuit, undervoltage protection circuit and short circuit protection circuit, which will not be elaborated further.

[0023] In some embodiments, the thermally conductive silicone includes an upper thermally conductive silicone 51 and a lower thermally conductive silicone 52, and the heat sink includes a first heat sink 41, a second heat sink 42, and a third heat sink 43. The upper thermally conductive silicone 51 is disposed between the first heat sink 41 and the front side of the AC board 31, the lower thermally conductive silicone 52 is disposed between the second heat sink 42 and the back side of the AC board 31, and the third heat sink 43 is disposed between components on the back side of the AC board 31.

[0024] In this embodiment, the main heat-generating areas on the front and back of the AC board are tightly bonded to the first heat sink 41 and the second heat sink 42 via upper thermally conductive silicone 51 and lower thermally conductive silicone 52, respectively, forming an efficient heat dissipation channel. Simultaneously, a third heat sink is added to the back area where high-power components and densely packed components are located for local reinforcement, improving local heat dissipation. The thermally conductive silicone, as a flexible thermally conductive medium, can fully fill the contact gaps, efficiently conducting heat from the chip and other heat sources to the heat sink; the heat sink, by increasing the heat dissipation area, conducts heat to the outer casing. This achieves comprehensive heat dissipation covering both sides of the AC board and the gaps between components, significantly reducing the temperature rise of key power devices in the high-power PFC circuit and DC-DC boost circuit, and improving the long-term operational stability and power density of the charger.

[0025] In some embodiments, the inner wall of the upper cover 1 is provided with a guide groove 11, and the edge of the circuit board 3 is mounted in the guide groove 11. The guide groove 11 on the inner wall of the upper cover 1 serves as a guide rail, allowing the edge of the circuit board 3 to slide into a predetermined position along the guide groove 11, achieving mechanical positioning and fixation. Optionally, adhesive can also be used to stably fix the circuit board 3 within the guide groove 11.

[0026] In some embodiments, the system further includes a plurality of insulating sheets 6, which are disposed between the heat sink and the thermally conductive silicone or between the thermally conductive silicone and the circuit board. The insulating sheets 6 are polycarbonate (PC) insulating sheets to establish a reliable insulating barrier between the heat sink and conductive paths such as the thermally conductive silicone.

[0027] In some embodiments, the system further includes a U-shaped base 7, the inner side of which is provided with a plurality of side anti-slip strips 71 and a plurality of bottom anti-slip strips 72. The inner wall of the U-shaped base 7 abuts against the heat sink, and the inner bottom of the U-shaped base 7 abuts against one edge of the circuit board 3. By using the side anti-slip strips 71 and the bottom anti-slip strips 72 to increase the friction of the contact surfaces, the circuit board is effectively prevented from shifting or loosening, thus improving the mechanical stability and vibration resistance of the overall structure.

[0028] In some embodiments, an AC plug 33 is provided on one side of the AC board 31, and the AC plug 33 is fixedly connected to the lower cover 2. The AC plug 33 serves as a power input terminal and is rigidly mounted on the lower cover 2, so that the insertion and removal force is directly borne by the lower cover 2, effectively avoiding the transmission of insertion and removal stress to the AC board 31, and greatly improving the safety and long-term reliability of the power connection.

[0029] In some embodiments, the DC board 32 is provided with a first SOC chip 321, a first buck circuit 322, a first capacitor filter circuit 323, and a first USB-C port 324. The input terminal of the first SOC chip 321 is connected to the output terminal of the DC-DC boost circuit, the output terminal of the first SOC chip 321 is connected to the input terminal of the first buck circuit 322, the output terminal of the first buck circuit 322 is connected to the input terminal of the first capacitor filter circuit 323, and the output terminal of the first capacitor filter circuit 323 is connected to the first USB-C port 324. The maximum output power of the first USB-C port 324 is 140W.

[0030] In this embodiment, the DC-DC conversion output of the first USBC port 324 is as follows: The DC voltage VIN output by the AC board 31 is controlled by the SW2566 protocol SOC chip U5 (i.e., the first SOC chip 321) through the USBC1 port (i.e., the first USBC port 324) to communicate with the power receiving end. The internal circuit of the SOC is controlled by the CC1 (1) / CC2 (1) signal pins of the chip U5, so that the PWM signal output of the 18 and 21 pins of the chip U5 controls the conduction and turn-off of the MOS transistors Q4 / Q6. Q4 / Q6 and L3 inductor form the first step-down circuit 322. After the voltage is stepped down to the communication voltage, the required voltage is output. The required voltage is filtered by the EC10 / EC14 solid capacitors of the first capacitor filter circuit 323 and a stable voltage is output to the C1 port power receiving terminal device. The maximum power of the first USBC port 324 can reach 140W (28V / 5A) by the internal program of the SOC chip.

[0031] In some embodiments, the DC board 32 is provided with a second SOC chip 331, a second buck circuit 332, a second capacitor filter circuit 333, and a second USB-C port 334. The input terminal of the second SOC chip 331 is connected to the output terminal of the DC-DC boost circuit, the output terminal of the second SOC chip 331 is connected to the input terminal of the second buck circuit 332, the output terminal of the second buck circuit 332 is connected to the input terminal of the second capacitor filter circuit 333, and the output terminal of the second capacitor filter circuit 333 is connected to the second USB-C port 334. The maximum output power of the second USB-C port 334 is 100W.

[0032] In this embodiment, the DC-DC conversion output of the second USBC port 334 is as follows: The second USBC port 334 also uses a Smart SW3536B protocol SOC chip U7 (i.e., the second SOC chip 331) to control the DC voltage VIN output by the AC board 31 to communicate with the powered terminal through the USBC2 port (i.e., the second USBC port 334). The internal circuit of the SOC is controlled by the CC1 (2) / CC2 (2) signal pins of the SOC chip U7, so that the PWM signals output by the 16 and 17 pins of the SOC chip U7 control the conduction and turn-off of the MOS transistors Q11 / Q13. Q11 / Q13 and L5 inductor form a step-down circuit. After the voltage is stepped down to the communication voltage, the required voltage is output. The required voltage is filtered by the EC12 solid capacitor of the second capacitor filter circuit 333 and a stable voltage is output to the C2 port powered terminal device. Controlled by the internal program of the SOC chip, the maximum power of the second USBC port 334 can reach 100W (20V / 5A).

[0033] In some embodiments, the DC board 32 is provided with a third SOC chip 341, a third buck circuit 342, a third capacitor filter circuit 343, and a third USB-C port 344. The input terminal of the third SOC chip 341 is connected to the output terminal of the DC-DC boost circuit, the output terminal of the third SOC chip 341 is connected to the input terminal of the third buck circuit 342, the output terminal of the third buck circuit 342 is connected to the input terminal of the third capacitor filter circuit 343, and the output terminal of the third capacitor filter circuit 343 is connected to the third USB-C port 344. The maximum output power of the third USB-C port 344 is 65W.

[0034] In this embodiment, the DC-DC conversion output of the third USBC port 344 is as follows: The third USBC port 344 also uses a Smart SW3536B protocol SOC chip U6 to control the DC voltage VIN output by the AC board 31 to communicate with the powered terminal through the USBC3 port (third USBC port 344). The internal circuit of the SOC is controlled by the CC1 (3) / CC2 (3) signal pins of the third USBC port 344, so that the PWM signals output by pins 16 and 17 control the conduction and turn-off of MOS transistors Q7 / Q9. Q7 / Q9 and L4 inductor form the third step-down circuit 342. After stepping down to the communication voltage, the required voltage is output. The required voltage is filtered by the EC11 solid capacitor of the third capacitor filter circuit 343 and a stable voltage is output to the powered terminal device of port C3. Controlled by the internal program of the SOC chip, the maximum power of the second USBC port 334 can reach 65W (20V / 3.25A).

[0035] In some embodiments, the DC board 32 is further provided with a USBA port 345, and a switch control circuit 346 is provided between the output terminal of the third capacitor filter circuit 344 and the input terminal of the USBA port 345. The maximum output power of the USBA port 345 is 22.5W.

[0036] In this embodiment, the switch control circuit 346 controls the switch to output to the USBA port through the MOSFET Q10. The two signal pins DMA3R and DPA3R communicate with the SOC protocol. The maximum power of the USBA port 345 can reach 22.5W (10V / 2.25A).

[0037] Tests showed that at an ambient temperature of 25℃, with an AC input of 90V~109V, after 30 minutes of full-load use, the casing temperature reached 74℃±3℃, triggering OTP1. The power output of USB-C1 + USB-C2 / USB-C3 or USB-C2 + USB-C3 dropped to a continuous output of 65W+45W.

[0038] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A charging device with PFC inductive charging, characterized in that, The device includes an upper cover, a lower cover, a circuit board, a heat dissipation component, and a heat conduction component. The upper cover and the lower cover are detachably connected to form a cavity. The circuit board, the heat dissipation component, and the heat conduction component are disposed within the cavity. The circuit board includes an AC board and a DC board. The DC board is vertically inserted into the AC board. The AC board is provided with a PFC circuit and a DC-DC boost circuit. The thermal conductive component includes a plurality of thermally conductive silicone pads disposed on both sides of the circuit board, and the heat dissipation component includes a plurality of heat sinks disposed on one side of the thermally conductive silicone pads; one side of the thermally conductive silicone pads is fixedly connected to one side of the heat sinks, the other side of the thermally conductive silicone pads abuts against the surface of the circuit board, the other side of the heat sinks abuts against the inner wall of the upper cover, and the heat sinks are provided with fixing feet that are fixedly connected to the circuit board.

2. The charging device with PFC inductor according to claim 1, characterized in that, The thermally conductive silicone includes an upper thermally conductive silicone and a lower thermally conductive silicone. The heat sink includes a first heat sink, a second heat sink, and a third heat sink. The upper thermally conductive silicone is disposed between the first heat sink and the front side of the AC board. The lower thermally conductive silicone is disposed between the second heat sink and the back side of the AC board. The third heat sink is disposed between the components on the back side of the AC board.

3. The charging device with PFC inductor according to claim 1, characterized in that, The inner wall of the upper cover is provided with a guide groove, and the edge of the circuit board is mounted in the guide groove.

4. The charging device with PFC inductor according to claim 1, characterized in that, It also includes several isolation plates, which are disposed between the heat sink and the thermally conductive silicone or between the thermally conductive silicone and the circuit board.

5. The charging device with PFC inductor according to claim 1, characterized in that, It also includes a U-shaped base, the inner side of which is provided with several side anti-slip strips and several bottom anti-slip strips. The inner wall of the U-shaped base abuts against the heat sink, and the inner bottom of the U-shaped base abuts against one edge of the circuit board.

6. The charging device with PFC inductor according to claim 1, characterized in that, An AC plug is provided on one side of the AC board, and the AC plug is fixedly connected to the lower cover.

7. The charging device with PFC inductor according to claim 1, characterized in that, The DC board is provided with a first USB-C port, a first SOC chip, a first buck circuit, and a first capacitor filter circuit. The input terminal of the first SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the first SOC chip is connected to the input terminal of the first buck circuit, the output terminal of the first buck circuit is connected to the input terminal of the first capacitor filter circuit, and the output terminal of the first capacitor filter circuit is connected to the first USB-C port. The maximum output power of the first USB-C port is 140W.

8. The charging device with PFC inductor according to claim 1, characterized in that, The DC board is equipped with a second USB-C port, a second SOC chip, a second buck circuit, and a second capacitor filter circuit. The input terminal of the second SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the second SOC chip is connected to the input terminal of the second buck circuit, the output terminal of the second buck circuit is connected to the input terminal of the second capacitor filter circuit, and the output terminal of the second capacitor filter circuit is connected to the second USB-C port. The maximum output power of the second USB-C port is 100W.

9. The charging device with PFC inductor according to claim 1, characterized in that, The DC board is equipped with a third USB-C port, a third SOC chip, a third buck circuit, and a third capacitor filter circuit. The input terminal of the third SOC chip is connected to the output terminal of the DC-DC boost circuit, the output terminal of the third SOC chip is connected to the input terminal of the third buck circuit, the output terminal of the third buck circuit is connected to the input terminal of the third capacitor filter circuit, and the output terminal of the third capacitor filter circuit is connected to the third USB-C port. The maximum output power of the third USB-C port is 65W.

10. The charging device with PFC inductor according to claim 9, characterized in that, The DC board is also equipped with a USBA port. A switch control circuit is provided between the output terminal of the third capacitor filter circuit and the input terminal of the USBA port. The maximum output power of the USBA port is 22.5W.

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