A modular one-piece housing inverter structure

Abstract

The utility model relates to a kind of integrated shell inverter structure based on modularization, including integrated shell inverter structure based on modularization, including integrated shell, electromagnetic shielding assembly, water-cooling plate assembly, drive motor cavity, water-cooling plate cavity and electromagnetic shielding cavity, the drive motor cavity, water-cooling plate cavity and electromagnetic shielding cavity are all set on integrated shell, the electromagnetic shielding assembly is installed on electromagnetic shielding cavity, the water-cooling plate assembly is installed on water-cooling plate cavity, the electromagnetic shielding assembly and water-cooling plate assembly communication connection, the electromagnetic shielding cavity is located in the side of integrated shell and the electromagnetic shielding cavity is isolated with water-cooling plate cavity.The utility model uses modularization design and motor electric control integrated shell design, and the motor electric control two-in-one system is divided into three parts, motor, control device and electromagnetic shielding assembly three mounting cavities, and the difference from traditional controller is that electromagnetic shielding assembly is separated from control device, electromagnetic shielding cavity is arranged on the side of casing, and electromagnetic shielding level is improved.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and in particular to a modular integrated inverter structure. Background Technology

[0002] Most existing electric drive products on the market use a shared cavity design for the control unit and electromagnetic shielding components, resulting in poor electromagnetic shielding. Furthermore, most employ a separate motor and electronic control structure, leading to large size, wasted space, and high cost. This fails to meet the increasingly stringent requirements of OEMs and limits vehicle layout. Additionally, the inverter contains numerous internal components, increasing manufacturing and assembly costs. These issues will hinder the development of new energy vehicles.

[0003] Chinese patent application CN117641866A discloses a high-reliability drive controller, including an upper protective cover, a lower protective cover, a mounting shell located between the upper and lower protective covers, and a front-end anti-interference component, a locking device, a semiconductor inverter component, etc. The mounting shell has a first shielding cavity, a second shielding cavity, a third shielding cavity, and a fourth shielding cavity. The front-end anti-interference component is located in the first shielding cavity. The locking device, the semiconductor inverter component, the three-phase AC component, and the Hall detector are located in the second shielding cavity. The energy storage device and the communication connector are located in the third shielding cavity. The integrated circuit board is located in the fourth shielding cavity. The input connector is connected to the front-end anti-interference component. The input end of the energy storage device is connected to the front-end anti-interference component. The output end of the energy storage device is connected to the semiconductor inverter component. One end of the three-phase AC component passes through the Hall detector and is connected to the output connector. The other end is connected to the semiconductor inverter component. This patent does not use a single housing for the two-in-one electric drive system.

[0004] Therefore, providing an inverter structure that enables a two-in-one electric drive system to share a single housing is an urgent problem to be solved. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a modular integrated inverter structure.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] According to one aspect of the present invention, a modular integrated inverter structure is provided, comprising an integrated shell, an electromagnetic shielding assembly, a water-cooled plate assembly, a drive motor cavity, a water-cooled plate cavity, and an electromagnetic shielding cavity. The drive motor cavity, the water-cooled plate cavity, and the electromagnetic shielding cavity are all disposed on the integrated shell. The electromagnetic shielding assembly is mounted on the electromagnetic shielding cavity, and the water-cooled plate assembly is mounted on the water-cooled plate cavity. The electromagnetic shielding assembly and the water-cooled plate assembly are communicatively connected. The electromagnetic shielding cavity is located on the side of the integrated shell and is isolated from the water-cooled plate cavity.

[0008] As a preferred technical solution, the water-cooled plate assembly includes a water-cooled plate, a thin-film capacitor, an IGBT module, a PCBA control and drive board, an IGBT mounting surface, and a PCBA mounting point. The thin-film capacitor, the IGBT mounting surface, and the PCBA mounting point are all mounted on one side of the water-cooled plate. The IGBT module is mounted on the IGBT mounting surface, and the PCBA control and drive board is mounted on the PCBA mounting point. The PCBA control and drive board is located on the IGBT module, and the thin-film capacitor is connected to both the electromagnetic shielding assembly and the IGBT module.

[0009] As a preferred technical solution, the water-cooled plate assembly further includes a water inlet and a water outlet, both of which are mounted on the water-cooled plate.

[0010] As a preferred technical solution, the water-cooled plate cavity includes a cavity bottom and two through holes, both of which are installed on the cavity bottom and are respectively connected to the water inlet and the water outlet.

[0011] As a preferred technical solution, the water-cooled plate cavity further includes a three-phase component mounting surface and a three-phase component, wherein the three-phase component mounting surface is mounted on the bottom of the cavity, and the three-phase component is mounted on the three-phase component mounting surface.

[0012] As a preferred technical solution, the water-cooled plate assembly further includes heat-conducting ribs, which are installed on the other side of the water-cooled plate.

[0013] As a preferred technical solution, the electromagnetic shielding assembly includes a shielding plate, a filter bracket, a magnetic ring bracket, and an electromagnetic shielding bracket, wherein the filter bracket, the magnetic ring bracket, and the electromagnetic shielding bracket are all mounted on the shielding plate.

[0014] As a preferred technical solution, the electromagnetic shielding assembly further includes a first magnetic ring, a second magnetic ring, an X capacitor, and a Y capacitor. The first magnetic ring is mounted on a filter bracket, the second magnetic ring is mounted on a magnetic ring bracket, and the X capacitor and the Y capacitor are both mounted on an electromagnetic shielding bracket.

[0015] As a preferred technical solution, the electromagnetic shielding assembly further includes a grounding copper busbar, a positive busbar, and a negative busbar. The positive busbar and the negative busbar are distributed through the magnetic ring bracket and installed on the shielding plate, and the grounding copper busbar is installed on the shielding plate.

[0016] The X capacitor is connected to the positive copper busbar and the negative copper busbar respectively, and the Y capacitor is connected to the positive copper busbar and the ground copper busbar respectively, or the Y capacitor is connected to the negative copper busbar and the ground copper busbar respectively.

[0017] As a preferred technical solution, the structure further includes an integrated shell cover and an electromagnetic shielding cover. The integrated shell cover is installed on the water-cooled plate cavity, and the electromagnetic shielding cover is installed on the electromagnetic shielding cavity.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. This utility model adopts a modular design and an integrated motor and electronic control housing design, dividing the motor and electronic control two-in-one system into three parts: a motor, a control device, and an electromagnetic shielding component. The difference from traditional controllers is that the electromagnetic shielding component is separated from the control device, and the electromagnetic shielding cavity is set on the side of the housing, thereby improving the electromagnetic shielding level.

[0020] 2. The through holes of this utility model form water channels with the water inlet and water outlet respectively, and heat-conducting ribs are provided, which is beneficial to the cooling of the thin film capacitor, improves the heat dissipation performance and life of the capacitor, and realizes multiple heat dissipation for the IGBT module and the capacitor. At the same time, the heat-conducting ribs can provide vibration reduction.

[0021] 3. This utility model adopts an integrated design scheme for the motor housing and inverter box, which can improve the overall rigidity and vibration reduction level, reduce the cost of mold development, and reduce the size and weight of the entire electric drive system, leaving more space for the overall vehicle layout.

[0022] 4. The electromagnetic shielding cover of this utility model adopts a composite damping cover, which effectively isolates internal noise and shields high-voltage electromagnetic interference, and can also improve the overall sound insulation level. Attached Figure Description

[0023] Figure 1 This is an exploded view of the overall structure of this utility model;

[0024] Figure 2 This is a side view of the overall structure of this utility model;

[0025] Figure 3 This is a top view of the overall structure of this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of the water-cooled plate cavity of this utility model;

[0027] Figure 5 This is a schematic diagram of the internal structure of the integrated shell of this utility model;

[0028] Figure 6 This is a structural schematic diagram of the water-cooled plate assembly of this utility model;

[0029] Figure 7 This is a schematic diagram of the structure of the three-phase component of this utility model;

[0030] Figure 8 This is a schematic diagram of one side of the water-cooled plate of this utility model;

[0031] Figure 9 This is a schematic diagram of the other side of the water-cooled plate of this utility model;

[0032] Figure 10 This is a schematic diagram of the electromagnetic shielding assembly of this utility model;

[0033] 1. Integrated housing; 2. Electromagnetic shielding assembly; 3. Water-cooled plate assembly; 4. Drive motor cavity; 5. Water-cooled plate cavity; 6. Electromagnetic shielding cavity; 7. Integrated housing cover; 8. Electromagnetic shielding box cover; 9. High-voltage connector; 10. Low-voltage wiring harness; 11. Three-phase cover plate; 12. Low-voltage connector; 13. High-voltage wiring harness; 14. Electrical control water inlet; 15. Motor water outlet; 16. Suspension position; 21. First magnetic ring; 22. Second magnetic ring; 23. X capacitor; 24. Y capacitor; 25. Grounding copper busbar; 26. Positive 27. Negative busbar; 31. Water-cooled plate; 32. Thin-film capacitor; 33. IGBT module; 34. PCBA control driver board; 35. IGBT mounting surface; 36. PCBA mounting point; 37. Water inlet; 38. Water outlet; 39. Heat-conducting fin; 40. Thin-film capacitor mounting slot; 51. Through hole; 52. Three-phase module mounting surface; 53. Three-phase module; 60. Fixed base; 61. Three-phase support; 62. Current sensor; 63. Three-phase adapter copper busbar; 64. Three-phase terminal block. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present utility model.

[0035] Example 1

[0036] like Figures 1-10As shown, a modular integrated inverter structure includes an integrated housing 1, an electromagnetic shielding assembly 2, a water-cooled plate assembly 3, a drive motor cavity 4, a water-cooled plate cavity 5, and an electromagnetic shielding cavity 6. The drive motor cavity 4, the water-cooled plate cavity 5, and the electromagnetic shielding cavity 6 are all disposed on the integrated housing 1. The electromagnetic shielding assembly 2 is mounted on the electromagnetic shielding cavity 6, and the water-cooled plate assembly 3 is mounted on the water-cooled plate cavity 5. The electromagnetic shielding assembly 2 and the water-cooled plate assembly 3 are communicatively connected. The electromagnetic shielding cavity 6 is located on the side of the integrated housing 1 and is isolated from the water-cooled plate cavity 5.

[0037] In this embodiment, the motor housing and inverter enclosure are designed as a single unit, using only one housing. At the same time, three cavities are set in the integrated housing to separate the electromagnetic shielding components from the control device (i.e., the water-cooled plate assembly 3), thereby improving the electromagnetic shielding level.

[0038] The inverter is mainly composed of an integrated housing 1, an electromagnetic shielding assembly 2, a water-cooled plate assembly 3, an integrated housing cover 7, an electromagnetic shielding cover 8, and a low-voltage wiring harness 10. The inverter assembles many internal parts into modular components, reducing assembly costs and increasing production line speed.

[0039] The integrated shell 1 is divided into three independent spaces: the drive motor cavity 4, the water-cooled plate cavity 5, and the electromagnetic shielding cavity 6. The electromagnetic shielding cavity 6 is integrated into the side of the integrated shell 1 to improve the structural integration. At the same time, separating the electromagnetic shielding cavity 6 from the water-cooled plate cavity 5 can better isolate electromagnetic interference.

[0040] The water-cooled plate assembly 3 includes a water-cooled plate 31, a thin-film capacitor 32, an IGBT module 33, a PCBA control and drive board 34, an IGBT mounting surface 35, and a PCBA mounting point 36. The thin-film capacitor 32, the IGBT mounting surface 35, and the PCBA mounting point 36 are all mounted on one side of the water-cooled plate 31. The IGBT module 33 is mounted on the IGBT mounting surface 35. The PCBA control and drive board 34 is mounted on the PCBA mounting point 36 and is located on the IGBT module 33. The thin-film capacitor 32 is connected to the electromagnetic shielding assembly 2 and the IGBT module 33 respectively.

[0041] The water-cooled plate assembly 3 also includes a water inlet 37 and a water outlet 38, both of which are mounted on the water-cooled plate 31. The water-cooled plate assembly 3 also includes heat-conducting ribs 39, which are mounted on the other side of the water-cooled plate 31.

[0042] In this embodiment, the water-cooled plate assembly 3 includes a water-cooled plate 31, a PCBA control drive board 34, an IGBT module 33, a current sensor 62, a three-phase bracket 61, a thin-film capacitor 32, a thin-film capacitor mounting slot 40, and a fixing base 60, etc., and is installed in a certain order. During assembly, the assembled water-cooled plate assembly 3 is simply fixed directly onto the integrated shell 1. The bottom of the water-cooled plate 31 has heat-conducting ribs 39 to guide the heat from the capacitor to the water channel for heat dissipation. The inlet 37 and outlet 38 of the water channel are sealed using friction stir welding. The PCBA control drive board 34 includes a control board and a drive board, which perform their respective functions.

[0043] A thin-film capacitor 32 is installed in a thin-film capacitor mounting slot 40. An IGBT module 33 is mounted on a water-cooled plate 31 via an IGBT mounting surface 35. A PCBA control drive board 34 is mounted on the water-cooled plate 31 via a PCBA mounting point and is located above the IGBT module 34. A fixed base 60 is located on the side of the PCBA mounting slot 40 closest to the IGBT module 34. The thin-film capacitor 32 is connected to the IGBT module 34 via the fixed base 60. A current sensor 62 is located on a three-phase bracket 61, which is mounted on the water-cooled plate 31. The IGBT module 34 is connected to the three-phase bracket 61.

[0044] The water-cooled plate cavity 5 includes a cavity bottom and two through holes 51. The two through holes 51 are both installed on the cavity bottom and are connected to the water inlet 37 and the water outlet 38, respectively.

[0045] The water-cooled plate cavity 5 also includes a three-phase component mounting surface 52 and a three-phase component 53. The three-phase component mounting surface 52 is mounted on the bottom of the cavity, and the three-phase component 53 is mounted on the three-phase component mounting surface 53.

[0046] In this embodiment, an electrically controlled water inlet 14 and a motor water outlet 15 are also provided on the integrated housing 1. The water inlet 37 is connected to the electrically controlled water inlet 14 through a through hole 51; the water outlet 38 is connected to the motor water outlet through a through hole 51, forming a water channel to remove heat. The three-phase component 53 includes a three-phase adapter copper busbar 63 and a three-phase terminal block 64. The three-phase adapter copper busbar 63 is mounted on the three-phase terminal block 64, and the three-phase terminal block 64 is mounted on the three-phase component mounting surface 53.

[0047] The electromagnetic shielding assembly 2 includes a shielding plate, a filter bracket, a magnetic ring bracket, and an electromagnetic shielding bracket, all of which are mounted on the shielding plate.

[0048] The electromagnetic shielding assembly 2 further includes a first magnetic ring 21, a second magnetic ring 22, an X capacitor 23, and a Y capacitor 24. The first magnetic ring 21 is mounted on a filter bracket, the second magnetic ring 22 is mounted on a magnetic ring bracket, and the X capacitor 23 and the Y capacitor 24 are both mounted on an electromagnetic shielding bracket.

[0049] The electromagnetic shielding assembly 2 also includes a grounding copper busbar 25, a positive busbar 26, and a negative busbar 27. The positive busbar 26 and the negative busbar 27 are distributed through the magnetic ring bracket and installed on the shielding plate. The grounding copper busbar 25 is installed on the shielding plate.

[0050] The X capacitor 23 is connected to the positive copper busbar 26 and the negative copper busbar 27 respectively, and the Y capacitor 24 is connected to the positive copper busbar 26 and the ground copper busbar 25 respectively, or the Y capacitor 24 is connected to the negative copper busbar 27 and the ground copper busbar 25 respectively.

[0051] The structure also includes an integrated shell cover 7 and an electromagnetic shielding cover 8. The integrated shell cover 7 is installed on the water-cooled plate cavity 5, and the electromagnetic shielding cover 8 is installed on the electromagnetic shielding cavity 6.

[0052] In this embodiment, the electromagnetic shielding assembly consists of a first magnetic ring 21, a second magnetic ring 22, two sets of Y capacitors 24, and a set of X capacitors 23. Each set of Y capacitors includes two Y capacitors 24. The first magnetic ring 21 and the second magnetic ring 22 are both runway magnetic rings. The electromagnetic shielding cover plate 8 adopts a composite damping cover plate, which effectively isolates high voltage interference and can improve the electromagnetic shielding effect and sound insulation effect.

[0053] In addition, this utility model also includes a suspension position 16, which is located on the integrated shell 1 and is used to suspend the overall structure for easy assembly. The thin-film capacitor 32, IGBT module 33, and electromagnetic shielding assembly 2 are connected via their respective copper busbars; as... Figure 6 , Figure 7 and Figure 10 As shown, both the positive busbar 26 and the negative busbar 27 are connected to the input copper busbar of the film capacitor 32. The output copper busbar of the film capacitor 32 is connected to the input copper busbar of the IGBT module 34. The output copper busbar of the IGBT module 34 is connected to the input copper busbar of the three-phase bracket 61. The output copper busbar of the three-phase bracket 61 is connected to the three-phase adapter copper busbar 63. The high-voltage harness 13 and the low-voltage harness 10 are respectively mounted on the integrated housing 1 through the high-voltage plug-in 9 and the low-voltage plug-in 10. The copper busbar terminals of the high-voltage harness 13 are connected to the positive busbar 26 and the negative busbar 27 of the electromagnetic shielding assembly 2. The harness end of the low-voltage harness 10 is inserted into the PCBA control drive board 34 of the water-cooled plate assembly 3.

[0054] The assembly process of electromagnetic shielding component 2 is as follows:

[0055] Install the first magnetic ring 21 in the corresponding position of the filter bracket and fix it with glue. Install the second magnetic ring 22 in the magnetic ring bracket and fix it with glue. Install the two sets of Y capacitors 24 and X capacitors 23 in the corresponding positions of the electromagnetic shielding bracket and fix them with glue. Pass the positive busbar 26 and negative busbar 27 through the magnetic ring bracket and install them in the corresponding positions of the magnetic ring bracket and fix them with bolts. The assembly of the modular electromagnetic shielding component 2 is completed.

[0056] The process of assembling the electromagnetic shielding component 2 onto the integrated housing 1 is as follows:

[0057] First, bolt the discharge resistor into the corresponding position of the integrated shell 1. Then, send the assembled electromagnetic shielding component 2 into the installation position from above the integrated shell 1. Pass the discharge resistor wire harness through the limiting groove of the electromagnetic shielding bracket and fix it in the corresponding position with bolts. Then, bolt the four grounding copper busbars 25 to the electromagnetic shielding bracket in the corresponding position of the integrated shell. The installation of the electromagnetic shielding component 2 is now complete.

[0058] The assembly process of water-cooled plate assembly 3 is as follows:

[0059] Place the module sealing ring into the film capacitor mounting slot 40 of the pre-filled film capacitor 32, and install the IGBT module 33. Pass the three-phase support 61 through the current sensor 62 and fix it on the output copper busbar of the IGBT module 33. Finally, lock the PCBA control drive board 34. The modular water-cooled plate assembly 3 is now assembled.

[0060] Finally, assemble the water-cooled plate assembly 3 onto the integrated housing 1. First, lead the motor thermal harness from the three-phase side slot to the PCBA plug-in position. Then, fix the three-phase adapter copper busbar 63 and the three-phase terminal block 64 onto the three-phase assembly mounting surface 52 of the integrated housing 1. Next, install the low-voltage plug-in 12 and bundle and lead the low-voltage harness 10 and the motor resolver harness to the PCBA plug-in position. Then, install the water-cooled plate assembly 3. Attach and fix the input copper busbar of the film capacitor 32 of the water-cooled plate assembly 3 to the positive busbar 26 and negative busbar 27 of the electromagnetic shielding assembly 2. At the same time, fix the copper busbar of the three-phase support 61 of the water-cooled plate assembly 3 to the installed three-phase adapter copper busbar 63. Secure the water-cooled plate 31 with bolts around its perimeter. After installing the high-voltage harness 13, secure the integrated housing cover 7, the electromagnetic shielding cover 8, and the three-phase cover plate 11, which have been glued and cured, onto the integrated housing 1 with bolts to achieve a seal. Finally, affix warning labels.

[0061] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A modular, integrated inverter structure, characterized in that, The device includes an integrated shell (1), an electromagnetic shielding assembly (2), a water-cooled plate assembly (3), a drive motor cavity (4), a water-cooled plate cavity (5), and an electromagnetic shielding cavity (6). The drive motor cavity (4), the water-cooled plate cavity (5), and the electromagnetic shielding cavity (6) are all disposed on the integrated shell (1). The electromagnetic shielding assembly (2) is mounted on the electromagnetic shielding cavity (6), and the water-cooled plate assembly (3) is mounted on the water-cooled plate cavity (5). The electromagnetic shielding assembly (2) and the water-cooled plate assembly (3) are communicatively connected. The electromagnetic shielding cavity (6) is located on the side of the integrated shell (1) and is isolated from the water-cooled plate cavity (5).

2. The modular integrated inverter structure according to claim 1, characterized in that, The water-cooled plate assembly (3) includes a water-cooled plate (31), a thin-film capacitor (32), an IGBT module (33), a PCBA control and drive board (34), an IGBT mounting surface (35), and a PCBA mounting point (36). The thin-film capacitor (32), the IGBT mounting surface (35), and the PCBA mounting point (36) are all mounted on one side of the water-cooled plate (31). The IGBT module (33) is mounted on the IGBT mounting surface (35). The PCBA control and drive board (34) is mounted on the PCBA mounting point (36). The PCBA control and drive board (34) is located on the IGBT module (33). The thin-film capacitor (32) is connected to the electromagnetic shielding assembly (2) and the IGBT module (33) respectively.

3. The modular integrated inverter structure according to claim 2, characterized in that, The water-cooled plate assembly (3) also includes a water inlet (37) and a water outlet (38), both of which are mounted on the water-cooled plate (31).

4. The modular integrated inverter structure according to claim 3, characterized in that, The water-cooled plate cavity (5) includes a cavity bottom and two through holes (51). The two through holes (51) are installed on the cavity bottom and are connected to the water inlet (37) and the water outlet (38) respectively.

5. The modular integrated inverter structure according to claim 3, characterized in that, The water-cooled plate cavity (5) also includes a three-phase component mounting surface (52) and a three-phase component (53). The three-phase component mounting surface (52) is mounted on the bottom of the cavity, and the three-phase component (53) is mounted on the three-phase component mounting surface (53).

6. The modular integrated inverter structure according to claim 2, characterized in that, The water-cooled plate assembly (3) also includes heat-conducting ribs (39), which are installed on the other side of the water-cooled plate (31).

7. The modular integrated inverter structure according to claim 1, characterized in that, The electromagnetic shielding assembly (2) includes a shielding plate, a filter bracket, a magnetic ring bracket, and an electromagnetic shielding bracket, all of which are mounted on the shielding plate.

8. The modular integrated inverter structure according to claim 7, characterized in that, The electromagnetic shielding assembly (2) further includes a first magnetic ring (21), a second magnetic ring (22), an X capacitor (23), and a Y capacitor (24). The first magnetic ring (21) is mounted on a filter bracket, the second magnetic ring (22) is mounted on a magnetic ring bracket, and the X capacitor (23) and the Y capacitor (24) are both mounted on an electromagnetic shielding bracket.

9. A modular integrated inverter structure according to claim 8, characterized in that, The electromagnetic shielding assembly (2) further includes a grounding copper busbar (25), a positive busbar (26) and a negative busbar (27). The positive busbar (26) and the negative busbar (27) are distributed through the magnetic ring bracket and installed on the shielding plate. The grounding copper busbar (25) is installed on the shielding plate. The X capacitor (23) is connected to the positive copper busbar (26) and the negative copper busbar (27) respectively, and the Y capacitor (24) is connected to the positive copper busbar (26) and the ground copper busbar (25) respectively, or the Y capacitor (24) is connected to the negative copper busbar (27) and the ground copper busbar (25) respectively.

10. A modular integrated inverter structure according to claim 1, characterized in that, The structure also includes an integrated shell cover (7) and an electromagnetic shielding cover (8). The integrated shell cover (7) is installed on the water-cooled plate cavity (5), and the electromagnetic shielding cover (8) is installed on the electromagnetic shielding cavity (6).

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