Power converter and energy storage converter

Abstract

The present disclosure relates to the field of power electronics, and provides a power converter and an energy storage converter to provide a circuit layout structure of a power converter. The power converter comprises: a first DC end and a second DC end; a three-phase bridge arm arranged between the first DC end and the second DC end; each phase of the bridge arm comprises a power module and a flying capacitor, the power module is provided with a first clamping point and a second clamping point, and two poles of the flying capacitor are connected to the first clamping point and the second clamping point respectively; a circuit board; wherein in each phase of the bridge arm, the power module and the flying capacitor are arranged adjacent to each other in the orthographic projection of the circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of power electronics technology, and in particular to a power converter and an energy storage converter. Background Technology

[0002] In ANPC (Active Neutral Point Clamped) converters, the switching devices are located in the large-loop commutation path during switching, resulting in significant stray inductance and thus requiring them to withstand substantial turn-off voltage stress. To reduce this stress, a flying capacitor can be added.

[0003] Compared to the original PCB (Printed Circuit Board) layout of the ANPC converter, the addition of flying capacitors significantly increases the difficulty of PCB layout. Utility Model Content

[0004] This disclosure provides a power converter and an energy storage converter to provide a circuit layout structure for the power converter.

[0005] According to some embodiments of this disclosure, this disclosure provides a power converter, including:

[0006] First DC terminal and second DC terminal;

[0007] A three-phase bridge arm is disposed between the first DC terminal and the second DC terminal; each phase of the bridge arm includes a power module and a flying capacitor, the power module is provided with a first clamping point and a second clamping point, and the two poles of the flying capacitor are respectively connected to the first clamping point and the second clamping point;

[0008] A circuit board; wherein, in each phase of the bridge arm, the power module and the flying capacitor are arranged adjacent to each other in the orthographic projection of the circuit board.

[0009] In the power converter provided in this embodiment, the power modules of each phase bridge arm are arranged adjacent to each other on the circuit board in terms of their projection onto the circuit board and the flying capacitors. This arrangement facilitates the electrical connection between the flying capacitors and the power modules, ensuring device efficiency. Furthermore, the separate arrangement of the power modules and flying capacitors facilitates the heat dissipation design of the power modules. The circuit layout of this power converter is simple and easy to implement. Attached Figure Description

[0010] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 A schematic diagram of the circuit topology of a three-phase ANPC converter with a flying capacitor provided in this embodiment of the present disclosure;

[0012] Figure 2 A schematic diagram of the circuit topology of a power converter provided in an embodiment of this disclosure;

[0013] Figure 3 A schematic diagram of the layout structure of a circuit board for a power converter provided in an embodiment of this disclosure;

[0014] Figure 4 A schematic diagram of the circuit board layout structure of another power converter provided in an embodiment of this disclosure;

[0015] Figure 5 This is a schematic diagram of the structure of a power converter provided in an embodiment of the present disclosure;

[0016] Figure 6 This is a schematic diagram of the structure of a power module provided in an embodiment of the present disclosure;

[0017] Figure 7 A schematic diagram of the circuit topology of another power converter provided in an embodiment of this disclosure. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this disclosure clearer, the technical solutions of this disclosure will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0019] In the description of the embodiments disclosed herein, "at least one" means one or more, "at least one layer" means one or more layers, "multiple" means two or more, "multiple layers" means two or more layers, "multiple groups" means two or more groups, and "multiple pieces" means two or more pieces, unless otherwise explicitly specified.

[0020] In the description of the embodiments disclosed herein, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0021] In the description of the embodiments of this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] In the description of the embodiments of this disclosure, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this disclosure. For example, if the device or element in the illustration is inverted, then the element described as "below," "under," "down," or "bottom" of other elements or features will be oriented "above" or "top" of said other elements or features. Therefore, the term "below" may cover both above and below orientation depending on the context in which the term is used, which will be obvious to those skilled in the art. Materials may be oriented in other ways (e.g., rotated 90 degrees, inverted, flipped), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0024] In the description of the embodiments of this disclosure, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0025] In the accompanying drawings corresponding to the embodiments of this disclosure, the thickness and area of ​​the layers are enlarged for better understanding and ease of description. Furthermore, when describing a component as "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor on a portion of the edge of the entire surface.

[0026] In the description of the embodiments of this disclosure, when a component "includes" another component, other components are not excluded unless otherwise stated, and other components may be further included. The formation or placement of a second component above or on a first component, or on the surface of a first component, or on one side of a first component, may include embodiments where the first and second components are in direct contact, and may also include embodiments where an additional component may be placed between the first and second components, thereby preventing direct contact between the first and second components. For simplicity and clarity, various components may be drawn at different scales. In the drawings, some layers / components may be omitted for simplicity. Unless otherwise specified, the formation or placement of a second component on the surface of a first component refers to direct contact between the first and second components. The term "component" may refer to: layer, film, region, portion, structure, etc.

[0027] Figure 1 This is a schematic diagram of the circuit topology of a three-phase ANPC converter with a flying capacitor. (Reference) Figure 1 As shown, the ANPC converter includes three phase arms (A-phase, B-phase, and C-phase). Each phase arm has the same circuit topology; the C-phase arm will be described in detail as an example. The C-phase arm includes six switching devices and a flying capacitor Cc. Each switching device includes a transistor and a diode. The source of the transistor is connected to the anode of the diode, the drain of the transistor is connected to the cathode of the diode, and the gate of the transistor receives the switching control signal.

[0028] For details, please refer to Figure 1As shown, the C-phase bridge arm includes a first switching device, a second switching device, a third switching device, and a fourth switching device connected sequentially between the first DC terminal DC_+ and the second DC terminal DC_-, and a fifth switching device and a sixth switching device located between the first clamping point F1 and the second clamping point F2. The connection point between the first and second switching devices is the first clamping point F1, and the connection point between the third and fourth switching devices is the second clamping point F2. The first switching device includes a switching transistor C_T1 and a diode C_D1. The source of the switching transistor C_T1 is connected to the anode of the diode C_D1, and the drain of the switching transistor C_T1 is connected to the cathode of the diode C_D1. The gate of the switching transistor C_T1 is used to receive the switching control signal. The structures of the second, third, fourth, fifth, and sixth switching devices are similar to those of the first switching device, each including a switching transistor and a diode, which will not be described in detail here. In the C-phase bridge arm, one terminal of the flying capacitor Cc is connected to the first clamping point F1, and the other terminal is connected to the second clamping point F2.

[0029] In the C-phase bridge arm, the switching transistors C_T1 to C_T6 are typically IGBTs (Insulated Gate Bipolar Transistors). Alternatively, other power electronic switching devices such as MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) can also be used.

[0030] Referring to Figure 1, the ANPC converter also includes a first bus capacitor C1 and a second bus capacitor C2 disposed between the first DC terminal DC_+ and the second DC terminal DC_-. The first terminal of the first bus capacitor C1 is connected to the first DC terminal DC_+, the second terminal of the first bus capacitor C1 is connected to the first terminal of the second bus capacitor C2, and the second terminal of the second bus capacitor C2 is connected to the second DC terminal DC_-.

[0031] The DC midpoint terminal DC_N of the ANPC converter is the connection point between the first bus capacitor C1 and the second bus capacitor C2. This DC midpoint terminal DC_N is connected to the intermediate node C_E of the C-phase bridge arm (the connection point between the fifth and sixth switching devices). Similarly, this DC midpoint terminal DC_N is also connected to the intermediate node B_E of the B-phase bridge arm (the connection point between the fifth and sixth switching devices of the B-phase bridge arm) and the intermediate node A_E of the A-phase bridge arm (the connection point between the fifth and sixth switching devices of the A-phase bridge arm).

[0032] As shown in Reference 1, the C-phase bridge arm is also equipped with an AC output terminal C_AC. Similarly, the B-phase bridge arm is also equipped with an AC output terminal B_AC, and the A-phase bridge arm is also equipped with an AC output terminal A_AC.

[0033] This three-phase ANPC converter with a flying capacitor effectively reduces the turn-off voltage stress on the second and third switching devices by using the flying capacitor, thus avoiding a reduction in the switching speed of the devices and consequently preventing a decrease in system efficiency. It should be noted that the principle behind the flying capacitor's reduction of the turn-off voltage stress on the switching devices can be found in relevant technologies and will not be elaborated upon here.

[0034] Compared to conventional three-phase ANPC converters, this three-phase flying capacitor ANPC converter has an additional flying capacitor on each phase bridge arm, which increases the complexity of circuit layout.

[0035] Based on this, embodiments of this disclosure provide a power converter, with reference to... Figure 2 As shown, it includes: a first DC terminal DC_+ and a second DC terminal DC_-; a three-phase bridge arm disposed between the first DC terminal DC_+ and the second DC terminal DC_-; each phase bridge arm includes a power module 1 and a flying capacitor ( Figure 2 C shown C C B Or C A The power module 1 is provided with a first clamping point F1 and a second clamping point F2, and the two terminals of the flying capacitor are respectively connected to the first clamping point F1 and the second clamping point F2; circuit board; wherein, reference Figure 3 and Figure 4 As shown, in each phase bridge arm, the power module's orthographic projection on circuit board 2 and the flying capacitor ( Figure 3 C shown C C B Or C A , Figure 4 C shown C_1 C C_2 C B_1 C B_2 C A_1 Or C A_2 It is placed adjacent to the orthographic projection of circuit board 2.

[0036] In this embodiment, the power modules of each phase bridge arm have the same structure, and their specific structure includes, but is not limited to, those of the phase bridge arm. Figure 2The C-phase bridge arm shown contains a first switching device C_S1, a second switching device C_S2, a third switching device C_S3, and a fourth switching device C_S4 connected sequentially between the first DC terminal DC_+ and the second DC terminal DC_-, and a fifth switching device C_S5 and a sixth switching device C_S6 located between the first clamping point F1 and the second clamping point F2. The first and second clamping points of the power module in each phase bridge arm can be determined according to the actual structure. For example, if the structure of the power module is as follows... Figure 2 For the C-phase bridge arm shown, the connection point of the first switching device C_S1 and the second switching device C_S2 is the first clamping point F1, and the connection point of the third switching device C_S3 and the fourth switching device C_S4 is the second clamping point F2.

[0037] In this embodiment of the disclosure, the circuit board includes a first surface and a second surface disposed opposite to each other along the thickness direction. The orthographic projection of the power module on the circuit board may be the orthographic projection of the power module on the first surface of the circuit board, and the orthographic projection of the flying capacitor on the circuit board may be the orthographic projection of the flying capacitor on the first surface of the circuit board; or, the orthographic projection of the power module on the circuit board may be the orthographic projection of the power module on the second surface of the circuit board, and the orthographic projection of the flying capacitor on the circuit board may be the orthographic projection of the flying capacitor on the second surface of the circuit board.

[0038] In this embodiment, the flying capacitors of each phase bridge arm can be disposed on the same side of the circuit board for ease of design. The power modules and flying capacitors of each phase bridge arm can be disposed on opposite sides of the circuit board; or, some power modules and flying capacitors can be disposed on the same side of the circuit board, while the remaining power modules can be disposed on the other side of the circuit board.

[0039] In the power converter provided in this embodiment, the power modules of each phase bridge arm are arranged adjacent to each other on the circuit board in terms of their projection onto the circuit board and the flying capacitors. This arrangement facilitates the electrical connection between the flying capacitors and the power modules, ensuring device efficiency. Furthermore, the separate arrangement of the power modules and flying capacitors facilitates the heat dissipation design of the power modules. The circuit layout of this power converter is simple and easy to implement.

[0040] It should be noted that power modules based on the same topology in a power converter can employ different packaging methods. In some embodiments, to simplify the packaging process, reference is used in each phase bridge arm. Figure 3 As shown, if the power module is fully packaged, then three power modules are set on the circuit board (e.g., Figure 3 The power modules shown are A, B, and C. For example, if the power modules include... Figure 2The first switching device C_S1, the second switching device C_S2, the third switching device C_S3, and the fourth switching device C_S4 of the C-phase bridge arm shown, as well as the fifth switching device C_S5 and the sixth switching device C_S6 disposed between the first clamping point F1 and the second clamping point F2, are all encapsulated.

[0041] Due to the significant heat dissipation requirements of the power module, and in order to facilitate the sharing of heat sinks among all phase arms and reduce costs, reference is made. Figure 5 As shown, the power modules 1 of the three-phase bridge arms are mounted on the same side of the circuit board 2. Since the heat dissipation requirements of the flying capacitor are relatively low, in order to reduce the size of the circuit board and improve its utilization efficiency, at this time, as... Figure 5 As shown, the power module 1 of the three-phase bridge arm and the flying capacitor of the three-phase bridge arm (such as...) Figure 5 The flying capacitor C of the C-phase bridge arm shown C The power modules of the three-phase bridge arms are respectively arranged on both sides of circuit board 2. The power modules of the three-phase bridge arms can be spaced apart along the length or width of the circuit board; the flying capacitors of each phase bridge arm are located on the same side of the circuit board as the power modules of each phase bridge arm are on the same side of the circuit board's orthogonal projection. For example, ... Figure 4 As shown, the flying capacitor of each phase bridge arm is projected onto the left side of the power module of each phase bridge arm on the circuit board 2; or, the flying capacitor of each phase bridge arm is projected onto the right side of the power module of each phase bridge arm on the circuit board.

[0042] In other embodiments, to make full use of the area space on the circuit board, reference is made to... Figure 4 As shown, in each phase arm, the power module includes multiple independently packaged sub-modules. For example, if the power module of phase C includes a first switching device C_S1, a second switching device C_S2, a third switching device C_S3, and a fourth switching device C_S4, and a fifth switching device C_S5 and a sixth switching device C_S6 disposed between a first clamping point F1 and a second clamping point F2, then the first switching device C_S1 and the fifth switching device C_S5 can be packaged in the first sub-module C1, the second switching device C_S2 and the third switching device C_S3 can be packaged in the second sub-module C2, and the fourth switching device C_S4 and the sixth switching device C_S6 can be packaged in the third sub-module C3. Following the packaging structure of phase C, the power module of phase A can include a first sub-module A1, a second sub-module A2, and a third sub-module A3, and the power module of phase B can include a first sub-module B1, a second sub-module B2, and a third sub-module B3.

[0043] In some implementations, the submodules of each phase arm are arranged on the same side of the circuit board, and the submodules of the three phase arms are arranged alternately or sequentially according to phase. For example, if the power module of phase C arm includes three submodules C1, C2, and C3, the power module of phase A arm includes three submodules A1, A2, and A3, and the power module of phase B arm includes three submodules B1, B2, and B3, then the alternating arrangement of the submodules of the three phase arms can be in the order of A1, B1, C1, A2, B2, C2, A3, B3, C3; the sequential arrangement of the submodules of the three phase arms according to phase can be in the order of A1, A2, A3, B1, B2, B3, C1, C2, C3.

[0044] In other embodiments, the circuit board includes two sides arranged opposite each other; in the three-phase bridge arms, submodules of any two phase bridge arms are located on the same side of the circuit board, and the submodule of the remaining phase bridge arm is located on the other side of the circuit board. For example, the submodules of phase A and phase B are located on the lower side of the circuit board, and the submodule of phase C is located on the upper side of the circuit board. In this case, the flying capacitors of each phase bridge arm can be located on the upper side of the circuit board.

[0045] It should be noted that the electrical connection points within any of the above-mentioned packaging types of power modules adopt... Figure 6 The pins are shown for connection to the circuit board via soldering or crimping. Electrical connection points include DC+, DC-, and AC connections, switching device drive connections, and first and second clamping points.

[0046] The flying capacitors of each phase bridge arm, the first DC terminal DC_+ and the second DC terminal DC_-, the DC midpoint terminal DC_N, the AC output terminals A_AC, B_AC and C_AC of each phase bridge arm, and the drive circuits of each power module (such as...) Figure 7 The drive circuits C, B, or A shown can be directly soldered onto the circuit board. The components mounted on the circuit board can be connected via copper traces. The first DC terminal (DC+), the second DC terminal (DC-), the DC midpoint terminal (DCN), and the AC output terminals A_AC, B_AC, and C_AC of each phase bridge arm can be located at the edge of the circuit board. Alternatively, the drive circuits for each power module can be soldered onto another circuit board and connected to the current circuit board via soldering or pin insertion.

[0047] Power modules in any of the above-described packaging types can be mounted to a heatsink using bolts, thereby achieving heat dissipation for the power module. (Reference) Figure 5As shown, the heat sink 4 can be positioned on the side of the power module 1 away from the circuit board 2. Types of heat sinks include, but are not limited to, finned heat sinks and liquid-cooled heat sinks. A power module can be formed by the circuit board, on-board components, power module, and heat sink.

[0048] In some embodiments, the flying capacitor includes multiple sub-capacitors connected in parallel. The sub-capacitors are film capacitors or electrolytic capacitors. For example, such as... Figure 3 As shown, the flying capacitor of each phase bridge arm may include four sub-capacitors connected in parallel.

[0049] In some embodiments, reference Figure 2 As shown, in each phase bridge arm, the power module includes a first switching device C_S1, a second switching device C_S2, a third switching device C_S3, and a fourth switching device C_S4, which are disposed between the first DC terminal and the second DC terminal and connected in sequence, and a fifth switching device C_S5 and a sixth switching device C_S6, which are disposed between the first clamping point F1 and the second clamping point F2. The connection point of the first switching device C_S1 and the second switching device C_S2 is the first clamping point F1, and the connection point of the third switching device C_S3 and the fourth switching device C_S4 is the second clamping point F2.

[0050] Each switching device may include a switching transistor and a diode; specific connection methods can be found in the aforementioned section. Figure 1 The explanation is as follows. Alternatively, other power electronic switching devices such as MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) can also be used.

[0051] In some embodiments, reference Figure 2 As shown, the power converter also includes a first bus capacitor C1 and a second bus capacitor C2; the power module 1 is provided with intermediate nodes; the first terminal of the first bus capacitor C1 is connected to the first DC terminal DC_+, and the second terminal of the first bus capacitor C1 is connected to the first terminal of the second bus capacitor C2 and the intermediate node of each phase arm (e.g., Figure 2 As shown in C_E, B_E, or A_E), the second terminal of the second bus capacitor C2 is connected to the second DC terminal DC_-; the first bus capacitor C1, the second bus capacitor C2, and the flying capacitor ( Figure 2 C shown C C B Or C A They are set on the same side of the circuit board.

[0052] refer to Figure 3 and Figure 4As shown, the first bus capacitor C1 and the second bus capacitor C2 can each include multiple film capacitors connected in parallel. For example, the number of film capacitors can be 4, 5, 6, 7, or 8, etc. The multiple film capacitors included in the first bus capacitor C1 are arranged in one row, and the multiple film capacitors included in the second bus capacitor C2 are arranged in another row, and can be directly soldered onto the circuit board. (Reference) Figure 3 As shown, if the power modules of each phase bridge arm are packaged as a whole, the flying capacitors of each phase bridge arm are located on the same side of the whole formed by the first bus capacitor C1 and the second bus capacitor C2. (Reference) Figure 4 As shown, if the power modules of each phase bridge arm are divided into two sub-modules and packaged independently, then flying capacitors are provided on both sides of the whole formed by the first bus capacitor C1 and the second bus capacitor C2.

[0053] This disclosure also provides an energy storage converter, including the power converter described in any of the above embodiments. In this energy storage converter, the circuit layout of the power converter is simple and easy to implement. The energy storage converter may also include other devices and modules, such as a control module, a detection and sensing module, a filtering module, a circuit breaker, and a heat sink, etc. Specific details can be found in related technologies and will not be elaborated here.

[0054] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of this disclosure. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure.

Claims

1. A power converter, characterized in that, include: First DC terminal and second DC terminal; A three-phase bridge arm is disposed between the first DC terminal and the second DC terminal; Each phase of the bridge arm includes a power module and a flying capacitor. The power module is provided with a first clamping point and a second clamping point. The two poles of the flying capacitor are respectively connected to the first clamping point and the second clamping point. A circuit board; wherein, in each phase of the bridge arm, the power module and the flying capacitor are arranged adjacent to each other in the orthographic projection of the circuit board.

2. The power converter according to claim 1, characterized in that, In each of the bridge arms, the power module is integrally packaged.

3. The power converter according to claim 2, characterized in that, The power modules of the three-phase bridge arms are disposed on the same side of the circuit board, and the power modules of the three-phase bridge arms and the flying capacitors of the three-phase bridge arms are disposed on opposite sides of the circuit board.

4. The power converter according to claim 1, characterized in that, In each phase of the bridge arm, the power module includes multiple independently packaged sub-modules.

5. The power converter according to claim 4, characterized in that, The sub-modules of each phase bridge arm are arranged on the same side of the circuit board, and the sub-modules of the three phase bridge arms are arranged alternately or sequentially according to phase.

6. The power converter according to claim 4, characterized in that, The circuit board includes two sides arranged opposite each other; in the three-phase bridge arms, the sub-modules of any two phase bridge arms are arranged on the same side of the circuit board, and the sub-module of the remaining phase bridge arm is arranged on the other side of the circuit board.

7. The power converter according to claim 1, characterized in that, The flying capacitor includes multiple sub-capacitors connected in parallel.

8. The power converter according to claim 7, characterized in that, The sub-capacitor is a film capacitor or an electrolytic capacitor.

9. The power converter according to claim 1, characterized in that, In each phase of the bridge arm, the power module includes a first switching device, a second switching device, a third switching device, and a fourth switching device that are disposed between the first DC terminal and the second DC terminal and connected in sequence, and a fifth switching device and a sixth switching device that are disposed between the first clamping point and the second clamping point, wherein the connection point between the first switching device and the second switching device is the first clamping point, and the connection point between the third switching device and the fourth switching device is the second clamping point.

10. The power converter according to claim 1, characterized in that, The power converter also includes a first bus capacitor and a second bus capacitor; the power module is provided with an intermediate node; The first terminal of the first bus capacitor is connected to the first DC terminal, the second terminal of the first bus capacitor is connected to the first terminal of the second bus capacitor and the intermediate node of each phase of the bridge arm, and the second terminal of the second bus capacitor is connected to the second DC terminal. The first bus capacitor, the second bus capacitor, and the flying capacitor are disposed on the same side of the circuit board.

11. An energy storage converter, characterized in that, Includes the power converter according to any one of claims 1-10.

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