Radio frequency front-end module and electronic device

CN224843765UActive Publication Date: 2026-10-09ANYSMART TECH CO LTD
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Patent Information

Application Number
CN202522539578.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-28
Publication Date
2026-10-09
Estimated Expiration
2035-11-28

AI Technical Summary

Technical Problem

[0003]本公开实施例提供一种方案,以解决相关技术中,射频前端模组设计成本过高的技术问题

Benefits of technology

[0006]本公开提供的技术方案,射频前端模组包括功率放大器、低噪声放大器、开关模块、天线、双工器;所述功率放大器通过所述双工器与所述开关模块连接,所述低噪声放大器通过所述双工器与所述开关模块连接,所述开关模块上设置有所述天线;所述功率放大器用于放大基带处理器发送的射频发射信号;所述低噪声放大器用于放大天线接收的射频信号;所述开关模块用于切换不同频段的通路;所述双工器用于实现发射信号与接收信号的频段隔离;所述天线用于射频信号的发射与接收;其中,所述功率放大器的基带信号输入侧设置有两个MIPI接口,每个MIPI接口的信号通道上并联一个电容,且电容的另一端接地;所述开关模块的基带信号输入侧同样设置有两个MIPI接口,每个MIPI接口的信号通道上并联一个电容,且电容的另一端接地。通过在功率放大器的基带信号输入侧的两个MIPI接口的信号通道上并联一个电容,且电容的另一端接地,以及在开关模块的基带信号输入侧的两个MIPI接口的信号通道上并联一个电容,且电容的另一端接地,通过电容可以滤除高频干扰信号,达到提升大宽带下灵敏度3dB的效果。

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Abstract

The present disclosure discloses a radio frequency front end module and electronic equipment, the radio frequency front end module includes: power amplifier, low noise amplifier, switch module, antenna, duplexer;Power amplifier is connected with switch module through duplexer, low noise amplifier is connected with switch module through duplexer, and antenna is arranged on switch module;Power amplifier is used for amplifying radio frequency transmitting signal sent by baseband processor;Low noise amplifier is used for amplifying radio frequency signal received by antenna;Switch module is used for switching the passageway of different frequency bands;The baseband signal input side of power amplifier is provided with two MIPI interfaces, a capacitor is connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded;The baseband signal input side of switch module is also provided with two MIPI interfaces, a capacitor is connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded.This technical scheme can effectively filter out interference signals and improve sensitivity by 3dB under large bandwidth.
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Description

Technical Field

[0001] This disclosure belongs to the field of radio frequency technology, and in particular relates to a radio frequency front-end module and electronic device. Background Technology

[0002] In related technologies, the RFFE (Radio Frequency Front-End) is a core component of wireless communication modules. Its sensitivity standard is relatively low under high bandwidth conditions because, compared to low bandwidth, such as 40M / 50M bandwidth, the channel covers a wide frequency range and is easily subject to interference, which affects OTA TIS and data transmission performance. Utility Model Content

[0003] This disclosure provides a solution to address the technical problem of excessively high design costs for radio frequency front-end modules in related technologies.

[0004] In a first aspect, this disclosure provides a radio frequency front-end module, the radio frequency front-end module comprising: a power amplifier, a low noise amplifier, a switching module, an antenna, and a duplexer; The power amplifier is connected to the switching module via the duplexer, the low-noise amplifier is connected to the switching module via the duplexer, and the antenna is provided on the switching module; The power amplifier is used to amplify the radio frequency transmission signal sent by the baseband processor; the low noise amplifier is used to amplify the radio frequency signal received by the antenna; the switching module is used to switch the paths of different frequency bands; the duplexer is used to achieve frequency band isolation between the transmitted signal and the received signal; the antenna is used for transmitting and receiving radio frequency signals. The power amplifier has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface and the other end of the capacitor grounded. The switching module also has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface and the other end of the capacitor grounded.

[0005] In a second aspect, this disclosure provides an electronic device, which includes the radio frequency front-end module of the embodiment described in the first aspect.

[0006] The technical solution provided in this disclosure includes a radio frequency (RF) front-end module comprising a power amplifier, a low-noise amplifier, a switching module, an antenna, and a duplexer. The power amplifier is connected to the switching module via the duplexer, and the low-noise amplifier is also connected to the switching module via the duplexer. The antenna is mounted on the switching module. The power amplifier amplifies the RF transmission signal sent by the baseband processor. The low-noise amplifier amplifies the RF signal received by the antenna. The switching module switches between different frequency bands. The duplexer isolates the transmission and reception signals by frequency band. The antenna is used for both transmitting and receiving RF signals. The power amplifier has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded. Similarly, the switching module has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded. By connecting a capacitor in parallel on the signal channels of the two MIPI interfaces on the baseband signal input side of the power amplifier, with the other end of the capacitor grounded, and by connecting a capacitor in parallel on the signal channels of the two MIPI interfaces on the baseband signal input side of the switching module, with the other end of the capacitor grounded, high-frequency interference signals can be filtered out through the capacitors, thereby improving the sensitivity by 3dB under wide bandwidth. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 This is a schematic diagram of the structure of a radio frequency front-end module provided in one embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of an electronic device provided in one embodiment of the present disclosure. Detailed Implementation

[0008] Embodiments of this disclosure are described in detail below, with examples of embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting this disclosure.

[0009] The terms "first" and "second," etc., used in the specification, claims, and drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present disclosure described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0010] In related technologies, the RFFE (Radio Frequency Front-End) is a core component of wireless communication modules. Its sensitivity standard is relatively low under high bandwidth conditions because, compared to low bandwidth, such as 40M / 50M bandwidth, the channel covers a wide frequency range and is easily subject to interference, which affects OTA TIS and data transmission performance.

[0011] The technical solutions of this disclosure and how they solve the aforementioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0012] Figure 1 This is a schematic diagram of a radio frequency (RF) front-end module provided as an exemplary embodiment of the present disclosure. The device can be applied to equipment with communication functions. The RF front-end module includes: a power amplifier 101, a low-noise amplifier 102, a switching module 104, an antenna 105, and a duplexer 103. The power amplifier 101 is connected to the switching module 104 via the duplexer 103, the low noise amplifier 102 is connected to the switching module 104 via the duplexer 103, and the antenna 105 is provided on the switching module 104; The power amplifier 101 has two MIPI interfaces on its baseband signal input side. A capacitor is connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded. The baseband signal input side of the switching module 104 is also provided with two MIPI interfaces. A capacitor is connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded.

[0013] In some embodiments, combined with Figure 1As shown, the power amplifier 101 has two MIPI interfaces on its baseband signal input side, namely MIPI interface 1011 and MIPI interface 1013. A capacitor 1015 is connected in parallel on the signal channel of MIPI interface 1011, and the other end of the capacitor 1015 is grounded.

[0014] Furthermore, a capacitor 1014 is connected in parallel on the signal channel of the MIPI interface 1013, and the other end of the capacitor 1014 is grounded.

[0015] Specifically, the power amplifier operates in the frequency band of 700MHz to 3GHz, with an output power of 29dBm to 32dBm and an efficiency of ≤30%.

[0016] Specifically, the low-noise amplifier operates in the frequency band of 1805MHz to 2690MHz and has a gain of ≤20dB.

[0017] In other embodiments, the output of the low-noise amplifier is provided with a bandpass filter for signal filtering.

[0018] In some embodiments, combined with Figure 1 As shown, the baseband signal input side of the switching module 104 also has two MIPI interfaces, namely MIPI interface 1041 and MIPI interface 1043. A capacitor 1045 is connected in parallel on the signal path of MIPI interface 1041, and the other end of the capacitor 1045 is grounded.

[0019] Furthermore, a capacitor 1044 is connected in parallel on the signal channel of the MIPI interface 1043, and the other end of the capacitor 1044 is grounded.

[0020] In some embodiments, the capacitance value of the capacitor on the signal channel of the aforementioned MIPI interface is preferably 1~15pF to suppress high-frequency noise. The specific capacitance value can be set according to the actual situation.

[0021] In some embodiments, the aforementioned capacitor may be a decoupling capacitor. The specific configuration can be adjusted according to the actual situation.

[0022] In some embodiments, the drive voltage VIO of the aforementioned MIPI interface is supplied by an external PMIC. Specifically, the VIO drive voltages of the power amplifier 101, low-noise amplifier 102, and switching module 104 are supplied by the same power input.

[0023] Furthermore, the typical value is 1.8V, and the dynamic range is 1.65V-1.95V. In some embodiments, the power amplifier 101 is used to amplify the radio frequency transmission signal sent by the baseband processor.

[0024] Specifically, in combination Figure 1 As shown, MIPI interface 1011 receives MIPI CLK, and MIPI interface 1013 receives MIPI DATA.

[0025] In some embodiments, the low-noise amplifier 102 is used to amplify the radio frequency signal received by the antenna 105.

[0026] Specifically, in combination Figure 1 As shown, MIPI interface 1021 receives MIPI CLK, and MIPI interface 1023 receives MIPI DATA.

[0027] In some embodiments, the switch module 104 is used to switch between different frequency bands. The switch module 104 is a multi-pole multi-throw (nPnT) RF switch or a single-pole multi-throw (SPnT) RF switch, supporting the switching of at least one antenna port with multiple RF paths.

[0028] In some embodiments, the duplexer 103 is used to achieve frequency band isolation between the transmitted signal and the received signal.

[0029] Specifically, the duplexer 103 includes a transmit filter and a receive filter.

[0030] The transmitting filter is connected between the power amplifier 101 and the switching module 104 to filter out interference signals outside the transmitting frequency band; the receiving filter is connected between the low-noise amplifier 102 and the switching module 104 to filter out interference signals outside the receiving frequency band.

[0031] In some embodiments, the antenna 105 is used for transmitting and receiving radio frequency signals.

[0032] Specifically, the antenna is a multi-band antenna that supports the following frequency bands: 700MHz~960MHz low frequency band, 1710MHz~2170MHz mid frequency band, 2300MHz~2690MHz high frequency band, and 3300MHz~5000MHz ultra-high frequency band.

[0033] To better understand this solution, a specific embodiment is provided below to further illustrate the relevant solutions for the RF front-end module, as shown in the figure. Figure 1 As shown, the specific process includes the following: The MIPI interfaces (MIPI interfaces 1011 and 1013) on the baseband signal input side of the power amplifier 101 are adjacent to the external PMIC power supply module and the RF signal port. The interference signal generated by the interference source enters the RF signal port directly or indirectly along the MIPI BUS path (MIPI interface channel) with the external PMIC power supply module. Since the MIPI CLK frequency is much lower than the interference signal, connecting a capacitor with a capacitance of no more than 15pF (such as 6pF) in parallel with the MIPI BUS can effectively filter out the interference signal and achieve the effect of improving the sensitivity by 3dB under a large bandwidth.

[0034] The technical solution provided in this disclosure includes a radio frequency (RF) front-end module comprising a power amplifier, a low-noise amplifier, a switching module, an antenna, and a duplexer. The power amplifier is connected to the switching module via the duplexer, and the low-noise amplifier is also connected to the switching module via the duplexer. The antenna is mounted on the switching module. The power amplifier amplifies the RF transmission signal sent by the baseband processor. The low-noise amplifier amplifies the RF signal received by the antenna. The switching module switches between different frequency bands. The duplexer isolates the transmission and reception signals by frequency band. The antenna is used for both transmitting and receiving RF signals. The power amplifier has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded. Similarly, the switching module has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface, and the other end of the capacitor is grounded. By connecting a capacitor in parallel on the signal channels of the two MIPI interfaces on the baseband signal input side of the power amplifier, with the other end of the capacitor grounded, and by connecting a capacitor in parallel on the signal channels of the two MIPI interfaces on the baseband signal input side of the switching module, with the other end of the capacitor grounded, high-frequency interference signals can be filtered out through the capacitors, thereby improving the sensitivity by 3dB under wide bandwidth.

[0035] Figure 2 This is a schematic diagram of the structure of an electronic device provided for an exemplary embodiment of the present disclosure; wherein the electronic device 20 includes any of the above-described exemplary radio frequency front-end modules 10.

[0036] Furthermore, the electronic device can be any device with communication capabilities.

[0037] Furthermore, although exemplary embodiments have been described herein, their scope includes any and all embodiments based on this disclosure that have equivalent elements, modifications, omissions, combinations (e.g., schemes involving intersections of various embodiments), adaptations, or alterations. Elements in the claims will be interpreted broadly based on the language used in the claims and are not limited to the examples described in this specification or during the implementation of this disclosure, which will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered illustrative only, and the true scope and spirit are indicated by the full scope of the following claims and their equivalents.

[0038] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. Other embodiments can be used by those skilled in the art when reading the above description. Furthermore, in the above detailed description, various features may be grouped together to simplify the disclosure. This should not be construed as an intention that a feature of the disclosure that is not claimed is necessary for any claim. Rather, the subject matter of this disclosure may be less than all the features of a particular disclosed embodiment. Thus, the following claims are incorporated herein by reference as examples or embodiments, wherein each claim is an independent, separate embodiment, and these embodiments are contemplated to be combined with each other in various combinations or arrangements. The scope of this disclosure should be determined by reference to the appended claims and the full scope of their equivalents.

[0039] The foregoing has provided a detailed description of several embodiments of this disclosure. However, this disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications based on the concept of this disclosure, and all such variations and modifications should fall within the scope of protection claimed by this disclosure.

Claims

1. A radio frequency front-end module, characterized in that, The radio frequency front-end module includes: a power amplifier, a low-noise amplifier, a switching module, an antenna, and a duplexer; The power amplifier is connected to the switching module via the duplexer, the low-noise amplifier is connected to the switching module via the duplexer, and the antenna is provided on the switching module; The power amplifier is used to amplify the radio frequency transmission signal sent by the baseband processor; the low noise amplifier is used to amplify the radio frequency signal received by the antenna; the switching module is used to switch the paths of different frequency bands; the duplexer is used to achieve frequency band isolation between the transmitted signal and the received signal; the antenna is used for transmitting and receiving radio frequency signals. The power amplifier has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface and the other end of the capacitor grounded. The switching module also has two MIPI interfaces on its baseband signal input side, with a capacitor connected in parallel on the signal channel of each MIPI interface and the other end of the capacitor grounded.

2. The radio frequency front-end module according to claim 1, characterized in that, The duplexer includes: The transmit filter, connected between the power amplifier and the switching module, is used to filter out interference signals outside the transmit frequency band.

3. The radio frequency front-end module according to claim 2, characterized in that, The duplexer also includes: The receiving filter, connected between the low-noise amplifier and the switching module, is used to filter out interference signals outside the receiving frequency band.

4. The radio frequency front-end module according to claim 1, characterized in that, The switching module is a multi-pole multi-throw RF switch or a single-pole multi-throw RF switch.

5. The radio frequency front-end module according to claim 1, characterized in that, The capacitance of the MIPI interface is 1~15pF, used to suppress high-frequency noise.

6. The radio frequency front-end module according to claim 1, characterized in that, The power amplifier operates in the frequency band of 700MHz to 3GHz, with an output power of 29dBm to 32dBm and an efficiency of ≤30%.

7. The radio frequency front-end module according to claim 1, characterized in that, The low-noise amplifier operates in the frequency band of 1805MHz to 2690MHz and has a gain of ≤20dB.

8. The radio frequency front-end module according to claim 1, characterized in that, The antenna is a multi-band antenna, supporting the following frequency bands: 700MHz~960MHz low frequency band, 1710MHz~2170MHz mid frequency band, 2300MHz~2690MHz high frequency band, and 3300MHz~5000MHz ultra-high frequency band.

9. The radio frequency front-end module according to claim 7, characterized in that, The low-noise amplifier is equipped with a bandpass filter for signal filtering at its output.

10. An electronic device, characterized in that, The electronic device includes the radio frequency front-end module according to any one of claims 1-9.