A flight management module and central processing device

Abstract

The application provides a flight management module and a central processing device, and relates to the technical field of flight control.In the flight management module, the sending end of a network transformer is connected with a network switching chip through a first PHY chip and a first Ethernet physical layer interface in sequence, the network switching chip is connected with a PL end in the processor through a second Ethernet physical layer interface, the network switching chip is also connected with a second PHY chip through a third Ethernet physical layer interface, the second PHY chip is connected with a PS end in the processor through a fourth Ethernet physical layer interface, and a volatile memory is connected with the PS end.Because the network switching chip, the volatile memory and the two PHY chips all adopt domestic devices, the domestication of the flight management module is improved, so that the passive risk of key devices being subject to people can be reduced, and the production cycle of a single machine is guaranteed to a certain extent, and the production demand of being self-controllable is met to a certain extent.

Description

Technical Field

[0001] This utility model relates to the field of flight control technology, and in particular to a flight management module and a central processing device. Background Technology

[0002] In the field of flight control technology, the flight management module is the smallest system that implements flight management functions.

[0003] Currently, some key components in the flight management module are imported. Due to the restrictions on the procurement of imported components, there is not only a passive risk of being dependent on others for key components, but also it is difficult to guarantee the production cycle of a single aircraft, which does not meet the requirements of independent and controllable production.

[0004] Therefore, improving the localization level of flight management modules is an urgent technical problem to be solved. Utility Model Content

[0005] In view of this, the present invention provides a flight management module and a central processing device to improve the localization level of the flight management module. The specific technical solution is as follows:

[0006] This application provides a flight management module, including: a processor, volatile memory, a network switching chip, a network transformer, and two-port physical layer PHY chips; wherein:

[0007] The receiving end of the network transformer serves as the first communication interface of the flight management module, and the transmitting end of the network transformer is connected to the first PHY chip.

[0008] The first PHY chip is connected to the network switching chip through a first Ethernet physical layer interface, and the network switching chip is connected to the PL terminal in the processor through a second Ethernet physical layer interface;

[0009] The network switching chip is also connected to the second PHY chip through a third Ethernet physical layer interface, and the second PHY chip is connected to the PS terminal in the processor through a fourth Ethernet physical layer interface.

[0010] The volatile memory is connected to the PS terminal;

[0011] The processor, the network switching chip, the volatile memory, and the two PHY chips all use domestically produced components.

[0012] Optionally, it also includes: an isolation transformer and a communication module; wherein:

[0013] One side of the isolation transformer serves as the second communication interface of the flight management module;

[0014] The other side of the isolation transformer is connected to the PL terminal via the communication module;

[0015] The communication module conforms to the 1553B standard.

[0016] Optionally, it also includes: three non-volatile memory locations; wherein:

[0017] The first non-volatile memory is connected to the PL terminal, and the second and third non-volatile memory are both connected to the PS terminal.

[0018] This application also provides a central processing device, comprising: a power module and a flight management module as described above; wherein:

[0019] The output terminal of the power module is connected to the power terminal of the flight management module.

[0020] Optionally, the power supply module includes: a reverse polarity protection circuit, a filter module, and two DC / DC conversion circuits; wherein:

[0021] The input terminal of the anti-reverse and protection circuit serves as the input terminal of the power module.

[0022] The output of the anti-reverse and protection circuit is connected to the input of the first DC / DC converter circuit through the filtering module.

[0023] The output terminal of the first DC / DC converter circuit is connected to the input terminal of the second DC / DC converter circuit;

[0024] The output terminal of the second DC / DC converter circuit serves as the output terminal of the power supply module.

[0025] Optionally, the power module further includes: a CANFD transceiver and a CANFD controller; wherein:

[0026] The first end of the CANFD transceiver serves as the first communication end of the power module.

[0027] The second terminal of the CANFD transceiver is connected to the PL terminal in the flight management module.

[0028] The third terminal of the CANFD transceiver is connected to one terminal of the CANFD controller;

[0029] The other end of the CANFD controller is connected to the PL terminal via a serial peripheral SPI interface.

[0030] Optionally, the power module further includes: a synchronous 422 interface circuit and a 422 interface circuit; wherein:

[0031] The outer side of the synchronous 422 interface circuit serves as the second communication terminal of the power module;

[0032] The inner side of the synchronous 422 interface circuit is connected to the PL terminal in the flight management module via a UART interface.

[0033] The outer side of the 422 interface circuit serves as the third communication terminal of the power module.

[0034] The inner side of the 422 interface circuit is connected to the PL terminal via a UART interface.

[0035] Optionally, the power module further includes: an input digital interface circuit and an output digital interface circuit; wherein:

[0036] One end of the input switch interface circuit serves as the input switch port of the power module, and the other end of the input switch interface circuit is connected to the PL terminal in the flight management module.

[0037] One end of the output switch interface circuit serves as the output switch port of the power module, and the other end of the output switch interface circuit is connected to the PL terminal.

[0038] Optionally, the power module further includes: a current and voltage acquisition circuit; wherein:

[0039] The acquisition terminal of the current and voltage acquisition circuit is connected to the output terminal of the second DC / DC conversion circuit;

[0040] The transmission terminal of the current and voltage acquisition circuit is connected to the PL terminal in the flight management module.

[0041] Optionally, it also includes: a thermal pad; wherein:

[0042] The thermal pad uses domestically produced components and is positioned between the central processing unit and the heat sink.

[0043] As can be seen from the above technical solution, this utility model provides a flight management module. In this flight management module, the transmitting end of the network transformer is connected to the network switching chip sequentially through a first PHY chip and a first Ethernet physical layer interface. The network switching chip is connected to the PL terminal of the processor through a second Ethernet physical layer interface. The network switching chip is also connected to the second PHY chip through a third Ethernet physical layer interface. The second PHY chip is connected to the PS terminal of the processor through a fourth Ethernet physical layer interface. The volatile memory is connected to the PS terminal. Since the network switching chip, volatile memory, and two PHY chips all use domestically produced components, the localization of the flight management module is improved, thereby reducing the passive risk of being dependent on others for key components. This, to a certain extent, ensures the production cycle of a single unit and also meets the requirements of independent and controllable production to a certain extent. Attached Figure Description

[0044] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0045] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0046] Figure 1 This is a schematic diagram of the structure of a flight management module provided in an embodiment of this application;

[0047] Figure 2 This is a schematic diagram of the structure of another flight management module provided in an embodiment of this application;

[0048] Figure 3 This is a schematic diagram of the structure of another flight management module provided in an embodiment of this application;

[0049] Figure 4 This is a schematic diagram of the structure of a central processing device provided in an embodiment of this application;

[0050] Figure 5 This is a schematic diagram of the structure of another central processing device provided in the embodiments of this application;

[0051] Figure 6 This is a schematic diagram of the structure of another central processing device provided in the embodiments of this application;

[0052] Figure 7 This is a schematic diagram of the structure of another central processing device provided in the embodiments of this application;

[0053] Figure 8 This is a schematic diagram of the structure of another central processing device provided in the embodiments of this application;

[0054] Figure 9 This is a schematic diagram of another central processing device provided in an embodiment of this application. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0056] In this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0057] To improve the localization rate of flight management modules, this application provides a flight management module with the following specific structure: Figure 1 As shown, it includes: processor 10, volatile memory 20, network switching chip 30, network transformer 40, first PHY (Port Physical Layer) chip 50, and second PHY chip 60. The specific connection relationships between the various devices are as follows:

[0058] The receiving end of the network transformer 40 serves as the first communication interface of the flight management module, and the transmitting end of the network transformer 40 is connected to the first PHY chip 50. The first PHY chip 50 is connected to the network switching chip 30 through the first Ethernet physical layer interface 01, and the network switching chip 30 is connected to the PL (Programmable Logic) in the processor 10 through the second Ethernet physical layer interface 02.

[0059] Optionally, the first Ethernet physical layer interface 01 can be SGMII (Serial Gigabit Media Independent Interface) or RGMII (Reduced Gigabit Media Independent Interface). In practical applications, it may include, but is not limited to, these options. No specific limitation is made here; the choice depends on the specific circumstances and is within the scope of this application. In practical applications, SGMII is preferred as the first Ethernet physical layer interface 01.

[0060] Optionally, the second Ethernet physical layer interface 02 can be SGMII or RGNII. In practical applications, this may include, but is not limited to, SGMII or RGNII. The choice is not specific but depends on the specific circumstances and is within the scope of this application. In practical applications, SGMII is preferred as the second Ethernet physical layer interface 02.

[0061] The network switching chip 30 is also connected to the second PHY chip 60 through the third Ethernet physical layer interface 03, and the second PHY chip 60 is connected to the PS (Processing System) in the processor 10 through the fourth Ethernet physical layer interface 04.

[0062] Optionally, the third Ethernet physical layer interface 03 can be SGMII or RGNII. In practical applications, it may include, but is not limited to, these options. No specific limitation is made here; the choice depends on the specific circumstances and is within the scope of this application. In practical applications, SGMII is preferred as the third Ethernet physical layer interface 03.

[0063] Optionally, the fourth Ethernet physical layer interface 04 can be RGMII or SGNII. In practical applications, this may include, but is not limited to, either. No specific limitation is made here; the choice depends on the specific circumstances and is within the scope of this application. In practical applications, RGMII is preferred as the fourth Ethernet physical layer interface 04.

[0064] It should be noted that in many existing high-end chips, the PL (Programmable Logic) terminal and the PS (Power Switch) terminal are often integrated into the same chip, forming a hardware-software co-working architecture: the PL terminal is responsible for high-speed real-time hardware tasks, while the PS terminal is responsible for complex logic software tasks, and the two communicate efficiently through an internal bus. The processor 10 in this embodiment integrates both the PL and PS terminals, continuing this mature architecture of existing high-end chips. Specifically, the PS terminal in the processor 10 relies on a mature embedded processor architecture and serves as the core of the flight management module. It can receive external input information such as sensor data and ground control commands in real time. Based on the built-in real-time operating system and flight control algorithm library, it completes flight management functions such as flight path planning, attitude adjustment, and task scheduling through software logic. Its software programmability allows for flexible iteration of functions. The PL terminal in the processor 10 is based on an existing programmable logic architecture and serves as the interface hub, achieving efficient data exchange with the PS terminal through an internal high-speed bus. Simultaneously, relying on a fixed hardware logic design, it undertakes external interface function expansion tasks and stably supports real-time data transmission and control signal conversion for multiple types of peripherals thanks to the parallel processing characteristics of programmable logic.

[0065] The volatile memory 20 is connected to the PS terminal in the processor 10. The processor 10, volatile memory 20, network switching chip 30, network transformer 40, first PHY chip 50 and second PHY chip 60 all use domestically produced components to improve the localization level of the flight management module, and even to achieve 100% domestic design of the flight management module.

[0066] In a specific example, processor 10 uses the domestically produced FMQLS45T900 chip from Fudan Microelectronics. The FMQLS45T900 supports 1553B bus control, voltage and current acquisition, 14 digital inputs, 8 digital outputs, 422 bus control, synchronous signal reception, and Ethernet switching output. It can also perform control tasks for CANFD (Controller Area Network with Flexible Data Rate) and the 1553B intelligent interface, transmitting external data received on the CANFD and 1553B buses to the PS terminal for processing in a timely manner. Through a "hardware-software co-operation" architecture between the PS and PL terminals, the FMQLS45T900 ensures domestic production while meeting the flight management module's dual requirements for real-time control and interface expansion.

[0067] The above example only illustrates one selection method for processor 10. In practical applications, there are other methods, including but not limited to this one. No specific limitation is made here. The selection method can be determined according to the specific circumstances, and all of them are within the protection scope of this application.

[0068] In a specific example, the network switching chip 30 uses the domestically produced JEM5396 chip. The JEM5396 integrates 16 1.25G SerDes / SGMII port interfaces, which can be directly connected to external Gigabit Ethernet chips or fiber optic modules. Through a stable hardware interface design, it provides the device with a high-speed and reliable network data transmission channel, effectively ensuring the stability of network communication during flight management.

[0069] The above example only shows one selection method for the network switching chip 30. In practical applications, there are other methods, including but not limited to this one. No specific limitation is made here. The selection method can be determined according to the specific circumstances, and all of them are within the protection scope of this application.

[0070] In a specific example, both PHY chips used are the domestically produced XYI9322QNI. The XYI9322QNI is a highly integrated Ethernet transceiver that conforms to the IEEE 802.3 standard's 1000Base-T (Gigabit Ethernet), 100Base-TX (100Mbps Ethernet), and 10Base-Te (10Mbps Ethernet) specifications, and can adapt to Ethernet communication needs of different speeds.

[0071] The above example only illustrates one selection method for two PHY chips. In practical applications, there are other methods, including but not limited to this one. No specific limitation is made here, and the choice can be made depending on the specific circumstances. All of these are within the scope of protection of this application.

[0072] In one specific example, the volatile memory 20 uses a domestically produced DDR3 (Double Data Rate 3) chip. In practical applications, this may include, but is not limited to, the following. No specific limitation is made here. It may be determined according to the specific circumstances and is within the scope of protection of this application.

[0073] In a specific example, the DDR3 chip used is the domestically produced SCB13H4G160AF 11MI, with a 32-bit bus width. It supports 1.5V and 1.35V power supplies, and its effective data transfer rate is no less than 800MT / s. By connecting two of these DDR3 chips to the processor 10, the total memory reaches 1GB, which can provide sufficient and stable storage support for the real-time data caching and intermediate data storage of the flight management module.

[0074] The above example only illustrates one way to select DDR3 chips. In practical applications, there are other methods, including but not limited to this one. No specific limitation is made here. The choice can be made depending on the specific circumstances, and all of them are within the scope of protection of this application.

[0075] Because the key components in this flight management module are all domestically produced, the localization level of the flight management module has been improved. This reduces the passive risk of being dependent on others for key components, and to a certain extent, the production cycle of a single unit can be guaranteed, which also meets the production requirements of independent control to a certain extent.

[0076] This application also provides another flight management module, which adds an isolation transformer 70 and a communication module 80 to any of the above embodiments, such as... Figure 2 As shown. Specifically, Figure 2 The flight management module shown includes: a processor 10, volatile memory 20, a network switching chip 30, a network transformer 40, a first PHY chip 50, a second PHY chip 60, an isolation transformer 70, and a communication module 80. The specific connections between these components are as follows:

[0077] The receiving end of the network transformer 40 serves as the first communication interface of the flight management module, and the transmitting end of the network transformer 40 is connected to the first PHY chip 50. The first PHY chip 50 is connected to the network switching chip 30 through the first Ethernet physical layer interface 01, and the network switching chip 30 is connected to the PL in the processor 10 through the second Ethernet physical layer interface 02.

[0078] The network switching chip 30 is also connected to the second PHY chip 60 through the third Ethernet physical layer interface 03, and the second PHY chip 60 is connected to the PS in the processor 10 through the fourth Ethernet physical layer interface 04.

[0079] The volatile memory 20 is connected to the PS terminal in the processor 10.

[0080] One side of the isolation transformer 70 serves as the second communication interface of the flight management module, while the other side of the isolation transformer 70 is connected to the PL terminal in the processor 10 via the communication module 80.

[0081] The processor 10, volatile memory 20, network switching chip 30, network transformer 40, first PHY chip 50 and second PHY chip 60 all use domestically produced components; the isolation transformer 70 and communication module 80 are also domestically produced chips, in order to continuously improve the localization level of the flight management module.

[0082] One side of the isolation transformer 70 serves as the second communication interface of the flight management module, while the other side is connected to the PL terminal of the processor 10 via the communication module 80. This connection method enables the isolation transformer 70 to effectively isolate the electrical connections between the internal and external circuits of the flight management module, reducing the impact of external electromagnetic interference on the internal components of the flight management module (such as the processor 10 and volatile memory 20), while also reducing the interference of internal signals of the flight management module to the outside world, significantly improving the working stability of the flight management module in complex electromagnetic environments. The communication module 80, as a bridge between the isolation transformer 70 and the PL terminal of the processor, expands the communication methods and range of the flight management module, enabling it to more flexibly interact with external devices (such as ground control terminals and other airborne modules) through the second communication interface, thus enhancing the module's communication adaptability.

[0083] The communication module 80 conforms to the 1553B standard, ensuring a standardized data exchange link with external devices using the 1553B bus. This enables the flight management module to have 1553B bus control capabilities, enriching its functionality and control methods. Because the 1553B standard itself possesses standardized protocols and reliable transmission characteristics, coupled with the anti-interference capability of the isolation transformer 70, it avoids data exchange obstacles caused by format incompatibility during transmission and reduces data loss or errors due to electromagnetic interference. This allows the flight management module to receive more accurate external control commands through the second communication interface and provides more reliable flight status data feedback, further enhancing the practical value of the flight management module in scenarios with stringent requirements for communication stability and compatibility.

[0084] This application also provides another flight management module, which, based on any of the above embodiments, adds a first non-volatile memory 91, a second non-volatile memory 92, and a third non-volatile memory 93, such as... Figure 3 As shown. Specifically, Figure 3 The flight management module shown includes: a processor 10, volatile memory 20, a network switching chip 30, a network transformer 40, a first PHY chip 50, a second PHY chip 60, a first non-volatile memory 91, a second non-volatile memory 92, and a third non-volatile memory 93. The specific connections between the components are as follows:

[0085] The receiving end of the network transformer 40 serves as the first communication interface of the flight management module, and the transmitting end of the network transformer 40 is connected to the first PHY chip 50. The first PHY chip 50 is connected to the network switching chip 30 through the first Ethernet physical layer interface 01, and the network switching chip 30 is connected to the PL in the processor 10 through the second Ethernet physical layer interface 02.

[0086] The network switching chip 30 is also connected to the second PHY chip 60 through the third Ethernet physical layer interface 03, and the second PHY chip 60 is connected to the PS in the processor 10 through the fourth Ethernet physical layer interface 04.

[0087] The volatile memory 20 is connected to the PS terminal in the processor 10.

[0088] The first non-volatile memory 91 is connected to the PL terminal in the processor 10, and the second non-volatile memory 92 and the third non-volatile memory 93 are both connected to the PS terminal in the processor 10.

[0089] The processor 10, volatile memory 20, network switching chip 30, network transformer 40, first PHY chip 50 and second PHY chip 60 all use domestically produced components; the first non-volatile memory 91, second non-volatile memory 92 and third non-volatile memory 93 are also domestically produced chips, in order to continuously improve the localization level of the flight management module.

[0090] By adding these three non-volatile memories, the PL can efficiently complete the real-time data acquisition and logic control related data access through the first non-volatile memory 91 without occupying the storage resources of the PS, further reducing data transmission latency and highlighting its high real-time performance advantage. The second non-volatile memory 92 and the third non-volatile memory 93 on the PS can independently handle the storage needs related to operating system operation and task data processing, reducing mutual interference during data read and write processes and improving the efficiency of complex calculations and system management. At the same time, independent memory allocation ensures that the storage operations of the PL and PS do not affect each other. If one memory fails, the other memory can still work normally, greatly reducing the risk of the entire module being paralyzed due to storage problems. The additional storage space also provides ample expansion space for the module to add functions and process more data in the future.

[0091] Optionally, each non-volatile memory can be a NOR flash memory or a NAND flash memory. In practical applications, this is not limited to either type, and the choice is made according to the specific circumstances, all of which are within the scope of protection of this application. For example, the first non-volatile memory 91 is a NOR flash memory, the second non-volatile memory 92 is a NOR flash memory, and the third non-volatile memory 93 is a NAND flash memory.

[0092] Alternatively, see still Figure 3The flight management module provided in this application embodiment may further include: an isolation transformer 70 and a communication module 80; one side of the isolation transformer 70 serves as the second communication interface of the flight management module, and the other side of the isolation transformer 70 is connected to the PL terminal in the processor 10 through the communication module 80; the functions of the isolation transformer 70 and the communication module 80 are described above.

[0093] This application embodiment also provides a central processing device, the specific structure of which is as follows: Figure 4 As shown, it specifically includes: a power module 100 and a flight management module 200 as provided in any of the above embodiments.

[0094] The output terminal of the power module 100 is connected to the power terminal of the flight management module 200. The power module 100 is used to supply power to the flight management module 200. The power module 100 uses domestically produced components.

[0095] In this central processing device, since the flight management module 200 provided in any of the above embodiments is adopted, the central processing device can reduce the passive risk of key components being subject to human control, thereby ensuring the production cycle of a single machine to a certain extent, and also meeting the production requirements of independent control to a certain extent.

[0096] The power module 100 can adopt, for example Figure 5 The structure shown specifically includes: an anti-reverse protection circuit 201, a filter module 202, a first DC / DC converter circuit 203, and a second DC / DC converter circuit 204. The specific connection relationships between the components are as follows:

[0097] The input terminal of the anti-reverse protection circuit 201 serves as the input terminal of the power module 100. The output terminal of the anti-reverse protection circuit 201 is connected to the input terminal of the first DC / DC converter circuit 203 through the filter module 202. The output terminal of the first DC / DC converter circuit 203 is connected to the input terminal of the second DC / DC converter circuit 204. The output terminal of the second DC / DC converter circuit 204 serves as the output terminal of the power module 100.

[0098] The core function of the reverse protection circuit 201 is to prevent the external input current from flowing back into the internal circuit of the power module 100. When the external power supply is connected in the wrong direction, the reverse protection circuit 201 can quickly cut off the path to prevent the reverse current from damaging the subsequent filter module 202, the first DC / DC conversion circuit 203 and the second DC / DC conversion circuit 204. In addition, the reverse protection circuit 201 can also trigger the protection mechanism when the input voltage is over-voltage, over-current or other abnormal conditions, providing basic safety protection for the entire power module 100.

[0099] The filter module 202 is responsible for filtering the input voltage after it has passed through the anti-reverse circuit 201. The external input voltage often contains unstable components such as high-frequency noise and pulse interference. If these noises directly enter the subsequent circuits, they may cause voltage fluctuations and affect the conversion accuracy of the conversion circuit. The filter module 202 can effectively filter out these noises and output a stable DC voltage, providing a stable input basis for the subsequent DC / DC conversion.

[0100] Both the first DC / DC converter circuit 203 and the second DC / DC converter circuit 204 are used for voltage conversion. The first DC / DC converter circuit 203 converts 28V to 5V, and the second DC / DC converter circuit 204 converts 5V to 5V. The two DC / DC converter circuits are designed with redundancy to increase the stability and reliability of the power supply.

[0101] The above is only one implementation of the power module 100. In practical applications, it is not limited to this, for example, using only one DC / DC conversion circuit. There is no specific limitation here, and it can be determined according to the specific situation. All of these are within the protection scope of this application.

[0102] The power module 100 provided above may further include: a CANFD transceiver 205 and a CANFD controller 206, such as Figure 6 As shown. The specific connection relationships between the various devices are as follows:

[0103] The first end of the CANFD transceiver 205 serves as the first communication end of the power module 100. The second end of the CANFD transceiver 205 is connected to the PL end in the flight management module 200. The third end of the CANFD transceiver 205 is connected to one end of the CANFD controller 206. The other end of the CANFD controller 206 is connected to the PL end through the serial peripheral SPI interface 05.

[0104] In this embodiment, by adding a CANFD transceiver 205 and a CANFD controller 206, the central processing device is equipped with CANFD communication functionality, thereby improving the communication capability of the central processing device.

[0105] After the CANFD transceiver 205 connects to an external CANFD network, it can receive differential signals from the external network and convert them into digital signals recognizable by the PL terminal. Simultaneously, it can convert digital signals output from the PL terminal into differential signals and send them to the external CANFD network, achieving format adaptation between the external network and the internal PL terminal. After establishing a connection with the PL terminal via the SPI interface, the CANFD controller 206 parses and processes the signals received from the CANFD transceiver 205 and then transmits the valid information to the PL terminal. At the same time, it can receive data output from the PL terminal, encapsulate it according to the CANFD communication protocol, and then transmit it to the CANFD transceiver 205, ensuring the standardization of data transmission.

[0106] This embodiment adds a CANFD transceiver 205 and a CANFD controller 206, enabling the central processing device to have CANFD communication capabilities. The two work together to form a complete CANFD communication link, which not only realizes signal interaction between the external network and the internal module, but also ensures the stability and efficiency of communication, significantly improving the communication capabilities of the central processing device.

[0107] like Figure 7 As shown, any of the power modules 100 provided above may further include: a synchronous 422 interface circuit 207 and a 422 interface circuit 208. The connection relationships between the various components are as follows:

[0108] The outer side of the synchronous 422 interface circuit 207 serves as the second communication terminal of the power module 100. The inner side of the synchronous 422 interface circuit 207 is connected to the PL terminal in the flight management module 200 via a UART interface. The outer side of the 422 interface circuit 208 serves as the third communication terminal of the power module 100. The inner side of the 422 interface circuit 208 is connected to the PL terminal in the flight management module 200 via a UART interface.

[0109] In this embodiment, by adding a 422 interface circuit 208, the central processing device is equipped with 422 bus control functionality, thereby enriching the control methods of the central processing device. Furthermore, by adding a synchronous 422 interface circuit 207, the central processing device is equipped with synchronous signal receiving functionality, thereby enriching the communication methods of the central processing device.

[0110] Another embodiment of this application provides another implementation of the power module 100, the specific structure of which is as follows: Figure 8 As shown, this embodiment, based on the above embodiment, further includes: an input digital interface circuit 209 and an output digital interface circuit 210. The specific connection relationships between the components are as follows:

[0111] One end of the input digital input interface circuit 209 serves as the input digital input port of the power module 100, and the other end of the input digital input interface circuit 209 is connected to the PL terminal in the flight management module 200. In a specific example, the input digital input interface circuit 209 supports 14 digital inputs.

[0112] One end of the output digital interface circuit 210 serves as the output digital port of the power module 100, and the other end of the output digital interface circuit 210 is connected to the PL terminal in the flight management module 200. In a specific example, the output digital interface circuit 210 supports 8 digital outputs.

[0113] In this embodiment, by adding an input switch interface circuit 209 and an output switch interface circuit 210, the central processing device is equipped with switch input and switch output functions, thereby facilitating processing and analysis by the processor 10 in the flight management module 200.

[0114] Another embodiment of this application provides another implementation of the power module 100, the specific structure of which is as follows: Figure 9 As shown, this embodiment, based on the above embodiment, further includes a current and voltage acquisition circuit 211. The connection relationship between these devices is specifically described below:

[0115] The acquisition terminal of the current and voltage acquisition circuit 211 is connected to the output terminal of the second DC / DC converter circuit 204. The transmission terminal of the current and voltage acquisition circuit 211 is connected to the PL terminal in the flight management module 200.

[0116] In this embodiment, by adding a current and voltage acquisition circuit 211, the central processing device can protect itself from damage when the voltage at the output terminal of the second DC / DC conversion circuit 204 becomes abnormal.

[0117] Another embodiment of this application provides another implementation of the power module 100, which, based on the above-described implementation, further includes a thermal pad. The thermal pad uses domestically produced components and is disposed between the central processing unit and the heat sink.

[0118] The thickness of the thermal pad is typically selected based on the distance between the heat source and the heat sink. For a single heat-generating device, a thin thermal pad can be used to achieve lower thermal resistance and improve heat conduction. However, for the central processing unit of this application, which consists of multiple chips assembled together, a thick thermal pad can be used. This allows a single thermal pad to cover multiple heat-generating devices, enabling rapid heat dissipation even if the chips have different heights.

[0119] In a specific example, the thermal pad selected is WT5902-160-55, which has a thermal conductivity of 16. It is expected that this type of thermal pad can reduce the maximum temperature of the chip by about 5~6℃, thus helping to reduce thermal resistance and temperature rise of the control device, and helping to improve the reliability of the processor 10.

[0120] The above example only illustrates one way to select a thermal pad. In practical applications, there are other methods, including but not limited to this one. No specific limitations are made here, and the choice can be made depending on the specific circumstances. All of these are within the scope of protection of this application.

[0121] In practical applications, temperature derating can be considered when selecting thermal pads to improve the reliability of the processor 10, thereby avoiding the problem of high device failure rate caused by excessive temperature.

[0122] In this embodiment, since the thermal pad uses domestically produced components, the localization of the flight management module 200 is further improved, thereby further reducing the passive risk of being dependent on others for key components. This, in turn, ensures the production cycle of a single unit to a certain extent and meets the production requirements of independent control to a certain extent.

[0123] The features described above in the disclosed embodiments can be substituted or combined with each other, enabling those skilled in the art to implement or use this application. The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present utility model using the disclosed methods and techniques, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of the present utility model. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A flight management module, characterized in that, include: The components include a processor, volatile memory, a network switch chip, a network transformer, and two port physical layer PHY chips; among which: The receiving end of the network transformer serves as the first communication interface of the flight management module, and the transmitting end of the network transformer is connected to the first PHY chip. The first PHY chip is connected to the network switching chip through a first Ethernet physical layer interface, and the network switching chip is connected to the PL terminal in the processor through a second Ethernet physical layer interface; The network switching chip is also connected to the second PHY chip through a third Ethernet physical layer interface, and the second PHY chip is connected to the PS terminal in the processor through a fourth Ethernet physical layer interface. The volatile memory is connected to the PS terminal; The processor, the network switching chip, the volatile memory, and the two PHY chips all use domestically produced components.

2. The flight management module according to claim 1, characterized in that, Also includes: Isolation transformer and communication module; wherein: One side of the isolation transformer serves as the second communication interface of the flight management module; The other side of the isolation transformer is connected to the PL terminal via the communication module; The communication module conforms to the 1553B standard.

3. The flight management module according to claim 1 or 2, characterized in that, Also includes: Three non-volatile memory locations; among which: The first non-volatile memory is connected to the PL terminal, and the second and third non-volatile memory are both connected to the PS terminal.

4. A central processing device, characterized in that, include: The power supply module and the flight management module as described in any one of claims 1 to 3; wherein: The output terminal of the power module is connected to the power terminal of the flight management module.

5. The central processing apparatus according to claim 4, characterized in that, The power supply module includes: a reverse polarity protection circuit, a filter module, and two DC / DC conversion circuits; wherein: The input terminal of the anti-reverse and protection circuit serves as the input terminal of the power module. The output of the anti-reverse and protection circuit is connected to the input of the first DC / DC converter circuit through the filtering module. The output terminal of the first DC / DC converter circuit is connected to the input terminal of the second DC / DC converter circuit; The output terminal of the second DC / DC converter circuit serves as the output terminal of the power supply module.

6. The central processing apparatus according to claim 5, characterized in that, The power module further includes: a CANFD transceiver and a CANFD controller; wherein: The first end of the CANFD transceiver serves as the first communication end of the power module. The second terminal of the CANFD transceiver is connected to the PL terminal in the flight management module. The third terminal of the CANFD transceiver is connected to one terminal of the CANFD controller; The other end of the CANFD controller is connected to the PL terminal via a serial peripheral SPI interface.

7. The central processing apparatus according to claim 5, characterized in that, The power module further includes: a synchronous 422 interface circuit and a 422 interface circuit; wherein: The outer side of the synchronous 422 interface circuit serves as the second communication terminal of the power module; The inner side of the synchronous 422 interface circuit is connected to the PL terminal in the flight management module via a UART interface. The outer side of the 422 interface circuit serves as the third communication terminal of the power module. The inner side of the 422 interface circuit is connected to the PL terminal via a UART interface.

8. The central processing apparatus according to claim 5, characterized in that, The power module further includes: an input digital interface circuit and an output digital interface circuit; wherein: One end of the input switch interface circuit serves as the input switch port of the power module, and the other end of the input switch interface circuit is connected to the PL terminal in the flight management module. One end of the output switch interface circuit serves as the output switch port of the power module, and the other end of the output switch interface circuit is connected to the PL terminal.

9. The central processing apparatus according to claim 5, characterized in that, The power supply module further includes: a current and voltage acquisition circuit; wherein: The acquisition terminal of the current and voltage acquisition circuit is connected to the output terminal of the second DC / DC conversion circuit; The transmission terminal of the current and voltage acquisition circuit is connected to the PL terminal in the flight management module.

10. The central processing apparatus according to any one of claims 5 to 9, characterized in that, Also includes: Thermal pad; wherein: The thermal pad uses domestically produced components and is positioned between the central processing unit and the heat sink.

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