Real-time monitoring device for tightness

Abstract

The utility model provides a kind of real-time monitoring device of secret communication rate, include protective shell and built-in circuit board, integrated with acquisition analysis unit, alarm unit and positioning unit on circuit board, display screen is set outside protective shell, acquisition analysis unit automatically acquires and analyzes sample data and exports current secret communication rate, alarm unit exports alarm signal according to current secret communication rate, positioning unit automatically locates plaintext point according to alarm signal, display screen displays current secret communication rate and plaintext point information;Circuit board adopts at least four layers composite structure, top layer is arranged acquisition analysis unit, first intermediate layer is power plane, second intermediate layer is ground plane, bottom layer is arranged alarm unit and positioning unit, bottom layer heat conduction is to the heat dissipation fin of protective shell, and with top layer forms convection heat dissipation.The utility model solves the problem that the heat generated by each electrical component on the circuit board is difficult to dissipate in time under the condition of continuous high load monitoring of the existing monitoring device, affecting the service life of electrical components.

Description

Technical Field

[0001] This utility model relates to the field of network security monitoring technology, and in particular to a real-time monitoring device for network security transmission rate. Background Technology

[0002] In the context of smart grids and digital transformation, the security of power monitoring systems has become a core component of the protection of critical national information infrastructure. Within the power system, power data is divided into encrypted and plaintext data. Plaintext transmission poses significant security risks and may lead to data breaches, cyberattacks, and other security incidents. The encryption-to-communication ratio, the ratio of encrypted data to total data, is a crucial indicator for assessing power data security. Real-time monitoring of changes in the encryption-to-communication ratio can promptly detect abnormal plaintext transmissions during data transmission (such as equipment vulnerabilities or configuration errors).

[0003] Currently, monitoring of the encryption rate at substations mainly relies on traditional manual methods: maintenance personnel need to manually input packet capture commands, capture packets, and then manually analyze the captured power data to find and locate plaintext points. The entire monitoring process is cumbersome, time-consuming, and labor-intensive. Furthermore, this process requires proficiency in network protocol analysis and encryption algorithms, placing high technical demands on maintenance personnel. Therefore, this paper proposes to solve the aforementioned problems by setting up automated real-time monitoring devices to automatically monitor the current encryption rate and locate plaintext points.

[0004] Existing automated real-time monitoring devices input sample data from the scheduling data network into the acquisition and analysis unit. This unit analyzes the sample data and outputs the current density-to-throughput ratio. Simultaneously, a positioning unit locates plaintext points within the sample data, enabling real-time monitoring of the current density-to-throughput ratio and pinpointing plaintext points upon detection. This solves the inefficiency problem caused by manual operation. However, because the acquisition and analysis unit and positioning module, among other electrical components, are integrated onto a single-layer circuit board with limited heat dissipation space, the heat generated by these components under continuous high-load monitoring conditions is difficult to dissipate in time. This results in the components operating in a high-temperature environment, which accelerates component aging or failure, thus affecting their lifespan. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a real-time monitoring device for throughput, which solves the problem that in existing technologies, the heat generated by electrical components on the circuit board is difficult to dissipate in time under continuous high-load monitoring conditions, thus affecting the service life of the electrical components.

[0006] According to an embodiment of this utility model, a real-time density monitoring device includes a protective housing and a built-in circuit board. The circuit board integrates a data acquisition and analysis unit, an alarm unit, and a positioning unit. A display screen is installed outside the protective housing. The data acquisition and analysis unit is used to automatically acquire and analyze sample data from the scheduling data network and output the current density. The alarm unit outputs an alarm signal based on the current density. The positioning unit automatically locates plaintext points in the sample data based on the alarm signal. The display screen displays the current density and plaintext point positioning information. The circuit board adopts a composite structure of at least four layers. The data acquisition and analysis unit is arranged on the top layer, the first intermediate layer is a power plane, the second intermediate layer is a ground plane, and the alarm unit and the positioning unit are arranged on the bottom layer. The heat from the bottom layer is conducted to the heat dissipation fins of the protective housing and forms convection heat dissipation with the top layer to reduce the overall temperature rise.

[0007] Preferably, a storage unit is also arranged on the top layer of the circuit board. The input end of the storage unit is connected to the output end of the acquisition and analysis unit and the positioning unit, and is used to store the density rate data and the three-dimensional information of the plaintext positioning point.

[0008] Preferably, at least two metal support pillars are evenly arranged inside the protective housing, and the circuit board is detachably mounted on all of the support pillars.

[0009] Preferably, the circuit board is detachably mounted on all the support columns using fixing bolts.

[0010] Preferably, the protective housing is further provided with a positioning post, the positioning post having a groove, and the bottom layer of the circuit board having a protrusion, the protrusion corresponding to the groove one by one, and each protrusion is inserted into the corresponding groove to quickly position the circuit board on the support post.

[0011] Preferably, a protective cover is detachably provided on the protective housing to protect the circuit board inside the protective housing.

[0012] Preferably, the protective cover and the protective housing are connected by a snap-fit ​​connection to achieve detachment.

[0013] Preferably, the protective cover has a plurality of buckles evenly distributed, and the protective shell has a number of slots evenly distributed in the same manner as the buckles. The slots correspond one-to-one with the buckles, and each buckle is fastened into the corresponding slot, so that the protective cover is limited and fixed on the protective shell.

[0014] Preferably, each of the latches is provided with a driving member to apply the external force required to unlock each latch when it is unlocked.

[0015] Preferably, the protective housing has a positioning pin and the protective cover has a positioning groove. The positioning pin is inserted into the positioning groove to quickly position the protective cover on the protective housing.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] By deploying the acquisition and analysis unit and the positioning unit on the top and bottom layers of the circuit board respectively, the heat accumulation of the two main heat-generating components, the acquisition and analysis unit and the positioning unit, is effectively dispersed. By using a complete ground plane as a heat-conducting layer and placing the ground plane and the power plane adjacent to each other, the heat conduction capacity is increased while the heat dissipation area is expanded. By conducting the heat from the bottom layer to the heat dissipation fins of the protective shell and allowing the bottom layer and the top layer to form convection heat dissipation, the heat from the top layer can be conducted from the bottom layer to the heat dissipation fins of the protective shell, accelerating the heat dissipation speed and improving the heat dissipation effect. This solves the problem in the prior art where the heat generated by the electrical components on the circuit board is difficult to dissipate in time under continuous high load monitoring conditions, affecting the service life of the electrical components. It can conduct the heat on the circuit board to the heat dissipation fins in time and dissipate it, ensuring the stable operation of the electrical components on the circuit board under continuous high load monitoring conditions. Attached Figure Description

[0018] Figure 1 This is a control principle diagram of a real-time monitoring device for throughput according to an embodiment of the present invention.

[0019] Figure 2 This is a cross-sectional schematic diagram along the protective shell of a real-time monitoring device for throughput according to an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the overall structure of a real-time monitoring device for throughput according to another embodiment of the present invention.

[0021] Figure 4 This is a cross-sectional schematic diagram along the drive component of a real-time monitoring device for throughput according to another embodiment of the present invention.

[0022] Figure 5 A real-time monitoring device for density and permeability according to another embodiment of this utility model Figure 4 Enlarged view of point A.

[0023] Figure 6 This is a cross-sectional schematic diagram along the fixing bolt of a real-time monitoring device for throughput according to another embodiment of the present invention.

[0024] Figure 7 This is a cross-sectional schematic diagram along the buckle of a real-time monitoring device for throughput according to another embodiment of the present invention.

[0025] Figure 8 This is a cross-sectional schematic diagram along the positioning pin axis of a real-time monitoring device for throughput according to another embodiment of the present invention.

[0026] Figure 9 A real-time monitoring device for density and permeability according to another embodiment of this utility model Figure 8 Enlarged view of point B.

[0027] In the above figures: 1. Protective housing; 2. Circuit board; 3. Support column; 4. Fixing bolt; 5. Positioning column; 6. Protective cover; 7. Drive head; 8. Drive plate; 9. Return spring; 11. Slot; 12. Positioning pin; 21. Data acquisition and analysis unit; 22. Alarm unit; 23. Positioning unit; 24. Display screen; 25. Storage unit; 26. Protruding rod; 51. Groove; 61. Buckle; 62. Positioning slot. Detailed Implementation

[0028] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.

[0029] like Figure 1 and Figure 2As shown in the figure, this utility model embodiment proposes a real-time monitoring device for throughput rate, comprising a protective housing 1 and a built-in circuit board 2. The circuit board 2 integrates a data acquisition and analysis unit 21, an alarm unit 22, and a positioning unit 23. A display screen 24 is installed outside the protective housing 1. The data acquisition and analysis unit 21 is used to automatically acquire and analyze sample data from the dispatch data network and output the current throughput rate. The alarm unit 22 outputs an alarm signal based on the current throughput rate. The positioning unit 23 automatically locates plaintext points in the sample data based on the alarm signal. The display screen 24 displays the current throughput rate and plaintext point positioning information. Specifically, the data acquisition and analysis unit 21 is connected to the substation-side dispatch data network router via a network cable, automatically acquires sample data from the substation-side dispatch data network, analyzes the acquired sample data, and outputs the current throughput rate. The alarm unit 21... The device includes a buzzer and indicator light. When the current density-to-pass ratio does not meet the set requirements, it can output an audible and visual alarm signal based on the current density-to-pass ratio output by the acquisition and analysis unit 21. The positioning unit 23 integrates a WGS84 coordinate system conversion module. At the same time as the alarm unit 22 issues the audible and visual alarm signal, the alarm unit 22 outputs an activation signal to the positioning unit, allowing the positioning unit 23 to locate the plaintext points in the sample data and output the three-dimensional coordinates of the plaintext points. By activating the positioning unit 23 through the alarm unit 22 when the current density-to-pass ratio does not meet the set requirements, the positioning unit 23 will not be activated when the current density-to-pass ratio meets the set requirements. Compared with traditional monitoring devices that require the positioning unit to locate plaintext point information at all times, this reduces the usage frequency of the positioning unit 23 and improves its service life.

[0030] The circuit board 2 adopts a composite structure of at least four layers. The acquisition and analysis unit 21 is arranged on the top layer, the first intermediate layer is the power plane, the second intermediate layer is the ground plane, and the alarm unit 22 and the positioning unit 23 are arranged on the bottom layer. The heat of the bottom layer is conducted to the heat dissipation fins of the protective shell 1 and forms convection heat dissipation with the top layer to reduce the overall temperature rise. Specifically, since the acquisition and analysis unit 21 needs to automatically acquire and analyze sample data from the scheduling data network, and the positioning unit 23 needs to automatically locate plaintext points in the sample data, the acquisition and analysis unit 21 and the positioning unit 23 are the main heat-generating components on the circuit board 2. By deploying the acquisition and analysis unit 21 and the positioning unit 23 on the top and bottom layers of the circuit board 2 respectively, the heat accumulation of these two main heat-generating components is effectively dispersed. By using a complete ground plane as a heat-conducting layer and placing the ground plane and the power plane adjacent to each other, the heat conduction capacity is increased while the heat dissipation area is expanded. Compared with the traditional single-layer circuit board 2, the heat dissipation effect is better.

[0031] The bottom and top layers of the circuit board 2 can form a convection cooling system, and the heat from the bottom layer can be directly conducted to the heat dissipation fins of the protective shell 1, allowing the heat from the top layer to be conducted from the bottom layer to the heat dissipation fins of the protective shell 1, thus accelerating the heat dissipation speed. To balance thermal conductivity and cost-effectiveness, the heat dissipation fins used in the protective shell 1 are mainly made of aluminum alloy. The height of the heat dissipation fins is ≥3mm to ensure sufficient heat dissipation surface area, and the spacing between the heat dissipation fins is ≥4mm to ensure smooth natural convection. The heat dissipation fins adopt a parallel sheet-like dense arrangement structure to maximize the contact area with air and improve the heat dissipation effect.

[0032] Furthermore, a storage unit 25 is arranged on the top layer of the circuit board 2. The input end of the storage unit 25 is connected to the output end of the acquisition and analysis unit 21 and the positioning unit 23, and is used to store the encryption success rate data and the three-dimensional information of the plaintext positioning point. Specifically, the storage unit 25 adopts a non-volatile memory to ensure that the data is not lost after power failure. The input end of the storage unit 25 is equipped with a dual-channel buffer to receive the encryption success rate data (such as encrypted communication success rate, bit error rate and other parameters) from the acquisition and analysis unit 21 and the three-dimensional coordinate information (such as longitude, latitude, elevation and timestamp) from the positioning unit 23. At the same time, the storage unit 25 is divided into two independent storage areas: an encryption success rate data area and a positioning information area, which store the encryption success rate data and the plaintext positioning information respectively. A circular storage mechanism is adopted, which automatically overwrites the oldest data when the storage space is full, and a write protection latch is set to prevent accidental tampering with historical data.

[0033] The detailed working process of this embodiment is as follows:

[0034] The acquisition and analysis unit 21 automatically collects sample data from the substation-side dispatch data network, analyzes the collected sample data, and outputs the current security pass rate to the alarm unit 22. The alarm unit 22 then outputs an alarm signal to the positioning unit 23 based on the current security pass rate. This allows the positioning unit 23 to automatically locate plaintext points in the sample data based on the alarm signal. Subsequently, the acquisition and analysis unit 21 and the positioning unit 23 transmit the current security pass rate and the three-dimensional positioning information of the plaintext points to the display screen 24. The display screen 24 then displays the current security pass rate and the three-dimensional positioning information of the plaintext points, allowing users to view the power safety status in real time. During the real-time monitoring of the security pass rate, by deploying the acquisition and analysis unit 21 and the positioning unit 23 on the top and bottom layers of the circuit board 2 respectively, the security pass rate is effectively dispersed. The heat accumulation of the two main heat-generating components, the acquisition and analysis unit 21 and the positioning unit 23, is mitigated by using a complete ground plane as a heat-conducting layer and placing the ground plane adjacent to the power plane. This increases heat conduction capacity and expands the heat dissipation area. By conducting heat from the bottom layer to the heat dissipation fins of the protective housing 1 and allowing convection heat dissipation between the bottom and top layers, the heat from the top layer can be conducted from the bottom layer to the heat dissipation fins of the protective housing 1, accelerating the heat dissipation speed and improving the heat dissipation effect. This solves the problem in the prior art where the heat generated by the electrical components on the circuit board 2 is difficult to dissipate in time under continuous high-load monitoring conditions, affecting the service life of the electrical components. It can conduct the heat on the circuit board 2 to the heat dissipation fins in time and dissipate it, ensuring the stable operation of the electrical components on the circuit board 2 under continuous high-load monitoring conditions.

[0035] like Figures 3-9As shown, another embodiment of this utility model proposes a real-time monitoring device for throughput, comprising a protective housing 1 and a built-in circuit board 2. At least two metal support pillars 3 are evenly arranged inside the protective housing 1. The circuit board 2 is detachably mounted on all the metal support pillars 3 via fixing bolts 4. The protective housing 1 also includes positioning pillars 5 with grooves 51. The circuit board 2 has protrusions 26, each corresponding to a groove 51. Inserting each protrusion 26 into its corresponding groove 51 quickly positions the circuit board 2 on the support pillars 3. Specifically, the circuit board 2 is, but is not limited to, detachably mounted on all the support pillars 3 via fixing bolts 4, making the circuit board 2 removable. To facilitate maintenance of electrical components on the circuit board 2 in case of malfunction, the circuit board 2 is mounted inside the protective housing 1 via the metal support pillars 3. This allows heat from the circuit board 2 to be directly transferred from the metal support pillars 3 to the heat dissipation fins of the protective housing 1, improving heat dissipation. The circuit board 2 is provided with at least two protruding rods 26, and the protective housing 1 is provided with the same number of positioning pillars 5 as the protruding rods 26. Each positioning pillar 5 has a groove 51, which mates with the protruding rod 26. The positions of the grooves 51 and the protruding rods 26 correspond one-to-one, allowing the protruding rods 26 to be inserted into the corresponding grooves 51. This enables rapid positioning of the circuit board 2 on the support pillars 3 for quick installation of the circuit board 2.

[0036] Furthermore, a protective cover 6 is detachably provided on the protective housing 1 to protect the circuit board 2 inside the protective housing 1. The protective cover 6 and the protective housing 1 are connected by a snap-fit ​​connection. The protective cover 6 has a plurality of buckles 61 evenly distributed, and the protective housing 1 has a number of slots 11 evenly distributed in the same quantity as the buckles 61. The slots 11 correspond one-to-one with the buckles 61. Each buckle 61 is snapped into its corresponding slot 11, so that the protective cover 6 is limited and fixed on the protective housing 1. Each buckle 61 is provided with a driving component to apply the external force required to unlock each buckle 61 when unlocking it. The protective housing 1 has a positioning pin 12. The cover 6 has a positioning groove 62. The positioning pin 12 is inserted into the positioning groove 62 to quickly position the protective cover 6 on the protective housing 1. Specifically, the protective cover 6 can be disassembled and installed on the protective housing 1 by means of a snap-fit ​​connection. When the protective cover 6 is disassembled and installed on the protective housing 1 by means of a snap-fit ​​connection, the buckle 61 can be snapped into the corresponding buckle groove 11, so that the protective cover 6 is limited and fixed on the protective housing 1, thereby realizing the installation of the protective cover 6 to shield and protect the circuit board 2 inside the protective housing 1. In order to improve the connection strength between the protective cover 6 and the protective housing 1, the buckle 61 is preferably a beveled buckle 61.

[0037] The driving component includes a driving head 7, a driving plate 8, and a return spring 9. The number of driving heads 7 is the same as the number of latches 61. There are two driving plates 8, each with half the number of driving heads 7. Moving the driving plate 8 towards the latches 61 causes the driving heads 7 distributed on the driving component to move towards the latches 61, and the return spring 9 is compressed. Through the movement of the driving heads 7 towards the latches 61, the driving heads 7 can remove the latches 61 from the slots 11, thereby releasing the limiting and fixing state of the protective cover 6 on the protective housing 1, so as to facilitate the disassembly of the protective cover 6. After the protective cover 6 is disassembled, the driving plate 8 is released, so that the compressive force on the return spring 9 disappears. At this time, the return spring 9 will drive the driving plate 8 to move towards its original position, thereby driving the driving heads 7 distributed on the driving plate 8 to move towards their original positions until they return to their original positions.

[0038] The protective housing 1 has a plurality of positioning pins 12 evenly distributed, and the protective cover 6 has a number of positioning grooves 62 evenly distributed in the same manner as the positioning pins 12. The positions of the positioning grooves 62 correspond one-to-one with the positions of the positioning pins 12, so that the positioning pins 12 can be inserted into the corresponding positioning grooves 62. This allows for quick positioning of the protective cover 6 on the protective housing 1, facilitating the rapid installation of the protective cover 6.

[0039] The detailed working process of this embodiment is as follows:

[0040] When the upper space of the protective housing 1 is exposed, the protrusions 26 of the circuit board 2 are aligned with the grooves 51 of the positioning posts 5, and the protrusions 26 are inserted into the corresponding grooves 51 to quickly position the circuit board 2 on the support posts 3. Then, the circuit board 2 is installed on all the support posts 3 by the fixing bolts 4. After installation, the positioning pins 12 of the protective housing 1 are aligned with the positioning grooves 62 of the protective cover 6, and the positioning pins 12 are inserted into the corresponding positioning grooves 62 to quickly position the protective cover 6 on the protective housing 1. At this time, the buckles 61 can be fastened into the corresponding slots 11, so that the protective cover 6 is limited and fixed on the protective housing 1, thus installing the protective cover 6 to shield and protect the circuit board 2 inside the protective housing 1, facilitating real-time monitoring of the airtightness.

[0041] When an electrical component on the circuit board 2 malfunctions, the drive plate 8 moves toward the latch 61, causing the drive heads 7 distributed on the drive unit to move toward the latch 61. The reset spring 9 is compressed. The movement of the drive heads 7 toward the latch 61 allows the latch 61 to be removed from the slot 11, thus releasing the limiting fixation of the protective cover 6 on the protective housing 1, facilitating its disassembly. The protective cover 6 is then moved away from the protective housing 1, allowing it to be removed from the protective housing 1. After the protective cover 6 is removed, the internal space of the protective housing 1 is exposed. The fixing bolts 4 are then removed one by one from the circuit board 2 and the support column 3, releasing the limiting fixation of the circuit board 2 on the support column 3. The circuit board 2 is then removed from the protective housing 1 for maintenance of the electrical components on the circuit board 2.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A real-time monitoring device for throughput rate, comprising a protective housing and a built-in circuit board, wherein the circuit board integrates a data acquisition and analysis unit, an alarm unit, and a positioning unit, and a display screen is disposed outside the protective housing; the data acquisition and analysis unit is used to automatically acquire and analyze sample data of the scheduling data network and output the current throughput rate; the alarm unit outputs an alarm signal according to the current throughput rate; the positioning unit automatically locates plaintext points in the sample data according to the alarm signal; and the display screen displays the current throughput rate and plaintext point positioning information. Its features are: The circuit board adopts a composite structure of at least four layers. The acquisition and analysis unit is arranged on the top layer, the first intermediate layer is the power plane, the second intermediate layer is the ground plane, and the alarm unit and the positioning unit are arranged on the bottom layer. The heat of the bottom layer is conducted to the heat dissipation fins of the protective shell and forms convection heat dissipation with the top layer to reduce the overall temperature rise.

2. The real-time monitoring device for density and throughput as described in claim 1, characterized in that: The top layer of the circuit board is also equipped with a storage unit. The input end of the storage unit is connected to the output end of the acquisition and analysis unit and the positioning unit, and is used to store the density rate data and the three-dimensional information of the plaintext positioning point.

3. The real-time monitoring device for density and throughput as described in claim 1, characterized in that: At least two metal support pillars are evenly arranged inside the protective housing, and the circuit board is detachably mounted on all of the support pillars.

4. The real-time monitoring device for throughput as described in claim 3, characterized in that: The circuit board is detached and mounted on all the support columns using fixing bolts.

5. The real-time monitoring device for density and throughput as described in claim 3, characterized in that: The protective housing is also provided with a positioning post, which has a groove. The bottom layer of the circuit board has a protrusion, which corresponds one-to-one with the groove. Each protrusion is inserted into the corresponding groove to quickly position the circuit board on the support post.

6. The real-time monitoring device for density and throughput as described in claim 1, characterized in that: A protective cover is detachably installed on the protective housing to protect the circuit board inside the protective housing.

7. The real-time monitoring device for density and throughput as described in claim 6, characterized in that: The protective cover and the protective shell are connected by a snap-fit ​​connection to achieve detachment.

8. The real-time monitoring device for density and throughput as described in claim 7, characterized in that: The protective cover has a number of buckles evenly distributed, and the protective shell has a number of slots evenly distributed, the same number as the buckles. Each slot corresponds to a buckle, and each buckle is fastened into its corresponding slot, so that the protective cover is fixed to the protective shell.

9. The real-time monitoring device for throughput as described in claim 8, characterized in that: Each of the latches is provided with a drive element to apply the external force required to unlock each latch when it is unlocked.

10. The real-time monitoring device for density and throughput as described in claim 6, characterized in that: The protective housing has a positioning pin, and the protective cover has a positioning groove. The positioning pin is inserted into the positioning groove to quickly position the protective cover on the protective housing.

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