sound production unit

Abstract

The utility model discloses a sound unit, including voice coil, soldering tray, solder point protection gum and basin frame, the voice coil includes the body and the lead wire of being connected, the soldering tray is used for welding and is conducted the lead wire, the solder point protection gum is located on the soldering tray and covers the partial area of lead wire, the basin frame includes the frame body, the inner wall of frame body has the extension of inwards extension, the soldering tray is located on the extension, is equipped with the retaining wall on the extension, the retaining wall is used for blocking the solder point protection gum that is blown by the air cock, and the soldering tray is located between the retaining wall and the frame body. This sound unit is convenient for production and has high production yield.

Description

Technical Field

[0001] This utility model relates to the field of electroacoustic converter technology, and in particular to a sound generating unit. Background Technology

[0002] Current VR devices require a sound unit thickness of ≤2mm and a diaphragm vibration stroke of ≥0.8mm. However, the cured height of conventional solder joint protective adhesive reaches 0.3-0.5mm, resulting in a gap of only 0.1-0.2mm between the diaphragm assembly and the adhesive, leading to a defect rate of 25%-35%. As the industry iterates towards 1.5mm thick sound units, the gap between the diaphragm assembly and the adhesive will approach zero. Due to the small internal space of the sound unit, existing adhesive scraping methods are time-consuming, inefficient, and prone to secondary damage, making mass production impossible. Based on this, our company developed a blown adhesive solution, which involves blowing thin, uncured protective adhesive using an air nozzle. However, this method easily blows the adhesive outside the designated area, causing production inconsistencies and leaving room for improvement in yield.

[0003] The above background information is provided only to aid in understanding the inventive concept and technical solution of this invention. It does not necessarily belong to the prior art of this patent application. In the absence of clear evidence that the above information was disclosed on the filing date of this patent application, the above background information should not be used to evaluate the novelty and inventiveness of this application. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a sound generating unit that is easy to produce and has a high production yield.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a sound-generating unit, comprising:

[0006] A voice coil, the voice coil comprising a connected body and leads;

[0007] solder pads, which are used to solder the leads to conduction;

[0008] Solder joint protective adhesive, wherein the solder joint protective adhesive is applied to the solder pad and covers a portion of the lead wire;

[0009] A basin stand, the basin stand including a frame, the inner wall of the frame having an inwardly extending extension, the solder pad being disposed on the extension, the extension having a baffle wall for blocking the solder joint protective adhesive blown by an air nozzle, the solder pad being located between the baffle wall and the frame.

[0010] In one embodiment, the barrier is disposed along the inner edge of the pad.

[0011] In one embodiment, both ends of the retaining wall extend toward the frame to form bends.

[0012] In one embodiment, the extension is provided with a glue-receiving groove, which is located close to the solder pad.

[0013] In one embodiment, there is a gap between the retaining wall and the adhesive trough, and the bent portion at one end of the retaining wall extends into the gap.

[0014] In one embodiment, the top surface of the extension corresponding to the gap is a slope, and the side of the slope near the adhesive groove is lower than the side of the slope near the solder pad.

[0015] In one embodiment, one wall of the adhesive reservoir is flush with the wall of the solder pad.

[0016] In one embodiment, the pad is embedded in the extension.

[0017] In one embodiment, the retaining wall, the extension, and the frame are integrally injection molded structures.

[0018] In one embodiment, the basin frame is further provided with a flexible conductive terminal, which makes contact with the pad and conducts electricity.

[0019] The beneficial effects of this utility model are as follows:

[0020] This sound unit uses a baffle on the frame extension to physically limit the flow boundary of the solder joint protective adhesive. During the blowing process, the uncured solder joint protective adhesive is mechanically limited by the baffle when it is blown thin by the air nozzle. The adhesive is constrained in the solder pad area between the baffle and the frame, which not only prevents the adhesive from overflowing into the magnetic circuit functional area, but also eliminates the need for an additional adhesive scraping process. A thin and uniform adhesive layer can be stably obtained in a small space. This allows the ultra-thin sound unit to retain a large amplitude stroke while eliminating the risk of collision between the diaphragm assembly and the solder joint protective adhesive, significantly improving production consistency and yield.

[0021] Furthermore, during the manufacturing process of this sound-generating unit, glue can be blown immediately after dispensing, which improves the production efficiency of the sound-generating unit. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structure of the sound-generating unit in Embodiment 1. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the overall structure of the sound-generating unit in Embodiment 1. Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the internal structure of the sound-generating unit in Embodiment 1;

[0026] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0027] Explanation of icon numbers:

[0028] 1. Sink stand; 11. Frame; 12. Extension; 13. Retaining wall; 131. Bending section; 14. Adhesive tray; 15. Gap;

[0029] 2. Voice coil; 21. Body; 22. Lead wire;

[0030] 3. Solder pads;

[0031] 4. Diaphragm assembly;

[0032] 5. Magnetic circuit assembly;

[0033] 6. Flexible conductive terminals. Detailed Implementation

[0034] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0038] Furthermore, if the word "and / or" appears throughout the text, it means that it includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] Example 1

[0041] Please refer to Figures 1 to 4 One embodiment of this utility model is as follows: a sound-generating unit, including a voice coil 2, solder joint protective adhesive (not shown in the figure), solder pads 3, a frame 1, and a diaphragm assembly 4 and a magnetic circuit assembly 5 respectively disposed on the frame 1. The magnetic circuit assembly 5 has a magnetic gap for the voice coil 2 to move. The voice coil 2 includes a connected body 21 and a lead wire 22, and the body 21 is connected to the diaphragm assembly 4. The frame 1 includes a frame 11, and the inner wall of the frame 11 has an inwardly extending extension 12. The solder pads 3 are disposed on the extension 12. The solder pad 3 is used to solder the conductive lead 22. The solder joint protective adhesive is applied to the solder pad 3 and covers a portion of the lead 22. During the production of the sound unit, after the lead 22 is soldered onto the solder pad 3, the solder joint protective adhesive covering the lead 22 is dripped onto the solder pad 3. Then, the solder joint protective adhesive that has not yet solidified is blown away using an air nozzle. The extension 12 is provided with a baffle 13. The solder pad 3 is located between the baffle 13 and the frame 11. The baffle 13 is used to block the solder joint protective adhesive blown away by the air nozzle.

[0042] To make full use of the internal space within the sound-generating unit, in one or more embodiments, the baffle 13 is arranged along the inner edge of the solder pad 3, so that the adhesive is directly blocked by the baffle 13 during the blowing process and immediately stops flowing, further reducing the risk of adhesive overflowing into the magnetic circuit assembly 5.

[0043] Preferably, both ends of the retaining wall 13 extend toward the frame 11 to form a bent portion 131. The retaining wall 13 forms a semi-enclosed structure, which has a good blocking effect on the adhesive and better consistency of the adhesive blowing.

[0044] Optionally, the extension 12 is provided with an adhesive reservoir 14, which is located close to the solder pad 3. The extension 12 is provided with an adhesive reservoir 14, and excess adhesive blocked by the baffle 13 can flow into the adhesive reservoir 14 for temporary storage, thereby making the adhesive layer thin and uniform.

[0045] In this embodiment, a gap 15 exists between the baffle 13 and the adhesive reservoir 14, and the bent portion 131 at one end of the baffle 13 extends into the gap 15. The gap 15 between the baffle 13 and the adhesive reservoir 14, with the bent portion 131 extending into this gap 15, forms a "guide-buffer" channel. The adhesive is first guided by the bent portion 131 into the gap 15 and then falls into the adhesive reservoir 14, controlling the flow path and reducing splashing. In one or more embodiments, the top surface of the extension 12 corresponding to the gap 15 is an inclined surface. The side of the inclined surface near the adhesive reservoir 14 is lower than the side of the inclined surface near the solder pad 3. The top surface of the gap 15 is an inclined surface with an inner higher surface and an outer lower surface, allowing the adhesive to slide more smoothly into the adhesive reservoir 14 under gravity.

[0046] In other embodiments, one wall of the adhesive reservoir 14 is flush with the wall of the solder pad 3, so that the adhesive can be seamlessly transferred from the edge of the solder pad 3 into the adhesive reservoir 14, with a smooth transition.

[0047] In some embodiments, the solder pad 3 is embedded on the extension 12, and the top surface of the solder pad 3 is substantially coplanar with the top surface of the extension 12, so that the barrier 13 can directly form a vertical block on the adhesive.

[0048] As a preferred embodiment, the retaining wall 13, the extension 12 and the frame 11 are integrally injection molded structures, eliminating the need for subsequent assembly processes. The retaining wall 13 has high dimensional accuracy and a fixed position, and can maintain a stable adhesive-blocking effect even during long-term production.

[0049] Optionally, the basin frame 1 is further provided with an elastic conductive terminal 6, which makes contact with the solder pad 3 for electrical connection. This eliminates the need for additional soldering or wiring during assembly of the sound-generating unit, thus improving the overall assembly efficiency. In some embodiments, the solder pad 3 and the elastic conductive terminal 6 are integrally formed metal structural components.

[0050] In the actual production process of the sound unit, a pulsed precision blowing process is used to blow the liquid solder joint protective adhesive. By adjusting parameters such as airflow pressure, duration and distance, a controllable airflow field is formed, which stably reduces the height of the solder joint protective adhesive layer to below 0.15mm, effectively avoiding abnormal noise caused by collision between the adhesive layer and the diaphragm component when the four-fold ring vibrates.

[0051] Moreover, in terms of production equipment, an air nozzle bracket can be added to the Z-axis module of the existing dispensing machine, and then an air nozzle for blowing glue can be installed on the air nozzle bracket. There is no need to modify the main structure of the production line, and the modification cost is low.

[0052] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the contents of this utility model specification and drawings under the utility model concept, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A sound-generating unit, characterized in that: include A voice coil, the voice coil comprising a connected body and leads; solder pads, which are used to solder the leads to conduction; Solder joint protective adhesive, wherein the solder joint protective adhesive is applied to the solder pad and covers a portion of the lead wire; A basin stand, the basin stand including a frame, the inner wall of the frame having an inwardly extending extension, the solder pad being disposed on the extension, the extension having a baffle wall for blocking the solder joint protective adhesive blown by an air nozzle, the solder pad being located between the baffle wall and the frame.

2. The sound-generating unit according to claim 1, characterized in that: The retaining wall is provided along the inner edge of the pad.

3. The sound-generating unit according to claim 1, characterized in that: Both ends of the retaining wall extend toward the frame to form bends.

4. The sound-generating unit according to claim 3, characterized in that: The extension is provided with a glue-containing groove, which is located close to the solder pad.

5. The sound-generating unit according to claim 4, characterized in that: There is a gap between the retaining wall and the adhesive trough, and the bent portion at one end of the retaining wall extends into the gap.

6. The sound-generating unit according to claim 5, characterized in that: The top surface of the extension corresponding to the gap is inclined, and the side of the inclined surface near the adhesive groove is lower than the side of the inclined surface near the solder pad.

7. The sound-generating unit according to claim 4, characterized in that: One wall of the adhesive reservoir is flush with the wall of the solder pad.

8. The sound-generating unit according to claim 1, characterized in that: The pads are embedded in the extension.

9. The sound-generating unit according to claim 1, characterized in that: The retaining wall, the extension, and the frame are integrally injection molded into a single structure.

10. The sound-generating unit according to claim 1, characterized in that: The basin frame is also provided with elastic conductive terminals, which are in contact with the pads for conduction.

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