A high and low pitch TWS micro speaker

Abstract

The utility model discloses a kind of bass and treble TWS micro loudspeaker, belong to electroacoustic technical field, the loudspeaker includes u cup, partition assembly, bass support, magnet, voice coil, bass diaphragm, treble support and treble diaphragm, the loudspeaker further includes sound insulation mechanism, the sound insulation mechanism is set in the partition assembly inside, and located between the bass diaphragm and the treble diaphragm, the sound insulation mechanism includes sound insulation board, flow guide hole is opened on the sound insulation board, the sound insulation mechanism further includes the elastic pad of being set around the sound insulation board outer edge. The utility model aims at solving the acoustic crosstalk and cavity standing wave problem caused by too close distance when bass and treble sound production structure integration. By setting sound insulation mechanism, utilize sound insulation board to physically separate bass and treble cavity, utilize flow guide hole to balance air pressure and buffer sound energy to reduce standing wave, utilize elastic pad to realize elastic support, reached the double effect of vibration reduction and sound insulation, effectively prevent sound turbidity distortion, improve sound quality.

Description

Technical Field

[0001] This utility model relates to the field of electroacoustic technology, and in particular to a high-low frequency TWS miniature speaker. Background Technology

[0002] With the rapid development of TWS (True Wireless Stereo) earphones, consumers have increasingly higher demands for the sound quality of portable audio devices. Users not only want to obtain rich bass, but also pursue clear and bright treble.

[0003] To achieve wide-band acoustic coverage that balances high and low frequencies within the extremely limited micro-space of TWS earbuds, industry solutions have gradually evolved from traditional single dynamic driver (full-range) to integrated dual-sound structures for both high and low frequencies (such as coaxial structures). This design inevitably requires encapsulating the high-frequency and low-frequency sound-generating structures within the same micro-cavity.

[0004] However, because TWS speakers are compressed to an extreme size, the tweeter and woofer structures are packaged in the same housing, placing them extremely close together. This causes low-frequency sound waves generated by the woofer diaphragm to directly interfere with the tweeter cavity, while high-frequency sound waves also crosstalk back to the woofer cavity. This crosstalk between high and low frequency sound waves, along with the standing wave effect that easily forms inside the miniature cavity, leads to distortion in the overall frequency response curve of the speaker, resulting in a muddy sound, reduced resolution, and severely impacting the audio experience.

[0005] Therefore, this invention proposes a high-low frequency TWS miniature speaker to address the shortcomings of existing technologies. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a high-low frequency TWS miniature speaker, which aims to improve the technical problems existing in the prior art. When integrating high and low frequency sound-generating structures, existing high-low frequency TWS miniature speakers are too close to each other because they are packaged in the same shell, which easily generates acoustic crosstalk and cavity standing waves, resulting in muddy and distorted sound, and the vibration transmission between structures is difficult to suppress effectively.

[0007] To achieve the above objectives, this utility model adopts the following technical solution: a high-low frequency TWS miniature speaker, comprising: a U-cup; a zone assembly; a bass bracket fixed to the zone assembly, the bass bracket and the U-cup jointly defining a bass cavity; a magnet fixed to the bass bracket; a voice coil disposed in the magnetic gap of the magnet; a bass diaphragm connected to the voice coil; a tweeter bracket fixed to the zone assembly; a tweeter diaphragm fixed by the tweeter bracket; and a sound insulation mechanism, the sound insulation mechanism being disposed inside the zone assembly and located between the bass diaphragm and the tweeter diaphragm, the sound insulation mechanism including a sound insulation plate, the sound insulation plate having a guide hole, the sound insulation mechanism further including an elastic pad disposed around the outer edge of the sound insulation plate, the sound insulation mechanism further including a buckle and a locking plate, the buckle and the locking plate cooperating with each other to fix the sound insulation plate and the elastic pad to the zone assembly.

[0008] Preferably, the elastic pad has a ring structure and is elastically supported on the inner wall of the partition component by friction.

[0009] Preferably, it also includes solder joints for electrically connecting the voice coil.

[0010] Preferably, it also includes a cover, which is installed on the end face of the tweeter bracket.

[0011] Preferably, the high and low frequency TWS miniature speaker further includes a tuning mesh, which covers the sound output side of the partition component.

[0012] Preferably, the buckle is detachably engaged with the card plate.

[0013] Preferably, the bass support is integrally formed into the partition assembly.

[0014] Preferably, the tweeter bracket is integrally formed into the partition component.

[0015] This utility model has the following beneficial effects:

[0016] 1. This utility model solves the problem of sound wave crosstalk caused by the close proximity of high and low frequency integrated loudspeakers in the prior art by setting up a sound insulation mechanism and using the sound insulation plate in the sound insulation mechanism to physically separate the high frequency cavity and the low frequency cavity. It achieves the effect of effectively isolating high and low frequency sound waves and preventing sound muddiness and distortion.

[0017] 2. This utility model solves the problem of standing wave effect and air pressure imbalance caused by sound wave reflection inside the high and low frequency cavities by opening a guide hole in the sound insulation board, thereby achieving the effect of balancing the air pressure of the cavity and buffering sound energy, thus optimizing the listening performance. Attached Figure Description

[0018] Figure 1 This is a perspective view of a high-low frequency TWS miniature speaker proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of a bass support for a high-low frequency TWS miniature speaker proposed in this utility model;

[0020] Figure 3 This is a schematic diagram of the tweeter diaphragm of a high-low frequency TWS miniature speaker proposed in this utility model;

[0021] Figure 4 This is a schematic diagram of a sound insulation panel for a high-low frequency TWS miniature speaker proposed in this utility model;

[0022] Figure 5 This is a schematic diagram of the U-cup of a high-low frequency TWS miniature speaker proposed in this utility model.

[0023] Legend:

[0024] 1. U-cup; 2. Tweeter bracket; 3. Zone control assembly; 301. Woofer bracket; 302. Voice coil; 303. Woofer diaphragm; 304. Solder joint; 305. Magnet; 306. Tweeter diaphragm; 307. Cover; 4. Sound insulation mechanism; 401. Sound insulation board; 402. Air guide hole; 403. Elastic pad; 404. Clip; 405. Clamping plate; 5. Tuning mesh. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Reference Figures 1-5This utility model provides an embodiment of a high-low frequency TWS miniature speaker, including a U-cup 1 and a partitioning component 3 installed within the U-cup 1. The U-cup 1 serves as a mounting base, and the partitioning component 3 supports the high-frequency and low-frequency sound-emitting structures. The partitioning component 3 includes a bass support 301, which is fixed to the partitioning component 3. The bass support 301 and the U-cup 1 together define a bass cavity. The partitioning component 3 also includes a tweeter support 2, which is fixed to the partitioning component 3. A magnet 305 is fixed to the bass support 301, and a voice coil 302 is disposed in the magnetic gap of the magnet 305. A bass diaphragm 303 is connected to the voice coil 302, and a solder joint 304 is used for electrical connection to the voice coil 302. A tweeter diaphragm 306 is fixed by the tweeter support 2, and a cover 307 is installed on the end face of the tweeter support 2. The speaker also includes a sound insulation mechanism 4, which is located inside the partition assembly 3 and between the bass diaphragm 303 and the tweeter diaphragm 306. The sound insulation mechanism 4 includes a sound insulation plate 401 with a guide hole 402. The sound insulation mechanism 4 also includes an elastic pad 403, which surrounds the outer edge of the sound insulation plate 401. The elastic pad 403 has a ring structure and is elastically supported on the inner wall of the partition assembly 3 by friction. The sound insulation mechanism 4 also includes a buckle 404 and a locking plate 405. The buckle 404 and the locking plate 405 cooperate to fix the sound insulation plate 401 and the elastic pad 403 to the partition assembly 3. The buckle 404 and the locking plate 405 are detachably engaged. The high and low frequency TWS miniature speaker also includes a tuning net 5, which covers the sound output side of the partition assembly 3.

[0027] The sound insulation mechanism 4 includes a sound insulation panel 401 with airflow guide holes 402. The sound insulation panel 401 serves as a physical barrier, and the airflow guide holes 402 are used to balance the air pressure on both sides of the sound insulation panel 401 and buffer sound energy. The sound insulation mechanism 4 also includes an elastic pad 403, which has a ring structure and surrounds the outer edge of the sound insulation panel 401. The sound insulation mechanism 4 also includes a buckle 404 and a locking plate 405. The sound insulation mechanism 4 is installed and fixed inside the partition assembly 3. Positionally, the sound insulation mechanism 4 is located between the bass diaphragm 303 and the tweeter diaphragm 306. The buckle 404 and the locking plate 405 cooperate to fix the sound insulation panel 401 and the elastic pad 403 to the partition assembly 3. In one specific embodiment, the buckle 404 and the card plate 405 are detachably engaged. In the assembled state, the elastic pad 403 is elastically supported on the inner wall of the partition component 3 by friction. The sound insulation mechanism 4, which is composed of the sound insulation plate 401, the guide hole 402 and the elastic pad 403, ensures effective acoustic isolation between the high-frequency cavity and the low-frequency cavity. The elastic pad 403 achieves the dual function of vibration reduction and sound insulation.

[0028] The elastic pad 403 has a ring structure and is elastically supported on the inner wall of the partition component 3 by friction. The high and low frequency TWS mini speaker also includes a solder joint 304 for electrically connecting the voice coil 302. In order to protect the tweeter diaphragm 306 and optimize high frequency diffusion, the high and low frequency TWS mini speaker also includes a cover 307, which is installed on the end face of the tweeter bracket 2. In order to filter and diffuse the sound waves, the high and low frequency TWS mini speaker also includes a tuning mesh 5, which covers the sound output side of the partition component 3. In order to improve the assembly and maintainability of the sound insulation mechanism 4, the buckle 404 and the plate 405 are detachably matched. In order to improve the overall structure and assembly stability, the bass bracket 301 is integrally formed into the partition component 3. In order to improve the overall structure and assembly stability, the tweeter bracket 2 is integrally formed into the partition component 3.

[0029] Working principle: When an audio signal is input, the signal is electrically connected to the voice coil 302 through the solder joint 304. The voice coil 302 is subjected to electromagnetic force in the stable magnetic field provided by the magnet 305, which drives the bass diaphragm 303 to reciprocate to generate low-frequency sound waves. The bass cavity defined by the bass bracket 301 and the U cup 1 enhances the low-frequency resonance.

[0030] Meanwhile, the tweeter diaphragm 306, fixed by the tweeter bracket 2, responds to the high-frequency signal and outputs high-frequency sound waves, and the cover 307 is installed on the end face of the tweeter bracket 2; since the bass diaphragm 303 and the tweeter diaphragm 306 are integrated in the partition component 3 and are close to each other, in order to avoid crosstalk between high and low frequency sound waves and cavity standing wave effect, a sound insulation mechanism 4 is set up.

[0031] When the sound insulation mechanism 4 is working, the sound insulation plate 401 physically separates the high and low frequency cavities to prevent sound wave crosstalk. The guide hole 402 on the sound insulation plate 401 is used to balance the air pressure in the cavity and buffer the sound energy to reduce the standing wave effect. The elastic pad 403 surrounding the outer edge of the sound insulation plate 401 is elastically supported on the inner wall of the partition component 3 by friction. This elastic support structure allows the sound insulation plate 401 to produce a slight displacement under the action of sound pressure, so as to achieve vibration reduction and sound insulation. The buckle 404 and the clip 405 ensure the assembly stability of the entire sound insulation mechanism 4.

[0032] After the high and low frequency sound-generating structures work together and are isolated and damped by the sound insulation mechanism 4, the superimposed sound waves are finally output to the tuning net 5. The tuning net 5 filters and diffuses the sound waves again. Through the synergistic effect of the above components, the high and low frequency TWS miniature speaker can achieve the coordinated output of high and low frequency sound waves in a limited space and effectively avoid acoustic interference.

Claims

1. A high-low frequency TWS miniature speaker, comprising: The U-cup (1), the partition assembly (3), and the bass support (301) are fixed to the partition assembly (3) and together with the U-cup (1) define the bass cavity; Magnet (305), the magnet (305) is fixed to the bass support (301); A voice coil (302) is disposed in the magnetic gap of the magnet (305); A bass diaphragm (303) is connected to the voice coil (302). Tweeter bracket (2), the tweeter bracket (2) is fixed to the partition component (3); The tweeter diaphragm (306) is fixed by the tweeter bracket (2); Its characteristic is that it further includes: The sound insulation mechanism (4) is disposed inside the partition assembly (3) and located between the bass diaphragm (303) and the tweeter diaphragm (306). The sound insulation mechanism (4) includes: a sound insulation plate (401), an elastic pad (403), a buckle (404) and a retaining plate (405). The sound insulation plate (401) has a flow guide hole (402). The elastic pad (403) is disposed around the outer edge of the sound insulation plate (401). The buckle (404) and the retaining plate (405) cooperate with each other to fix the sound insulation plate (401) and the elastic pad (403) to the partition assembly (3).

2. The high and low frequency TWS miniature speaker according to claim 1, characterized in that: The elastic pad (403) has a ring structure and is elastically supported on the inner wall of the partition component (3) by friction.

3. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: It also includes solder joints (304) for electrically connecting the voice coil (302).

4. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: It also includes a cover (307) which is mounted on the end face of the tweeter bracket (2).

5. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: It also includes a tuning mesh (5) that covers the sound output side of the partition component (3).

6. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: The buckle (404) is detachably engaged with the card plate (405).

7. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: The bass support (301) is integrally formed into the partition component (3).

8. A high-low frequency TWS miniature speaker according to claim 1, characterized in that: The tweeter bracket (2) is integrally formed on the partition component (3).

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