Bone-voiceprint sensor and electronic device

Abstract

The utility model discloses a kind of bone acoustic print sensors and electronic equipment, it is related to sensor manufacturing technical field, wherein, the bone acoustic print sensor includes shell, substrate, vibration assembly and microphone assembly, shell is connected with substrate and is surrounded with substrate and forms containing cavity;Substrate inside forms containing vibration assembly and can install cavity for vibration assembly vibration;Microphone assembly is located in containing cavity, microphone assembly includes signal processing chip and sound signal pickup chip, sound signal pickup chip is set to substrate and is surrounded with substrate and forms first cavity, substrate is provided with the communication hole of intercommunication installation cavity and first cavity.Because vibration assembly is located in the installation cavity inside substrate, therefore, vibration assembly will not occupy the space of containing cavity, which leads to the height size of shell compared with the case that existing bone acoustic print sensor sets vibration assembly in containing cavity is reduced, thereby reducing the package size of bone acoustic print sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor manufacturing technology, and in particular to a bone conduction sensor and electronic device. Background Technology

[0002] Bone conduction sensors utilize the slight vibrations in the bones of the head and neck caused by a person speaking to collect sound signals and convert them into electrical signals. Unlike traditional microphones that collect sound through air conduction, bone conduction sensors can clearly transmit sound even in noisy environments, and the transmission accuracy is high.

[0003] Currently, existing bone conduction sensors have a connector plate mounted on the bottom of the MEMS (Microelectro Mechanical Systems) chip, on which a vibration component is fixed. This setup results in a large package size, which is not conducive to the assembly of the entire device. Utility Model Content

[0004] The main objective of this invention is to propose a bone voiceprint sensor and electronic device, aiming to solve the problem of how to reduce the package size of the bone voiceprint sensor.

[0005] To achieve the above objectives, the bone conduction sensor proposed in this utility model includes: shell; A substrate, wherein the outer shell is connected to the substrate and forms a receiving cavity with the substrate, and a mounting cavity is formed inside the substrate; A vibration assembly, wherein the vibration assembly is located within the mounting cavity and is capable of vibrating within the mounting cavity; A microphone assembly is located within the receiving cavity. The microphone assembly includes a signal processing chip and an acoustic signal pickup chip. The signal processing chip is electrically connected to the acoustic signal pickup chip. The acoustic signal pickup chip is disposed on the substrate and forms a first cavity with the substrate. The substrate has a communicating hole that connects the mounting cavity and the first cavity.

[0006] In one embodiment, the vibration assembly includes a fixing member and a diaphragm. The fixing member is connected to the cavity wall of the mounting cavity, and the outer edge of the diaphragm is connected to the fixing member. The diaphragm divides the mounting cavity into a second cavity and a third cavity, and the second cavity communicates with the first cavity through the connecting hole.

[0007] In one embodiment, the connecting hole is disposed toward the diaphragm; And / or, the radial dimension of the effective vibration area of ​​the diaphragm is greater than the radial dimension of the sensing diaphragm of the acoustic signal pickup chip.

[0008] In one embodiment, the vibration assembly further includes a mass block connected to the diaphragm.

[0009] In one embodiment, the diaphragm has a through hole connecting the second cavity and the third cavity; Alternatively, the diaphragm may have a through hole penetrating the mass block, and the second cavity may communicate with the third cavity through the through hole.

[0010] In one embodiment, both the acoustic signal pickup chip and the signal processing chip are connected to the substrate.

[0011] In one embodiment, the substrate includes a support layer and a board body; One side of the support layer is connected to the outer shell and forms the receiving cavity with the outer shell. The support layer is provided with the communicating hole. The acoustic signal pickup chip and the signal processing chip are both connected to the support layer. The board body forms the mounting cavity. Alternatively, the outer shell is connected to the board body and forms the receiving cavity with the board body, the support layer is located in the receiving cavity, one side of the support layer is connected to the board body, the other side of the support layer is connected to the acoustic signal pickup chip and the signal processing chip, the support layer is provided with the communicating hole, and the board body forms the mounting cavity.

[0012] In one embodiment, the support layer is a semi-cured sheet; Alternatively, the support layer may be a steel sheet layer; Alternatively, the support layer may be a polyimide film layer.

[0013] In one embodiment, the acoustic signal pickup chip is electrically connected to the signal processing chip via a first lead; the signal processing chip is electrically connected to the substrate via a second lead. And / or, the outer casing has a pressure relief hole that communicates with the receiving cavity.

[0014] This invention also proposes an electronic device, which includes the aforementioned bone conduction sensor.

[0015] The technical solution of this utility model adopts a mounting cavity formed inside the substrate to accommodate the vibration component. The acoustic signal pickup chip and the substrate form a first cavity. A connecting hole is opened on the substrate to connect the mounting cavity and the first cavity. The vibration of the vibration component can drive the airflow in the mounting cavity and the first cavity. The airflow in the first cavity will drive the sensing membrane on the acoustic signal pickup chip to vibrate. Since the vibration component is located in the mounting cavity inside the substrate, the vibration component will not occupy the space of the accommodating cavity whether it is in a static state or in a vibrating state. This results in a reduction in the height of the shell compared with the case of existing bone conduction sensors where the vibration component is placed in the accommodating cavity, thereby reducing the package size of the bone conduction sensor. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A cross-sectional structural schematic diagram of an embodiment of the bone voiceprint sensor provided by this utility model; Figure 2 This is a cross-sectional structural schematic diagram of another embodiment of the bone voiceprint sensor provided by this utility model.

[0018] Explanation of icon numbers: 100. Bone conduction sensor; 1. Housing; 11. Pressure relief hole; 2. Substrate; 21. Support layer; 211. Connecting hole; 22. Plate body; 221. Mounting cavity; 2211. Second cavity; 2212. Third cavity; 3. Vibration assembly; 31. Fixing member; 32. Diaphragm; 321. Through hole; 33. Mass block; 4. Microphone assembly; 41. Signal processing chip; 42. Sound signal pickup chip; 5. Receiving cavity; 6. First cavity; 71. First lead; 72. Second lead.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] Bone conduction sensors utilize the slight vibrations in the bones of the head and neck caused by a person speaking to collect sound signals and convert them into electrical signals. Unlike traditional microphones that collect sound through air conduction, bone conduction sensors can clearly transmit sound even in noisy environments, and the transmission accuracy is high.

[0024] Currently, existing bone conduction sensors have a connector plate mounted on the bottom of the MEMS chip, and a vibration component is fixed on the connector plate. This setup results in a large package size, which is not conducive to the assembly of the whole device.

[0025] The inventors discovered that the existing MEMS chip bottom-mounted connectors have a large height dimension because space needs to be reserved for the vibration of the vibration component. Since the MEMS chip is placed on the connector, the overall height of the component to be packaged is too large, which leads to an increase in package size and is not conducive to the assembly of the whole device.

[0026] This invention proposes a bone voiceprint sensor, aiming to solve the problem of how to reduce the package size of the bone voiceprint sensor.

[0027] Please see Figure 1 In one embodiment of the present invention, the bone conduction sensor 100 includes a housing 1, a substrate 2, a vibration component 3, and a microphone component 4. The housing 1 is connected to the substrate 2 and forms a receiving cavity 5 with the substrate 2. An installation cavity 221 is formed inside the substrate 2. The vibration component 3 is located in the installation cavity 221 and can vibrate within the installation cavity 221. The microphone component 4 is located in the receiving cavity 5 and includes a signal processing chip 41 and a sound signal pickup chip 42. The signal processing chip 41 and the sound signal pickup chip 42 are electrically connected. The sound signal pickup chip 42 is disposed on the substrate 2 and forms a first cavity 6 with the substrate 2. The substrate 2 has a connecting hole 211 that connects the installation cavity 221 and the first cavity 6.

[0028] The technical solution of this utility model adopts a mounting cavity 221 formed inside the substrate 2 to accommodate the vibration component 3. The sound signal pickup chip 42 and the substrate 2 form a first cavity 6. By opening a connecting hole 211 on the substrate 2 to connect the mounting cavity 221 and the first cavity 6, the vibration component 3 can drive the airflow in the mounting cavity 211 and the first cavity 6. The airflow in the first cavity 6 will drive the sensing diaphragm on the sound signal pickup chip 42 to vibrate. Since the vibration component 3 is located in the mounting cavity 221 inside the substrate 2, the vibration component 3 will not occupy the space of the accommodating cavity 5 whether it is in a static state or a vibrating state. Compared with the sound signal pickup chip 42 being set on the substrate 2 by a bottom adhesive connecting piece, the sound signal pickup chip 42 in this embodiment can be directly set on the substrate 2, which effectively reduces the height position of the sound signal pickup chip 42. As a result, the height dimension of the outer shell 1 is reduced compared with the case of the existing bone voiceprint sensor 100 where the vibration component 3 is set in the accommodating cavity 5, thereby reducing the packaging size of the bone voiceprint sensor 100. The outer casing 1 can be made of metal, which protects the components on the substrate 2 and also isolates environmental noise. The sound signal pickup chip 42 can be a MEMS chip, and the signal processing chip 41 can be an ASIC (Application-Specific Integrated Circuit) chip. It should be noted that the height direction is... Figure 1 The up and down directions are shown.

[0029] The vibration component 3 generates strong vibrations upon sensing external vibration signals. This vibration causes the air inside the mounting cavity 221 and the first cavity 6 to vibrate, generating a vibrating airflow. The acoustic signal pickup chip 42 receives the gas flow caused by the vibration of the vibration component 3 and performs signal conversion and processing via the signal processing chip 41. Finally, the signal is output from the substrate 2.

[0030] Please see Figure 1 and Figure 2 In one embodiment, the vibration assembly 3 includes a fixing member 31 and a diaphragm 32. The fixing member 31 is connected to the cavity wall of the mounting cavity 221, and the outer edge of the diaphragm 32 is connected to the fixing member 31. The diaphragm 32 divides the mounting cavity 221 into a second cavity 2211 and a third cavity 2212. The second cavity 2211 is connected to the first cavity 6 through a connecting hole 211. By connecting the fixing member 31 to the cavity wall of the mounting cavity 221, the diaphragm 32 can be better fixed, ensuring stable vibration of the diaphragm 32. The second cavity 2211 and the third cavity 2212 provide corresponding vibration spaces for the upward and downward vibration of the diaphragm 32, respectively, ensuring smooth vibration of the diaphragm 32. It should be noted that the second cavity 2211 and the third cavity 2212 are arranged sequentially along the vibration direction of the diaphragm 32; the fixing member 31 is connected to the inner wall of the mounting cavity 221 through an adhesive layer. It should be noted that the fixing member 31 can be a fixing ring or multiple fixing blocks arranged sequentially along the circumference of the diaphragm 32; no specific restrictions are imposed here.

[0031] Please see Figure 1 and Figure 2 In one embodiment, the connecting hole 211 is disposed facing the diaphragm 32. In this embodiment, the connecting hole 211 is disposed facing the diaphragm 32, so that the cavity of the MEMS chip can be disposed directly facing the diaphragm 32, thereby allowing the airflow driven by the vibration of the diaphragm 32 to act more effectively on the sensing membrane of the MEMS chip, thereby improving the signal response of the MEMS chip.

[0032] According to one embodiment of the present invention, the effective vibration area of ​​the diaphragm 32 is greater than the area of ​​the sensing membrane of the sound signal pickup chip 42.

[0033] The inventors discovered that in existing MEMS chips, a connecting piece is attached to the bottom, and then the diaphragm 32 is connected to the connecting piece. The size of the effective vibration area of ​​the diaphragm 32 is limited by the size of the MEMS chip, so the effective vibration area of ​​the diaphragm 32 is generally smaller than or equal to the area of ​​the MEMS sensing film.

[0034] In this embodiment, both the diaphragm 32 and the fixing member 31 are disposed in the mounting cavity 221 within the substrate 2. This means that the effective vibration area of ​​the diaphragm 32 in this embodiment is no longer limited by the size of the MEMS chip, and the effective vibration area of ​​the diaphragm 32 can be larger than the area of ​​the sensing membrane of the acoustic signal pickup chip 42. Compared with the existing diaphragm 32 which is fixed by a connecting piece bonded to the bottom of the MEMS chip, the diaphragm 32 in this embodiment has a larger effective vibration area. The larger effective vibration area of ​​the diaphragm 32 means that the MEMS chip can receive a larger airflow signal, and its sensitivity is higher.

[0035] Please see Figure 1 and Figure 2 In one embodiment, the vibration assembly 3 further includes a mass block 33 connected to the diaphragm 32. By providing the mass block 33 on the diaphragm 32, the vibration amplitude of the diaphragm 32 under the same vibration signal can be significantly increased, thereby generating a larger vibration airflow and effectively improving the sensitivity of the bone conduction sensor 100.

[0036] In one embodiment, the diaphragm 32 has a through hole 321 connecting the second cavity 2211 and the third cavity 2212; or, the diaphragm 32 has a through hole 321 penetrating the mass block 33, and the second cavity 2211 is connected to the third cavity 2212 through the through hole 321. By providing the through hole 321 to connect the second cavity 2211 and the third cavity 2212, the air pressure between the two cavities can be balanced, avoiding excessive air pressure changes in the second cavity 2211 and the third cavity 2212, thereby preventing excessive stress on the diaphragm 32 and the sensing film on the MEMS chip, and ensuring stable vibration of the diaphragm 32 and the sensing film of the MEMS chip.

[0037] Please see Figure 1 and Figure 2 In one embodiment, both the acoustic signal pickup chip 42 and the signal processing chip 41 are connected to the substrate 2. Compared to the case where the MEMS chip and ASIC chip are stacked vertically, this embodiment places both the MEMS chip and ASIC chip on the substrate 2, arranging them sequentially along the vibration direction perpendicular to the diaphragm 32. This further reduces the height of the component to be packaged, allowing for a further reduction in the height of the housing 1, thereby effectively decreasing the package height. The MEMS chip and ASIC chip can be spaced apart horizontally.

[0038] Please see Figure 1In one embodiment, the substrate 2 includes a support layer 21 and a board body 22; one side of the support layer 21 is connected to the outer shell 1 and forms a receiving cavity 5 with the outer shell 1; the support layer 21 is provided with a connecting hole 211; the acoustic signal pickup chip 42 and the signal processing chip 41 are both connected to the support layer 21; the board body 22 forms a mounting cavity 221; or, please refer to Figure 2 The outer shell 1 is connected to the board body 22 and forms a receiving cavity 5 with the board body 22. The support layer 21 is located in the receiving cavity 5. One side of the support layer 21 is connected to the board body 22, and the other side of the support layer 21 is connected to the acoustic signal pickup chip 42 and the signal processing chip 41. The support layer 21 is provided with a connecting hole 211, and the board body 22 forms a mounting cavity 221. In this embodiment, the support layer 21 is provided to provide stable support for the MEMS chip and the ASIC chip.

[0039] In one embodiment, the support layer 21 is a prepreg layer; or, the support layer 21 is a steel sheet layer; or, the support layer 21 is a polyimide film layer. The support layer 21 can be a prepreg layer, a steel sheet layer, or a polyimide film layer. The board body 22 can be a PCB (Printed Circuit Board).

[0040] Please see Figure 2 In one embodiment, the acoustic signal pickup chip 42 is electrically connected to the signal processing chip 41 via a first lead 71; the signal processing chip 41 is electrically connected to the substrate 2 via a second lead 72; wherein, the MEMS chip is electrically connected to the ASIC chip via the first lead 71, and the ASIC chip is electrically connected to the board body 22 via the second lead 72; wherein, both the first lead 71 and the second lead 72 are gold wires, so that the first lead 71 and the second lead 72 have good conductivity.

[0041] Please see Figure 1 and Figure 2 In one embodiment, the outer casing 1 has a pressure relief hole 11 that communicates with the receiving cavity 5. By providing the pressure relief hole 11, the air pressure inside and outside the outer casing 1 can be balanced, preventing uneven pressure inside the receiving cavity 5 and reducing safety hazards.

[0042] This utility model also proposes an electronic device, which includes the aforementioned bone conduction sensor 100. The specific structure of the bone conduction sensor 100 is as described in the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. The electronic device can be headphones, VR (Virtual Reality) devices, AR (Augmented Reality) devices, MR (Mixed Reality) devices, XR (Extended Reality) devices, etc.

[0043] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A bone conduction sensor, characterized in that, include: shell; A substrate, wherein the outer shell is connected to the substrate and forms a receiving cavity with the substrate, and a mounting cavity is formed inside the substrate; A vibration assembly, wherein the vibration assembly is located within the mounting cavity and is capable of vibrating within the mounting cavity; A microphone assembly is located within the receiving cavity. The microphone assembly includes a signal processing chip and an acoustic signal pickup chip. The signal processing chip is electrically connected to the acoustic signal pickup chip. The acoustic signal pickup chip is disposed on the substrate and forms a first cavity with the substrate. The substrate has a communicating hole that connects the mounting cavity and the first cavity.

2. The bone conduction sensor as described in claim 1, characterized in that, The vibration assembly includes a fixing member and a diaphragm. The fixing member is connected to the cavity wall of the mounting cavity, and the outer edge of the diaphragm is connected to the fixing member. The diaphragm divides the mounting cavity into a second cavity and a third cavity. The second cavity communicates with the first cavity through the connecting hole.

3. The bone conduction sensor as described in claim 2, characterized in that, The connecting hole is oriented toward the diaphragm; And / or, the effective vibration area of ​​the diaphragm is greater than the area of ​​the sensing diaphragm of the acoustic signal pickup chip.

4. The bone conduction sensor as described in claim 2, characterized in that, The vibration assembly also includes a mass block connected to the diaphragm.

5. The bone conduction sensor as described in claim 4, characterized in that, The diaphragm has a through hole connecting the second cavity and the third cavity; Alternatively, the diaphragm may have a through hole penetrating the mass block, and the second cavity may communicate with the third cavity through the through hole.

6. The bone conduction sensor as described in any one of claims 1 to 5, characterized in that, Both the acoustic signal pickup chip and the signal processing chip are connected to the substrate.

7. The bone conduction sensor as described in any one of claims 1 to 5, characterized in that, The substrate includes a support layer and a board body; One side of the support layer is connected to the outer shell and forms the receiving cavity with the outer shell. The support layer is provided with the communicating hole. The acoustic signal pickup chip and the signal processing chip are both connected to the support layer. The board body forms the mounting cavity. Alternatively, the outer shell is connected to the board body and forms the receiving cavity with the board body, the support layer is located in the receiving cavity, one side of the support layer is connected to the board body, the other side of the support layer is connected to the acoustic signal pickup chip and the signal processing chip, the support layer is provided with the communicating hole, and the board body forms the mounting cavity.

8. The bone conduction sensor as described in claim 7, characterized in that, The support layer is a semi-cured sheet layer; Alternatively, the support layer may be a steel sheet layer; Alternatively, the support layer may be a polyimide film layer.

9. The bone conduction sensor as described in any one of claims 1 to 5, characterized in that, The acoustic signal pickup chip is electrically connected to the signal processing chip via a first lead; the signal processing chip is electrically connected to the substrate via a second lead. And / or, the outer casing has a pressure relief hole that communicates with the receiving cavity.

10. An electronic device, characterized in that, The electronic device includes the bone conduction sensor as described in any one of claims 1 to 9.

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