An inductive heating resonant cell structure

Abstract

The utility model provides a kind of induction heating resonance unit structure, comprising: first secondary circuit connecting plate, second secondary circuit connecting plate, resonance capacitor, resonance capacitor connecting plate, transformer and inductor;Second secondary circuit connecting plate insulation superposition is arranged at the side of first secondary circuit connecting plate, resonance capacitor, transformer is arranged at the other side of first secondary circuit connecting plate;Resonance capacitor and transformer are adjacent arrangement, to minimize the secondary side loop inductance between resonance capacitor and transformer;The utility model, using secondary resonance architecture, effectively reduces primary side voltage, and greatly shortens secondary side current path, to significantly reduce loop leakage inductance and loss;Compact overall structure, material is simplified, realize the characteristics of light weight, small size, excellent portability, especially suitable for handheld device application.

Description

Technical Field

[0001] This utility model belongs to the field of induction heating technology, specifically relating to an induction heating resonant unit structure. Background Technology

[0002] With the increasing maturity of third-generation semiconductor technology represented by silicon carbide (SiC), ultra-high frequency induction heating equipment is rapidly developing towards miniaturization and high power density.

[0003] In contrast, traditional IGBT-based devices are limited by their low operating frequency, and their resonant units have many inherent drawbacks: large size, heavy weight, and low power density; to handle high power, their transformers are bulky or must rely on water cooling; the primary resonant circuit voltage is too high; and the overall structure is loose with large parasitic inductance, which restricts further performance improvement.

[0004] Therefore, there is an urgent need to design an induction heating resonant unit structure to solve the current technical problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an induction heating resonant unit structure that optimizes the secondary circuit current path, reduces circuit noise, and achieves miniaturization and weight reduction, thereby significantly improving the power density, efficiency, and portability of the resonant circuit.

[0006] The technical solution of this utility model is as follows: an induction heating resonant unit structure, comprising: a first secondary circuit connecting plate, a second secondary circuit connecting plate, a resonant capacitor, a resonant capacitor connecting plate, a transformer, and an inductor; the second secondary circuit connecting plate is insulated and stacked on one side of the first secondary circuit connecting plate, and the resonant capacitor and transformer are disposed on the other side of the first secondary circuit connecting plate; the resonant capacitor and the transformer are disposed adjacent to each other to minimize the secondary circuit inductance between the resonant capacitor and the transformer; the transformer includes a magnetic ring, a primary coil, and a secondary coil, one end of the secondary coil is electrically connected to the first secondary circuit connecting plate, and the other end of the secondary coil is electrically connected to the second secondary circuit connecting plate; the second secondary circuit connecting plate includes a second cooling pipe; one end of the resonant capacitor is electrically connected to the first secondary circuit connecting plate, and the other end of the resonant capacitor is electrically connected to the resonant capacitor connecting plate; the resonant capacitor connecting plate includes a third cooling pipe; the two ends of the inductor are respectively electrically connected to the second cooling pipe and the third cooling pipe.

[0007] Furthermore, an insulating plate is stacked between the first secondary circuit connecting plate and the second secondary circuit connecting plate.

[0008] Furthermore, the insulating plate includes a first insulating plate and a second insulating plate.

[0009] Furthermore, the primary coil is wound around the magnetic ring, and the secondary coil consists of multiple sets of single conductors and is evenly arranged on the outside of the magnetic ring.

[0010] Furthermore, the single conductor has an "n" shaped structure, one end of the single conductor is welded to the first secondary circuit connection plate, and the other end of the single conductor is welded to the second secondary circuit connection plate.

[0011] Furthermore, the first secondary circuit connecting plate has a first conductive plate, on which a first welding hole matching the end of the single conductor is formed; the second secondary circuit connecting plate has a second conductive plate, the second cooling pipe is disposed on one side of the second conductive plate, on which a second welding hole matching the end of the single conductor is formed.

[0012] Furthermore, a first cooling pipe is provided on one side of the first conductive plate.

[0013] Furthermore, one end of both the second and third cooling pipes is provided with a connector, copper busbar, or quick-connect interface for connecting the sensor.

[0014] Furthermore, the resonant capacitor connection plate has a third conductive plate, and the third cooling pipe is disposed on one side of the third conductive plate.

[0015] Furthermore, the number of resonant capacitors is at least one.

[0016] The beneficial effects of this utility model are: (1) This utility model adopts a secondary resonant architecture, which effectively reduces the primary side voltage and significantly shortens the secondary side current path, thereby significantly reducing the leakage inductance and loss of the circuit; (2) The overall structure is compact and the materials are simple, achieving the characteristics of light weight and small size, with excellent portability, especially suitable for handheld device applications. Attached Figure Description

[0017] Figure 1 This is one of the structural schematic diagrams of the induction heating resonant unit structure in this utility model.

[0018] Figure 2 This is the second schematic diagram of the induction heating resonant unit structure in this utility model.

[0019] Figure 3 This is the third schematic diagram of the induction heating resonant unit structure in this utility model.

[0020] Figure 4 This is a schematic diagram of the structure of the first and second circuit connection plates in this utility model.

[0021] Figure 5 This is a schematic diagram of the structure of the second secondary circuit connection plate in this utility model.

[0022] Figure 6 This is a schematic diagram of the resonant capacitor connection plate in this utility model.

[0023] Figure 7 This is a schematic diagram of the structure of a single conductor in this utility model. Detailed Implementation

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are not intended to limit the present invention or its application or use in any way. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0025] The terms "first," "second," and similar words used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] like Figures 1 to 7As shown, an induction heating resonant unit structure is disclosed, including: a first secondary circuit connecting plate 1, a second secondary circuit connecting plate 7, a resonant capacitor 3, a resonant capacitor connecting plate 4, a transformer 2, and an inductor 5; the second secondary circuit connecting plate 7 is insulated and stacked on one side of the first secondary circuit connecting plate 1, and the resonant capacitor 3 and the transformer 2 are disposed on the other side of the first secondary circuit connecting plate 1; the resonant capacitor 3 and the transformer 2 are disposed adjacent to each other to minimize the secondary circuit inductance between the resonant capacitor 3 and the transformer 2; the transformer 2 includes a magnetic ring 21, a primary coil 22, and a secondary coil 23, one end of the secondary coil 23 is electrically connected to the first secondary circuit connecting plate 1, and the other end of the secondary coil 23 is electrically connected to the second secondary circuit connecting plate 7; the second secondary circuit connecting plate 7 includes a second cooling pipe 72; one end of the resonant capacitor 3 is electrically connected to the first secondary circuit connecting plate 1, and the other end of the resonant capacitor 3 is electrically connected to the resonant capacitor connecting plate 4; the resonant capacitor connecting plate 4 includes a third cooling pipe 42; the two ends of the inductor 5 are electrically connected to the second cooling pipe 72 and the third cooling pipe 42, respectively; the second cooling pipe 72 and the third cooling pipe 42 are both conductive cooling pipes.

[0027] In the above embodiments, a secondary resonant architecture is adopted, which effectively reduces the primary side voltage and significantly shortens the secondary side current path, thereby significantly reducing the circuit leakage inductance and loss; the overall structure is compact and uses simple materials, achieving the characteristics of light weight and small size, with excellent portability, especially suitable for handheld device applications.

[0028] In some embodiments, an insulating plate 6 is stacked between the first secondary circuit connecting plate 1 and the second secondary circuit connecting plate 7. Specifically, since the magnetic ring 21 and the secondary coil 23 of the transformer 2 protrude in a direction perpendicular to the first secondary circuit connecting plate 1 and the second secondary circuit connecting plate 7, the insulating plate 6 adopts a split structure to avoid interference, including a first insulating plate 61 and a second insulating plate 62. The first insulating plate 61 and the second insulating plate 62 are spliced ​​at the position corresponding to the transformer 2, thereby forming a complete insulation isolation between the first secondary circuit connecting plate 1 and the second secondary circuit connecting plate 7.

[0029] In some embodiments, the primary coil 22 is wound around the magnetic ring 21, and the secondary coil 23 is composed of multiple sets of single conductors 231 and is evenly arranged on the outside of the magnetic ring 21; specifically, as shown in... Figure 7 As shown, the single conductor 231 has an "n" shaped structure. One end of the single conductor 231 is welded to the first secondary circuit connection plate 1, and the other end of the single conductor 231 is welded to the second secondary circuit connection plate 7. By using a secondary coil 23 composed of multiple sets of "n" shaped single conductors 231 and a high-frequency magnetic ring 21, the transformer 2 can operate in the ultra-high frequency band with high power density and extremely low self-loss. It can operate stably with only natural cooling or forced air cooling.

[0030] To facilitate the welding and fixing of the single conductor 231, in some embodiments, such as Figure 4 As shown, the first and second circuit connecting plate 1 has a first conductive plate 11, on which a first welding hole 13 is formed to match the end of the single conductor 231; as Figure 5 As shown, the second secondary circuit connection plate 7 has a second conductive plate 71, a second cooling pipe 72 is disposed on one side of the second conductive plate 71, and a second welding hole 73 is provided on the second conductive plate 71 to match the end of the single conductor 231.

[0031] In some embodiments, such as Figure 4 As shown, a first cooling pipe 12 is provided on one side of the first conductive plate 11.

[0032] In some embodiments, one end of the second cooling pipe 72 and the third cooling pipe 42 is provided with a nut head, a copper busbar or a quick-connect interface for connecting the sensor 5. Figure 1 The diagram shows how one end of the second cooling pipe 72 and the third cooling pipe 42 are connected to the sensor 5 via a ferrule.

[0033] In some embodiments, such as Figure 6 As shown, the resonant capacitor connection plate 4 has a third conductive plate 41, and a third cooling pipe 42 is disposed on one side of the third conductive plate 41.

[0034] In some embodiments, the number of resonant capacitors 3 is at least one, and the resonant capacitors 3 are arranged adjacent to the transformer 2 to minimize the secondary circuit inductance between the resonant capacitors 3 and the transformer 2; for example Figure 1 As shown, the resonant unit structure has one resonant capacitor 3; in some embodiments, the resonant unit structure has two or more resonant capacitors 3.

[0035] In some embodiments, the third conductive plate 41 is assembled and connected to one end of the resonant capacitor 3 via a bolt and nut mechanism, and the first conductive plate 11 is assembled and connected to the other end of the resonant capacitor 3 via a bolt and nut mechanism.

[0036] The various embodiments of this utility model have now been described in detail. To avoid obscuring the concept of this utility model, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0037] The embodiments described above only illustrate some implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A structure for an induction heating resonant unit, characterized in that, include: First and second secondary circuit connection boards, second and second secondary circuit connection boards, resonant capacitors, resonant capacitor connection boards, transformers and inductors; The second secondary circuit connection plate is insulated and stacked on one side of the first secondary circuit connection plate, and the resonant capacitor and transformer are disposed on the other side of the first secondary circuit connection plate; The resonant capacitor is arranged adjacent to the transformer to minimize the secondary circuit inductance between the resonant capacitor and the transformer. The transformer includes a magnetic ring, a primary coil, and a secondary coil. One end of the secondary coil is electrically connected to the first secondary circuit connection plate, and the other end of the secondary coil is electrically connected to the second secondary circuit connection plate. The second secondary circuit connection plate includes a second cooling pipe; One end of the resonant capacitor is electrically connected to the first secondary circuit connection plate, and the other end of the resonant capacitor is electrically connected to the resonant capacitor connection plate. The resonant capacitor connection plate includes a third cooling pipe; The two ends of the sensor are electrically connected to the second cooling pipe and the third cooling pipe, respectively.

2. The induction heating resonant unit structure according to claim 1, characterized in that: An insulating plate is stacked between the first secondary circuit connecting plate and the second secondary circuit connecting plate.

3. The induction heating resonant unit structure according to claim 2, characterized in that: The insulating plate includes a first insulating plate and a second insulating plate.

4. The induction heating resonant unit structure according to claim 1, characterized in that: The primary coil is wound around the magnetic ring, and the secondary coil consists of multiple sets of single conductors and is evenly arranged on the outside of the magnetic ring.

5. The induction heating resonant unit structure according to claim 4, characterized in that: The single conductor has an "n" shaped structure. One end of the single conductor is welded to the first secondary circuit connection plate, and the other end of the single conductor is welded to the second secondary circuit connection plate.

6. The induction heating resonant unit structure according to claim 5, characterized in that: The first secondary circuit connecting plate has a first conductive plate, and the first conductive plate has a first welding hole that matches the end of the single conductor; The second secondary circuit connecting plate has a second conductive plate, the second cooling pipe is disposed on one side of the second conductive plate, and the second conductive plate has a second welding hole that matches the end of the single conductor.

7. The induction heating resonant unit structure according to claim 6, characterized in that: A first cooling pipe is provided on one side of the first conductive plate.

8. The induction heating resonant unit structure according to claim 1, characterized in that: One end of the second and third cooling pipes is provided with a nut, copper busbar or quick connector for connecting the sensor.

9. The induction heating resonant unit structure according to claim 1, characterized in that: The resonant capacitor connection plate has a third conductive plate, and the third cooling pipe is disposed on one side of the third conductive plate.

10. The induction heating resonant unit structure according to claim 1, characterized in that: The number of resonant capacitors is at least one.

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