High-vibration-resistant adjustable heat dissipation support circuit board structure

Abstract

The utility model provides a kind of high anti-vibration type adjustable heat dissipation support circuit board structure, including circuit board body, first side heat dissipation support, second side heat dissipation support, arc-shaped stop block;Arc-shaped stop block is installed between the opposite two installation convex edges correspondingly;The opposite sides of first side heat dissipation support and the second side heat dissipation support are fixed with the circuit board body by screw;The opposite side of first side heat dissipation support and the second side heat dissipation support and located below the installation convex edge are sequentially provided with two heat-conducting blocks from top to bottom;The opposite sides of first inner layer plate and second inner layer plate are all provided with trapezoidal positioning slot for the heat-conducting block insertion;The opposite sides of the lower part of the outer side of first side heat dissipation support and the second side heat dissipation support are all provided with guide adjusting groove, and bolt mounting seat is embedded in the two sides guide adjusting groove. With high anti-vibration, heat dissipation function.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a highly vibration-resistant adjustable heat dissipation bracket circuit board structure. Background Technology

[0002] Chinese Patent Announcement No. CN219893508U, with an announcement date of October 24, 2023, specifically relates to a circuit board with rapid heat dissipation performance, belonging to the field of circuit board technology. The circuit board includes a main body, comprising a board body, detachable lifting seats mounted on the front and rear sides of the lower surface of the board body, and a protective shell located between the two lifting seats. The lifting seats have several strip-shaped mounting holes. By using an active heat dissipation mechanism and a passive heat dissipation unit in conjunction, heat dissipation fins, a thermally conductive copper plate, and a thermally conductive silicone coating work together to achieve active heat conduction and dissipation of the working heat of the board body. A reciprocating motion component drives the passive heat dissipation plate to drive the passive heat dissipation fan in a reciprocating motion, which can further accelerate the heat dissipation of the heat conducted by the active heat dissipation mechanism, effectively improving heat dissipation efficiency. Furthermore, the passive heat dissipation plate can be adjusted to a fixed position for targeted heat dissipation at high heat dissipation locations, improving the heat dissipation effect and enhancing functional versatility. The existing technology has the following drawbacks: the heat conduction path relies on external heat sinks or passive fans, resulting in high thermal resistance and slow response; interlayer heat dissipation on the circuit board relies on vias, but the heat conduction efficiency is limited by the thermal conductivity of the materials; and the structure of the existing technology has a high impact damage rate if applied to high-impact equipment. Given this situation, improvements are urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a highly vibration-resistant adjustable heat dissipation bracket circuit board structure, which has high vibration resistance and heat dissipation functions.

[0004] This utility model provides a high vibration-resistant adjustable heat dissipation bracket circuit board structure, including a circuit board body. The circuit board body includes, from top to bottom, a first inner layer board, a first circuit layer, a first semi-cured layer, a second inner layer board, a second semi-cured layer, a second circuit layer, and a third inner layer board. It also includes a first side heat dissipation bracket, a second side heat dissipation bracket, and an arc-shaped block.

[0005] The first side heat dissipation bracket and the second side heat dissipation bracket each have a mounting protrusion on their opposite sides, and the arc-shaped stop block is installed between the two opposite mounting protrusions.

[0006] The first side heat dissipation bracket and the second side heat dissipation bracket are fixed to the circuit board body by screws on their opposite sides. The circuit board body has anti-loosening thread grooves on all four sides of its upper surface that cooperate with the screws. The thread grooves are pre-coated with thread locking adhesive.

[0007] Two heat-conducting blocks are arranged sequentially from top to bottom on one side of the first-side heat dissipation bracket and the second-side heat dissipation bracket, below the mounting protrusion; each heat-conducting block has a tapered guide at its end; the upper heat-conducting block corresponds to the first inner layer plate, and the lower heat-conducting block corresponds to the second inner layer plate; trapezoidal positioning grooves for inserting the heat-conducting blocks are provided on both sides of the first inner layer plate and the second inner layer plate.

[0008] On the opposite side of the first-side heat dissipation bracket and the second-side heat dissipation bracket, and below the mounting protrusion, a NiTi shape memory alloy corrugated sheet is provided on the side attached to the circuit board body. The corrugation depth is 0.5–3 mm, and the deformation pressure threshold is ≥2 N.

[0009] Both the first-side heat dissipation bracket and the second-side heat dissipation bracket have guide adjustment grooves on opposite sides of their outer lower surfaces, and bolt mounting seats are fitted into each guide adjustment groove. A neoprene rubber shock-absorbing pad is fitted into the bottom of each bolt mounting seat. Multiple positioning pins are linearly arranged along the length of the lower outer surfaces of the first-side and second-side heat dissipation brackets. A positioning flap is rotatably connected to the upper surface of each bolt mounting seat via a hinge shaft. The free end of the positioning flap has a limiting groove for receiving the positioning pins. When the positioning pin is inserted into the limiting groove, the bolt mounting seat is locked.

[0010] Both the first-side heat dissipation bracket and the second-side heat dissipation bracket have gradient heat dissipation holes. The hole diameter in the high-heat area of ​​the circuit board body is 3.0mm±0.1mm, and the hole diameter in the low-heat area of ​​the circuit board body is 1.0mm±0.1mm. The hole wall is inclined at 30°±5°. The high-heat area corresponds to the power device area of ​​the circuit board body.

[0011] The first-side heat dissipation bracket and the second-side heat dissipation bracket are provided with dustproof mesh storage cavities, and stainless steel dustproof mesh is provided inside the dustproof mesh storage cavities.

[0012] Preferably, the mounting protrusions of the first-side heat dissipation bracket and the mounting protrusions of the second-side heat dissipation bracket are each provided with a first dovetail groove on their opposite sides, and the opposite sides of the arc-shaped stop are each provided with a first dovetail insert that is inserted into the first dovetail groove.

[0013] Preferably, the screw torque is 0.8–1.2 N•m.

[0014] Preferably, the cone angle of the tapered guide is 15°±1°, the depth of the trapezoidal positioning groove is 2.0mm±0.1mm, and the clearance between the groove and the heat-conducting block is ≤0.05mm.

[0015] Preferably, a second dovetail protrusion is provided in the guide adjustment groove along its length direction, and the bolt mounting seat has a second dovetail fitting groove that mates with the second dovetail protrusion.

[0016] Preferably, the hardness of the neoprene rubber shock-absorbing pad is 60±5 Shore A.

[0017] Preferably, the bottom and top of the dustproof net storage cavity are provided with a third dovetail groove with a groove depth of 2.0mm±0.1mm; the edge of the stainless steel dustproof net is provided with a third dovetail protrusion with a protrusion height of 1.8mm±0.05mm; a silicone damping layer with a thickness of 0.2mm and a Shore hardness of 40A is pre-placed between the third dovetail protrusion and the third dovetail groove.

[0018] Preferably, the first-side heat dissipation bracket and the second-side heat dissipation bracket are coated with a graphene-aluminum nitride composite coating cured by plasma spraying on the circuit board side, with a thickness of 50μm±5μm, a surface resistivity of (1.0±0.3)×10³Ω, and a thermal conductivity of ≥95W / mK.

[0019] Preferably, the outer surface of the arc-shaped stop is coated with an antistatic coating and an embedded polyurethane buffer layer with a thickness of 1.0mm ± 0.1mm and a Shore hardness of 70A.

[0020] Preferably, the bottom of the bolt mounting base is provided with a disc spring assembly with a spring stiffness coefficient of 50N / mm±5N / mm, the spring material is 60Si2MnA, and the pre-compression is 0.2–0.5mm.

[0021] The beneficial effects of this utility model are as follows: The combination of screws, anti-loosening threaded grooves, and locking adhesive ensures vibration displacement ≤0.1mm, significantly reducing thermal resistance fluctuation. The combination of heat-conducting blocks and trapezoidal positioning grooves eliminates assembly deviations with a tapered guide, and precise clearance ensures zero disengagement under vibration. NiTi shape memory alloy corrugated sheets absorb vibration energy with their super-elastic properties and automatically reset after deformation. The combination of gradient heat dissipation holes and dustproof mesh optimizes airflow with a 30° inclination angle. A pre-placed silicone damping layer between the third dovetail protrusion and the third dovetail slot suppresses noise from the dustproof mesh. The first and second side heat dissipation brackets are coated with a graphene-aluminum nitride composite coating cured by plasma spraying on the circuit board side, improving heat dissipation efficiency. Arc-shaped blocks enhance impact absorption. The combination of guide adjustment grooves and bolt mounting seats allows for adjustment of bolt fixing positions according to different equipment environments, improving applicability. Attached Figure Description

[0022] Figure 1 This is a front view of the present invention.

[0023] Figure 2 This is a side view of the present invention.

[0024] The attached figures are labeled as follows: arc-shaped stop 10, first inner layer 13, first circuit layer 14, first semi-cured layer 15, second inner layer 16, second semi-cured layer 12, second circuit layer 17, third inner layer 11, circuit board body 18, first side heat dissipation bracket 19, second side heat dissipation bracket 20, screw 21, heat-conducting block 22, stainless steel dustproof mesh 23, NiTi shape memory alloy corrugated sheet 24, bolt mounting seat 25, neoprene rubber shock-absorbing pad 26, gradient heat dissipation hole 27, second dovetail protrusion 28, guide adjustment groove 29, mounting flange 30, positioning pin 31, positioning flap 32. Detailed Implementation

[0025] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Please refer to Figure 1-2 As shown, this utility model provides a high vibration-resistant adjustable heat dissipation bracket circuit board structure, including a circuit board body 18. The circuit board body 18 includes, from top to bottom, a first inner layer board 13, a first circuit layer 14, a first semi-cured layer 15, a second inner layer board 16, a second semi-cured layer 12, a second circuit layer 17, and a third inner layer board 11. It also includes a first side heat dissipation bracket 19, a second side heat dissipation bracket 20, and an arc-shaped stop 10. The first side heat dissipation bracket 19 and the second side heat dissipation bracket 20 are coated with a graphene-aluminum nitride composite coating cured by plasma spraying on the circuit board side, with a thickness of 50μm±5μm, a surface resistivity of (1.0±0.3)×10³Ω, and a thermal conductivity ≥95W / mK. The outer surface of the arc-shaped stop 10 is coated with an antistatic coating and has an embedded polyurethane buffer layer with a thickness of 1.0mm±0.1mm and a Shore hardness of 70A.

[0028] Both the first heat dissipation bracket 19 and the second heat dissipation bracket 20 have mounting flanges 30 on opposite sides, and arc-shaped blocks 10 are installed between the two opposite mounting flanges 30. The mounting flanges 30 of the first heat dissipation bracket 19 and the second heat dissipation bracket 20 each have a first dovetail groove on their opposite sides, and the arc-shaped blocks 10 each have a first dovetail insert that inserts into the first dovetail groove on their opposite sides. This facilitates disassembly and assembly, improving maintenance efficiency.

[0029] The first heat sink bracket 19 and the second heat sink bracket 20 are fixed to the circuit board body 18 on opposite sides by screws 21. The torque of the screws 21 is 0.8–1.2 N•m. The circuit board body 18 has anti-loosening thread grooves on all four sides of its upper surface that cooperate with the screws 21. The thread grooves are pre-coated with thread locking adhesive. The thread locking adhesive is Loctite 243 glue used to fill the thread gaps. The torque controls the preload.

[0030] Two heat-conducting blocks 22 are arranged sequentially from top to bottom on the opposite side of the first heat dissipation bracket 19 and the second heat dissipation bracket 20, below the mounting flange 30. Each heat-conducting block 22 has a tapered guide portion at its end. The upper heat-conducting block 22 corresponds to the first inner layer plate 13, and the lower heat-conducting block 22 corresponds to the second inner layer plate 16. Trapezoidal positioning grooves for inserting heat-conducting blocks 22 are provided on both opposite sides of the first inner layer plate 13 and the second inner layer plate 16. The tapered angle of the tapered guide portion is 15°±1°, the depth of the trapezoidal positioning groove is 2.0mm±0.1mm, and the clearance fit with the heat-conducting block 22 is ≤0.05mm.

[0031] On the side opposite to the first heat sink bracket 19 and the second heat sink bracket 20, and below the mounting flange 30, a NiTi shape memory alloy corrugated sheet 24 is provided on the side of the circuit board body 18. The corrugation depth is 0.5–3 mm, and the deformation pressure threshold is ≥2 N.

[0032] Both sides of the lower outer surface of the first heat dissipation bracket 19 and the second heat dissipation bracket 20 are provided with guide adjustment grooves 29, and bolt mounting seats 25 are fitted into both guide adjustment grooves 29. A neoprene rubber shock-absorbing pad 26 is fitted into the bottom of the bolt mounting seat 25. The hardness of the neoprene rubber shock-absorbing pad is 60±5 Shore A. Multiple positioning pins 31 are linearly arranged along the length of the lower outer surface of the first heat dissipation bracket 19 and the second heat dissipation bracket 20. The upper surface of the bolt mounting seat 25 is rotatably connected to a positioning flap 32 through a hinge shaft. The free end of the positioning flap 32 is provided with a limiting groove for receiving the positioning pins 31. When the positioning pins 31 are inserted into the limiting groove, the bolt mounting seat 25 is locked. The bottom of the bolt mounting seat 25 is provided with a disc spring assembly with a spring stiffness coefficient of 50N / mm±5N / mm, a spring material of 60Si2MnA, and a pre-compression of 0.2–0.5mm. A second dovetail protrusion 28 is provided in the guide adjustment groove 29 along its length direction, and a second dovetail fitting groove is provided in the bolt mounting seat 25 to cooperate with the second dovetail protrusion 28.

[0033] Both the first heat sink bracket 19 and the second heat sink bracket 20 have gradient heat dissipation holes 27. The hole diameter in the high-heat area of ​​the circuit board body 18 is 3.0mm±0.1mm, and the hole diameter in the low-heat area of ​​the circuit board body 18 is 1.0mm±0.1mm. The hole wall is inclined at 30°±5°. The high-heat area corresponds to the power device area of ​​the circuit board body 18. The first heat sink bracket 19 and the second heat sink bracket 20 are provided with dustproof mesh storage cavities, and stainless steel dustproof mesh 23 is provided in the dustproof mesh storage cavities.

[0034] The bottom and top of the dustproof net storage cavity are provided with a third dovetail groove with a groove depth of 2.0mm±0.1mm; the edge of the stainless steel dustproof net 23 is provided with a third dovetail protrusion with a protrusion height of 1.8mm±0.05mm, and a silicone damping layer with a thickness of 0.2mm and a Shore hardness of 40A is pre-placed between the third dovetail protrusion and the third dovetail groove.

[0035] In this embodiment, a combination of screws, anti-loosening threaded grooves, and locking adhesive is used to ensure that the vibration displacement is ≤0.1mm, significantly reducing the thermal resistance fluctuation rate. A combination of heat-conducting blocks and trapezoidal positioning grooves is employed, with a tapered guide eliminating assembly deviations and precise clearances ensuring zero disengagement under vibration. NiTi shape memory alloy corrugated sheets are used, whose superelastic properties absorb vibration energy and automatically reset after deformation. A combination of gradient heat dissipation holes and dust filters, with a 30° inclination angle to optimize airflow, and a pre-placed silicone damping layer between the third dovetail protrusion and the third dovetail slot, suppresses noise from the dust filters. The first and second side heat dissipation brackets are coated with a graphene-aluminum nitride composite coating cured by plasma spraying on the circuit board side, improving heat dissipation efficiency. An arc-shaped stop is provided to improve the absorption rate of impact. A combination of guide adjustment grooves and bolt mounting seats allows for adjustment of bolt fixing positions according to different equipment environments, improving applicability.

[0036] The manufacturing process of this embodiment is as follows:

[0037] Circuit board body pretreatment → inner layer board processing trapezoidal positioning groove → heat conduction block selection and assembly → heat sink bracket positioning and installation → screw fixing → shock absorption system assembly → dustproof mesh assembly → vibration aging test.

[0038] The trapezoidal positioning groove assembly uses a laser displacement sensor to monitor the gap online. The locking adhesive requires baking at 80°C for 30 minutes to cure, with a shear strength ≥15MPa.

[0039] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A high vibration-resistant adjustable heat dissipation bracket circuit board structure, comprising a circuit board body (18), wherein the circuit board body (18) comprises, from top to bottom, a first inner layer board (13), a first circuit layer (14), a first semi-cured layer (15), a second inner layer board (16), a second semi-cured layer (12), a second circuit layer (17), and a third inner layer board (11), characterized in that: It also includes a first-side heat dissipation bracket (19), a second-side heat dissipation bracket (20), and an arc-shaped stop (10). The first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) each have mounting protrusions (30) on opposite sides, and the arc-shaped stop (10) is installed between the two opposite mounting protrusions (30); The first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) are fixed to the circuit board body (18) by screws (21) on both sides. The circuit board body (18) has anti-loosening thread grooves on all four sides of its upper surface that cooperate with the screws (21). The thread grooves are pre-coated with thread locking adhesive. Two heat-conducting blocks (22) are arranged sequentially from top to bottom on one side of the first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) and below the mounting protrusion (30); each heat-conducting block (22) has a tapered guide at its end; the upper heat-conducting block (22) corresponds to the first inner layer plate (13), and the lower heat-conducting block (22) corresponds to the second inner layer plate (16); trapezoidal positioning grooves for inserting the heat-conducting blocks (22) are provided on both sides of the first inner layer plate (13) and the second inner layer plate (16); The first side heat sink bracket (19) and the second side heat sink bracket (20) are provided with a NiTi memory alloy corrugated sheet (24) on the side opposite to each other and located below the mounting flange (30) on the side attached to the circuit board body (18). The corrugation depth is 0.5–3 mm and the deformation pressure threshold is ≥2 N. The first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) are provided with guide adjustment grooves (29) on opposite sides of the lower outer side, and bolt mounting seats (25) are fitted into the guide adjustment grooves (29) on both sides; neoprene rubber shock-absorbing pads (26) are fitted into the bottom of the bolt mounting seats (25); multiple positioning pins (31) are linearly arranged along the length direction on the lower outer side of the first side heat dissipation bracket (19) and the second side heat dissipation bracket (20); a positioning flap (32) is rotatably connected to the upper surface of the bolt mounting seat (25) through a hinge shaft; a limiting groove for receiving the positioning pins (31) is provided at the free end of the positioning flap (32); when the positioning pins (31) are inserted into the limiting groove, the bolt mounting seat (25) is locked. Both the first-side heat dissipation bracket (19) and the second-side heat dissipation bracket (20) have gradient heat dissipation holes (27). The high-heat area hole diameter of the circuit board body (18) is 3.0mm±0.1mm, and the low-heat area hole diameter of the circuit board body (18) is 1.0mm±0.1mm. The hole wall is inclined at 30°±5°. The high-heat area corresponds to the power device area of ​​the circuit board body (18). The first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) are provided with dustproof mesh storage cavities, and stainless steel dustproof mesh (23) is provided in the dustproof mesh storage cavities.

2. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The mounting protrusion (30) of the first side heat sink bracket (19) and the mounting protrusion (30) of the second side heat sink bracket (20) are both formed with a first dovetail groove on their opposite sides. The arc-shaped stop block (10) is provided with a first dovetail insert block that is inserted into the first dovetail groove on its opposite two sides.

3. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The torque of the screw (21) is 0.8–1.2 N•m.

4. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The cone angle of the tapered guide is 15°±1°, the depth of the trapezoidal positioning groove is 2.0mm±0.1mm, and the clearance fit with the heat-conducting block (22) is ≤0.05mm.

5. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The guide adjustment groove (29) is provided with a second dovetail protrusion (28) along its length direction, and the bolt mounting seat (25) is provided with a second dovetail fitting groove that cooperates with the second dovetail protrusion (28).

6. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The hardness of the neoprene rubber shock-absorbing pad is 60±5 Shore A.

7. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The bottom and top of the dustproof net storage cavity are provided with a third dovetail groove with a groove depth of 2.0mm±0.1mm; the edge of the stainless steel dustproof net (23) is provided with a third dovetail protrusion with a protrusion height of 1.8mm±0.05mm, and a silicone damping layer with a thickness of 0.2mm is pre-placed between the third dovetail protrusion and the third dovetail groove.

8. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The first side heat dissipation bracket (19) and the second side heat dissipation bracket (20) are coated with a graphene-aluminum nitride composite coating cured by plasma spraying on the circuit board side. The coating has a thickness of 50μm±5μm, a surface resistance of (1.0±0.3)×10³Ω, and a thermal conductivity of ≥95W / mK.

9. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The outer surface of the arc-shaped stop (10) is coated with an antistatic coating and has an embedded polyurethane buffer layer with a thickness of 1.0mm ± 0.1mm.

10. The high vibration-resistant adjustable heat dissipation bracket circuit board structure according to claim 1, characterized in that: The bottom of the bolt mounting base (25) is provided with a disc spring assembly with a spring stiffness coefficient of 50N / mm±5N / mm, a spring material of 60Si2MnA, and a pre-compression of 0.2–0.5mm.

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