AMOLED module chip protection mechanism

Abstract

The utility model discloses a kind of AMOLED module chip protection mechanism belong to amoled module technical field, including circuit board, the driving chip is fixed with on circuit board top surface, the circuit board top surface is also fixedly connected with the mounting seat of mouth shape, the driving chip is located inside mounting seat. This AMOLED module chip protection mechanism, through the cooperation of bottom frame, outer side plate and first elastic sheet of protective cover, electromagnetic shielding to driving chip is realized, through outer side plate and protective cover, mechanical protection to driving chip is realized, avoid external force directly affecting driving chip, through heat dissipation block bonding driving chip, realize the heat dissipation of driving chip, compared with existing device, avoid the problem that electromagnetic shielding and mechanical protection influence heat dissipation, improve heat dissipation effect and practicality.

Description

Technical Field

[0001] This utility model belongs to the field of AMOLED module technology, and in particular relates to an AMOLED module chip protection mechanism. Background Technology

[0002] AMOLED (Active-matrix organic light-emitting diode) is a display technology. OLED (Organic Light Emitting Diode) describes a specific type of thin-film display technology: organic electroluminescent display; AM (Active Matrix) refers to the pixel addressing technology behind it. AMOLED technology is primarily used in smartphones and continues to evolve towards lower power consumption, lower cost, and larger screen sizes.

[0003] When existing AMOLED modules are operating, the driver chip generates strong electromagnetic signals. The electromagnetic interference signals generated between the chips can cause individual chips to malfunction. In current technologies, most solutions involve adding a shield directly to the outside of the driver chip. However, this shield design restricts airflow around the driver chip, affecting its proper heat dissipation.

[0004] To address this issue, we propose a protective mechanism for AMOLED module chips. Utility Model Content

[0005] The purpose of this invention is to solve the problem of electromagnetic shielding affecting heat dissipation in the prior art, and to propose an AMOLED module chip protection mechanism.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An AMOLED module chip protection mechanism includes a circuit board. A driver chip is fixedly mounted on the top surface of the circuit board, and a U-shaped mounting base is also fixedly connected to the top surface of the circuit board. The driver chip is located inside the mounting base. The mounting base includes a bottom frame fixedly connected to the top surface of the circuit board. An outer plate is fixedly extended upward from the outer wall of the bottom frame. A first elastic sheet is fixedly connected to the top of the outer plate facing the driver chip. A protective cover is provided inside the outer plate, covering the driver chip. A heat sink that fits the driver chip is fixedly connected to the top wall of the inner side of the protective cover.

[0008] Preferably, the first elastic sheet is trapezoidal.

[0009] Preferably, an inner side plate is fixedly connected to the inner side wall of the bottom frame, and a second elastic sheet is fixedly connected to the top of the side of the inner side plate facing away from the driving chip.

[0010] Preferably, the top surface of the bottom frame has a mounting groove for inserting the bottom end of the protective cover.

[0011] Preferably, the mounting groove is provided with a sponge, and the sponge is impregnated with adhesive that matches the protective cover.

[0012] Preferably, the top surface of the protective cover has multiple heat dissipation grooves.

[0013] In summary, the technical effects and advantages of this utility model are as follows: This AMOLED module chip protection mechanism achieves electromagnetic shielding of the driver chip through a protective cover in conjunction with the bottom frame, outer side plate, and first elastic sheet; it also achieves mechanical protection of the driver chip through the outer side plate and protective cover, preventing external forces from directly affecting the driver chip; and it achieves heat dissipation of the driver chip by attaching a heat sink to the driver chip. Compared with existing devices, it avoids the problem of electromagnetic shielding and mechanical protection affecting heat dissipation, thus improving heat dissipation effect and practicality.

[0014] In addition, the mounting groove accommodates the height tolerance of the protective cover, and the adhesive is used to bond and fix the protective cover to the mounting groove. The use of sponge can reduce the amount of adhesive used, saving costs. The sponge can also fill the gap between the protective cover and the mounting groove, preventing the adhesive layer from being too thick and affecting the fixing effect, thus improving the fixing stability. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 Cross-sectional side view of this utility model;

[0017] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0018] Figure 4 This is a top view of the present invention after the protective cover has been removed.

[0019] In the diagram: 1. Circuit board; 2. Driver chip; 3. Mounting base; 4. Base frame; 5. Outer side plate; 6. First elastic sheet; 7. Protective cover; 8. Heat sink; 9. Inner side plate; 10. Second elastic sheet; 11. Mounting groove; 12. Sponge; 13. Glue; 14. Heat dissipation trench. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figure 1 , Figure 4 An AMOLED module chip protection mechanism includes a circuit board 1, a driver chip 2 fixedly mounted on the top surface of the circuit board 1, and a U-shaped mounting base 3 fixedly connected to the top surface of the circuit board 1. The driver chip 2 is located inside the mounting base 3. (See reference...) Figure 2-4 The mounting base 3 includes a base frame 4 fixedly connected to the top surface of the circuit board 1. An outer side plate 5 is fixedly extended upward from the outer side wall of the base frame 4. A first elastic sheet 6 is fixedly connected to the top of the outer side plate 5 facing the driver chip 2. A protective cover 7 is provided on the inner side of the outer side plate 5, covering the driver chip 2. A heat sink 8 that fits the driver chip 2 is fixedly connected to the top wall of the inner side of the protective cover 7. The gap between the heat sink 8 and the driver chip 2 can also be filled with common techniques such as thermal paste to improve heat dissipation. This is quite common and will not be described in detail.

[0022] Reference Figure 2-4 This AMOLED module chip protection mechanism, during use, achieves electromagnetic shielding of the driver chip 2 through the bottom frame 4, outer side plate 5, first elastic sheet 6, and protective cover 7. Due to the characteristics of electromagnetic shielding, the bottom frame 4, outer side plate 5, first elastic sheet 6, and protective cover 7 should all be made of metal. The bottom frame 4, outer side plate 5, and protective cover 7 provide mechanical protection for the driver chip 2, preventing external forces from directly affecting the driver chip 2. During chip use, the chip's heat is transferred to the heat sink 8 and dissipated to the outside through the top wall of the protective cover 7, improving heat dissipation and avoiding the problem of poor heat dissipation due to an overly enclosed chip environment caused by electromagnetic shielding and mechanical protection. The bottom frame 4, outer side plate 5, and first elastic sheet 6 can be made of aluminum or steel to reduce costs, while the protective cover 7 can be made of copper to improve heat dissipation.

[0023] Reference Figure 4 The first elastic sheet 6 is trapezoidal. The trapezoidal design can cover the gap between the outer plate 5 and the protective cover 7 as much as possible, thereby improving the electromagnetic shielding effect. There is only a seam between adjacent first elastic sheets 6, which facilitates the dripping of adhesive remover during subsequent disassembly.

[0024] Reference Figure 2-4 An inner side plate 9 is fixedly connected to the inner wall of the bottom frame 4. A second elastic sheet 10 is fixedly connected to the top of the side of the inner side plate 9 facing away from the driving chip 2. The inner side plate 9 and the second elastic sheet 10 provide inner support and limit for the protective cover 7, which improves the strength of the protective cover 7 and thus improves the protective strength of the mechanism.

[0025] The bottom frame 4 has a mounting groove 11 on its top surface for inserting the bottom end of the protective cover 7. With the design of the mounting groove 11, the bottom end of the protective cover 7 is located between the bottom end and the top end of the mounting groove 11, which facilitates the heat sink 8 to fit the top surface of the driver chip 2 and improves its practicality.

[0026] The mounting groove 11 is equipped with a sponge 12, which is impregnated with adhesive 13 that matches the protective cover 7. The deformation of the sponge 12, in conjunction with the adhesive 13, enables the bottom end of the protective cover 7 to be bonded and fixed. The deformation of the sponge 12 can accommodate the problem of inconsistent lengths of the bottom end of the protective cover 7 inserted into the mounting groove 11 due to tolerances, thus improving its practicality in actual use.

[0027] During installation, glue 13 is dripped into the mounting groove 11, and then the protective cover 7 is inserted between the first elastic sheet 6 and the second elastic sheet 10. After completion, the protective cover 7 is pressed down, and the bottom end of the protective cover 7 enters the mounting groove 11 and squeezes the sponge 12 until the bottom surface of the heat sink 8 is attached to the top surface of the driver chip 2. At this time, continuous downward pressure is applied to the protective cover 7 until the glue 13 is set. The protective cover 7 is then fixedly installed in the mounting base 3, thus completing the installation of the protective mechanism.

[0028] When repairing the driver chip 2, simply drip a desiccant into the gap between adjacent first elastic sheets 6. The desiccant enters the mounting groove 11 along the outer wall of the protective cover 7, reacts with the adhesive 13 to desiccate, and then the protective cover 7 can be lifted, exposing the driver chip 2 for repair. Desiccant is existing technology and commonly used in circuit board repair, so it will not be elaborated upon further.

[0029] Reference Figure 2 The top surface of the protective cover 7 has multiple heat dissipation grooves 14, which increase the surface area of ​​the top surface of the protective cover 7, thereby improving the heat dissipation effect. It should be noted that the protective cover 7 and the heat sink 8 should be integrally molded to improve the heat transfer efficiency between the heat sink 8 and the protective cover 7, thereby further improving the heat dissipation effect.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An AMOLED module chip protection mechanism, comprising a circuit board (1), characterized in that, The circuit board (1) has a driver chip (2) fixedly mounted on its top surface. The circuit board (1) also has a U-shaped mounting base (3) fixedly connected to its top surface. The driver chip (2) is located inside the mounting base (3). The mounting base (3) includes a bottom frame (4) fixedly connected to the top surface of the circuit board (1). The outer side wall of the bottom frame (4) is fixedly extended upward with an outer plate (5). The top of the outer plate (5) facing the driver chip (2) is fixedly connected with a first elastic sheet (6). The inner side of the outer plate (5) is provided with a protective cover (7) covering the driver chip (2). The top wall of the inner side of the protective cover (7) is fixedly connected with a heat sink (8) that fits the driver chip (2).

2. The AMOLED module chip protection mechanism according to claim 1, characterized in that, The first elastic sheet (6) is trapezoidal.

3. The AMOLED module chip protection mechanism according to claim 1, characterized in that, The inner side plate (9) is fixedly connected to the inner side wall of the bottom frame (4) upward, and the top of the inner side plate (9) facing away from the driving chip (2) is fixedly connected to the second elastic sheet (10).

4. The AMOLED module chip protection mechanism according to claim 3, characterized in that, The bottom frame (4) has an installation groove (11) on its top surface for the bottom end of the protective cover (7) to be inserted.

5. The AMOLED module chip protection mechanism according to claim 4, characterized in that, The mounting groove (11) is provided with a sponge (12), and the sponge (12) is impregnated with glue (13) that matches the protective cover (7).

6. The AMOLED module chip protection mechanism according to claim 1, characterized in that, The top surface of the protective cover (7) has multiple heat dissipation grooves (14).

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