A PCM panel and battery

Abstract

The embodiment of the utility model provides a kind of PCM board and battery, it is related to PCM board field.The PCM board includes mainboard and current-carrying auxiliary part, the internal wiring of mainboard has current-carrying narrow area, current-carrying auxiliary part is electrically connected with the internal wiring of current-carrying narrow area, and heat dissipation enhancement area is also provided on current-carrying auxiliary part.The PCM board is attached current-carrying auxiliary part on mainboard, increases the current-carrying capacity of the current-carrying narrow area of mainboard, so that PCM board meets current-carrying requirement, and current-carrying auxiliary part is also set in the current-carrying narrow area of mainboard, which increases the strength of the current-carrying narrow area of mainboard, avoids the fracture and deformation of current-carrying narrow area in assembly process, in addition, current-carrying auxiliary part and heat dissipation enhancement area provided on current-carrying auxiliary part also increase the local heat dissipation capacity of PCM board, improve heat dissipation efficiency, avoid the problem of temperature of the current-carrying narrow area of mainboard being too high.The embodiment of the utility model also provides a kind of battery, including the PCM board.

Description

Technical Field

[0001] This utility model relates to the field of PCM boards, and more specifically, to a PCM board and a battery. Background Technology

[0002] The PCM board (Protection Circuit Module) is an indispensable part of batteries in consumer electronics products. It is used to prevent overcharging and over-discharging, thereby ensuring battery safety during use. The requirements for capacity and charge / discharge rates in 3C consumer electronics batteries are increasingly demanding. To achieve higher battery capacity and faster charge / discharge rates, the PCM board needs to withstand greater current carrying capacity and temperature rise. This is especially true in narrow, localized areas where insufficient current carrying capacity and slow heat dissipation lead to higher temperatures.

[0003] Existing technologies often increase the width of the PCM board or the thickness of the copper to increase the current carrying capacity and heat dissipation area. However, increasing the width and copper thickness of the PCM board will increase the overall size of the PCM board, making assembly inconvenient and increasing material costs. Utility Model Content

[0004] This invention provides a PCM board and a battery that can solve the problem of excessive temperature caused by local narrowing of the PCM board.

[0005] The embodiments of this utility model can be implemented as follows: An embodiment of this utility model provides a PCM board, which includes: The motherboard includes internal traces, which have a current-carrying narrow area. A first current-carrying end and a second current-carrying end are respectively provided at both ends of the current-carrying narrow area. The current-carrying auxiliary component includes a first auxiliary current-carrying end and a second auxiliary current-carrying end, the first auxiliary current-carrying end being electrically connected to the first current-carrying end, and the second auxiliary current-carrying end being electrically connected to the second current-carrying end; the current-carrying auxiliary component is provided with a heat dissipation enhancement area.

[0006] Optionally, the current-carrying auxiliary component includes a copper busbar and an insulating layer. The insulating layer is attached to the outside of the copper busbar. The two ends of the copper busbar are electrically connected to the first current-carrying end and the second current-carrying end, respectively. At least part of the insulating layer exposes copper to form a heat dissipation enhancement area.

[0007] Optionally, the heat dissipation enhancement area is provided with a heat dissipation enhancement layer, which at least partially covers the heat dissipation enhancement area.

[0008] Optionally, the heat dissipation enhancement layer is a graphene coating, a thermally conductive plastic layer, or a silver foil layer.

[0009] Optionally, a spacer cavity is formed between the current-carrying auxiliary component and the motherboard, and a heat dissipation structure is provided in the spacer cavity; the heat dissipation structure is connected to the current-carrying auxiliary component, and / or the heat dissipation structure is connected to the motherboard.

[0010] Optionally, the heat dissipation structure includes heat dissipation fins, which are wavy and bent. The crests of the heat dissipation fins are attached to and fixed to the surface of the current-carrying auxiliary component, and the troughs of the heat dissipation fins are attached to and fixed to the surface of the motherboard. The wavy surface of the heat dissipation fins forms a flow channel to connect the areas on both sides of the current-carrying auxiliary component.

[0011] Optionally, the heat dissipation structure includes a heat sink, with the two opposite flat surfaces of the heat sink respectively attached and fixed to the motherboard and the current-carrying auxiliary component.

[0012] Optionally, there are multiple heat sinks, which are distributed at intervals.

[0013] Optionally, the motherboard has a first surface and a second surface, the first surface being provided with a current-carrying auxiliary component, and / or the second surface being provided with a current-carrying auxiliary component.

[0014] An embodiment of this utility model also provides a battery, including the PCM board described above.

[0015] The beneficial effects of this utility model embodiment: The PCM board includes a motherboard and a current-carrying auxiliary component. The motherboard includes internal traces with a current-carrying narrow area. A first current-carrying end and a second current-carrying end are respectively provided at both ends of the current-carrying narrow area. The current-carrying auxiliary component includes a first auxiliary current-carrying end and a second auxiliary current-carrying end. The first auxiliary current-carrying end is electrically connected to the first current-carrying end, and the second auxiliary current-carrying end is electrically connected to the second current-carrying end. By setting the current-carrying auxiliary component, the current-carrying capacity of the current-carrying narrow area of ​​the motherboard is increased, so that the current-carrying capacity of the motherboard meets the requirements. The current-carrying auxiliary component also increases the heat dissipation area of ​​the current-carrying narrow area of ​​the motherboard and improves the heat dissipation speed. At the same time, the current-carrying auxiliary component is also provided with a heat dissipation enhancement area, which further enhances the heat dissipation efficiency and helps to reduce the local temperature.

[0016] The battery includes a PCM board, which has all the functions of a PCM board. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a side view of the PCM board provided in an embodiment of the present invention; Figure 2 This is a top view of the PCM board provided in an embodiment of the present invention; Figure 3 This is a schematic diagram showing a narrow current-carrying region with a first current-carrying end and a second current-carrying end provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the other side of the current-carrying narrow region provided in an embodiment of this utility model; Figure 5 This is a schematic diagram of one side of the first auxiliary current-carrying end and the second auxiliary current-carrying end of the current-carrying auxiliary component provided in an embodiment of this utility model; Figure 6 This is a schematic diagram of one side of the heat dissipation enhancement area of ​​the current-carrying auxiliary component provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the heat dissipation fins provided in an embodiment of the present invention.

[0019] Icons: 1-Motherboard; 10-Current-carrying narrow area; 101-First current-carrying end; 102-Second current-carrying end; 11-First surface; 12-Second surface; 14-Pad; 15-Via; 2-Current-carrying auxiliary component; 201-First auxiliary current-carrying end; 202-Second auxiliary current-carrying end; 21-Heat-dissipation enhancement area; 3-Heat-dissipation enhancement layer; 4-Spacer cavity; 5-Heat-dissipation structure; 50-Heat-dissipation fins. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] The terms “comprising,” “including,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0026] Unless otherwise explicitly specified and limited, terms such as "setup" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0028] PCM boards (Protection Circuit Modules) are commonly used in batteries of consumer electronics products to prevent overcharging and over-discharging, ensuring safe battery use. Currently, the requirements for capacity and charge / discharge rates in 3C consumer electronics batteries are increasingly demanding. To achieve higher battery capacity and faster charge / discharge rates, PCM boards need to withstand greater current carrying capacity and temperature rise. This is especially true in narrow, localized areas of the PCM board, where the current-carrying capacity is insufficient due to the small cross-section, leading to rapid temperature rise and slow heat dissipation, resulting in locally high temperatures.

[0029] Existing technologies often employ methods such as increasing the width or copper thickness of the PCM board, or increasing the number of layers to allow the current-carrying copper foil to carry current in layers, thereby increasing the current-carrying capacity and heat dissipation area. However, given the limited size of the entire battery module, increasing the width of the PCM board will reduce the size and capacity of the battery cell. Increasing the copper thickness or the number of layers will increase the thickness of the PCM board, causing interference between the PCM board and the assembly frame of the entire battery module, posing a potential risk of PCM board failure. Furthermore, the narrowness of some areas of the PCM board poses a risk of breakage due to stress during assembly, and it does not improve heat dissipation efficiency.

[0030] In view of the above reasons, the present invention provides a PCM board and battery that can solve the above problems, and will be described in detail below.

[0031] Please refer to Figures 1 to 6 The PCM board includes a main board 1 and a current-carrying auxiliary component 2. The main board 1 includes internal wiring with a current-carrying narrow area 10. A first current-carrying end 101 and a second current-carrying end 102 are respectively provided at both ends of the current-carrying narrow area 10. The current-carrying auxiliary component 2 includes a first auxiliary current-carrying end 201 and a second auxiliary current-carrying end 202. The first auxiliary current-carrying end 201 is electrically connected to the first current-carrying end 101, and the second auxiliary current-carrying end 202 is electrically connected to the second current-carrying end 102. A heat dissipation enhancement area 21 is also provided on the current-carrying auxiliary component 2. The current-carrying narrow area 10 of the motherboard 1 is equipped with a current-carrying auxiliary component 2 to increase its current-carrying capacity, so that the current-carrying capacity of the current-carrying narrow area 10 of the motherboard 1 meets the design requirements. The current-carrying auxiliary component 2 also increases the heat dissipation area of ​​the current-carrying narrow area 10 of the motherboard 1, improves the heat dissipation speed of the entire PCM board, and further enhances the heat dissipation speed and improves the heat dissipation efficiency through the heat dissipation enhancement area 21. This helps to reduce the local temperature of the current-carrying narrow area 10 of the motherboard 1 and avoid the temperature rise of the current-carrying narrow area 10 too quickly.

[0032] In this embodiment of the present invention, the main board 1 of the PCM board has a current-carrying auxiliary component 2 attached to its surface, which can not only improve the current-carrying capacity of the current-carrying narrow area 10 of the main board 1, but also increase the heat dissipation area and reduce the production cost.

[0033] In this embodiment, the PCM board includes a main board 1 and several current-carrying auxiliary components 2. The internal wiring material of the main board 1 in this embodiment is copper. Specifically, the internal wiring of the main board 1 may include one or more layers of copper foil. The thickness of the inner copper layer (i.e., the thickness of the internal wiring) can be designed according to performance requirements, such as 0.5 ounces, 1 ounce, 2 ounces, etc. In this embodiment, the inner copper layer thickness of the PCM board is approximately 2 ounces (here, ounce refers to the thickness achieved by evenly spreading 2 ounces of copper on an area of ​​1 square foot). Of course, in other embodiments, the internal wiring material of the main board 1 can also be copper alloy, aluminum, aluminum alloy, or other conductive metals or conductive non-metallic materials; this is not limited.

[0034] The motherboard 1 has a first surface 11 and a second surface 12, with the first surface 11 facing the second surface 12. Both the first surface 11 and the second surface 12 are coated with solder resist ink to act as an insulating layer. When it is necessary to attach the current-carrying auxiliary component 2 to the first surface 11, the second surface 12, or both of the first surface 11 and the second surface 12 of the motherboard 1, the solder resist ink on the surface of the motherboard 1 is cleaned at a preset position to expose the solderable copper. The current-carrying auxiliary component 2 can be attached only to the first surface 11 of the motherboard 1, only to the second surface 12 of the motherboard 1, or simultaneously to both the first surface 11 and the second surface 12 of the motherboard 1, depending on the specific mounting configuration.

[0035] It is worth mentioning that, in this embodiment, the mainboard 1 refers to the entire assembly of a board made of non-conductive material, electronic components mounted on the board, and multiple copper foils disposed inside the board. These copper foils are embedded in the non-conductive material board. Because multiple electronic components are distributed on the non-conductive material board according to a certain pattern, the structure and shape of some copper foils are limited, resulting in a smaller current-carrying cross-sectional area for some of the designed copper foils, or a smaller conductive connection area for several connected copper foils, which cannot meet the current-carrying requirements of large current flows. Therefore, this embodiment of the invention provides a current-carrying auxiliary component 2. By attaching the current-carrying auxiliary component 2 to the mainboard 1, the current-carrying capacity is increased. The current-carrying auxiliary component 2 is actually conductively connected to the inner copper foil.

[0036] The internal traces (copper foil) of the motherboard 1 have a first current-carrying end 101 and a second current-carrying end 102. The first current-carrying end 101 and the second current-carrying end 102 extend to the first surface 11 of the motherboard 1 or to the second surface 12 of the motherboard 1, or extend to both the first surface 11 and the second surface 12 of the motherboard 1, through electrical connection. Pads 14 are provided at the positions where the first current-carrying end 101 and the second current-carrying end 102 extend to the first surface 11 and / or the second surface 12 of the motherboard 1, for mounting current-carrying auxiliary components 2.

[0037] Several current-carrying auxiliary components 2 are mounted on the surface of the motherboard 1 (first surface 11 or second surface 12 or first surface 11 and second surface 12) using surface mount technology (SMT), and are electrically connected to the first current-carrying terminal 101 and the second current-carrying terminal 102. Surface mount technology is a circuit assembly technology that mounts leadless or short-lead chip components on the surface of the motherboard 1, and then assembles them by reflow soldering or dip soldering. Compared with assembling components using screws, surface mount technology eliminates the need for additional connection structures between the components and the motherboard 1. Therefore, this embodiment of the invention utilizes surface mount technology to assemble the current-carrying auxiliary components 2, which can reduce the product size of the PCM board; furthermore, it allows the mounting of the current-carrying auxiliary components 2 to be performed simultaneously with the mounting of other components, reducing production steps, optimizing the production process, and improving production efficiency.

[0038] Specifically, each current-carrying auxiliary component 2 has exposed copper at both ends, forming a first auxiliary current-carrying end 201 and a second auxiliary current-carrying end 202. The first auxiliary current-carrying end 201 is connected to the pad 14 at the first current-carrying end 101 via surface mount technology, and the second auxiliary current-carrying end 202 is connected to the pad 14 at the second current-carrying end 102 via surface mount technology. In this embodiment, the current-carrying auxiliary component 2 is preferably a copper busbar. When mounting the copper busbar via surface mount technology, the first auxiliary current-carrying end 201 and the second auxiliary current-carrying end 202 of the copper busbar can be soldered to the pad 14 using, for example, solder paste. Of course, an insulating layer is provided on the outside of the copper busbar. The insulating layer can be a high-temperature resistant solder resist ink, which is applied by electroplating.

[0039] There are several ways to mount the current-carrying auxiliary components 2 on the motherboard 1. For example, all the current-carrying auxiliary components 2 can be mounted on the first surface 11 of the motherboard 1 by surface mounting, or all the current-carrying auxiliary components 2 can be mounted on the second surface 12 of the motherboard 1 by surface mounting, or some of the current-carrying auxiliary components 2 can be mounted on the first surface 11 of the motherboard 1, and the remaining current-carrying auxiliary components 2 can be mounted on the second surface 12 of the motherboard 1.

[0040] When a narrow current-carrying area 10 needs to carry a larger current or requires winding, the current-carrying auxiliary component 2 can be symmetrically arranged on both sides of the motherboard 1. That is, at least one current-carrying auxiliary component 2 is provided on each of the first surface 11 and the second surface 12 of the motherboard 1. For example, if the current-carrying capacity required by a narrow current-carrying area 10 cannot be achieved by using a single current-carrying auxiliary component 2, continuing to attach current-carrying auxiliary components 2 on the same side would waste a lot of space, increase the size of the motherboard 1, and affect the arrangement of adjacent components. In this case, if the current-carrying auxiliary components 2 are symmetrically attached on the other side of the motherboard 1, the current-carrying capacity of the narrow current-carrying area 10 can be further improved without affecting the arrangement of components. Furthermore, the current-carrying auxiliary components 2 located on the first surface 11 and the second surface 12 of the motherboard 1 can also be assembled into a whole according to design requirements.

[0041] Furthermore, since the current-carrying auxiliary component 2 is externally attached to the motherboard 1, its heat dissipation effect is better than that of a thick copper layer located inside the motherboard 1 compared to the solution of increasing the copper thickness of the motherboard 1.

[0042] Continue to refer to Figure 5 and Figure 6 To enhance the heat dissipation capacity of the current-carrying auxiliary component 2 and thus the overall heat dissipation capacity of the PCM board, a heat dissipation enhancement area 21 is also provided on the current-carrying auxiliary component 2. For example, the current-carrying auxiliary component 2 is a copper busbar with an insulating layer on its exterior. The insulating layer is made of solder resist ink. By removing part of the solder resist ink to expose the internal copper, one or more heat dissipation enhancement areas 21 are formed. The internal copper exposed to the air can quickly conduct heat to the air, thus improving heat dissipation efficiency.

[0043] Of course, while the exposed internal copper can accelerate heat dissipation, a heat dissipation enhancement layer 3 can still be provided in the heat dissipation enhancement area 21. The heat dissipation enhancement layer 3 is in close contact with the surface of the exposed internal copper. The internal copper transfers heat to the heat dissipation enhancement layer 3, and then the heat is transferred to the air through the heat dissipation enhancement layer 3. It should be understood that the thermal conductivity of the heat dissipation enhancement layer 3 should be superior to that of copper to dissipate heat more quickly. For example, the heat dissipation enhancement layer 3 can be a graphene coating or graphene sheet. When using a graphene coating, nano-sized graphene particles are coated and adhered to the exposed inner copper surface. When using a graphene sheet, pre-prepared graphene sheets that meet the required dimensions are attached to the exposed inner copper surface. Alternatively, the heat dissipation enhancement layer 3 can also be a silver foil layer. Silver has a higher thermal conductivity than copper, and when a silver foil layer is attached to the exposed inner copper surface, heat dissipation can be accelerated. Another example is that the heat dissipation enhancement layer 3 can be a thermally conductive adhesive or thermally conductive plastic with higher thermal conductivity than copper. Covering the exposed inner copper surface with thermally conductive adhesive or thermally conductive plastic increases the heat dissipation speed. Of course, printed solder paste, thermally conductive silicone, or other heat dissipation materials or phase change materials can also be used to increase the thermal conductivity and heat dissipation effect of the PCM board in the thickness direction and improve heat dissipation efficiency.

[0044] The current-carrying auxiliary component 2 can be a flat plate in the thickness direction, directly attaching to the motherboard 1 during mounting. This method does not significantly increase the thickness dimension of the PCM board, but its heat dissipation efficiency is lower. Therefore, the current-carrying auxiliary component 2 can also be designed as a trapezoidal arch shape. Except for the electrical connection area between the current-carrying auxiliary component 2 and the motherboard 1, the remaining parts of the current-carrying auxiliary component 2 are spaced apart from the motherboard 1, forming a spacer cavity 4 in the thickness direction. This not only increases the heat dissipation area but also prevents the heat from the current-carrying auxiliary component 2 from being transferred to the motherboard 1 over a large area, thus avoiding rapid temperature rise.

[0045] Optionally, a heat dissipation structure 5 is provided inside the partition cavity 4 to further increase the heat dissipation speed and improve the heat dissipation efficiency.

[0046] refer to Figure 7 The heat dissipation structure 5 is a heat dissipation fin 50. For example, the heat dissipation fin 50 is a continuously bent thin plate with excellent thermal conductivity. By continuously bending and spacing it, a larger surface area is presented in a smaller area. When the heat dissipation fin 50 is installed in the spacer cavity 4, the motherboard 1 or the current-carrying auxiliary component 2, or both, can conduct heat to the heat dissipation fin 50. The heat dissipation fin 50 dissipates heat through its continuous and large surface area, transferring the heat to the air. The heat dissipation fin 50 can also be bent into a wave shape. The crests of the heat dissipation fin 50 are attached to the surface of the current-carrying auxiliary component 2, and the troughs are attached to the surface of the motherboard 1. The wave surface of the heat dissipation fin 50 forms a flow channel to connect the areas on both sides of the current-carrying auxiliary component 2, thereby forming convection heat dissipation. Of course, the heat dissipation fin 50 can also be connected only to the motherboard 1, only to the current-carrying auxiliary component 2, or simultaneously to both the motherboard 1 and the current-carrying auxiliary component 2. The heat sink 50 is simply attached to the motherboard 1 / current-carrying auxiliary component 2 / motherboard 1 and current-carrying auxiliary component 2, and does not serve to conduct electricity.

[0047] The heat dissipation fins 50 can also take other forms, such as corrugated sheets with multiple inclined openings to increase the heat dissipation area; or, multiple small heat-conducting fins can be welded to the corrugated sheet, with one side of each fin welded to the sheet, further increasing the surface area of ​​the heat dissipation fins 50. Other specific forms and structures of the heat dissipation fins 50 are not listed here. It is understood that any heat dissipation fin 50 that can increase the heat dissipation surface area falls within the protection scope of this utility model embodiment.

[0048] To balance heat dissipation speed and the strength of the narrow current-carrying area 10 of the motherboard 1, the heat dissipation structure 5 can be configured as multiple heat sinks. These heat sinks are spaced apart, and the two opposite sides of each heat sink are fixedly connected to the motherboard 1 and the current-carrying auxiliary component 2, for example, by using thermally conductive adhesive. The heat sinks not only increase the heat dissipation area but also support the current-carrying auxiliary component 2, thereby increasing the strength of the narrow current-carrying area 10 of the motherboard 1 and preventing bending, deformation, or breakage during assembly. At the same time, they also prevent the current-carrying auxiliary component 2 from deforming during assembly, thus connecting the current-carrying auxiliary component 2 and the motherboard 1 into one unit.

[0049] The heat sink can be a cylinder, a polygonal prism, or other irregularly shaped structure. A larger surface area is more beneficial for improving heat dissipation efficiency. For example, a heat sink with protruding edges (similar to a cylindrical gear) has a much larger surface area than a conventional cylinder, resulting in stronger heat dissipation. Alternatively, heat dissipation holes can be formed on the cylinder or prism, distributed radially along the cylinder or prism. Another example is the surface of the cylinder or prism being densely covered with multiple pits or protrusions to increase the heat dissipation surface area. It is understood that there can be many forms of heat sinks; the above descriptions are merely illustrative. This embodiment cannot describe all forms of heat sinks, but any improvements derived from the teachings of this embodiment should be included within the protection scope of this utility model.

[0050] The heat sink can be made of materials such as silver pillars, graphene pillars, thermally conductive plastic pillars, thermally conductive adhesive pillars, or thermally conductive silicone pillars. Taking thermally conductive adhesive pillars with excellent thermal conductivity as an example, the thermally conductive adhesive has good thermal conductivity, adhesion, and insulation properties to achieve good thermal conduction, good adhesion to the current-carrying auxiliary component 2, and without affecting the electrical connections on the motherboard 1. The heat sink can simultaneously help dissipate heat from both the motherboard 1 and the current-carrying auxiliary component 2.

[0051] Refer again Figure 1 To further enhance the heat dissipation capacity of the PCM board under high current overload, multiple heat dissipation vias 15 can be formed on the motherboard 1. The vias 15 penetrate the motherboard 1, aiding in heat dissipation and transfer. Preferably, the vias 15 can be positioned near the current-carrying auxiliary component 2 to further assist in heat dissipation for the current-carrying auxiliary component 2. Besides assisting in heat dissipation for the current-carrying auxiliary component 2, the vias 15 can also help dissipate heat from the inner copper layers of the motherboard 1 and the components on the motherboard 1. The diameter and number of vias 15 are not limited here; the shape of the vias 15 can be round, square, elliptical, or other shaped holes. Of course, heat dissipation structures 5, such as heat sinks 50, that enhance the heat dissipation surface area can also be arranged within the vias 15, thus not only dissipating heat from the motherboard 1 but also from the components on the motherboard 1 and the current-carrying auxiliary component 2 mounted on the motherboard 1.

[0052] Optionally, the shape of the current-carrying auxiliary component 2 is the same as that of the current-carrying narrow area 10 of the motherboard 1. This can save materials and reduce size, while ensuring that the current-carrying capacity meets the requirements. Of course, in other embodiments, the shape of the current-carrying auxiliary component 2 may also be different from that of the current-carrying narrow area 10 of the motherboard 1, and this is not limited.

[0053] The current-carrying auxiliary component 2 can be a rigid plate, such as a copper busbar or aluminum strip, or a soft conductive material, such as silver foil.

[0054] The PCM board of this embodiment increases the current-carrying capacity of the narrow current-carrying area 10 of the motherboard 1 by attaching the current-carrying auxiliary component 2 on the motherboard 1, thus enabling the PCM board to meet the current-carrying requirements. Simultaneously, the placement of the current-carrying auxiliary component 2 on the narrow current-carrying area 10 of the motherboard 1 also increases the strength of the narrow current-carrying area 10, preventing breakage and deformation during assembly. Furthermore, the current-carrying auxiliary component 2 and the heat dissipation enhancement area 21 on it increase the local heat dissipation capacity of the PCM board, improving heat dissipation efficiency and preventing the problem of excessive temperature in the narrow current-carrying area 10 of the motherboard 1. The current-carrying auxiliary component 2 of this embodiment is attached to a local surface of the motherboard 1, without increasing the overall length and width of the PCM board or significantly increasing the production cost, offering multiple advantages.

[0055] The method for manufacturing the PCM board according to this utility model embodiment: (1) Remove the solder resist ink from the surfaces of the internal traces on the motherboard 1 that are close to the narrow current-carrying area 10. Combine the size of the solder pad 14 to expose a suitable window area (i.e., expose a certain area of ​​solderable copper surface). Select a suitable stencil according to the size and shape of the window area and use the stencil to print solder paste in the window area.

[0056] It should be noted that the shape of the window area can be circular, square, or other shapes, depending on the shape of the base of the solder pad 14. Similarly, the size of the window area also needs to be determined based on the size of the base of the pre-soldered solder pad 14. The window area can be set on the first surface 11 of the motherboard 1, or on the second surface 12 of the motherboard 1, or on both the first surface 11 and the second surface 12 of the motherboard 1, so that the loading flow aid 2 can be attached to the first surface 11 of the motherboard 1, or to the second surface 12 of the motherboard 1, or to both the first surface 11 and the second surface 12 of the motherboard 1. Since the outer side of the internal traces in this embodiment is solder resist ink, the solder resist ink has an insulating effect, corresponding to the insulating layer. The method of printing solder paste using a stencil is to align the window on the stencil with the window area, and use a printing machine to brush the solder paste onto the stencil. The solder paste is deposited into the window area through the window on the stencil.

[0057] (2) The pre-made current-carrying auxiliary component 2 is attached to the surface of the motherboard 1. The first auxiliary current-carrying end 201 and the second auxiliary current-carrying end 202 exposed at both ends of the current-carrying auxiliary component 2 are aligned with the window area on the motherboard 1 and bonded together with solder paste. The bonded current-carrying auxiliary component 2 and the motherboard 1 are placed in a heating oven for the solder paste to be heated and cured, so that the current-carrying auxiliary component 2 is firmly fixed on the motherboard 1.

[0058] (3) A heat dissipation enhancement area 21 is opened on the current-carrying auxiliary component 2. For example, a certain area of ​​exposed copper area is opened on the outer surface layer of the current-carrying auxiliary component 2 to form a heat dissipation enhancement area 21 to increase the heat dissipation effect of the PCM board. Of course, graphene sheets can also be pasted on the heat dissipation enhancement area 21 using thermally conductive adhesive to further increase the heat dissipation efficiency. At the same time, a heat dissipation structure 5 can be pasted and fixed in the spacer cavity 4 between the motherboard 1 and the current-carrying auxiliary component 2 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0059] An embodiment of this utility model also provides a battery that includes the aforementioned PCM board and has all the functions of a PCM board.

[0060] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A PCM board, characterized in that, include: The motherboard (1) includes internal wiring, the internal wiring has a current-carrying narrow area (10), and a first current-carrying end (101) and a second current-carrying end (102) are respectively provided at both ends of the current-carrying narrow area (10). The current-carrying auxiliary component (2) includes a first auxiliary current-carrying end (201) and a second auxiliary current-carrying end (202). The first auxiliary current-carrying end (201) is electrically connected to the first current-carrying end (101), and the second auxiliary current-carrying end (202) is electrically connected to the second current-carrying end (102). The current-carrying auxiliary component (2) is provided with a heat dissipation enhancement area (21).

2. The PCM board according to claim 1, characterized in that, The current-carrying auxiliary component (2) includes a copper busbar and an insulating layer. The insulating layer is attached to the outside of the copper busbar. The two ends of the copper busbar are electrically connected to the first current-carrying end (101) and the second current-carrying end (102) respectively. The insulating layer exposes at least part of the copper to form the heat dissipation enhancement area (21).

3. The PCM board according to claim 2, characterized in that, The heat dissipation enhancement area (21) is provided with a heat dissipation enhancement layer (3), which at least partially covers the heat dissipation enhancement area (21).

4. The PCM board according to claim 3, characterized in that, The heat dissipation enhancement layer (3) is a graphene coating, a thermally conductive plastic layer, or a silver foil layer.

5. The PCM board according to claim 1, characterized in that, A spacer cavity (4) is formed between the current-carrying auxiliary component (2) and the main board (1), and a heat dissipation structure (5) is provided in the spacer cavity (4); the heat dissipation structure (5) is connected to the current-carrying auxiliary component (2), and / or the heat dissipation structure (5) is connected to the main board (1).

6. The PCM board according to claim 5, characterized in that, The heat dissipation structure (5) includes heat dissipation fins (50), which are wavy and bent. The peaks of the heat dissipation fins (50) are attached to the surface of the current-carrying auxiliary component (2), and the troughs of the heat dissipation fins (50) are attached to the surface of the motherboard (1). The wave surface of the heat dissipation fins (50) forms a flow channel to connect the areas on both sides of the current-carrying auxiliary component (2).

7. The PCM board according to claim 5, characterized in that, The heat dissipation structure (5) includes a heat sink, and the two opposite planes of the heat sink are respectively attached and fixed to the motherboard (1) and the current-carrying auxiliary component (2).

8. The PCM board according to claim 7, characterized in that, The number of heat sinks is multiple, and the multiple heat sinks are distributed at intervals.

9. The PCM board according to any one of claims 1-8, characterized in that, The motherboard (1) has a first surface (11) and a second surface (12), wherein the first surface (11) is provided with the current-carrying auxiliary component (2), and / or the second surface (12) is provided with the current-carrying auxiliary component (2).

10. A battery, characterized in that, Includes the PCM board as described in any one of claims 1-9.

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