Circuit board assembly and electronic device

Abstract

The application discloses a circuit board assembly and an electronic device, and belongs to the technical field of electronic devices. The circuit board assembly comprises a board body, a first pad group and a second pad group are arranged on one side of the board body, a first device is connected to the first pad group, and at least part of the first device covers at least part of the pads of the second pad group.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] In related technologies, due to the different price points of electronic devices and the different needs of users, the memory of the same electronic device may take two forms: Universal Flash Storage (UFS) and Embedded Multimedia Card (eMMC). Each type of memory requires pads to be placed at two locations on the circuit board, and these two pads usually have other electronic components or circuits between them. However, in practice, only one type of memory (UFS or eMMC) is used, resulting in a waste of internal space in the electronic device. Utility Model Content

[0003] This application aims to provide a circuit board assembly and electronic device that can solve the technical problem of wasted circuit board space caused by the need to match multiple types of devices on the circuit board of electronic devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, comprising:

[0006] The board body has a first pad group and a second pad group on one side.

[0007] A first device is connected to a first pad group, and at least a portion of the first device covers at least a portion of the pads in a second pad group.

[0008] Secondly, embodiments of this application provide an electronic device, including:

[0009] The circuit board assembly provided in the first aspect embodiment.

[0010] In embodiments of this application, the circuit board assembly includes a board body and a first device. A first pad group and a second pad group are provided on one side of the board body. The first pad group and the second pad group are respectively matched with a device. The first device is matched with the first pad group, and the second device is matched with the second pad group. During installation, only the first device is installed as required. Furthermore, at least a portion of the first device covers at least a portion of the pads of the second pad group, thereby reducing the unusable area on the board body. This helps to improve the layout of the devices on the circuit board assembly, thereby reducing the volume of the circuit board assembly and reducing the space occupied by the circuit board assembly inside the electronic device.

[0011] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0012] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0013] Figure 1 This is a schematic diagram of a circuit board assembly according to an embodiment of this application;

[0014] Figure 2 This is a schematic diagram showing the cooperation of a circuit board assembly, a first device, and a second device according to an embodiment of this application;

[0015] Figure 3 This is a schematic diagram showing the positions of the first and second devices in a circuit board assembly according to an embodiment of this application;

[0016] Figure 4 This is one of the schematic diagrams of a first device in a circuit board assembly according to an embodiment of this application;

[0017] Figure 5 This is a second schematic diagram of the first device in a circuit board assembly according to an embodiment of this application;

[0018] Figure 6 This is one of the schematic diagrams of a circuit board assembly according to an embodiment of this application;

[0019] Figure 7 This is a second schematic diagram of a circuit board assembly according to an embodiment of this application;

[0020] Figure 8 This is a third schematic diagram of a circuit board assembly according to an embodiment of this application;

[0021] Figure 9 This is a fourth schematic diagram of a circuit board assembly according to an embodiment of this application;

[0022] Figure 10 This is a fifth schematic diagram of a circuit board assembly according to an embodiment of this application;

[0023] Figure 11 This is one of the schematic diagrams of a processor in a circuit board assembly according to an embodiment of this application;

[0024] Figure 12 This is a second schematic diagram of a processor in a circuit board assembly according to an embodiment of this application;

[0025] Figure 13 This is one of the layout diagrams of the first device, processor, and memory in a circuit board assembly according to an embodiment of this application;

[0026] Figure 14 This is a second schematic diagram showing the layout of the first device, processor, and memory in a circuit board assembly according to an embodiment of this application;

[0027] Figure 15 This is a third schematic diagram showing the layout of the first device, processor, and memory in a circuit board assembly according to an embodiment of this application;

[0028] Figure 16 This is a fourth schematic diagram showing the layout of the first device, processor, and memory in a circuit board assembly according to an embodiment of this application;

[0029] Figure 17 This is one of the schematic diagrams showing the solder joint definition of the first device in a circuit board assembly according to an embodiment of this application;

[0030] Figure 18 This is a second schematic diagram showing the solder joint definition of the first device in a circuit board assembly according to an embodiment of this application;

[0031] Figure 19 This is a schematic diagram of an electronic device according to an embodiment of this application.

[0032] Figure label:

[0033] 1 Electronic device, 10 Circuit board assembly, 11 Board body, 111 First pad group, 112 First inner ring pad, 113 First outer ring pad, 114 Second pad group, 115 Second inner ring pad, 116 Second outer ring pad, 117 Pad, 118 First side, 119 Second side, 12 First device, 121 First region, 122 Solder joint, 123 Second region, 124 Conductive point, 14 Insulating adhesive, 15 Second device, 16 First solder, 17 Second solder, 20 Processor, 21 First connection region, 22 Second connection region, 30 Memory. Detailed Implementation

[0034] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0036] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] The following is combined Figures 1 to 19 This application describes a circuit board assembly 10 and an electronic device 1 according to embodiments thereof.

[0039] Firstly, such as Figure 1 and Figure 2 As shown, this application embodiment proposes a circuit board assembly 10, including: a board body 11, on one side of the board body 11 being a first pad group 111 and a second pad group 114; a first device 12 connected to the first pad group 111, at least a portion of the first device 12 covering at least a portion of the pads 117 of the second pad group 114.

[0040] In the embodiments of this application, the circuit board assembly 10 includes a board body 11 and a first device 12. A first pad group 111 and a second pad group 114 are provided on one side of the board body 11. The first pad group 111 and the second pad group 114 are respectively matched with a device. The first device 12 is matched with the first pad group 111, and the second device 15 is matched with the second pad group 114. During installation, only the first device 12 is installed as required, and at least a portion of the first device 12 covers at least a portion of the pads 117 of the second pad group 114, thereby reducing the unusable area on the board body 11, which helps to improve the layout of the devices on the circuit board assembly 10, thereby reducing the volume of the circuit board assembly 10 and reducing the space occupied by the circuit board assembly 10 inside the electronic device 1.

[0041] According to some embodiments of this application, the pads 117 of the first pad group 111 are distributed in a first rectangular array; the pads 117 of the second pad group 114 are distributed in a second rectangular array.

[0042] Specifically, the pads 117 of the first pad group 111 are distributed in a first rectangular array, that is, the outermost ring of the pads 117 in the first pad group 111 is rectangularly distributed, so that the pads 117 in the first pad group 111 are distributed within the rectangle, making the first pad group 111 more regular and facilitating the planning and design of various components on the board 11. The outermost ring of the pads 117 in the second pad group 114 is rectangularly distributed, so that the pads 117 in the second pad group 114 are distributed within the rectangle, making the second pad group 114 more regular and facilitating the planning and design of various components on the board 11.

[0043] like Figure 2 As shown, in some embodiments of this application, the first pad group 111 and the second pad group 114 are used selectively. If both are used simultaneously, the first device 12 and the second device 15 will overlap, making installation impossible.

[0044] like Figure 1 As shown, according to some embodiments of this application, the first side 118 of the first pad group 111 and the second side 119 of the second pad group 114 are arranged in parallel; the first side 118 and the second side 119 are arranged opposite to each other.

[0045] Specifically, when the outermost pads 117 of the first pad group 111 and the second pad group 114 are both rectangularly distributed, the first side 118 of the first pad group 111 and the second side 119 of the second pad group 114 are arranged in parallel, which makes the first pad group 111 and the second pad group 114 roughly form a larger rectangle, making the first pad group 111 and the second pad group 114 more regular, occupying a smaller area of ​​the board body 11, and making it easier to lay out and miniaturize the circuit board assembly 10.

[0046] like Figure 1 As shown, according to some embodiments of this application, the number of pads 117 distributed on the first side 118 and the number of pads 117 distributed on the second side 119 are equal and are arranged in a one-to-one correspondence.

[0047] Specifically, the number of pads 117 distributed on the first side 118 and the number of pads 117 distributed on the second side 119 are equal, and the pads 117 on the first side 118 and the pads 117 on the second side 119 are arranged in a one-to-one correspondence. This makes the pads 117 in the first pad group 111 and the second pad group 114 arranged in a rectangular array, making the first pad group 111 and the second pad group 114 more regular. The entire first pad group 111 and the second pad group 114 only occupy a rectangular area of ​​the board body 11, and the utilization rate of the rectangular area is high, further reducing the area occupied by the first pad group 111 and the second pad group 114 on the board body 11.

[0048] like Figure 1 As shown, according to some embodiments of this application, the first pad group 111 includes a first inner ring pad 112 and a first outer ring pad 113, with the first inner ring pad 112 located inside the first outer ring pad 113; the second pad group 114 includes a second inner ring pad 115 and a second outer ring pad 116, with the second inner ring pad 115 located inside the second outer ring pad 116.

[0049] Specifically, the first pad group 111 includes a first inner ring pad 112 and a first outer ring pad 113. The first inner ring pad 112 is located inside the first outer ring pad 113. The first device 12 is matched by the arrangement of the first inner ring pad 112 and the first outer ring pad 113. Similarly, the second pad group 114 includes a second inner ring pad 115 and a second outer ring pad 116. The second inner ring pad 115 is located inside the second outer ring pad 116. The second device 15 is matched by the arrangement of the second inner ring pad 115 and the second outer ring pad 116.

[0050] In some embodiments of this application, the first pad group 111 and the second pad group 114 have the same number of pads, the same pad arrangement, and corresponding pad positions. This improves the versatility of the first pad group 111 and the second pad group 114.

[0051] like Figure 1 As shown, according to some embodiments of this application, the minimum distance L1 between the first pad group 111 and the second pad group 114 is less than twice the distance L2 between any adjacent pads 117 within the first inner ring pad 112, the first outer ring pad 113, the second inner ring pad 115, or the second outer ring pad 116.

[0052] Specifically, the minimum distance L1 between the first pad group 111 and the second pad group 114 is less than twice the distance L2 between any adjacent pads 117 within the first inner ring pad 112, the first outer ring pad 113, the second inner ring pad 115, or the second outer ring pad 116. This reduces the spacing between the first pad group 111 and the second pad group 114, making the first pad group 111 and the second pad group 114 closer together, and further reducing the area occupied by the first pad group 111 and the second pad group 114 on the board 11.

[0053] The distance L1 between the first pad group 111 and the second pad group 114, and the distance L2 between any adjacent pads 117 within the first inner ring pad 112, the first outer ring pad 113, the second inner ring pad 115, and the second outer ring pad 116 can all be equal.

[0054] like Figure 4 and Figure 5 As shown, according to some embodiments of this application, the first device 12 has a first region 121 and a second region 123 on the side facing the board 11. A plurality of solder points 122 are disposed in the first region 121, and the solder points 122 in the first region 121 are soldered to a first pad group 111. Wherein, as... Figure 4 and Figure 5 There are two types of first devices 12.

[0055] Specifically, the side of the first device 12 facing the board 11 is divided into a first region 121 and a second region 123. Multiple solder points 122 are disposed in the first region 121. The solder points 122 in the first region 121 are soldered to the first pad group 111. At least part of the second region 123 covers at least part of the second pad group 114. That is, the solder points 122 of the first device 12 only occupy part of the area of ​​the first device 12, while the second region 123 protrudes from the first pad group 111 and covers at least part of the second pad group 114. Other devices cannot usually be disposed between the second region 123 and the board 11. Therefore, this arrangement is suitable for both the installation and cooperation of the first device 12 and the board 11 and the cooperation of choosing one of the first device 12 and the second device 15, so that different electronic devices 1 can use the same circuit board assembly 10, reducing design costs.

[0056] like Figure 3 and Figure 4As shown, according to some embodiments of this application, a second region 123 surrounds the outside of the first region 121, and an insulating adhesive 14 is disposed between the first device 12 and the board 11. Specifically, except for the soldering positions, the insulating adhesive 14 fills the gap between the first device 12 and the board 11. The second region 123 is provided with a plurality of conductive points 124. The insulating adhesive 14 is used to isolate the conductive points 124 and the second pad group 114 within the second region 123, and also serves to fix the first device 12.

[0057] Specifically, the second region 123 surrounds the outside of the first region 121. The part of the first region 121 except for the solder joint 122 and the second region 123 are provided with insulating adhesive 14. The insulating adhesive 14 achieves insulation between the first device 12 and the board 11 except for the solder joint 122. The second region 123 is also provided with conductive points 124 for testing or other purposes. The insulating adhesive 14 can isolate the conductive points 124 and the second pad group 114 in the second region 123, reduce the impact of the second pad group 114 on the first device 12, and thus improve the reliability of the first device 12.

[0058] like Figure 6 As shown, when the first device 12 and the board 11 are not soldered, a first solder 16 is applied to the board 11, and a second solder 17 is applied to the first device 12, as follows. Figure 7 As shown, after the first device 12 and the board 11 are soldered, a collapse will occur between the first solder 16 and the second solder 17, resulting in a closer distance between the first device 12 and the board 11.

[0059] And such Figure 4 and Figure 5 As shown, the first device 12 also includes a conductive point 124. To reduce the possibility of contact between the conductive point 124 and the second pad group 114 of the board 11, as shown... Figure 8 As shown, an insulating adhesive 14 is provided between the board body 11 and the first device 12 to isolate the first device 12 from the board body 11. In addition, the insulating adhesive 14 can also reduce the possibility of short circuits between the first solder 16 and between the second solder 17.

[0060] Specifically, such as Figure 9 As shown, after soldering the first component 12, insulating adhesive 14 is filled between the first component 12 and the board 11 through position A, as follows. Figure 10 As shown, insulating adhesive 14 will fill the space between the first device 12 and the board 11 along path B.

[0061] According to some embodiments of this application, the first device 12 is one of a general-purpose flash memory device and an embedded multimedia memory device; the second pad group 114 is used to carry the other of the general-purpose flash memory device and the embedded multimedia memory device.

[0062] Specifically, the first device 12 is a general-purpose flash memory device, and the second pad group 114 is used to carry an embedded multimedia memory device, that is, the second device 15 is an embedded multimedia memory device; or, the first device 12 is an embedded multimedia memory device, and the second pad group 114 is used to carry a general-purpose flash memory device, that is, the second device 15 is a general-purpose flash memory device.

[0063] There are differences in cost and performance between general-purpose flash memory devices and embedded multimedia memory devices. Therefore, by setting up the first pad group 111 and the second pad group 114, the circuit board assembly 10 can solder flash memory devices or embedded multimedia memory devices according to actual application requirements, thereby improving the adaptability of the board 11 to different memory devices and reducing the design cost of the circuit board assembly 10.

[0064] The following explanation will be based on the example of the first device 12 being a general-purpose flash memory device or an embedded multimedia memory device.

[0065] like Figure 17 As shown, the solder ball 122 of a general-purpose flash memory device is defined as follows:

[0066] Solder point 122 corresponds to the unused pin (NC);

[0067] Core power supply pins (VDDiQ, VDDiQ2)

[0068] Solder point 122 corresponding to the power supply pins (VCCQ, VCCQ2) of the internal controller unit;

[0069] Solder point 122 corresponding to the core voltage pin (VDDi);

[0070] Solder point 122 corresponding to the differential clock pins (C-, C+);

[0071] Solder point 122 corresponding to the main power ground pin (Vss);

[0072] Solder point 122 is reserved for the pin (RFU);

[0073] Solder point 122 corresponding to the charge output pins (CPOUT1, CPOUT2);

[0074] Solder point 122 corresponding to the voltage power supply pin (LSS);

[0075] Solder point 122 corresponding to the receive fork pair pins (Din0_t, Din0_c, Din1_t, Din1_c);

[0076] Send the solder joint 122 corresponding to the differential pair pins (DOUT0_t, DOUT0_c, DOUT1_t, DOUT1_c);

[0077] Solder point 122 corresponding to the reference clock pin (REF_CLK);

[0078] Solder point 122 corresponding to the reset pin (RST_n);

[0079] Refer to solder point 122 corresponding to the heavier resistor pins (RZQ1, RZQ2);

[0080] The solder point 122 corresponds to the pin (NC (Index)) indicating the soldering position.

[0081] Solder point 122 corresponding to the voltage shielding frame pins (VSF1, VSF2, VSF3, VSF4, VSF5, VSF6, VSF7 and VSF8);

[0082] like Figure 18 As shown, the solder joint 122 of the embedded multimedia storage device is defined as follows:

[0083] Solder point 122 corresponds to the unused pin (NC);

[0084] The solder joints 122 corresponding to the signal pins (DAT) include DAT0, DAT1, DAT2, DAT3, DAT4, DAT5, DAT6 and DAT7;

[0085] Solder point 122 corresponding to the main power ground pin (Vss);

[0086] Solder point 122 is reserved for the pin (RFU);

[0087] Solder point 122 corresponding to the core power supply pin (VDDi);

[0088] Solder point 122 corresponds to the ground pin (Vssq) of the internal controller;

[0089] Solder point 122 corresponds to the power supply pin (Vccq) of the internal controller;

[0090] Solder point 122 corresponding to the power supply pin (Vcc) of the internal memory cell;

[0091] Solder point 122 corresponding to the voltage shielded frame (VSF) pin;

[0092] Solder point 122 corresponding to the data strobe pin (DS);

[0093] Solder point 122 corresponding to the reset pin (RSTN);

[0094] Solder point 122 corresponding to the command signal pin (CMD);

[0095] Solder point 122 corresponding to the clock signal pin (CLK).

[0096] Because the solder joints 122 of general-purpose flash memory devices and embedded multimedia memory devices are defined differently, separate pad groups are required to support them respectively. In related technologies, pads for general-purpose flash memory devices and embedded multimedia memory devices are typically located at different positions on the board. However, general-purpose flash memory devices and embedded multimedia memory devices also occupy a large amount of space outside the solder joints, resulting in excessive space occupation on the board. In this embodiment, by arranging the first pad group 111 and the second pad group 114 side by side, after setting the first device 12, the first device 12 covers the second pad group 114, thereby reducing the space occupied by the first pad group 111 and the second pad group 114 on the board 11. Specifically, the area occupied by the first pad group 111 and the second pad group 114 on the board 11 is reduced by about 50%.

[0097] Analysis reveals that both general-purpose flash memory devices and embedded multimedia memory devices have solder joints 122 concentrated in the center, with empty areas around them. Since flash memory devices and embedded multimedia memory devices are used selectively, therefore, as... Figure 3 As shown, in terms of design, the first device 12 and the second device 15 can be considered to overlap to reduce the layout space.

[0098] By utilizing the structural characteristics of flash memory devices and embedded multimedia memory devices, the cost of designing an additional circuit board assembly 10 is saved, as well as the area occupied by the solder pads on the board body 11 is reduced.

[0099] In related technologies, the first device is mounted by a rack. The total area occupied by the first pad group 111 and the second pad group 114 of the circuit board assembly 10 provided in this application embodiment is small, and it occupies less layout resources of the board body 11. Moreover, compared with the rack solution, it has lower cost and thinner thickness, which is conducive to reducing the cost and making the electronic device 1 thinner and lighter.

[0100] This allows for the development, production, and inventory of only one type of circuit board assembly 10 for two different device models, greatly saving on non-repetitive engineering costs and material costs associated with designing multiple circuit board assemblies 10.

[0101] Furthermore, it saves space in the circuit board assembly 10: compared to reserving an area for independent pads 117 for different types of devices, the circuit board assembly 10 provided in this application embodiment only uses one pad 117 area, which optimizes the layout of the circuit board assembly 10, frees up space for other functional devices, and eliminates the need for complex or expensive special devices, resulting in low technical risk and easy rapid implementation in products.

[0102] The circuit board assembly 10 provided in this application embodiment also improves production flexibility. Manufacturers can flexibly choose to solder flash memory devices or embedded multimedia memory devices on a unified board 11 according to market demand, device supply and cost conditions, and quickly launch product versions with different configurations, thereby enhancing market responsiveness.

[0103] The circuit board assembly 10 also includes a processor 20 and a memory 30, and the communication locations between different types of processors 20 and the first device 12 may vary.

[0104] like Figure 11 As shown, the first connection area 21, which connects the processor 20 to the flash memory device, and the second connection area 22, which connects to the embedded multimedia storage device, are on the same side.

[0105] like Figure 12 As shown, the first connection area 21, which connects the processor 20 to the flash memory device, and the second connection area 22, which connects to the embedded multimedia storage device, are on different sides.

[0106] The layout of the processor 20, memory 30, and first device 12 typically has four types, such as... Figure 13 , Figure 14 , Figure 15 and Figure 16 As shown, Figure 13 As shown, the processor 20, memory 30, and first device 12 are arranged in a straight line; as Figure 14 As shown, the first device 12, processor 20, and memory 30 are arranged in a straight line, as... Figure 15 As shown, the first device 12, processor 20, and memory 30 are arranged in a triangular pattern, as follows: Figure 16 As shown, the processor 20, memory 30 and the first device 12 are arranged in a triangular pattern.

[0107] like Figure 11 As shown, the processor 20, flash memory device, and embedded multimedia storage device are located in the lower right corner, and can be implemented as follows: Figure 13 , Figure 14 and Figure 16 The processor 20, memory 30 and first device 12 are arranged in such a way that the line length between the first device 12 and the processor 20 is less than or equal to 60 millimeters (mm). Figure 15The layout of the processor 20, memory 30 and the first device 12 shown can easily result in a trace length exceeding 60 mm between the first device 12 and the processor 20. Of course, in such cases, the number of layers in the board 11 can be increased, for example, the board 11 can be changed from 8 layers and 2 levels to 10 layers and 2 levels. Or, if space allows, the first device 12 can be placed above the memory 30 to shorten the trace path.

[0108] like Figure 12 As shown, the first connection area 21 between the processor 20 and the flash memory device is near the center, and the second connection area 22 connecting the processor 20 and the embedded multimedia storage device is near the upper right corner. This can be achieved using... Figure 13 and Figure 15 The processor 20, memory 30, and first device 12 are arranged in a layout such that the line length between the first device 12 and the processor 20 is less than or equal to 60 mm. Figure 14 The layout of the processor 20, memory 30, and first device 12 shown in the diagram makes it easy for the wire length between the processor 20 and the flash memory device to exceed 60 mm. Figure 16 The layout of the processor 20, memory 30 and first device 12 shown indicates that the line length between the processor 20 and the embedded multimedia storage device can easily exceed 60 mm.

[0109] Since flash memory devices and embedded multimedia memory devices have many conductive points 124 in addition to the solder joints 122, in order to reduce the contact between the conductive points 124 and the solder on the board 11, two sets of stencils can be set. When the board 11 needs to solder devices on the first pad group 111, the first stencil is used to apply the solder, so that there is no solder on the second pad group 114. When the board 11 needs to solder devices on the second pad group, the second stencil is used to apply the solder, so that there is no solder on the first pad group 111, thereby reducing the impact of the solder on the conductive points 124.

[0110] And, as Figure 9 As shown, after the first device 12 is installed, insulating glue 14 can be filled between the first device 12 and the board 11 via A, such as... Figure 10 As shown, the insulating adhesive 14 flows along path B, thereby filling the space between the first device 12 and the board 11, isolating the conductive point 124 from the board 11, and reducing the possibility of short circuits between solders.

[0111] Secondly, such as Figure 19 As shown, this application provides an electronic device 1, including a circuit board assembly 10 as provided in the first aspect embodiment.

[0112] In the embodiments of this application, since the electronic device 1 includes the circuit board assembly 10 as provided in the first aspect embodiment, it has all the beneficial effects of the circuit board assembly 10 as provided in the first aspect embodiment, which will not be described in detail here.

[0113] In this application embodiment, electronic device 1 can be a terminal or other devices besides a terminal. For example, electronic device 1 can be a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not make specific limitations.

[0114] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0115] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, include: A board body, wherein a first pad group and a second pad group are provided on one side of the board body; A first device is connected to the first pad group, and at least a portion of the first device covers at least a portion of the pads in the second pad group.

2. The circuit board assembly according to claim 1, characterized in that, The pads of the first pad group are distributed in the first rectangular array; The pads of the second pad group are distributed in the second rectangular array.

3. The circuit board assembly according to claim 2, characterized in that, The first side of the first pad group and the second side of the second pad group are arranged in parallel. The first side and the second side are arranged opposite to each other.

4. The circuit board assembly according to claim 3, characterized in that, The number of pads distributed on the first side and the number of pads distributed on the second side are equal and are set in a one-to-one correspondence.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The first pad group includes a first inner ring pad and a first outer ring pad, wherein the first inner ring pad is located inside the first outer ring pad; The second pad group includes a second inner ring pad and a second outer ring pad, with the second inner ring pad located inside the second outer ring pad.

6. The circuit board assembly according to claim 5, characterized in that, The minimum distance between the first pad group and the second pad group is less than twice the distance between any adjacent pads within the first inner ring pad, the first outer ring pad, the second inner ring pad, or the second outer ring pad.

7. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The first device has a first region and a second region on the side facing the board, and a plurality of solder joints are disposed in the first region, wherein the solder joints in the first region are soldered to the first pad group.

8. The circuit board assembly according to any one of claims 1 to 4, characterized in that, An insulating adhesive is provided between the first device and the plate.

9. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The first device is one of a general-purpose flash memory device and an embedded multimedia memory device; The second pad group is used to carry another of the general-purpose flash memory device and the embedded multimedia memory device.

10. An electronic device, characterized in that, include: The circuit board assembly as described in any one of claims 1 to 9.

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