High-voltage single-layer cutting copper-aluminum composite circuit board

Abstract

The utility model belongs to copper aluminium composite circuit board technical field especially, it is copper aluminium composite circuit board for high -voltage single -layer cutting, including composite conductive layer, insulating base and edge protection layer, the composite conductive layer is compounded in the upper surface of insulating base, and copper aluminium composite structure of composite conductive layer matches conductive bonding layer, forms low resistance conductive passage, avoids partial heating under high voltage, the epoxy glass cloth substrate of insulating base and glass fiber reinforced net cooperate and promote the insulation strength, and the edge protection layer forms full -wrap insulation system with insulating film, effectively resists high -voltage electric field breakdown, adapts high -voltage equipment working environment, the composite conductive layer of copper aluminium composite has the conductive advantage of copper and the easy cutting characteristic of aluminium, and it is not easy to produce the edge collapse, burr when cutting, the edge protection layer of cutting edge coating seamlessly links each structure layer, avoids the edge insulation performance attenuation after cutting, can directly assemble without additional processing, improves processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of copper-aluminum composite circuit board technology, and in particular to a copper-aluminum composite circuit board for high voltage single-layer cutting. Background Technology

[0002] In fields such as high-voltage power supplies, high-voltage switches, and power testing equipment, single-layer circuit boards are widely used as circuit connection carriers due to their simple structure and convenient assembly. Traditional high-voltage single-layer circuit boards are mostly made of pure copper or pure aluminum. Pure copper circuit boards offer excellent conductivity, but their high density and cost, coupled with the tendency to chip and burr during cutting, negatively impact assembly accuracy. While pure aluminum circuit boards are low-cost and lightweight, their conductivity and mechanical strength are insufficient, making them prone to localized high temperatures under high-voltage conditions due to current overload, potentially leading to insulation failure. Furthermore, the bonding between the insulation and conductive layers in traditional single-layer circuit boards is not tight, making them susceptible to interlayer delamination under high-voltage electric fields, and the edge insulation performance deteriorates significantly after cutting. Therefore, we propose a copper-aluminum composite circuit board for high-voltage single-layer cutting. Utility Model Content

[0003] The purpose of this invention is to provide a copper-aluminum composite circuit board for high-voltage single-layer cutting, which solves the existing problems.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A high-voltage single-layer copper-aluminum composite circuit board for cutting includes a composite conductive layer, an insulating substrate, and an edge protection layer. The composite conductive layer is laminated onto the upper surface of the insulating substrate, and the two are tightly bonded together by a hot-pressing process. The composite conductive layer includes a surface copper foil and a bottom aluminum foil, with a conductive adhesive layer between the surface copper foil and the bottom aluminum foil. An anti-corrosion coating is provided on the lower surface of the insulating substrate. The edge protection layer covers the cutting edge of the circuit board and is tightly connected to the composite conductive layer, the insulating substrate, and the anti-corrosion coating. High-voltage circuit patterns are etched on the composite conductive layer, and solder bumps are provided at the nodes of the circuit patterns.

[0005] Preferably, the surface copper foil is made of oxygen-free copper and its surface is polished; the bottom aluminum foil is made of high-purity aluminum and its surface has a micro-nano uneven structure; the conductive adhesive layer is made of conductive silver paste and is filled between the surface copper foil and the bottom aluminum foil to form an integrated conductive structure.

[0006] Preferably, the insulating substrate is made of epoxy glass cloth substrate material, and a glass fiber reinforcing mesh is embedded inside; the glass fiber reinforcing mesh is distributed in a grid pattern, and circular reinforcing knots are provided at the grid nodes, and the glass fiber reinforcing mesh and epoxy base material form an interwoven structure.

[0007] Preferably, the edge protection layer includes an insulating base layer and a wear-resistant surface layer; the insulating base layer is made of silicone rubber and tightly wraps around the end face of the cut edge; the wear-resistant surface layer is made of polyimide and is composited on the outer surface of the insulating base layer, and the thickness of the edge protection layer is consistent with the overall thickness of the circuit board.

[0008] Preferably, the anti-corrosion coating is made of polytetrafluoroethylene and is formed on the lower surface of the insulating substrate by spraying; the edge of the anti-corrosion coating extends to the side of the insulating substrate and is seamlessly connected with the insulating underlayer of the edge protection layer.

[0009] Preferably, the surface of the high-voltage circuit texture is provided with an insulating film; the insulating film is made of epoxy film material, with exposed windows reserved only at the welding protrusions; the bonding surface between the insulating film and the composite conductive layer is provided with a serrated interlocking structure.

[0010] Preferably, the welding bump includes a base boss and a welding layer; the base boss is integrally formed with the composite conductive layer, and the welding layer is made of tin-lead alloy material and electroplated on the surface of the base boss; the top of the welding bump is provided with an arc-shaped transition surface, and the side is provided with an annular anti-slip groove; positioning holes and weight-reducing holes are provided on the insulating substrate; the positioning holes are evenly distributed along the edge of the circuit board, and the hole walls are provided with insulating bushings; the weight-reducing holes are located in the non-circuit area of ​​the circuit board, the hole walls are provided with rounded corner transition structures, and the inner wall of the weight-reducing holes is also covered with an insulating bottom layer of edge protection layer.

[0011] Preferably, an interface treatment layer is provided between the composite conductive layer and the insulating substrate; the interface treatment layer is formed by coating with a silane coupling agent, and the surface of the interface treatment layer is provided with microgrooves, which are interlocked with the micro-nano uneven structure of the bottom aluminum foil; a chamfered protective structure is provided at the corners of the circuit board; the chamfered protective structure is integrally formed with the edge protection layer and has an arc-shaped reinforcing rib embedded inside; the surface of the chamfered protective structure is smoothly transitioned to the anti-corrosion coating and the insulating film.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a copper-aluminum composite circuit board for high-voltage single-layer cutting. The copper-aluminum composite structure of the composite conductive layer, combined with the conductive adhesive layer, forms a low-resistance conductive path, avoiding localized heating under high voltage. The epoxy glass cloth substrate and glass fiber reinforced mesh of the insulating base work together to improve the insulation strength. The edge protection layer and the insulating film form a fully enclosed insulation system, effectively resisting high-voltage electric field breakdown and adapting to the working environment of high-voltage equipment. The copper-aluminum composite conductive layer combines the conductivity of copper with the easy cutting characteristics of aluminum, making it less prone to chipping and burrs during cutting. The edge protection layer covering the cutting edge seamlessly connects to each structural layer, avoiding the attenuation of edge insulation performance after cutting. It can be directly assembled without additional processing, improving processing efficiency. This utility model discloses a copper-aluminum composite circuit board for high-voltage single-layer cutting. The micro-grooves of the interface treatment layer are interlocked with the micro-nano uneven structure of the bottom aluminum foil. Combined with a hot-pressing composite process, the composite conductive layer is firmly bonded to the insulating substrate, preventing interlayer delamination. The glass fiber reinforcement mesh and chamfered corner protection structure in the insulating substrate significantly improve the overall mechanical strength of the circuit board, which can withstand the vibration and impact during equipment operation. The surface copper foil ensures high-efficiency conductivity, while the bottom aluminum foil enhances heat conduction, which can quickly dissipate the heat during high-voltage circuit operation and avoid local high temperature. The anti-corrosion coating on the lower surface and the edge protection layer work together to isolate corrosive media, adapting to the needs of high-voltage equipment in humid and chemically complex environments and extending service life. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a three-dimensional structural diagram of a copper-aluminum composite circuit board for high-voltage single-layer cutting proposed in this utility model. Figure 2 This is a partial three-dimensional structural diagram of a copper-aluminum composite circuit board for high-voltage single-layer cutting proposed in this utility model. Figure 3 This is a partial three-dimensional structural diagram of the interface processing layer proposed in this utility model. Figure 4 This is a partial three-dimensional structural diagram of the anti-corrosion coating proposed in this utility model.

[0015] In the diagram: 1. Composite conductive layer; 101. Surface copper foil; 102. Bottom aluminum foil; 103. Conductive adhesive layer; 104. Micro-nano uneven structure; 2. Insulating substrate; 201. Glass fiber reinforced mesh; 202. Circular reinforcing nodule; 3. Edge protection layer; 301. Insulating bottom layer; 302. Wear-resistant surface layer; 4. Anti-corrosion coating; 5. High voltage circuit texture; 501. Insulating film; 502. Exposed window; 503. Serrated interlocking structure; 6. Welding protrusion; 601. Base boss; 602. Welding layer; 603. Arc-shaped transition surface; 604. Annular anti-slip groove; 7. Positioning hole; 701. Insulating bushing; 8. Weight reduction hole; 801. Rounded corner transition structure; 9. Interface treatment layer; 901. Microgroove; 10. Chamfered protective structure; 1001. Arc-shaped reinforcing rib. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0017] refer to Figure 1-4 A high-voltage single-layer copper-aluminum composite circuit board for cutting includes a composite conductive layer 1, an insulating substrate 2, and an edge protection layer 3. The composite conductive layer 1 is laminated onto the upper surface of the insulating substrate 2, and the two are tightly bonded together by a hot-pressing process. The composite conductive layer 1 includes a surface copper foil 101 and a bottom aluminum foil 102, with a conductive adhesive layer 103 between the surface copper foil 101 and the bottom aluminum foil 102. An anti-corrosion coating 4 is provided on the lower surface of the insulating substrate 2. The edge protection layer 3 covers the cutting edge of the circuit board and is tightly connected to the composite conductive layer 1, the insulating substrate 2, and the anti-corrosion coating 4. High-voltage circuit patterns 5 are etched on the composite conductive layer 1, and solder bumps 6 are provided at the nodes of the circuit patterns 5. The copper-aluminum composite structure 1, combined with the conductive adhesive layer 103, forms a low-resistance conductive path, preventing localized heating under high voltage. The epoxy glass cloth substrate 2 and the glass fiber reinforced mesh 201 of the insulating substrate 2 work together to improve the insulation strength. The edge protection layer 3 and the insulating film 501 form a fully enclosed insulation system, effectively resisting high-voltage electric field breakdown and adapting to the working environment of high-voltage equipment. In this embodiment, the surface copper foil 101 is made of oxygen-free copper and the surface is polished. The bottom aluminum foil 102 is made of high-purity aluminum and has a micro-nano uneven structure 104 on its surface. The conductive adhesive layer 103 is made of conductive silver paste and is filled between the surface copper foil 101 and the bottom aluminum foil 102, so that the two form an integrated conductive structure.

[0018] In this embodiment, the insulating substrate 2 is made of epoxy glass cloth substrate material, with glass fiber reinforcing mesh 201 embedded inside; the glass fiber reinforcing mesh 201 is distributed in a grid pattern, and circular reinforcing knots 202 are provided at the grid nodes. The glass fiber reinforcing mesh 201 and the epoxy substrate form an interwoven structure; the copper-aluminum composite conductive layer 1 combines the conductivity of copper with the easy cutting characteristics of aluminum, and is not prone to chipping or burrs during cutting; the edge protection layer 3 covering the cut edge seamlessly connects the various structural layers, avoiding the attenuation of edge insulation performance after cutting, and can be directly assembled without additional processing, improving processing efficiency; in this embodiment, the edge protection layer 3 includes an insulating bottom layer 301 and a wear-resistant surface layer 302; the insulating bottom layer 301 is made of silicone rubber material and tightly covers the end face of the cut edge; the wear-resistant surface layer 302 is made of polyimide material and is composited on the outer surface of the insulating bottom layer 301, and the thickness of the edge protection layer 3 is consistent with the overall thickness of the circuit board.

[0019] In this embodiment, the anti-corrosion coating 4 is made of polytetrafluoroethylene and is formed on the lower surface of the insulating substrate 2 by spraying. The edge of the anti-corrosion coating 4 extends to the side of the insulating substrate 2 and is seamlessly connected with the insulating bottom layer 301 of the edge protection layer 3. The micro-grooves 901 of the interface treatment layer 9 are embedded with the micro-nano uneven structure 104 of the bottom aluminum foil 102. With the hot pressing composite process, the composite conductive layer 1 is firmly bonded to the insulating substrate 2, avoiding interlayer peeling. The glass fiber reinforcing mesh 201 and the chamfered corner protection structure 10 in the insulating substrate 2 greatly improve the overall mechanical strength of the circuit board and can resist the vibration and impact during equipment operation. In this embodiment, the surface of the high voltage circuit pattern 5 is provided with an insulating film 501. The insulating film 501 is made of epoxy film material, and an exposed window 502 is reserved only at the position of the welding protrusion 6. The bonding surface between the insulating film 501 and the composite conductive layer 1 is provided with a sawtooth interlocking structure 503.

[0020] In this embodiment, the welding bump 6 includes a base boss 601 and a welding layer 602; the base boss 601 is integrally formed with the composite conductive layer 1, and the welding layer 602 is made of tin-lead alloy and electroplated on the surface of the base boss 601; the top of the welding bump 6 is provided with an arc-shaped transition surface 603, and the side is provided with an annular anti-slip groove 604; the insulating substrate 2 is provided with positioning holes 7 and weight-reducing holes 8; the positioning holes 7 are evenly distributed along the edge of the circuit board, and the hole walls are provided with insulating bushings 701; the weight-reducing holes 8 are located in the non-circuit area of ​​the circuit board, and the hole walls are provided with rounded corner transition structures 801, and the inner wall of the weight-reducing holes 8 is also covered with the insulating bottom layer 301 of the edge protection layer 3; in this embodiment, a layer is provided between the composite conductive layer 1 and the insulating substrate 2. Interface treatment layer 9; the insulating substrate 2 can also be made of high-temperature resistant PET film, the core function of which is to block current conduction, used for insulation isolation of electrical equipment, to avoid risks such as short circuits and leakage, and to ensure that the insulation performance of the equipment meets safety standards; the interface treatment layer 9 is formed by coating with silane coupling agent, and the surface of the interface treatment layer 9 is provided with micro-grooves 901, which are interlocked with the micro-nano uneven structure 104 of the bottom aluminum foil 102; the corners of the circuit board are provided with chamfered protection structure 10; the chamfered protection structure 10 is integrally formed with the edge protection layer 3, and an arc-shaped reinforcing rib 1001 is embedded inside; the surface of the chamfered protection structure 10 is smoothly transitioned to the anti-corrosion coating 4 and the insulating film 501.

[0021] Specifically, the copper-aluminum composite structure of the composite conductive layer 1, combined with the conductive adhesive layer 103, forms a low-resistance conductive path, preventing localized heating under high voltage. The epoxy glass cloth substrate and glass fiber reinforced mesh 201 of the insulating substrate 2 work together to improve insulation strength. The edge protection layer 3 and the insulating film 501 form a fully enclosed insulation system, effectively resisting high-voltage electric field breakdown and adapting to the working environment of high-voltage equipment. The copper-aluminum composite conductive layer 1 combines the conductivity of copper with the easy-to-cut characteristics of aluminum, making it less prone to chipping and burrs during cutting. The edge protection layer 3 covering the cut edge seamlessly connects to each structural layer, preventing the edge insulation performance from decaying after cutting. It can be directly assembled without additional processing, improving processing efficiency. The micro-grooves 901 of the interface treatment layer 9 are interlocked with the micro-nano uneven structure 104 of the bottom aluminum foil 102. Combined with the hot-pressing composite process, the composite conductive layer 1 and the insulating substrate 2 are firmly bonded together, avoiding interlayer delamination. The glass fiber reinforcing mesh 201 and the chamfered corner protection structure 10 in the insulating substrate 2 greatly improve the overall mechanical strength of the circuit board and can withstand the vibration and impact during equipment operation. The surface copper foil 101 ensures high-efficiency conductivity, and the bottom aluminum foil 102 enhances heat conduction, which can quickly dissipate the heat during the operation of the high-voltage circuit and avoid local high temperature. The anti-corrosion coating 4 on the lower surface and the edge protection layer 3 work together to isolate corrosive media, adapting to the needs of high-voltage equipment in humid and multi-chemical environments and extending service life. The electroplated welding layer 602 of the welding protrusion 6 and the arc transition surface 603 facilitate precise welding of components, and the annular anti-slip groove 604 enhances the welding strength; the insulating bushing 701 of the positioning hole 7 ensures accurate assembly positioning and avoids damage to the insulation structure during assembly; the weight reduction hole 8 realizes lightweight design and reduces the overall load of the equipment.

[0022] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0023] The above provides a detailed description of a high-voltage single-layer copper-aluminum composite circuit board for cutting. Specific embodiments have been used to illustrate the principles and implementation methods of this utility model. These embodiments are merely illustrative and are intended to help understand the method and core concepts of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A copper-aluminum composite circuit board for high-voltage single-layer cutting, characterized in that, include: The composite conductive layer (1), the insulating substrate (2), and the edge protection layer (3) are bonded together. The composite conductive layer (1) is bonded to the upper surface of the insulating substrate (2) by a hot-pressing bonding process. The composite conductive layer (1) includes a surface copper foil (101) and a bottom aluminum foil (102). A conductive adhesive layer (103) is provided between the surface copper foil (101) and the bottom aluminum foil (102). An anti-corrosion coating (4) is provided on the lower surface of the insulating substrate (2). The edge protection layer (3) is wrapped around the cut edge of the circuit board and is tightly connected to the composite conductive layer (1), the insulating substrate (2), and the anti-corrosion coating (4). High-voltage circuit patterns (5) are etched on the composite conductive layer (1), and welding bumps (6) are provided at the nodes of the circuit patterns (5).

2. The copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The surface copper foil (101) is made of oxygen-free copper and the surface is polished; the bottom aluminum foil (102) is made of high-purity aluminum and the surface is provided with micro-nano uneven structure (104); the conductive adhesive layer (103) is made of conductive silver paste and is filled between the surface copper foil (101) and the bottom aluminum foil (102) to form an integrated conductive structure.

3. The copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The insulating substrate (2) is made of epoxy glass cloth substrate material and has a glass fiber reinforcing mesh (201) embedded inside. The glass fiber reinforcing mesh (201) is distributed in a grid pattern, and circular reinforcing knots (202) are provided at the grid nodes. The glass fiber reinforcing mesh (201) and the epoxy material form an interwoven structure.

4. The copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The edge protection layer (3) includes an insulating base layer (301) and a wear-resistant surface layer (302); the insulating base layer (301) is made of silicone rubber and tightly wraps around the end face of the cut edge; the wear-resistant surface layer (302) is made of polyimide and is composited on the outer surface of the insulating base layer (301), and the thickness of the edge protection layer (3) is consistent with the overall thickness of the circuit board.

5. A copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The anti-corrosion coating (4) is made of polytetrafluoroethylene and is formed on the lower surface of the insulating substrate (2) by spraying process; the edge of the anti-corrosion coating (4) extends to the side of the insulating substrate (2) and is seamlessly connected with the insulating bottom layer (301) of the edge protection layer (3).

6. The copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The surface of the high voltage circuit pattern (5) is provided with an insulating film (501); the insulating film (501) is made of epoxy film material, and an exposed window (502) is reserved only at the position of the welding protrusion (6); the bonding surface between the insulating film (501) and the composite conductive layer (1) is provided with a sawtooth interlocking structure (503).

7. A copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, The welding bump (6) includes a base boss (601) and a welding layer (602); the base boss (601) is integrally formed with the composite conductive layer (1), and the welding layer (602) is made of tin-lead alloy material and electroplated on the surface of the base boss (601); the top of the welding bump (6) is provided with an arc-shaped transition surface (603), and the side is provided with an annular anti-slip groove (604); the insulating substrate (2) is provided with positioning holes (7) and weight-reducing holes (8); the positioning holes (7) are evenly distributed along the edge of the circuit board, and the hole wall is provided with an insulating bushing (701); the weight-reducing holes (8) are located in the non-circuit area of ​​the circuit board, and the hole wall is provided with a rounded corner transition structure (801), and the inner wall of the weight-reducing holes (8) is also covered with the insulating bottom layer (301) of the edge protection layer (3).

8. A copper-aluminum composite circuit board for high-voltage single-layer cutting according to claim 1, characterized in that, An interface treatment layer (9) is provided between the composite conductive layer (1) and the insulating substrate (2); the interface treatment layer (9) is formed by coating with a silane coupling agent, and micro-grooves (901) are provided on the surface of the interface treatment layer (9). The micro-grooves (901) are interlocked with the micro-nano uneven structure (104) of the bottom aluminum foil (102); a chamfered protection structure (10) is provided at the corner of the circuit board; the chamfered protection structure (10) is integrally formed with the edge protection layer (3), and an arc-shaped reinforcing rib (1001) is embedded inside; the surface of the chamfered protection structure (10) is smoothly transitioned to the anti-corrosion coating (4) and the insulating film (501).

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