High performance copper clad laminate

Abstract

The utility model discloses a kind of high-performance copper-clad plate, belong to copper-clad plate technical field, including substrate layer, and the heat dissipation mechanism and stabilizing mechanism of integration setting on substrate layer and work in conjunction, wherein, heat dissipation mechanism from bottom to top sequentially includes fixedly connected with the heat dissipation strip of substrate layer top surface, the copper foil layer of covering heat dissipation strip, fixedly connected with the honeycomb structure layer of copper foil layer top surface, and the protective film of being arranged in outermost layer and bottom surface fixedly connected with wave plate, honeycomb structure layer and wave plate jointly constitute multi-path heat dissipation structure, stabilizing mechanism includes the buffer pad of being covered in substrate layer outer wall four quarters, and the side plate of being installed in substrate layer two sides and plate body and being provided with ventilation groove, side plate and substrate layer are fixedly connected by triangular block between. The utility model realizes efficient heat convection by multilevel heat dissipation structure, meanwhile, provides strong support using composite stabilizing mechanism and takes into account heat dissipation, effectively improve the thermal stability and structural reliability of copper-clad plate.

Description

Technical Field

[0001] This utility model relates to the field of copper clad laminate technology, and in particular to a high-performance copper clad laminate. Background Technology

[0002] Copper clad laminates, as the core substrate for manufacturing printed circuit boards, primarily function to provide reliable electrical connections and mechanical support for electronic components. With the rapid development of electronic technology towards high power and high-density integration, the heat generated by electronic devices during operation has increased dramatically. Traditional copper clad laminates mainly rely on the substrate itself for natural heat dissipation. However, under high load conditions, heat is easily accumulated locally on the substrate, leading to excessively high temperatures. This high temperature not only reduces the electrical performance and reliability of the copper clad laminate but also accelerates material aging and may even cause high-temperature failure, seriously affecting the stable operation of electronic devices.

[0003] At the same time, high-performance copper-clad laminates not only face severe thermal challenges, but also must maintain their structural integrity in complex mechanical environments. Existing copper-clad laminate structures are usually relatively simple and lack targeted structural reinforcement and buffering designs. When subjected to external mechanical forces, the substrate is prone to warping, deformation, or even micro-cracks, which can also damage the precision circuits on it and lead to electrical failures.

[0004] Existing technologies often struggle to address both of these issues simultaneously. Designs focused on heat dissipation may sacrifice structural flexibility or increase weight, while designs focused on structural reinforcement often neglect the protection of heat dissipation channels and may even create closed structures that obstruct air convection.

[0005] Therefore, this utility model proposes a high-performance copper-clad laminate to overcome the shortcomings of the prior art. Utility Model Content

[0006] In view of the problems existing in the high-performance copper clad laminate, such as low heat dissipation efficiency under high load conditions, easy heat accumulation leading to high temperature failure, and poor structural stability under external impact or assembly stress, which makes it easy to deform or shift, this utility model aims to provide a high-performance copper clad laminate with an improved structure that can effectively solve the above problems.

[0007] This utility model provides a high-performance copper-clad laminate, including a substrate layer as a load-bearing structure, and a heat dissipation mechanism and a stabilization mechanism integrated on the substrate layer and working together.

[0008] The heat dissipation mechanism comprises, from bottom to top: a heat dissipation strip fixedly connected to the heat dissipation area on the top surface of the substrate layer; a copper foil layer tightly attached to the surface of the substrate layer and covering the heat dissipation strip; a honeycomb structure layer fixedly connected to the top surface of the copper foil layer; and a protective film disposed on the outermost layer. A corrugated plate that cooperates with the honeycomb structure layer is fixedly connected to the bottom surface of the protective film. The honeycomb structure layer and the corrugated plate together constitute a multi-path heat dissipation structure for increasing the air contact area.

[0009] The stabilizing mechanism includes: a buffer pad covering the outer wall of the substrate layer, and a side plate providing rigid support for the substrate layer. The side plate has ventilation slots to ensure air circulation, and the inner wall of the side plate is fixedly connected to the outer wall of the substrate layer by a triangular block for reinforcement.

[0010] Preferably, mounting grooves for quickly fixing the copper foil layer are provided at both the upper and lower ends of the substrate layer. The inner wall of the mounting groove is provided with a slot, and the edge of the copper foil layer is precisely fixed in the slot by a snap-fit ​​engagement, ensuring the bonding stability between the copper foil layer and the substrate layer.

[0011] Preferably, the outer walls on both sides of the substrate are provided with limiting grooves for installing the side plates along their length direction. The side plates are inserted into the limiting grooves by means of plugging. This structure achieves stable vertical support and improves the convenience of assembly.

[0012] Preferably, the triangular block is a right-angled triangle structure, with one right-angled side connected to the middle of the inner wall of the side plate by welding, and the other right-angled side connected to the outer wall of the substrate by welding. This arrangement makes full use of the stability of the triangle and effectively prevents the substrate layer from shifting laterally.

[0013] Preferably, the heat dissipation strip is a metal strip with a high thermal conductivity, which is bonded and fixed to the top of the substrate layer by a high thermal conductivity adhesive. The structure is designed to form a basic heat conduction path, ensuring that heat is efficiently and unimpededly conducted from the substrate layer to the upper structure of the heat dissipation mechanism.

[0014] Preferably, the honeycomb structure layer is a hollow structure with multiple through holes, and the corrugated plate is a continuous undulating concave-convex structure. The two work together to maximize the air contact surface area, thereby significantly accelerating the air convection around the heat sink.

[0015] Preferably, the buffer pad is made of elastic rubber material with excellent energy absorption properties, which is used to prevent the substrate layer from directly colliding with external components and causing deformation or damage during copper clad laminate assembly or when subjected to external impact.

[0016] Preferably, the protective film covers the top surface of the honeycomb structure layer and, together with the corrugated plate, provides physical protection and dust prevention for the internal heat dissipation components, especially the honeycomb structure layer and the copper foil layer.

[0017] In summary, this utility model has the following beneficial effects: 1. This utility model solves the problems of slow heat dissipation, easy heat accumulation, and easy high-temperature failure of copper-clad laminates in the prior art by setting up a multi-path heat dissipation mechanism composed of heat dissipation strips, copper foil layer, honeycomb structure layer and corrugated plate. It utilizes the hollow and concave-convex shape of honeycomb structure and corrugated plate to increase air contact area, thereby achieving accelerated air convection, efficient heat dissipation and improved thermal stability.

[0018] 2. This utility model solves the problems of insufficient structural strength of copper-clad laminates and easy deformation or lateral displacement when subjected to external impact by setting up a composite stabilizing mechanism composed of a buffer pad, a side plate, a limiting groove and a triangular block. The buffer pad absorbs the impact, the side plate and the limiting groove provide rigid support, and the triangular block reinforces the connection. This achieves the goal of improving the impact resistance, deformation resistance and displacement resistance of copper-clad laminates and enhancing the overall structural stability.

[0019] 3. This utility model solves the problem in the prior art that structural reinforcement components easily obstruct airflow and affect heat dissipation efficiency by opening ventilation slots on the side plate that provides rigid support. It achieves high structural stability without obstructing airflow, takes into account heat dissipation requirements, and ensures efficient operation of the heat dissipation mechanism. Attached Figure Description

[0020] Figure 1 This is a perspective view of a high-performance copper-clad laminate proposed in this utility model; Figure 2 This is a schematic diagram of the substrate layer structure of a high-performance copper-clad laminate proposed in this utility model; Figure 3 This is a structural exploded view of the heat dissipation mechanism of a high-performance copper-clad laminate shock absorption device proposed in this utility model; Figure 4 This is a structural exploded view of the stabilization mechanism of a high-performance copper-clad laminate shock absorption device proposed in this utility model.

[0021] Explanation of reference numerals in the attached figures: 1. Substrate layer; 2. Heat dissipation mechanism; 201. Mounting groove; 202. Card slot; 203. Copper foil layer; 204. Heat dissipation strip; 205. Honeycomb structure layer; 206. Corrugated plate; 207. Protective film; 3. Stabilizing mechanism; 301. Side plate; 302. Ventilation groove; 303. Triangular block; 304. Limiting groove; 305. Buffer pad. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Example

[0024] Please refer to Figures 1 to 4 This utility model provides a high-performance copper-clad laminate, which aims to solve the problems of low heat dissipation efficiency, heat accumulation, and high-temperature failure of copper-clad laminates under high load, and the fact that its structure is prone to deformation and displacement when subjected to external impact or assembly stress.

[0025] like Figure 1 and Figure 2 As shown, the high-performance copper-clad laminate includes a substrate layer 1 as a load-bearing structure, and a heat dissipation mechanism 2 and a stabilization mechanism 3 integrated on the substrate layer 1 and working together. The substrate layer 1 is used to support the electronic components on the surface of the copper-clad laminate. The heat dissipation mechanism 2 covers the surface of the substrate layer 1 and is used to quickly dissipate the heat generated by the substrate layer 1 and the electronic components on the surface. The stabilization mechanism 3 is installed around the outer wall of the substrate layer 1 and is used to provide structural support and buffer protection when the copper-clad laminate is assembled or subjected to external impact.

[0026] Specifically, the heat dissipation mechanism 2 includes, from bottom to top: a heat dissipation strip 204 fixedly connected to the heat dissipation area on the top surface of the substrate layer 1; a copper foil layer 203 tightly attached to the surface of the substrate layer 1 and covering the heat dissipation strip 204; a honeycomb structure layer 205 fixedly connected to the top surface of the copper foil layer 203; and a protective film 207 disposed on the outermost layer; a corrugated plate 206 that cooperates with the honeycomb structure layer 205 is fixedly connected to the bottom surface of the protective film 207; the honeycomb structure layer 205 and the corrugated plate 206 together constitute a multi-path heat dissipation structure for increasing the air contact area.

[0027] The stabilizing mechanism 3 includes: a buffer pad 305 covering the outer wall of the substrate layer 1; and a side plate 301 that provides rigid support for the substrate layer 1; the side plate 301 has ventilation slots 302 to ensure air circulation; and the inner wall of the side plate 301 is fixedly connected to the outer wall of the substrate layer 1 by a triangular block 303 that serves as a reinforcement.

[0028] Please refer to Figure 3 and Figure 4 The heat dissipation mechanism 2 achieves efficient heat dissipation through a multi-level structure, such as... Figure 3 As shown, the heat dissipation strip 204 is a metal strip with a high thermal conductivity, which is bonded to the top of the substrate layer 1 with a high thermal conductivity adhesive to form a basic heat conduction path; the copper foil layer 203 is tightly attached to the surface of the substrate layer 1 and completely covers the heat dissipation strip 204; the honeycomb structure layer 205 is fixedly connected to the top surface of the copper foil layer 203, and it is a hollow structure with multiple through holes; the protective film 207 is set on the outermost layer, and a corrugated plate 206 is fixedly connected to its bottom surface. The corrugated plate 206 has a continuous undulating concave-convex structure and cooperates with the top surface of the honeycomb structure layer 205; this combined structure composed of the honeycomb structure layer 205 and the corrugated plate 206 greatly increases the contact area with air, ensuring that when heat is conducted out from the heat dissipation strip 204, it can be quickly carried away by enhanced air convection, thereby achieving multi-path efficient heat dissipation.

[0029] Stabilizing mechanism 3 provides structural stability while also addressing heat dissipation requirements, such as... Figure 4 As shown, the buffer pad 305 is made of elastic rubber material and covers the outer wall of the substrate layer 1 to absorb external impact energy; the side plate 301 serves as a vertical rigid support, and its plate body has ventilation slots 302 to ensure air circulation, ensuring that the setting of the stabilizing mechanism 3 does not obstruct the air convection around the heat dissipation mechanism 2; the triangular block 303 is a right-angled triangle structure, with one right-angled side fixedly connected to the inner wall of the side plate 301 by welding, and the other right-angled side fixedly connected to the outer wall of the substrate layer 1 by welding; this connection method utilizes the inherent stability of the triangle to effectively strengthen the connection between the side plate 301 and the substrate layer 1, jointly ensuring that the substrate layer 1 has excellent impact resistance, deformation resistance and lateral displacement resistance.

[0030] As a preferred embodiment, in order to achieve rapid fixation and tight adhesion of the copper foil layer 203, please refer to... Figure 2 and Figure 3 The upper and lower ends of the substrate layer 1 are provided with mounting grooves 201 for mounting the copper foil layer 203. The inner wall of the mounting groove 201 is also provided with a slot 202. The edge of the copper foil layer 203 is precisely fixed in the slot 202 by a snap-fit ​​engagement. As another preferred embodiment, to improve the stability of the connection between the side plate 301 and the substrate layer 1, please refer to... Figure 4 The outer walls of both sides of the substrate layer 1 are provided with limiting grooves 304 for installing the side plates 301 along their length direction. The side plates 301 are embedded in the limiting grooves 304 by plugging in, and this matching method achieves stable vertical support. As another preferred embodiment, to maximize the reinforcement effect of the triangular block 303, please refer to... Figure 4 The triangular block 303 is preferably a right-angled triangle structure, with one right-angled side fixed to the middle of the inner wall of the side plate 301 by welding, and the other right-angled side fixed to the outer wall of the substrate layer 1 by welding. As another preferred implementation, to optimize the basic heat conduction path, please refer to... Figure 3 The heat dissipation strip 204 is preferably a metal strip with a high thermal conductivity, which is bonded and fixed to the top of the substrate layer 1 by a high thermal conductivity adhesive to ensure that heat is efficiently conducted from the substrate layer 1 to the heat dissipation strip 204. As another preferred embodiment, to enhance the convection effect of the multi-path heat dissipation structure, please refer to... Figure 3 The honeycomb structure layer 205 is specifically a hollow structure with multiple through holes, while the corrugated plate 206 is specifically a continuous undulating concave-convex structure. As another preferred embodiment, to provide excellent buffering and energy absorption effects, please refer to... Figure 4 The buffer pad 305 is preferably made of elastic rubber material to ensure effective protection of the substrate layer 1 when subjected to external impact. As another preferred embodiment, to protect the internal heat dissipation components, please refer to... Figure 3 The protective film 207 covers the top surface of the honeycomb structure layer 205 and, together with the corrugated plate 206, provides structural protection for the internal honeycomb structure layer 205 and copper foil layer 203.

[0031] Working principle: The substrate layer 1 serves as the core load-bearing structure, and its surface is covered with a heat dissipation mechanism 2. The slots 202 in the mounting grooves 201 at the upper and lower ends of the substrate layer 1 are used to quickly fix the copper foil layer 203, ensuring that the two are tightly attached. At the same time, the heat dissipation strip 204 bonded to the top of the substrate layer 1 can cover the heat dissipation area, forming a basic heat conduction path. When the copper clad laminate is working, the heat generated by the substrate layer 1 and the electronic components on the surface is quickly conducted to the heat dissipation strip 204 through high thermal conductivity, avoiding heat accumulation in the substrate layer 1. After the heat dissipation strip 204 absorbs the heat, the honeycomb structure layer 205 on the top of the copper foil layer 203 and the corrugated plate 206 at the bottom of the protective film 207 increase the air contact area through hollow and concave-convex structures, accelerating the air convection around the heat dissipation strip 204. Through rapid heat conduction, efficient heat dissipation through multiple paths, and structural protection, the thermal stability of the copper clad laminate is improved, solving the problems of slow heat dissipation and high temperature failure in the existing technology. Furthermore, with the stabilizing mechanism 3 as its core, the 305 buffer pads installed around the outer wall of its substrate layer 1 prevent the substrate layer 1 from directly colliding with external components and causing deformation when the copper clad laminate is assembled or subjected to external impact. The side plate 301 serves as a vertical rigid support, fitting the substrate layer 1 and being installed on both sides through the limiting groove 304. At the same time, the triangular block 303 can use the stability of the triangle to reinforce the connection between the side plate 301 and the substrate layer 1, preventing the substrate layer 1 from shifting laterally. The ventilation groove 302 on the side plate 301 ensures structural stability while not obstructing airflow, avoiding the impact of the closed structure on heat dissipation efficiency. This solves the problem of deformation and displacement of the substrate layer 1 during the reaction, while also taking into account heat dissipation requirements and improving the overall structural stability of the copper clad laminate.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-performance copper-clad laminate, comprising a substrate layer (1) as a core load-bearing structure, characterized in that, It also includes a heat dissipation mechanism (2) and a stabilization mechanism (3) that are integratedly disposed on the substrate layer (1) and work together. The heat dissipation mechanism (2) includes, from bottom to top, a heat dissipation strip (204) fixedly connected to the heat dissipation area on the top surface of the substrate layer (1), a copper foil layer (203) tightly attached to the surface of the substrate layer (1) and covering the heat dissipation strip (204), a honeycomb structure layer (205) fixedly connected to the top surface of the copper foil layer (203), and a protective film (207) disposed on the outermost layer. The bottom surface of the protective film (207) is fixedly connected to a corrugated plate (206) that cooperates with the honeycomb structure layer (205). The honeycomb structure layer (205) and the corrugated plate (206) together constitute a multi-path heat dissipation structure for increasing the air contact area. The stabilizing mechanism (3) includes: a buffer pad (305) covering the outer wall of the substrate layer (1) and a side plate (301) providing rigid support for the substrate layer (1). The side plate (301) has ventilation slots (302) to ensure air circulation, and the inner wall of the side plate (301) is fixedly connected to the outer wall of the substrate layer (1) by a triangular block (303) for reinforcement.

2. The high-performance copper-clad laminate according to claim 1, characterized in that, The substrate layer (1) has mounting grooves (201) at both the upper and lower ends for quickly fixing the copper foil layer (203). The inner wall of the mounting groove (201) is provided with a slot (202), and the edge of the copper foil layer (203) is fixed in the slot (202) by a snap-fit ​​engagement.

3. The high-performance copper-clad laminate according to claim 1, characterized in that, The outer walls of the substrate layer (1) on both sides are provided with limiting grooves (304) for installing the side plate (301) along its length direction. The side plate (301) is embedded in the limiting groove (304) by plugging in to achieve stable vertical support.

4. The high-performance copper-clad laminate according to claim 1, characterized in that, The triangular block (303) is a right-angled triangle structure. One right-angled side is welded to the middle of the inner wall of the side plate (301), and the other right-angled side is welded to the outer wall of the substrate layer (1). The stability of the triangle is used to prevent the substrate layer (1) from shifting laterally.

5. A high-performance copper-clad laminate according to claim 1, characterized in that, The heat dissipation strip (204) is a metal strip with a high thermal conductivity, which is bonded to the top of the substrate layer (1) by a high thermal conductivity adhesive to form a basic heat conduction path.

6. A high-performance copper-clad laminate according to claim 1, characterized in that, The honeycomb structure layer (205) is a hollow structure with multiple through holes, and the wave plate (206) is a continuous undulating concave-convex structure. The two work together to accelerate the air convection around the heat dissipation strip (204).

7. A high-performance copper-clad laminate according to claim 1, characterized in that, The buffer pad (305) is made of elastic rubber material, which is used to prevent the substrate layer (1) from directly colliding with external parts and causing deformation when the copper clad laminate is assembled or subjected to external impact.

8. A high-performance copper-clad laminate according to claim 1, characterized in that, The protective film (207) covers the top surface of the honeycomb structure layer (205) and together with the corrugated plate (206), it protects the internal heat dissipation components.

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