Heat dissipation structure of a heat generating device

Abstract

A heat dissipation structure of a heating device, the heating device comprising a PCBA assembly, the heat dissipation structure of the heating device comprising a heat sink, a heat dissipation surface of the heat sink being attached to the PCBA assembly; the PCBA assembly comprising at least a first heating device and a second heating device, the heat dissipation surface of the heat sink being provided with a first mounting slot and a second mounting slot, the first heating device being arranged in the first mounting slot, and the second heating device being arranged in the second mounting slot; a first heat insulation groove being arranged between the first mounting slot and the second mounting slot to cut off a heat conduction path between the first heating device and the second heating device, thereby avoiding a thermal coupling effect between the first heating device and the second heating device, and further avoiding an impact on the overall performance of a power module.

Description

Technical Field

[0001] This utility model relates to the field of power modules, and more specifically, to a heat dissipation structure for a heat-generating device. Background Technology

[0002] In power modules, common-mode inductors and power factor correction (PFC) inductors are core magnetic components, typically located adjacent to each other on a printed circuit board (PCB). Since both common-mode and PFC inductors are heat sources, they are prone to thermal coupling, leading to mutual interference between these heat-generating components and consequently affecting the overall performance of the power module. For example, PFC inductors experience significant temperature rise when carrying large currents. While common-mode inductors have relatively lower losses, they are also temperature-sensitive; excessively high temperatures can degrade their common-mode rejection performance, impacting EMI filtering effectiveness. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a heat dissipation structure for heat-generating devices, which can cut off the heat conduction path between heat-generating devices, avoid thermal coupling effect, and thus further avoid affecting the overall performance of the power module.

[0004] The technical solution adopted by this utility model to solve its technical problem is as follows: A heat dissipation structure for a heating device is constructed, wherein the heating device includes a PCBA assembly, and the heat dissipation structure of the heating device includes a heat sink, the heat dissipation surface of the heat sink being attached to the PCBA assembly; the PCBA assembly includes at least a first heating device and a second heating device, a first mounting slot and a second mounting slot are provided on the heat dissipation surface of the heat sink, the first heating device is disposed in the first mounting slot, and the second heating device is disposed in the second mounting slot; a first heat insulation groove is provided between the first mounting slot and the second mounting slot to cut off the heat conduction path between the first heating device and the second heating device.

[0005] In the heat dissipation structure of the heating device described in this utility model, the first heating device includes a PFC inductor, and the second heating device includes a common-mode inductor. The PFC inductor is disposed in the first mounting slot, and the common mode inductor is disposed in the second mounting slot.

[0006] In the heat dissipation structure of the heat-generating device described in this utility model, the PCBA assembly further includes a third heat-generating device; a third mounting slot is further provided on the heat dissipation surface of the heat sink; the third heat-generating device is disposed in the third mounting slot; the first heat insulation slot is located between the first heat-generating device and the third heat-generating device to cut off the heat conduction path between the first heat-generating device and the third heat-generating device.

[0007] In the heat dissipation structure of the heating device described in this utility model, the first heating device includes a first PFC inductor, a second PFC inductor, and a third PFC inductor. The second heating device includes a first common-mode inductor and a second common-mode inductor; The third heating device includes a filter capacitor; The first common-mode inductor, the filter capacitor, and the second common-mode inductor are arranged side by side at the first end of the PCBA assembly board. The first PFC inductor, the second PFC inductor, and the third PFC inductor are arranged side by side on one side of the first common-mode inductor, the filter capacitor, and the second common-mode inductor.

[0008] In the heat dissipation structure of the heat-generating device described in this utility model, the first mounting slot includes a first PFC inductor mounting slot, a second PFC inductor mounting slot, and a third PFC inductor mounting slot. The first PFC inductor is housed in the first PFC inductor mounting slot, the second PFC inductor is housed in the second PFC inductor mounting slot, and the third PFC inductor is housed in the third PFC inductor mounting slot. A second heat insulation groove is formed between the first PFC inductor mounting slot and the second PFC inductor mounting slot; a third heat insulation groove is formed between the second PFC inductor mounting slot and the third PFC inductor mounting slot.

[0009] In the heat dissipation structure of the heat-generating device described in this utility model, the first PFC inductor mounting slot, the second PFC inductor mounting slot, and the third PFC inductor mounting slot are U-shaped slots. The first PFC inductor mounting slot is formed by the first L-shaped shell portion of the heat sink and the first vertical partition. The second PFC inductor mounting slot is formed by the first horizontal partition, the second vertical partition, and the third vertical partition. The third PFC inductor mounting slot is formed by the second horizontal partition, the fourth vertical partition, and the fifth vertical partition.

[0010] In the heat dissipation structure of the heating device described in this utility model, potting compound is introduced into the first PFC inductor mounting slot, the second PFC inductor mounting slot, and the third PFC inductor mounting slot, respectively. The first vertical partition and the second vertical partition form the second heat insulation groove; The third vertical partition and the fourth vertical partition form the third heat insulation groove.

[0011] In the heat dissipation structure of the heat-generating device described in this utility model, the second mounting slot includes a first common-mode inductor mounting slot and a second common-mode inductor mounting slot; Both the first common-mode inductor mounting slot and the second common-mode inductor mounting slot are rectangular mounting slots; The first common mode inductor mounting slot is formed by the second L-shaped housing portion of the heat sink, the third horizontal partition, and the sixth vertical partition. The second common mode inductor mounting slot is formed by the third L-shaped housing part of the heat sink, the fourth horizontal partition, and the seventh vertical partition.

[0012] In the heat dissipation structure of the heat-generating device described in this utility model, the third mounting slot includes a filter capacitor mounting slot, which is located between the first common-mode inductor mounting slot and the second common-mode inductor mounting slot. The filter capacitor mounting slot is formed by the sixth vertical partition, the seventh vertical partition, the fifth horizontal partition, and the first horizontal housing portion of the heat sink; The two ends of the first horizontal shell portion are respectively connected to the second L-shaped shell portion and the third L-shaped shell portion.

[0013] In the heat dissipation structure of the heat-generating device described in this utility model, potting compound is introduced into the filter capacitor mounting slot, the first common mode inductor mounting slot, and the second common mode inductor mounting slot, respectively. The first horizontal partition, the second horizontal partition, the third horizontal partition, the fourth horizontal partition, and the fifth horizontal partition form the first heat insulation groove; The first horizontal partition and the second horizontal partition are aligned in a straight line and integrally formed, and the third horizontal partition, the fourth horizontal partition and the fifth horizontal partition are aligned in a straight line and integrally formed.

[0014] The present invention discloses a heat dissipation structure for a heating device, wherein the heating device includes a PCBA assembly, and the heat dissipation structure includes a heat sink; the PCBA assembly includes at least a first heating device and a second heating device, and a first mounting slot and a second mounting slot are provided on the heat dissipation surface of the heat sink; the first heating device is disposed in the first mounting slot, and the second heating device is disposed in the second mounting slot; a first heat insulation groove is provided between the first mounting slot and the second mounting slot to cut off the heat conduction path between the first heating device and the second heating device, thereby avoiding thermal coupling effect between the first heating device and the second heating device, and further avoiding impact on the overall performance of the power module. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a schematic diagram of a preferred embodiment of the heat dissipation structure of the heating device of this utility model; Figure 2 yes Figure 1 The diagram shows a partial enlarged view of the heat dissipation structure of the heating device of this utility model. Figure 3 This is a partial structural diagram of the heat dissipation structure of the heating device of this utility model. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0017] Figure 1 This is a schematic diagram of a preferred embodiment of the heat dissipation structure of the heating device of this utility model. For example... Figure 1 As shown, the heating device includes a PCBA assembly 200, and the heat dissipation structure of the heating device includes a heat sink 100. The heat dissipation surface 110 of the heat sink 100 is attached to the PCBA assembly 200; the PCBA assembly 200 includes at least a first heating device 210 and a second heating device 220, and a first mounting slot 120 and a second mounting slot 130 are provided on the heat dissipation surface 110 of the heat sink 100. The first heating device 210 is disposed in the first mounting slot 120, and the second heating device 220 is disposed in the second mounting slot 130; a first heat insulation groove 310 is provided between the first mounting slot 120 and the second mounting slot 130 to cut off the heat conduction path between the first heating device 210 and the second heating device 220.

[0018] In a preferred embodiment of the present invention, the first heating device 210 includes a PFC inductor, and the second heating device 220 includes a common-mode inductor; the PFC inductor is disposed in the first mounting slot 120, and the common-mode inductor is disposed in the second mounting slot 130.

[0019] The present invention discloses a heat dissipation structure for a heating device, wherein the heating device includes a PCBA assembly, and the heat dissipation structure includes a heat sink; the PCBA assembly includes at least a first heating device and a second heating device, and a first mounting slot and a second mounting slot are provided on the heat dissipation surface of the heat sink; the first heating device is disposed in the first mounting slot, and the second heating device is disposed in the second mounting slot; a first heat insulation groove is provided between the first mounting slot and the second mounting slot to cut off the heat conduction path between the first heating device and the second heating device, thereby avoiding thermal coupling effect between the first heating device and the second heating device, and further avoiding impact on the overall performance of the power module.

[0020] Figure 1 A heat dissipation structure for a heat-generating device is further disclosed, wherein the heat-generating device includes a PCBA assembly 200 and the heat dissipation structure of the heat-generating device includes a heat sink 100. The heat dissipation surface 110 of the heat sink 100 is attached to the PCBA assembly 200. The PCBA assembly 200 includes at least a first heating element 210, a second heating element 220, and a third heating element 230. A first mounting slot 120, a second mounting slot 130, and a third mounting slot 140 are provided on the heat dissipation surface 110 of the heat sink 100. The first heating element 210 is disposed in the first mounting slot 120, and the second heating element 220 is disposed in the second mounting slot 130. The third heating element 230 is disposed in the third mounting slot 140. A first heat insulation groove 310 is provided between the first mounting slot 120 and the second mounting slot 130 to cut off the heat conduction path between the first heating element 210 and the second heating element 220. The first heat insulation groove is also located between the first heating element 210 and the third heating element 230 to cut off the heat conduction path between the first heating element 210 and the third heating element 230. In this preferred embodiment, thermal coupling between the first heating device and the third heating device can be avoided, thereby further avoiding any impact on the overall performance of the power module.

[0021] Figure 2 yes Figure 1 The diagram shows a partial enlarged view of the heat dissipation structure of the heating device of this utility model. Figure 3This is a partial structural diagram of the heat dissipation structure of the heating device of this utility model.

[0022] Further as Figures 2-3 As shown, the first heating device 210 includes a first PFC inductor 211, a second PFC inductor 212, and a third PFC inductor 213; the second heating device 220 includes a first common-mode inductor 221 and a second common-mode inductor 222; the third heating device 230 includes a filter capacitor 231; the first common-mode inductor 221, the filter capacitor 231, and the second common-mode inductor 222 are arranged side by side at the first end of the board body 240 of the PCBA assembly 200; the first PFC inductor 211, the second PFC inductor 212, and the third PFC inductor 213 are arranged side by side on one side of the first common-mode inductor 221, the filter capacitor 231, and the second common-mode inductor 222.

[0023] The first mounting slot 120 includes a first PFC inductor mounting slot, a second PFC inductor mounting slot, and a third PFC inductor mounting slot; the first PFC inductor 211 is housed in the first PFC inductor mounting slot, the second PFC inductor 212 is housed in the second PFC inductor mounting slot, and the third PFC inductor 213 is housed in the third PFC inductor mounting slot; a second heat insulation groove 320 is formed between the first PFC inductor mounting slot and the second PFC inductor mounting slot; a third heat insulation groove 330 is formed between the second PFC inductor mounting slot and the third PFC inductor mounting slot. The second heat insulation groove 320 and the third heat insulation groove 330 can further cut off the heat conduction path between the first PFC inductor 211, the second PFC inductor 212 and the third PFC inductor 213, thereby avoiding the thermal coupling effect between the first PFC inductor 211, the second PFC inductor 212 and the third PFC inductor 213, and thus further avoiding the impact on the overall performance of the power module.

[0024] like Figure 2As shown, the first, second, and third PFC inductor mounting slots are U-shaped grooves. The first PFC inductor mounting slot is formed by the first L-shaped housing portion 111 of the heat sink 100 and the first vertical partition 411. The second PFC inductor mounting slot is formed by the first horizontal partition 511, the second vertical partition 412, and the third vertical partition 413. The third PFC inductor mounting slot is formed by the second horizontal partition 512, the fourth vertical partition 414, and the fifth vertical partition 415. Encapsulating adhesive is introduced into each of the first, second, and third PFC inductor mounting slots. The first vertical partition 411 and the second vertical partition 412 form the second heat insulation groove 320. The third vertical partition 413 and the fourth vertical partition 414 form the third heat insulation groove 330.

[0025] like Figure 2 As shown, the second mounting slot 130 includes a first common mode inductor mounting slot and a second common mode inductor mounting slot; both the first common mode inductor mounting slot and the second common mode inductor mounting slot are rectangular mounting slots; the first common mode inductor mounting slot is formed by the second L-shaped housing portion 112 of the heat sink 100, the third horizontal partition 513 and the sixth vertical partition 416; the second common mode inductor mounting slot is formed by the third L-shaped housing portion 113 of the heat sink 100, the fourth horizontal partition 514 and the seventh vertical partition 417. The third mounting slot 140 includes a filter capacitor mounting slot, which is located between the first common mode inductor mounting slot and the second common mode inductor mounting slot. The filter capacitor mounting slot is formed by the sixth vertical partition 416, the seventh vertical partition 417, the fifth horizontal partition 515, and the first horizontal housing portion 114 of the heat sink 100. The two ends of the first horizontal housing portion 114 are respectively connected to the second L-shaped housing portion 112 and the third L-shaped housing portion 113.

[0026] Encapsulating adhesive is introduced into the filter capacitor mounting slot, the first common mode inductor mounting slot, and the second common mode inductor mounting slot, respectively. The first horizontal partition 511, the second horizontal partition 512, the third horizontal partition 513, the fourth horizontal partition 514, and the fifth horizontal partition 515 form the first heat insulation groove 310; wherein the first horizontal partition 511 and the second horizontal partition 512 are aligned with each other and integrally formed, and the third horizontal partition 513, the fourth horizontal partition 514, and the fifth horizontal partition 515 are aligned with each other and integrally formed.

[0027] In this preferred embodiment, the heat dissipation structure of the heat-generating device of this utility model includes a PCBA assembly, and the heat dissipation structure of the heat-generating device includes a heat sink. The PCBA assembly includes a first PFC inductor 211, a second PFC inductor 212, a third PFC inductor 213, a first common-mode inductor 221, a filter capacitor 231, and a second common-mode inductor 222. The heat dissipation surface 110 of the heat sink 100 is provided with a first PFC inductor mounting slot, a second PFC inductor mounting slot, a third PFC inductor mounting slot, a first common-mode inductor mounting slot, a second common-mode inductor mounting slot, a filter capacitor mounting slot, a first heat insulation groove 310, a second heat insulation groove 320, and a third heat insulation groove 330. When the PCBA assembly is installed on the heat dissipation surface of the heat sink, each device is located in its mounting slot, and potting compound is introduced into each mounting slot. Due to the excessive current of the PFC inductor, the temperature rise is relatively high. The design of the first heat insulation groove 310, the second heat insulation groove 320, and the third heat insulation groove 330 isolates the PFC inductor from the common mode inductor and filter capacitor, etc., blocking the lateral heat conduction path. This forcibly blocks or greatly weakens the lateral flow of heat from the PFC inductor area to the input common mode inductor and filter capacitor area, so that the heat of the PFC inductor can only be transferred vertically downward to the heat sink fins in its own independent heat dissipation area, and then carried away by air cooling, without interfering with the neighbors.

[0028] In this preferred embodiment, the temperature rise of the first common-mode inductor 221, the filter capacitor 231, and the second common-mode inductor 222 is relatively low, so no heat insulation groove is made to save costs. However, those skilled in the art will know that in a further preferred embodiment of this utility model, a heat insulation groove can be further provided between the first common-mode inductor 221, the filter capacitor 231, and the second common-mode inductor 222.

[0029] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a heating device, characterized in that, The heating device includes a PCBA assembly, and the heat dissipation structure of the heating device includes a heat sink, with the heat dissipation surface of the heat sink attached to the PCBA assembly. The PCBA assembly includes at least a first heating device and a second heating device. A first mounting slot and a second mounting slot are provided on the heat dissipation surface of the heat sink. The first heating device is disposed in the first mounting slot, and the second heating device is disposed in the second mounting slot. A first heat insulation groove is provided between the first mounting slot and the second mounting slot to cut off the heat conduction path between the first heating device and the second heating device.

2. The heat dissipation structure of the heating device according to claim 1, characterized in that, The first heating device includes a PFC inductor, and the second heating device includes a common-mode inductor; The PFC inductor is disposed in the first mounting slot, and the common mode inductor is disposed in the second mounting slot.

3. The heat dissipation structure of the heating device according to claim 1, characterized in that, The PCBA assembly further includes a third heating element; a third mounting slot is further provided on the heat dissipation surface of the heat sink; the third heating element is disposed in the third mounting slot; the first heat insulation slot is located between the first heating element and the third heating element to cut off the heat conduction path between the first heating element and the third heating element.

4. The heat dissipation structure of the heating device according to claim 3, characterized in that, The first heating device includes a first PFC inductor, a second PFC inductor, and a third PFC inductor; The second heating device includes a first common-mode inductor and a second common-mode inductor; The third heating device includes a filter capacitor; The first common-mode inductor, the filter capacitor, and the second common-mode inductor are arranged side by side at the first end of the PCBA assembly board. The first PFC inductor, the second PFC inductor, and the third PFC inductor are arranged side by side on one side of the first common-mode inductor, the filter capacitor, and the second common-mode inductor.

5. The heat dissipation structure of the heating device according to claim 4, characterized in that, The first mounting slot includes a first PFC inductor mounting slot, a second PFC inductor mounting slot, and a third PFC inductor mounting slot; The first PFC inductor is housed in the first PFC inductor mounting slot, the second PFC inductor is housed in the second PFC inductor mounting slot, and the third PFC inductor is housed in the third PFC inductor mounting slot. A second heat insulation groove is formed between the first PFC inductor mounting slot and the second PFC inductor mounting slot; a third heat insulation groove is formed between the second PFC inductor mounting slot and the third PFC inductor mounting slot.

6. The heat dissipation structure of the heating device according to claim 5, characterized in that, The first PFC inductor mounting slot, the second PFC inductor mounting slot, and the third PFC inductor mounting slot are U-shaped slots. The first PFC inductor mounting slot is formed by the first L-shaped housing portion of the heat sink and the first vertical partition. The second PFC inductor mounting slot is formed by the first horizontal partition, the second vertical partition, and the third vertical partition. The third PFC inductor mounting slot is formed by the second horizontal partition, the fourth vertical partition, and the fifth vertical partition.

7. The heat dissipation structure of the heating device according to claim 6, characterized in that, Encapsulating adhesive is introduced into the first PFC inductor mounting slot, the second PFC inductor mounting slot, and the third PFC inductor mounting slot, respectively; The first vertical partition and the second vertical partition form the second heat insulation groove; The third vertical partition and the fourth vertical partition form the third heat insulation groove.

8. The heat dissipation structure of the heating device according to claim 6, characterized in that, The second mounting slot includes a first common mode inductor mounting slot and a second common mode inductor mounting slot; Both the first common-mode inductor mounting slot and the second common-mode inductor mounting slot are rectangular mounting slots; The first common mode inductor mounting slot is formed by the second L-shaped housing portion of the heat sink, the third horizontal partition, and the sixth vertical partition. The second common mode inductor mounting slot is formed by the third L-shaped housing part of the heat sink, the fourth horizontal partition, and the seventh vertical partition.

9. The heat dissipation structure of the heating device according to claim 8, characterized in that, The third mounting slot includes a filter capacitor mounting slot, which is located between the first common mode inductor mounting slot and the second common mode inductor mounting slot. The filter capacitor mounting slot is formed by the sixth vertical partition, the seventh vertical partition, the fifth horizontal partition, and the first horizontal housing portion of the heat sink; The two ends of the first horizontal shell portion are respectively connected to the second L-shaped shell portion and the third L-shaped shell portion.

10. The heat dissipation structure of the heating device according to claim 9, characterized in that, Encapsulating adhesive is introduced into the filter capacitor mounting slot, the first common mode inductor mounting slot, and the second common mode inductor mounting slot, respectively; The first horizontal partition, the second horizontal partition, the third horizontal partition, the fourth horizontal partition, and the fifth horizontal partition form the first heat insulation groove; The first horizontal partition and the second horizontal partition are aligned in a straight line and integrally formed, and the third horizontal partition, the fourth horizontal partition and the fifth horizontal partition are aligned in a straight line and integrally formed.

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