An LGA pad and connector that is easy to produce
Patent Information
- Application Number
- CN202522094933.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-29
AI Technical Summary
[0004]本申请的主要目的在于提供一种便于生产的LGA焊盘及连接器，旨在解决现有焊盘设计难以兼容低速插座的技术问题
[0016]本申请包括多个电源焊盘，多个电源焊盘的边长大于或等于0.65mm；多个第一探针，多个第一探针分别连接于对应的电源焊盘上，且每个第一探针与电源焊盘的连接端的长度大于或等于0.5mm。本申请通过将传统多个电源焊盘进行合并以扩大至0.65mm及以上的尺寸，从而可适应性地与0.5mm及以上尺寸的第一探针接触，该尺寸结构的第一探针更耐损，可支持2000次以上的插拔，提高了使用寿命，同时保证电气性能良好，接触电阻小于20mohm，因此受益于焊盘的调整对公差的控制以及结构的要求有放松，从原设计的±0.04mm的公差要求可以放松到±0.1mm的公差要求，在此公差要求下可以调整定位机制为普通的加工边定位并设计导向槽支持盲插，从而针对低速插座也可具备较好的兼容性。
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Figure CN224844180U_ABST
Abstract
Description
[0001] An easy-to-manufacture LGA pad and connector Technical Field
[0002] This application relates to the field of pad design technology, and in particular to an LGA pad and connector that are easy to manufacture. Background Technology
[0003] The production process of an optical engine involves steps such as surface mount technology (SMT), aging, coupling, testing, and packaging. Aging and coupling are steps where only power is applied and high-speed signal testing is not required. For these steps, low-speed probes or sockets can be used to avoid the problems associated with high-speed sockets, such as easy socket damage, the need for extensive auxiliary positioning and fixing, and the significant spring force of the sockets. However, these low-speed sockets often have larger electrical interface spacing and larger probe tip sizes. Existing pad designs are difficult to integrate with these low-speed sockets and probes, resulting in shorter lifespans and making it difficult to meet the needs of various production stages. Utility Model Content
[0004] The main purpose of this application is to provide an LGA pad and connector that are easy to manufacture, in order to solve the technical problem that existing pad designs are difficult to be compatible with low-speed sockets.
[0005] To achieve the above objectives, this application provides an LGA pad that is easy to manufacture, including multiple power pads with a side length greater than or equal to 0.65 mm; multiple first probes, each first probe being connected to a corresponding power pad, and the length of the connection end between each first probe and the power pad being greater than or equal to 0.5 mm.
[0006] Optionally, the side length of the power pad is 0.65mm-1.46mm.
[0007] Optionally, the length of the connection end between the first probe and the power pad is 0.5mm-1mm.
[0008] Optionally, three power pads are provided and arranged in the same column to form a power area. In the same column of the power area, a control area of the same size as the power pad is provided. The control area includes two first control pads and four second control pads. The two first control pads are in a separate column, and the four second control pads are in a separate column. The first control pads are connected to second probes, and the second control pads are connected to third probes.
[0009] Optionally, the side lengths of the two first control pads are equal to the side lengths of the four second control pads.
[0010] Optionally, the side length of the second control pad is 0.25 mm, and the length of the connection end between the third probe and the second control pad is 0.22 mm.
[0011] Optionally, it also includes a high-speed signal area, with the power supply area and control area located on the same side of the high-speed signal area, which includes multiple high-speed interface groups arranged in a cross-array.
[0012] Optionally, the high-speed interface group includes two high-speed signal pads for forming a high-speed differential pair, and ten ground pads are arranged around the two high-speed signal pads. Both the high-speed signal pads and the ground pads are connected to a fourth probe.
[0013] Optionally, the side length of both the high-speed signal pad and the ground pad is 0.25 mm, and the length of the connection end between the fourth probe and the high-speed signal pad and the ground pad is 0.22 mm.
[0014] To achieve the above objectives, this application also provides a connector including the aforementioned LGA pad that is easy to manufacture.
[0015] The beneficial effects that this application can achieve are as follows:
[0016] This application includes multiple power pads, each with a side length greater than or equal to 0.65 mm; and multiple first probes, each connected to a corresponding power pad, with the connection end of each first probe to the power pad having a length greater than or equal to 0.5 mm. This application expands the traditional multiple power pads to a size of 0.65 mm or larger by merging them, thus adapting to contact with first probes of 0.5 mm or larger. The first probes of this size structure are more wear-resistant, supporting over 2000 insertion and removal cycles, improving service life, while ensuring good electrical performance with a contact resistance of less than 20 mohm. Therefore, the adjustment of the pads allows for relaxed tolerance control and structural requirements, reducing the original ±0.04 mm tolerance requirement to ±0.1 mm. Under this tolerance requirement, the positioning mechanism can be adjusted to ordinary machined edge positioning and a guide groove can be designed to support blind insertion, thus providing good compatibility even for low-speed sockets. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0018] Figure 1 A schematic diagram of the existing pad structure;
[0019] Figure 2 This is a schematic diagram of the structure of an LGA pad that is easy to manufacture, as described in an embodiment of this application.
[0020] Figure 3 This is a schematic diagram of the overall layout structure of the existing pads;
[0021] Figure 4 This is a schematic diagram of the overall layout structure of an LGA pad that is easy to manufacture, as shown in an embodiment of this application.
[0022] Figure label:
[0023] 110 - Power pad, 120 - First probe.
[0024] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0027] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0028] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0029] Example 1
[0030] Reference Figures 1-4 This embodiment provides an LGA pad that is easy to manufacture, including multiple power pads 110, the side length of the multiple power pads 110 (i.e. Figure 2 d1) is greater than or equal to 0.65 mm; multiple first probes 120 are respectively connected to corresponding power pads 110, and the length of the connection end of each first probe 120 to the power pad 110 is (i.e., Figure 2 (d2) is greater than or equal to 0.5 mm.
[0031] like Figure 1 As shown, the current connector pad spacing is 0.15mm, the probe (pin) spacing is 0.4mm, and the probe size is 0.22mm. Such probes are extremely fragile and cannot withstand repeated insertion and removal. A 0.4mm pitch pin can only withstand less than 10 insertions and removals. Using 0.5mm pins would be more durable, supporting over 2000 insertions and removals while maintaining good electrical performance and a contact resistance of less than 20 mohm. Figure 3 As shown, the conventional pad layout is vertically elongated. Such a pad layout cannot be connected to form a large-sized pad, thus making it impossible to match with 0.5-1mm probes.
[0032] In this embodiment, by merging multiple conventional power pads 110 to expand their size to 0.65mm or larger, they can adaptably contact the first probe 120, which is 0.5mm or larger. This size structure of the first probe 120 is more durable, supporting over 2000 insertion / removal cycles, thus improving its lifespan. Simultaneously, it ensures good electrical performance with a contact resistance of less than 20 mohm. Therefore, the adjustment of the pads allows for relaxed tolerance control and structural requirements. For example, the original design had very small pins; to ensure alignment with the LGA pads, a high-precision limiting mechanism with a tolerance of ±0.04mm was required. This extremely high machining precision necessitates high-precision molds. However, the pad structure in this embodiment has significantly reduced tolerance requirements; a ±0.1mm precision limiting mechanism is generally sufficient. Under this tolerance requirement, the positioning mechanism can be adjusted to ordinary machining edge positioning, and a guide groove can be designed to support blind insertion, thus providing good compatibility even for low-speed sockets. Overall, the cost optimization of the fixture portion can reach over 50%.
[0033] It should be noted that LGA refers to a pad grid array.
[0034] As an optional implementation, the side length of the power pad 110 is 0.65mm-1.46mm, and the length of the connection end between the first probe 120 and the power pad 110 is 0.5mm-1mm.
[0035] In this embodiment, the probe size should not be too large, otherwise it will not meet the small volume design requirements of the connector. Therefore, the service life requirements are met by the power pad 110 being between 0.65mm and 1.46mm and the connection end length of the first probe 120 being between 0.5mm and 1mm, and the volume ratio is also relatively small.
[0036] It should be noted that the side length of the power pad 110 is directly proportional to the length of the connection end of the first probe 120. For example, when the side length of the power pad 110 is 0.65mm, the length of the connection end of the first probe 120 is 0.5mm. When the side length of the power pad 110 is 1.46mm, the length of the connection end of the first probe 120 can reach 1mm.
[0037] As an optional implementation, the power pad 110 is provided with three (i.e.) Figure 4 (P1-P3) are arranged in the same column to form a power area. The same column of the power area has a control area of the same size as the power pad 110. The control area includes two first control pads (i.e.... Figure 4 (M1 and M2) and four second control pads (i.e. Figure 4(M3-M6), two first control pads are in a separate column, four second control pads are in a separate column, the first control pads are connected to second probes, and the second control pads are connected to third probes.
[0038] In this embodiment, P1-P3 correspond to the three combined power pads 110. If the voltages of each power supply group are different, they cannot be combined. M1-M6 are control signals, with M1 and M2 being key communication signals whose pins are used for aging and coupling during production. Other pins are only used for testing. Pads with different attributes cannot be combined; only pads with the same attribute can be combined. Electrical connection is achieved only when the pads and the probes below them are in contact. Arranging the pads in a matrix allows all pads with the same attribute to be connected into a large pad, with a size of 0.65-1.46mm, which can be used to match probes with a diameter of 0.5-1mm. Therefore, in addition to the power pads P1-P3, some control pads with the same attribute can be combined to obtain the two first control pads, M1 and M2. These two first control pads are important control signals, and this design helps to enhance the stability of the connection.
[0039] As an optional implementation, the side lengths of the two first control pads are equal to the side lengths of the four second control pads, making the entire pad surface more standardized and neat.
[0040] As an optional implementation, the side length of the second control pad is 0.25 mm, and the length of the connection end between the third probe and the second control pad is 0.22 mm.
[0041] In this embodiment, the second control pad and the corresponding third probe are not merged, so their original dimensions and structure can be retained. Based on the dimension and structure design of the power pad 110, the side length of the first control pad can be designed accordingly, following the design principle of "side length of the second control pad + side length of the first control pad = side length of the power pad 110". For example, when the side length of the power pad 110 is designed to be 0.65mm, the side length of the first control pad can be designed to be 0.65 - 0.25 = 0.4mm. Furthermore, the length of the second probe connection end corresponding to the first control pad can be designed between 0.22 and 0.5mm.
[0042] As an optional implementation, a high-speed signal area is also included, with the power supply area and control area located on the same side of the high-speed signal area. The high-speed signal area includes multiple high-speed interface groups arranged in a horizontal and vertical array, resulting in a more aesthetically pleasing layout.
[0043] As an optional implementation, the high-speed interface group includes two high-speed signal pads for forming high-speed differential pairs, and ten ground pads are arranged around the two high-speed signal pads. Both the high-speed signal pads and the ground pads are connected to a fourth probe.
[0044] In this embodiment, such as Figure 4 As shown, S is a high-speed signal pad, and G is a ground pad. Two S's form a high-speed differential pair. G's pads are used to wrap the S's pads to avoid crosstalk. Two S's and ten G's form a high-speed interface. The corresponding high-speed interface groups can be arranged according to the requirements.
[0045] As an optional implementation, the side length of both the high-speed signal pad and the ground pad is 0.25 mm, and the length of the connection end between the fourth probe and the high-speed signal pad and the ground pad is 0.22 mm.
[0046] In this embodiment, the high-speed signal pad, ground pad, and their corresponding fourth probe can retain their original size and structural design.
[0047] In summary, this embodiment pre-divides the LGA pads according to their functional types and attribute definitions, dividing them into three categories: high-speed signal section, power supply section, and control section. The key control pins of the power supply section and control section are merged and expanded, and their corresponding pads are also merged and expanded. At the same time, the layout structure is optimized, which improves the service life and ensures the neatness and aesthetics of the pad layout.
[0048] Example 2
[0049] To achieve the above objectives, this embodiment also provides a connector including the aforementioned easy-to-manufacture LGA pad, thereby having a service life of more than 2,000 mating cycles.
[0050] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An LGA pad that is easy to manufacture, characterized in that, include: Multiple power pads, wherein the side length of the multiple power pads is greater than or equal to 0.65 mm; Multiple first probes are connected to corresponding power pads, and the length of the connection end of each first probe to the power pad is greater than or equal to 0.5 mm.
2. The LGA pad for easy production as described in claim 1, characterized in that, The side length of the power pad is 0.65mm-1.46mm.
3. The LGA pad for easy production as described in claim 2, characterized in that, The length of the connection end between the first probe and the power pad is 0.5mm-1mm.
4. The LGA pad for easy production as described in claim 1, characterized in that, The power pads are arranged in three columns to form a power area. The same column of the power area has a control area of the same size as the power pads. The control area includes two first control pads and four second control pads. The two first control pads are in a separate column, and the four second control pads are in a separate column. The first control pads are connected to second probes, and the second control pads are connected to third probes.
5. An LGA pad for easy production as described in claim 4, characterized in that, The side length of the two first control pads is equal to the side length of the four second control pads.
6. The LGA pad for easy production as described in claim 4, characterized in that, The second control pad has a side length of 0.25 mm, and the connection end of the third probe to the second control pad has a length of 0.22 mm.
7. An LGA pad for easy production as described in any one of claims 4-6, characterized in that, It also includes a high-speed signal region, wherein the power supply region and the control region are located on the same side of the high-speed signal region, and the high-speed signal region includes multiple high-speed interface groups arranged in a longitudinal and transverse array.
8. The LGA pad for easy production as described in claim 7, characterized in that, The high-speed interface group includes two high-speed signal pads for forming high-speed differential pairs. Ten ground pads are arranged around the two high-speed signal pads. Both the high-speed signal pads and the ground pads are connected to a fourth probe.
9. The LGA pad for easy production as described in claim 8, characterized in that, The side length of both the high-speed signal pad and the ground pad is 0.25 mm, and the length of the connection end between the fourth probe and the high-speed signal pad and the ground pad is 0.22 mm.
10. A connector, characterized in that, Includes an LGA pad that is easy to manufacture, as described in any one of claims 1-9.