A power management chip pin reinforcing structure

Abstract

The utility model relates to chip production and processing technical field discloses a power management chip pin reinforcing structure, including second pin, the telescopic plate is connected with the sliding of second pin outer wall, the second connecting plate is fixedly connected with telescopic plate outer wall, the first connecting plate is fixedly connected with telescopic plate outer wall, spring no.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing and processing technology, and in particular to a pin reinforcement structure for a power management chip. Background Technology

[0002] Chips face various mechanical stresses in practical use, such as vibration and impact. Simultaneously, the circuit board's thermal expansion and contraction also exert forces on the pins. As critical components connecting the chip to the circuit board, insufficient mechanical strength in the pins can easily lead to deformation, breakage, or loosening, affecting the chip's normal operation. Therefore, reinforcement technology is needed to enhance the mechanical strength of the pins, ensuring reliable connection under various mechanical stresses. Loose or detached pins can cause chip failure, increasing product repair costs and scrap rates. Pin reinforcement technology can reduce failures caused by pin problems, improve product reliability and lifespan, thereby reducing production costs for manufacturers and operating costs for users.

[0003] Under current technological conditions, pin reinforcement technology for power management chips primarily relies on the application of solder. Solder, due to its excellent conductivity and adhesion, is widely used for connecting and securing chip pins to the circuit board. However, during actual operation, electronic devices generate heat due to the flow of current, and this heat gradually accumulates and is transferred to the solder. Over time and with increased operation, the solder may reach its melting point due to heat accumulation, resulting in melting.

[0004] Once the solder melts, its original fixing function fails, causing the connection between the power management chip's pins and the circuit board to become loose, or even completely separate. This physical separation not only compromises the integrity of the circuit but may also cause deformation of the pins themselves due to movement. Pin deformation directly affects the chip's internal circuit connections, thereby impacting the chip's normal function.

[0005] More seriously, severe pin deformation can lead to permanent chip damage, rendering the chip irreparable and requiring replacement. This undoubtedly increases product maintenance costs and may also affect the overall product lifespan and user experience. Therefore, while soldering is a common and simple method for pin reinforcement, its stability and reliability may be challenged under prolonged operation and high-temperature environments, requiring further improvement and optimization. Summary of the Invention

[0006] To overcome the above deficiencies, this utility model provides a power management chip pin reinforcement structure, which aims to fundamentally solve the problems of pin damage and failure by optimizing the mechanical structure, enhancing electrical connections, and improving environmental protection capabilities. This not only reduces product failure rate and extends service life, but also expands the application of the chip in harsh environments or high reliability scenarios.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a power management chip pin reinforcement structure, including a second pin, a telescopic plate slidably connected to the outer wall of the second pin, a second connecting plate fixedly connected to the outer wall of the telescopic plate, a first connecting plate fixedly connected to the outer wall of the telescopic plate, a second spring fixedly connected to the outer wall of the lower surface of the second connecting plate, a second spring fixedly connected to the outer wall of the upper surface of the first connecting plate, a transmission rod rotatably connected to the upper surface of the first connecting plate, and a handle fixedly connected to the outer wall of the transmission rod.

[0008] Furthermore, a first connecting post is fixedly connected to the upper surface of the PCB circuit board, and a second connecting post is fixedly connected to the upper surface of the PCB circuit board. A second pin is provided on the outer wall of the first connecting post.

[0009] Furthermore, a first pin is fixedly connected to the outer wall of the chip.

[0010] Furthermore, a second fixing post is fixedly connected to the outer wall of the first pin, and the second fixing post is fixedly connected to the upper surface of the PCB circuit board.

[0011] Furthermore, a first fixing post is fixedly connected to the upper surface of the PCB circuit board.

[0012] Furthermore, a first fixing post is fixedly connected to the outer wall of the first pin.

[0013] Furthermore, a nut is fixedly connected to the outer wall of the screw.

[0014] Furthermore, a screw is slidably connected inside the first connecting column, and a spring is slidably connected to the outer wall of the screw.

[0015] This utility model has the following beneficial effects: 1. In this utility model, the conveyor belt is driven by rotating the lever, which causes the telescopic plate to move. When the telescopic plate moves to the appropriate position, the lever is stopped. At this time, the spring returns to its elastic deformation and forms a clamping effect on the transmission rod, thereby fixing the telescopic plate. This fundamentally solves the problem of easy damage and failure of pins, which can not only reduce the product failure rate and extend the service life, but also expand the application of chips in harsh environments or high reliability scenarios.

[0016] 2. In this utility model, when performing chip pin reinforcement, the user only needs to align the chip with the corresponding position on the printed circuit board and apply slight pressure to the chip. At this time, the screw moves backward under the squeezing force, thereby locking the chip pin under the screw. The reinforcement structure strengthens the connection, effectively reducing the loosening and breakage of pins caused by external impact or vibration, reducing the failure rate caused by poor pin contact, and thus improving the overall reliability of the product. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a power management chip pin reinforcement structure proposed in this utility model; Figure 2 This is a schematic diagram of a snap-fit ​​structure for reinforcing the pins of a power management chip proposed in this utility model; Figure 3 This is a schematic diagram of a telescopic structure for reinforcing the pins of a power management chip proposed in this utility model; Figure 4 for Figure 1 Enlarged view of point A in the middle; Figure 5 for Figure 1 Enlarged diagram of point B in the middle.

[0018] Legend: 1. Chip; 2. PCB circuit board; 3. First pin; 4. First fixing post; 5. Second fixing post; 6. First connecting post; 7. Second connecting post; 8. Second pin; 9. Spring 1; 10. Nut; 11. Screw; 12. Hand lever; 13. Transmission rod; 14. First connecting plate; 15. Second connecting plate; 16. Spring 2; 17. Telescopic plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figure 3 and Figure 5One embodiment of this utility model provides a power management chip pin reinforcement structure, including a second pin 8. A telescopic plate 17 is slidably connected to the outer wall of the second pin 8. A second connecting plate 15 is fixedly connected to the outer wall of the telescopic plate 17 to prevent it from detaching from the chip 1 during sliding. A first connecting plate 14 is fixedly connected to the outer wall of the telescopic plate 17. A second spring 16 is fixedly connected to the outer wall of the lower surface of the second connecting plate 15. The other end of the second spring 16 is fixedly connected to the first connecting plate 14 to provide the necessary space for the movement of the transmission rod 13. The transmission rod 13 is rotatably connected to the upper surface of the first connecting plate 14. A handle 12 is fixedly connected to the outer wall of the transmission rod 13 for easy operation.

[0021] Reference Figure 1 , Figure 2 and Figure 4 A first connecting post 6 is fixedly connected to the upper surface of PCB circuit board 2, and a second connecting post 7 is fixedly connected to the upper surface of PCB circuit board 2. A second pin 8 is provided on the outer wall of the first connecting post 6. A first pin 3 is fixedly connected to the outer wall of chip 1. A second fixing post 5 is fixedly connected to the outer wall of the first pin 3, so that chip 1 is initially fixed. A second fixing post 5 is fixedly connected to the upper surface of PCB circuit board 2, and a first fixing post 4 is fixedly connected to the upper surface of PCB circuit board 2. A first fixing post 4 is fixedly connected to the outer wall of the first pin 3. A nut 10 is fixedly connected to the outer wall of screw 11 to prevent screw 11 from popping out due to spring force. Screw 11 is slidably connected inside the first connecting post 6 so that screw 11 can move. A spring 9 is slidably connected to the outer wall of screw 11 to provide power for the movement of screw 11.

[0022] Working principle: When it is necessary to reinforce the pins, the chip 1 should first be accurately placed in the predetermined corresponding position on the PCB circuit board 2 to ensure that it is aligned with the solder joint on the circuit board. The first connecting post 6 and the second connecting post 7 are fixed on the solder joint on the PCB circuit board 2. Then, apply appropriate pressure to the chip 1 to make it fit tightly against the circuit board. During this process, the spring 9 will be compressed due to the pressure from the chip 1. This deformation will cause the screw 11 connected to it to move accordingly. At this time, the second pin 8, which was originally obstructed by the screw 11, can move freely downwards because the obstruction is removed. When the position of the second pin 8 drops below the level of the screw 11, the spring 9 no longer bears additional external force and returns to its original state, causing the screw 11 to move in the opposite direction. The nut 10 fixes the screw 11, thus providing conditions for further fixing of the second pin 8. At this time, the chip 1 is initially fixed, and the first fixing post 4 and the second fixing post 5 are respectively snapped onto the second pin 8. The operator needs to rotate the lever 12, and the rotation of the lever 12 drives the connected transmission rod 13. Due to the first connecting plate 14 and the second connecting plate 15... Under the force transmitted by the lever 12, the second spring 16 will be compressed and deformed. This deformation will cause the transmission rod 13 to move accordingly, so that the telescopic plate 17 is fixed on the second pin 8. When the transmission rod 13 moves to a suitable position to ensure that the first pin 3 is effectively fixed, the operator should stop rotating the lever 12. At this time, the second spring 16 will gradually recover its deformation and use its own elasticity to hold the transmission rod 13 in place, so that the first connecting plate 14 also stops moving, ensuring that the entire reinforcement process is completed smoothly.

[0023] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A pin reinforcement structure for a power management chip, comprising a PCB circuit board (2) and a second pin (8), characterized in that: The outer wall of the second pin (8) is provided with a telescopic plate (17), the outer wall of the telescopic plate (17) is fixedly connected to a second connecting plate (15), the outer wall of the telescopic plate (17) is fixedly connected to a first connecting plate (14), the outer wall of the lower surface of the second connecting plate (15) is fixedly connected to a second spring (16), the other end of the second spring (16) is fixedly connected to the first connecting plate (14), the upper surface of the first connecting plate (14) is rotatably connected to a transmission rod (13), and the outer wall of the transmission rod (13) is fixedly connected to a handle (12).

2. The pin reinforcement structure for a power management chip according to claim 1, characterized in that: The upper surface of the PCB circuit board (2) is fixedly connected to a first connecting post (6), and the upper surface of the PCB circuit board (2) is fixedly connected to a second connecting post (7). The outer wall of the first connecting post (6) is provided with a second pin (8).

3. The power management chip pin reinforcement structure according to claim 2, characterized in that: The chip (1) has a first pin (3) fixedly connected to its outer wall.

4. The power management chip pin reinforcement structure according to claim 3, characterized in that: The outer wall of the first pin (3) is fixedly connected to the second fixing post (5), and the upper surface of the PCB circuit board (2) is fixedly connected to the second fixing post (5).

5. The pin reinforcement structure for a power management chip according to claim 2, characterized in that: The first fixing post (4) is fixedly connected to the upper surface of the PCB circuit board (2).

6. The pin reinforcement structure for a power management chip according to claim 3, characterized in that: The first pin (3) is fixedly connected to the outer wall of the first fixing post (4).

7. The power management chip pin reinforcement structure according to claim 2, characterized in that: The first connecting column (6) has a sliding connection screw (11) inside, and a spring (9) is slidably connected to the outer wall of the screw (11), and a nut (10) is fixedly connected to the outer wall of the screw (11).

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