A high-precision tin spraying device for circuit board

Abstract

The utility model relates to circuit board processing technical field, and disclose a kind of high-precision tin spraying device of circuit board, including processing table, the top of processing table is fixedly installed with mounting bracket, the side of mounting bracket is fixedly installed with controller, the top of processing table is equipped with multiple fixed slots;The high-precision tin spraying device of circuit board, by setting tin spraying mechanism, can be tin sprayed to circuit board, by setting moving mechanism, the position of tin spraying mechanism can be adjusted, again in combination multiple fixed slots, multiple circuit boards can be simultaneously tin sprayed operation, improve the tin spraying efficiency of circuit board, by setting placing cavity, steel wire mesh and collection box, the tin liquid in excess can be collected, by setting partition, the collection box can be separated, and then by heating in heating cavity to avoid the tin liquid collected in collection cavity to carry out heat preservation, and then avoid the tin liquid solidification to cause the situation of cleaning difficulty to occur.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a high-precision tin-spraying device for circuit boards. Background Technology

[0002] Circuit boards, also known as printed circuit boards, make circuits miniaturized and more intuitive. They play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit boards are also called ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, and circuit boards, etc. During the production process of circuit boards, tin spraying equipment is used to spray tin onto the surface of the circuit board.

[0003] A search revealed Chinese patent CN214864637U, which discloses an adjustable-position circuit board soldering device. The device includes a fixing mechanism, a positioning mechanism, a soldering mechanism, and a purification mechanism. The fixing mechanism includes a fixed platform with supporting feet fixedly mounted on its lower side and a collection groove on its upper side. The positioning mechanism includes four support rods, with a fixing sleeve welded to the outer side of each support rod. A connecting rod is welded between the fixing sleeves, and two sliding plates are movably mounted on the outer side of each connecting rod. Positioning pins are detachably mounted on the front and rear sides of each sliding plate, and a fixing button is detachably mounted on the upper side of each sliding plate. A screw is welded to the lower side of the fixing button. This adjustable-position circuit board soldering device is suitable for circuit boards of different sizes, increasing its practicality. The adjustable positioning allows for better soldering, and the collection groove can be used to collect waste materials.

[0004] However, existing technologies still have certain shortcomings in use. For example, the nozzle structure in existing tin spraying devices is fixed, the nozzle position cannot be adjusted, and only one circuit board can be tin sprayed at a time. After processing, the circuit board needs to be replaced manually, resulting in extremely low tin spraying efficiency, which is difficult to meet the needs of mass production. Utility Model Content

[0005] This invention provides a high-precision tin-spraying device for circuit boards, which has the beneficial effect of high tin-spraying efficiency and solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-precision tin spraying device for circuit boards, including a processing table, a mounting frame fixedly installed on the top of the processing table, a controller fixedly installed on the side of the mounting frame, multiple fixing slots opened on the top of the processing table, a tin spraying mechanism and a moving mechanism provided on the mounting frame, and a collecting mechanism provided inside the processing table.

[0007] As an optional solution of this utility model, the tin spraying mechanism includes a tin liquid tank installed on the top of the mounting frame, a paint pump fixedly installed on the side of the tin liquid tank, a corrugated pipe fixedly installed at the output end of the paint pump, and a nozzle fixedly connected to one end of the corrugated pipe.

[0008] As an optional solution of this utility model, the moving mechanism includes a limiting groove formed at the bottom of the mounting frame, a limiting block slidably connected inside the limiting groove, a bidirectional lead screw threaded through and threaded to the side of the limiting block, both ends of the bidirectional lead screw being rotatably connected to the mounting frame, and a motor fixedly installed on the mounting frame being fixedly connected to one end of the bidirectional lead screw.

[0009] As an optional solution of this utility model, a linkage groove is provided at the top of the inner cavity of the limiting groove, and a linkage block is slidably connected inside the linkage groove. The bottom of the linkage block is fixedly connected to the top of the limiting block, and a U-shaped seat is fixedly connected to the top of the linkage block. The molten solder tank is fixedly installed on the top of the U-shaped seat, and a connecting plate is fixedly connected to the bottom of the limiting block. An installation frame is provided at the bottom end of the connecting plate, and the corrugated pipe and the nozzle are both installed on the installation frame.

[0010] As an optional solution of this utility model, the U-shaped seat is slidably connected to the surface of the mounting frame, the top of the connecting plate is fixedly connected to the bottom of the U-shaped seat, and the connecting plate is slidably connected to the mounting frame.

[0011] As an optional solution of this utility model, an electric actuator is fixedly installed at the bottom of the connecting plate, and the bottom end of the electric actuator is fixedly connected to the top of the mounting frame.

[0012] As an optional solution of this utility model, the collection mechanism includes a placement cavity opened on the side of the processing table, the fixing groove and the placement cavity are interconnected, the inner wall of the fixing groove is fixedly installed with a wire mesh, and a collection box is placed inside the placement cavity.

[0013] As an optional solution of this utility model, a partition plate is fixedly installed on the inner wall of the collection box, and the collection box is divided into a collection chamber and a heating chamber by the partition plate. The heating chamber is filled with heating liquid, and a heating element is fixedly installed at the bottom of the inner cavity of the heating chamber. A temperature sensor, a temperature control display screen and a switch are fixedly installed on the side of the collection box, and the probe of the temperature sensor extends into the interior of the heating chamber.

[0014] This utility model has the following beneficial effects:

[0015] 1. This high-precision tin spraying device for circuit boards can spray tin onto circuit boards by setting a tin spraying mechanism. By setting a moving mechanism, the position of the tin spraying mechanism can be adjusted. Combined with multiple fixed slots, multiple circuit boards can be sprayed with tin simultaneously, which improves the tin spraying efficiency of circuit boards.

[0016] 2. This high-precision solder spraying device for circuit boards can collect excess molten solder by setting up a placement chamber, a wire mesh, and a collection box. By setting up a partition plate, the collection box can be divided. Furthermore, by heating in the heating chamber, the molten solder collected in the collection chamber is kept warm, thereby avoiding the situation where the molten solder solidifies and becomes difficult to clean. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the tin spraying mechanism of this utility model.

[0019] Figure 3 This is a side view sectional structural diagram of the present invention.

[0020] Figure 4 This is a partial structural diagram of the moving mechanism of this utility model.

[0021] In the diagram: 1. Processing table; 2. Mounting bracket; 3. Controller; 4. Fixing tank; 5. Tin spraying mechanism; 6. Moving mechanism; 7. Collecting mechanism;

[0022] 51. Solder tank; 52. Paint pump; 53. Corrugated pipe; 54. Spray nozzle;

[0023] 61. Limiting groove; 62. Limiting block; 621. Two-way lead screw; 622. Motor; 63. Linkage groove; 64. Linkage block; 65. U-shaped seat; 66. Connecting plate; 67. Mounting frame; 68. Electric actuator;

[0024] 71. Placement chamber; 72. Wire mesh; 73. Collection box; 74. Divider plate; 75. Collection chamber; 76. Heating chamber; 77. Heating element; 78. Temperature sensor; 79. Temperature control display screen; 710. Switch. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example:

[0027] Please see Figure 1-4 A high-precision solder spraying device for circuit boards includes a processing table 1, a mounting frame 2 fixedly mounted on the top of the processing table 1, a controller 3 fixedly mounted on the side of the mounting frame 2, multiple fixing slots 4 opened on the top of the processing table 1, a solder spraying mechanism 5 and a moving mechanism 6 arranged on the mounting frame 2, and a collection mechanism 7 arranged inside the processing table 1. By setting the fixing slots 4, circuit boards can be placed, and by setting the controller 3, the solder spraying mechanism 5 and the moving mechanism 6 can be controlled, thereby enabling solder spraying operations on multiple circuit boards, improving solder spraying efficiency. By setting the 9, excess solder liquid can be collected.

[0028] The tin spraying mechanism 5 includes a tin liquid tank 51 installed on the top of the mounting frame 2. A paint pump 52 is fixedly installed on the side of the tin liquid tank 51. A corrugated pipe 53 is fixedly installed at the output end of the paint pump 52. One end of the corrugated pipe 53 is fixedly connected to a nozzle 54. By turning on the paint pump 52, tin liquid can be drawn out from the tin liquid tank 51 and introduced into the nozzle 54 through the corrugated pipe 53. Tin spraying can then be performed through the nozzle 54.

[0029] Furthermore, the moving mechanism 6 includes a limiting groove 61 formed at the bottom of the mounting frame 2. A limiting block 62 is slidably connected inside the limiting groove 61. A bidirectional lead screw 621 is threaded through and threaded onto the side of the limiting block 62. Both ends of the bidirectional lead screw 621 are rotatably connected to the mounting frame 2. One end of the bidirectional lead screw 621 is fixedly connected to a motor 622 that is fixedly mounted to the mounting frame 2. By turning on the motor 622, the bidirectional lead screw 621 is driven to rotate. Under the limiting action of the limiting groove 61, the limiting block 62 can slide inside the limiting groove 61, thereby driving the solder spraying mechanism 5 to move.

[0030] The upper part of the inner cavity of the limiting groove 61 is provided with a linkage groove 63. A linkage block 64 is slidably connected inside the linkage groove 63. The bottom of the linkage block 64 is fixedly connected to the top of the limiting block 62. A U-shaped seat 65 is fixedly connected to the top of the linkage block 64. The solder bath 51 is fixedly installed on the top of the U-shaped seat 65. A connecting plate 66 is fixedly connected to the bottom of the limiting block 62. A mounting frame 67 is provided at the bottom end of the connecting plate 66. The corrugated pipe 53 and the nozzle 54 are both installed on the mounting frame 67. When the limiting block 62 moves, the limiting block 62 drives the linkage block 64 to slide in the linkage groove 63, which can drive the U-shaped seat 65 to move synchronously. This allows the solder bath 51 to move synchronously. Under the action of the connecting plate 66, the mounting frame 67 can move synchronously, which can drive the corrugated pipe 53 and the nozzle 54 to move synchronously. This allows the solder spraying mechanism 5 to move, so that the circuit boards in the multiple fixed grooves 4 can be soldered.

[0031] It should also be noted that the U-shaped seat 65 is slidably connected to the surface of the mounting frame 2, and the top of the connecting plate 66 is fixedly connected to the bottom of the U-shaped seat 65. The connecting plate 66 and the mounting frame 2 are slidably connected. The mutual cooperation between the U-shaped seat 65 and the connecting plate 66 can increase the stability of the device. An electric actuator 68 is fixedly installed at the bottom of the connecting plate 66, and the bottom end of the electric actuator 68 is fixedly connected to the top of the mounting frame 67. By setting the electric actuator 68, the height of the mounting frame 67 can be adjusted, thereby adjusting the height of the nozzle 54.

[0032] Furthermore, the collection mechanism 7 includes a placement cavity 71 opened on the side of the processing table 1, the fixing groove 4 and the placement cavity 71 are interconnected, the inner wall of the fixing groove 4 is fixedly installed with a wire mesh 72, and the placement cavity 71 is filled with a collection box 73; by setting the wire mesh 72, the circuit board can be supported, and by setting the collection box 73, excess solder can be collected.

[0033] The collection box 73 is divided into a collection chamber 75 and a heating chamber 76 by a partition plate 74 fixedly installed on the inner wall. The heating chamber 76 is filled with heating liquid and a heating element 77 is fixedly installed at the bottom of the inner cavity of the heating chamber 76. A temperature sensor 78, a temperature control display screen 79, and a switch 710 are fixedly installed on the side of the collection box 73. The probe of the temperature sensor 78 extends into the interior of the heating chamber 76. The partition plate 74 can divide the collection box 73 into the collection chamber 75 for holding molten solder and the heating chamber 76 for heating. The switch 710 can open the heating element 77 to heat the heating liquid inside. The temperature sensor 78 can monitor the temperature of the heating liquid and the temperature control display screen 79 can be used to observe the temperature value. This can ensure the temperature of the molten solder in the collection chamber 75 and prevent it from solidifying and becoming difficult to clean.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A high-precision tin plating device for circuit boards, comprising a processing table (1), characterized in that: A mounting bracket (2) is fixedly installed on the top of the processing table (1), and a controller (3) is fixedly installed on the side of the mounting bracket (2). Multiple fixing slots (4) are opened on the top of the processing table (1). A solder spraying mechanism (5) and a moving mechanism (6) are provided on the mounting bracket (2). A collection mechanism (7) is provided inside the processing table (1).

2. The high-precision tin-spraying device for circuit boards according to claim 1, characterized in that: The tin spraying mechanism (5) includes a tin liquid tank (51) installed on the top of the mounting frame (2), a paint pump (52) is fixedly installed on the side of the tin liquid tank (51), a corrugated pipe (53) is fixedly installed at the output end of the paint pump (52), and a nozzle (54) is fixedly connected to one end of the corrugated pipe (53).

3. The high-precision tin-plating device for circuit boards according to claim 2, characterized in that: The moving mechanism (6) includes a limiting groove (61) opened at the bottom of the mounting frame (2). A limiting block (62) is slidably connected inside the limiting groove (61). A bidirectional lead screw (621) is threaded through and threaded onto the side of the limiting block (62). Both ends of the bidirectional lead screw (621) are rotatably connected to the mounting frame (2). One end of the bidirectional lead screw (621) is fixedly connected to a motor (622) that is fixedly installed on the mounting frame (2).

4. The high-precision tin-plating device for circuit boards according to claim 3, characterized in that: The upper part of the inner cavity of the limiting groove (61) is provided with a linkage groove (63). A linkage block (64) is slidably connected inside the linkage groove (63). The bottom of the linkage block (64) is fixedly connected to the top of the limiting block (62). A U-shaped seat (65) is fixedly connected to the top of the linkage block (64). The tin liquid tank (51) is fixedly installed on the top of the U-shaped seat (65). A connecting plate (66) is fixedly connected to the bottom of the limiting block (62). A mounting frame (67) is provided at the bottom end of the connecting plate (66). The corrugated pipe (53) and the nozzle (54) are both installed on the mounting frame (67).

5. The high-precision tin-plating device for circuit boards according to claim 4, characterized in that: The U-shaped seat (65) is slidably connected to the surface of the mounting bracket (2), the top of the connecting plate (66) is fixedly connected to the bottom of the U-shaped seat (65), and the connecting plate (66) is slidably connected to the mounting bracket (2).

6. The high-precision tin-plating device for circuit boards according to claim 5, characterized in that: An electric actuator (68) is fixedly installed at the bottom of the connecting plate (66), and the bottom end of the electric actuator (68) is fixedly connected to the top of the mounting frame (67).

7. The high-precision tin-plating device for circuit boards according to claim 1, characterized in that: The collection mechanism (7) includes a placement cavity (71) opened on the side of the processing table (1), the fixing groove (4) and the placement cavity (71) are interconnected, the inner wall of the fixing groove (4) is fixedly installed with a wire mesh (72), and a collection box (73) is placed inside the placement cavity (71).

8. The high-precision tin-plating device for circuit boards according to claim 7, characterized in that: The inner wall of the collection box (73) is fixedly installed with a partition plate (74). The collection box (73) is divided by the partition plate (74) to form a collection chamber (75) and a heating chamber (76). The heating chamber (76) is filled with heating liquid. A heating element (77) is fixedly installed at the bottom of the inner cavity of the heating chamber (76). A temperature sensor (78), a temperature control display screen (79), and a switch (710) are fixedly installed on the side of the collection box (73). The probe of the temperature sensor (78) extends into the interior of the heating chamber (76).

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