Red gum steel mesh and printing mechanism thereof

Abstract

The utility model discloses a red glue steel net and printing mechanism relates to red glue steel net technical field, including tin cream steel net and red glue steel net, the tin cream steel net includes first frame, be equipped with the calibration hole and with PCB patch component device pad adaptation's tin cream net mouth on the first frame, the calibration hole is used for realizing the positioning alignment of tin cream steel net and PCB, the red glue steel net includes second frame, the second frame is equipped with calibration hole, first surface, second surface, red glue net mouth, tin cream defers the slot and red glue boss, and the red glue net mouth of first surface corresponds the middle position of PCB patch component device pad and is set up, in the utility model, through tin cream welding red glue bonding double fixed mechanism, the mechanical bonding force is formed after reflow soldering red glue solidification, can effectively resist tin wave impact force when crest welding, reduces the bad rate such as patch component device drop, virtual connection of welding spot, improves product reliability.

Description

Technical Field

[0001] This utility model relates to the field of red glue steel mesh technology, specifically red glue steel mesh and its printing mechanism. Background Technology

[0002] With the rapid development of consumer electronics, automotive electronics, and other fields, electronic products are continuously evolving towards miniaturization, high density, and multifunctionality, which places higher demands on the design and manufacturing of printed circuit boards (PCBs). To achieve functional integration, the component layout on PCBs is becoming increasingly compact, and pin-type components and surface-mount components often need to be arranged in close proximity.

[0003] In traditional PCB soldering processes, surface mount components are typically fixed using solder paste printing and reflow soldering, while pin-type components are soldered using wave soldering. However, when the spacing between the two types of components is too small, the surface mount components cannot be effectively shielded during wave soldering. The impact of the high-temperature solder wave will directly affect the surface mount components, and the solder paste joints formed by reflow soldering alone cannot provide sufficient fixing force. This leads to surface mount components being prone to falling off, poor solder joints, and other defects, which seriously affect product yield and reliability.

[0004] In existing technologies, some solutions attempt to reduce component loss by optimizing pad design or adjusting wave soldering parameters, but the core problem of insufficient shielding space due to component layout density remains unresolved. Another solution uses a single red glue printing to fix surface mount components, but the conductivity and soldering strength of the red glue are insufficient to meet the connection requirements of high-precision circuits.

[0005] In view of the above, this application is hereby submitted. Utility Model Content

[0006] The purpose of this invention is to provide a red glue steel mesh and its printing mechanism to solve the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the present invention provides a red glue stencil, including a solder paste stencil and a red glue stencil; the solder paste stencil includes a first frame, the first frame is provided with calibration holes and solder paste stencil openings adapted to the pads of PCB surface mount components, the calibration holes are used to achieve positioning and alignment of the solder paste stencil and the PCB;

[0008] The red glue stencil includes a second frame, which has a calibration hole, a first surface, a second surface, a red glue stencil opening, a solder paste clearance groove, and a red glue boss. The red glue stencil opening on the first surface is opened at the middle position of the PCB surface mount component pad. The solder paste clearance groove on the second surface is adapted to the position of the solder paste stencil opening. The red glue boss protrudes from the second surface and is used for support during red glue printing.

[0009] The calibration holes of the red glue stencil are the same as those of the solder paste stencil, and the solder paste clearance groove can provide clearance protection for the solder paste printed on the PCB by the solder paste stencil.

[0010] Furthermore, the first and second surfaces of the red glue stencil are the front and back sides of the stencil, the aperture of the red glue stencil opening is smaller than the spacing of the PCB surface mount component pads, and the edge of the red glue stencil opening does not overlap with the edge of the surface mount component pads. The red glue bosses are distributed along the edge of the red glue stencil and the periphery of the red glue stencil opening, and the height of the red glue bosses is the same as the depth of the solder paste clearance groove.

[0011] Furthermore, the solder paste clearance groove is a groove structure formed on the second surface of the red glue stencil. The depth of the groove is not less than the thickness of the solder paste after printing, and the area of ​​the groove is greater than the area of ​​the solder paste stencil opening. The PCB adapted to the system is provided with surface mount components and pin components. The center position of the pad of the surface mount component corresponds to the red glue stencil opening. The pad of the pin component does not overlap with the red glue printing area.

[0012] Furthermore, the calibration holes of the solder paste stencil are symmetrically distributed at the four corners of the first frame, and the number of solder paste stencil openings corresponds one-to-one with the number of surface mount component pads on the PCB.

[0013] The red glue stencil printing mechanism also includes a housing, the inner wall of which is provided with a standard squeegee. The standard squeegee is used to cooperate with the solder paste stencil to complete solder paste printing. The red glue stencil printing mechanism also includes the following steps:

[0014] Step 1: Solder paste printing. Align the solder paste stencil with the PCB through the calibration holes, and use a standard squeegee to print the solder paste through the solder paste stencil openings onto the pads of the surface mount components.

[0015] Step 2: Red glue printing. The red glue stencil is aligned with the PCB positioning through the calibration holes of the same reference, so that the solder paste clearance groove completely covers the printed solder paste area. With the red glue boss as support, the red glue is printed through the red glue stencil opening to the middle position of the surface mount component pad.

[0016] Step 3: After the surface mount technology (SMT) operation, reflow soldering is performed to melt the solder paste and solder the SMT components, while the red glue cures to bond and fix the SMT components to the PCB.

[0017] Step 4: After inserting the pin-mounted components, perform wave soldering. While soldering the pin-mounted components, use the adhesive strength of the cured red glue to prevent the surface mount components from falling off.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. Through the dual fixing mechanism of solder paste soldering and red glue bonding, the red glue cures after reflow soldering to form mechanical bonding force, which can effectively resist the impact of solder waves during wave soldering, reduce the defect rate of surface mount components falling off and poor solder joints, and improve product reliability.

[0020] 2. The solder paste clearance groove of the red glue stencil precisely avoids the printed solder paste, while the red glue boss supports the red glue printing. It can realize the dual process in a compact space without the need for additional masking devices, perfectly adapting to the development needs of miniaturization and high density of electronic products.

[0021] 3. The solder paste mesh forms conductive solder joints to ensure circuit connection performance, while the red glue mesh forms a mechanical fixation to provide sufficient strength. The two work together to balance conductivity and reliability, meeting the functional requirements of high-precision circuits. Attached Figure Description

[0022] Figure 1 A schematic diagram of the external facade structure of the red glue steel mesh and its printing mechanism;

[0023] Figure 2 A schematic diagram of the internal elevation structure of the red glue steel mesh and its printing mechanism;

[0024] Figure 3 A schematic diagram of the internal structure of a PCB, showing the red glue stencil and its printing mechanism;

[0025] Figure 4 A schematic diagram of the front structure of the red glue steel mesh and its printing mechanism;

[0026] Figure 5 A schematic diagram of the back structure of the red glue steel mesh and its printing mechanism;

[0027] Figure 6 for Figure 5 Enlarged structural diagram at point A in the middle;

[0028] Figure 7 A schematic diagram of the front structure of the solder paste stencil and its printing mechanism;

[0029] Figure 8 A magnified schematic diagram of the mesh opening of the red glue steel mesh and its printing mechanism;

[0030] Figure 9 This is a schematic diagram of the back structure of the red glue steel mesh and its printing mechanism.

[0031] In the diagram: 1. Outer shell; 2. Standard scraper; 3. Red glue stencil; 4. First surface; 5. Second frame; 6. Calibration hole; 7. Second surface; 8. First frame; 9. Solder paste stencil opening; 10. Solder paste stencil; 11. Solder paste clearance groove; 12. Red glue boss; 13. Red glue stencil opening; 14. Pin-mount component; 15. Surface mount component. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil, including a solder paste stencil 10 and a red glue stencil 3; the solder paste stencil 10 includes a first frame 8, on which calibration holes 6 and solder paste slots 9 adapted to the pads of PCB surface mount components 15 are provided. The calibration holes 6 are used to achieve positioning alignment between the solder paste stencil 10 and the PCB; the red glue stencil 3 includes a second frame 5, on which calibration holes 6, a first surface 4, a second surface 7, red glue slots 13, solder paste clearance grooves 11, and red glue bosses 12 are provided. The solder paste stencil 10 and the red glue stencil 3 use calibration holes 6 of the same specification to ensure that the two printing processes are aligned with the PCB using the same reference, avoiding solder paste printing misalignment caused by positioning deviation, significantly improving the positional accuracy of solder paste and red glue printing, and laying a solid foundation for subsequent soldering and fixing quality. The foundation is established; the red glue stencil opening 13 on the first surface 4 corresponds to the middle position of the pad of the PCB surface mount component 15, and the solder paste clearance groove 11 on the second surface 7 is precisely matched with the solder paste stencil opening 9 of the solder paste stencil 10. During the red glue printing process, it can effectively avoid the printed solder paste, prevent the red glue from covering, scratching or contaminating the solder paste, ensure the integrity of the solder paste and the subsequent soldering performance, and also ensure the accuracy of the red glue printing area; the red glue boss 12 protrudes from the second surface 7 of the red glue stencil 3, providing stable support during red glue printing, so that the standard squeegee 2 can apply pressure evenly, ensuring that the red glue printing thickness is consistent and the forming is good, avoiding problems such as uneven red glue printing and missing printing caused by insufficient support, and the solder paste clearance groove 11 can avoid and protect the solder paste printed on the PCB by the solder paste stencil 10.

[0034] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil, including calibration holes 6 of solder paste stencil 10 symmetrically distributed at the four corners of the first frame 8. This distribution improves the stability and accuracy of the positioning of the solder paste stencil 10 and the PCB. The number of solder paste slots 9 corresponds one-to-one with the number of pads of surface mount components 15 on the PCB, ensuring that each pad can be accurately printed with solder paste, avoiding omissions or overprints, and providing a basic guarantee for the subsequent soldering quality.

[0035] Please see Figures 1-9This utility model provides a technical solution: a red glue stencil, comprising a first surface 4 and a second surface 7 of the red glue stencil 3 as the front and back sides of the stencil. The aperture of the red glue mesh opening 13 is smaller than the spacing of the pads of the PCB surface mount components 15, and the edge of the red glue mesh opening 13 does not overlap with the edge of the pads of the surface mount components 15, ensuring that the red glue is only printed in the middle area of ​​the pads, which avoids the red glue contaminating the solder paste and affecting conductivity, and ensures that the red glue has a concentrated and effective bonding force to the surface mount components 15.

[0036] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil, including a solder paste relief groove 11 which is a groove structure opened on the second surface 7 of the red glue stencil 3. The depth of the groove structure is not less than the thickness of the solder paste after printing, and the area of ​​the groove is greater than the area of ​​the solder paste opening 9. It can completely accommodate and protect the printed solder paste, prevent the standard squeegee 2 from scratching or the red glue from covering the solder paste during red glue printing, and ensure the integrity of the solder paste and subsequent soldering performance.

[0037] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil, including red glue protrusions 12 distributed along the edge of the red glue stencil 3 and the periphery of the red glue mesh opening 13, and the height of the red glue protrusions 12 is the same as the depth of the solder paste relief groove 11. The distribution method and height setting can keep the red glue stencil 3 parallel and attached to the PCB surface, ensuring uniform pressure of the standard squeegee 2 during red glue printing, avoiding problems such as uneven red glue printing and inconsistent thickness caused by insufficient support, and improving the bonding reliability of the red glue after curing.

[0038] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil, including a PCB adapted to the system with surface mount components 15 and pin-mount components 14. The center position of the pad of the surface mount component 15 corresponds to the red glue mesh opening 13 of the red glue stencil 3. The pad of the pin-mount component 14 does not overlap with the red glue printing area. This clarifies the layout and adaptation relationship of the two types of components on the PCB, ensuring the fixing effect of the red glue on the surface mount component 15, and avoiding the red glue affecting the wave soldering quality of the pin-mount component 14, thus improving the process compatibility when the two types of components coexist.

[0039] Please see Figures 1-9 This utility model provides a technical solution: a red glue stencil printing mechanism, including a standard squeegee 2 provided on the inner wall of the outer shell 1. The outer shell 1 can provide storage and protection for the stencil and the standard squeegee 2, reducing damage during transportation and storage. The standard squeegee 2 is used to cooperate with the solder paste stencil 10 to complete solder paste printing, and to cooperate with the red glue stencil 3 to complete red glue printing, reducing the complexity of operation and equipment cost.

[0040] Please see Figures 1-9This utility model provides a technical solution: a printing method for a red glue stencil printing mechanism, comprising the following steps: Step 1: Solder paste printing, aligning the solder paste stencil 10 with the PCB through the calibration hole 6, and using a standard squeegee 2 to print solder paste through the solder paste stencil opening 9 onto the pads of the surface mount components 15; Step 2: Red glue printing, aligning the red glue stencil 3 with the PCB through the calibration hole 6 of the same reference, so that the solder paste clearance groove 11 completely covers the printed solder paste area, using the red glue boss 12 as support, and using a standard squeegee 2 to print red glue through the red glue stencil opening 13 onto the center position of the pads of the surface mount components 15; Step 3: After the surface mount operation, reflow soldering is performed to melt the solder paste. The process involves several steps: Step 1: Soldering the surface mount component 15 and simultaneously curing the red glue to bond and fix the surface mount component 15 to the PCB; Step 4: After inserting the pin component 14, wave soldering is performed. While soldering the pin component 14, the adhesive force of the cured red glue prevents the surface mount component 15 from falling off. The above-mentioned clearly defined process steps connect solder paste printing, red glue printing, reflow soldering, and wave soldering in an orderly manner. In particular, the positioning of the calibration hole 6 with the same reference and the protection of the solder paste clearance groove 11 ensure the stability and reliability of the dual process, ensuring that the solder paste soldering and red glue bonding mechanisms take effect in sequence, and finally achieving high-quality soldering and fixing of the surface mount component 15 and the pin component 14.

[0041] Working principle: The solder paste stencil 10 is aligned with the PCB through the calibration holes 6 of the first frame 8. The standard squeegee 2 prints solder paste through the solder paste stencil openings 9 onto the pads of the surface mount components 15, laying the foundation for conductive connection. Subsequently, the red glue stencil 3 achieves secondary precise positioning through the calibration holes 6 of the second frame 5, which are of the same specifications as the solder paste stencil 10. The solder paste clearance grooves 11 on its second surface 7 are adapted to the printed solder paste area to avoid damaging the solder paste. At the same time, supported by the red glue bosses 12, the red glue is printed onto the middle position of the pads of the surface mount components 15 through the red glue stencil openings 13 on the first surface 4, forming a mechanical fixing structure. After reflow soldering, the solder paste melts to solder the surface mount components 15, and the red glue cures simultaneously to complete the bonding. Finally, when the pin components 14 are inserted for wave soldering, the bonding force of the cured red glue can resist the impact of the solder wave, preventing the surface mount components 15 from falling off, and at the same time completing the soldering of the pin components 14.

[0042] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. Red adhesive steel mesh, characterized in that: It includes a solder paste stencil (10) and a red glue stencil (3); the solder paste stencil (10) includes a first frame (8), the first frame (8) is provided with a calibration hole (6) and a solder paste stencil port (9) adapted to the pads of the PCB surface mount components (15), the calibration hole (6) is used to realize the positioning alignment of the solder paste stencil (10) and the PCB; The red glue stencil (3) includes a second frame (5), which has a calibration hole (6), a first surface (4), a second surface (7), a red glue mesh opening (13), a solder paste clearance groove (11), and a red glue boss (12). The red glue mesh opening (13) of the first surface (4) is opened at the middle position of the pad of the PCB surface mount component (15). The solder paste clearance groove (11) of the second surface (7) is adapted to the position of the solder paste mesh opening (9) of the solder paste stencil (10). The red glue boss (12) protrudes from the second surface (7) and is used for support during red glue printing. The calibration hole (6) of the red glue stencil (3) is consistent with the calibration hole (6) of the solder paste stencil (10), and the solder paste clearance groove (11) can provide clearance protection for the solder paste printed on the PCB by the solder paste stencil (10).

2. The red-glued steel mesh as described in claim 1, characterized in that: The calibration holes (6) of the solder paste stencil (10) are symmetrically distributed at the four corners of the first frame (8), and the number of solder paste stencil openings (9) corresponds one-to-one with the number of pads of surface mount components (15) on the PCB.

3. The red-glued steel mesh as described in claim 2, characterized in that: The first surface (4) and the second surface (7) of the red glue steel mesh (3) are the front and back sides of the steel mesh. The aperture of the red glue mesh opening (13) is smaller than the spacing of the pads of the PCB surface mount components (15), and the edge of the red glue mesh opening (13) does not overlap with the edge of the pads of the surface mount components (15).

4. The red adhesive steel mesh as described in claim 3, characterized in that: The solder paste clearance groove (11) is a groove structure opened on the second surface (7) of the red glue steel mesh (3). The depth of the groove is not less than the thickness of the solder paste after printing, and the area of ​​the groove is greater than the area of ​​the solder paste mesh opening (9).

5. The red-glued steel mesh as described in claim 4, characterized in that: The red glue boss (12) is distributed along the edge of the red glue steel mesh (3) and the periphery of the red glue mesh opening (13). The height of the red glue boss (12) is the same as the depth of the solder paste relief groove (11).

6. The red-glued steel mesh as described in claim 5, characterized in that: It also includes a PCB adapted to the system, on which surface mount components (15) and pin components (14) are provided. The middle position of the pad of the surface mount component (15) corresponds to the red glue mesh opening (13) of the red glue stencil (3). The pad of the pin component (14) does not overlap with the red glue printing area.

7. A red glue steel mesh printing mechanism, characterized in that: It also includes a housing (1), the inner wall of which is provided with a standard scraper (2), the standard scraper (2) is used to cooperate with the solder paste stencil (10) to complete solder paste printing, and to cooperate with the red glue stencil (3) to complete red glue printing.

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