SMT patch glue curing device
Patent Information
- Application Number
- CN202522154273.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-11
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-10-11
AI Technical Summary
1、该专利中的固化装置在使用时虽然可以方便对电路板贴片胶加热与固化,但是在使用的过程中,电热丝固定在单一支撑架的定位孔内,加热时无法单独对不同区域进行控温,因此,对于需要不同固定温度的电路板,该装置无法满足使用需求
本实用新型通过设置的控制器、升降杆、设备架、固定组件和转盘组件相配合工作,使用时,风管和辅管配合将风机的风流送入不同的连接管,随后再经过进管内的加热丝,即可对下方转盘主体上的电路板进行加热作业,加热完成后,关闭加热丝,风机产生的风流可以继续对下方的电路板进行冷却固化作业,在此过程中,转盘主体在驱动电机和驱动座的带动下,匀速转动,另外根据待加工电路板的固化温度需求,可以通过控制器分别设置三组加热丝的温度参数,当不需要某一个加热丝工作时,需要将该处对应的电控阀门关闭,从而使得本装置能够对不同的区域进行单独控温,满足使用需求。
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Figure CN224844225U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of SMT (Surface Mount Technology) technology, and more specifically, to an SMT adhesive curing device. Background Technology
[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). SMT is a surface mount technology, one of the most popular technologies and processes in the electronics assembly industry.
[0003] A review of the publicly disclosed SMT adhesive curing device (CN218244010U) reveals that it includes a frame, a control mechanism on the surface of the frame, a control platform, a cylinder fixedly connected to the surface of the frame, a connecting frame fixedly connected to the bottom of the cylinder, a control box fixedly connected to the surface of the connecting frame, a blower fixedly connected to the surface of the control box, a through hole on the surface of the control box, a support frame slidably connected to the surface of the control box, a positioning hole on the surface of the support frame, a heating wire fixedly connected to the surface of the positioning hole, a control switch on the surface of the control platform, and a mounting mechanism on the surface of the frame. Through the control mechanism, the entire device allows for convenient heating and curing of the SMT adhesive by the blower by controlling the switch of the heating wire.
[0004] However, the above-mentioned SMT adhesive curing device has the following disadvantages: 1. Although the curing device in this patent can conveniently heat and cure the adhesive on the circuit board, the heating wire is fixed in the positioning hole of a single support frame during use. It is not possible to control the temperature of different areas individually during heating. Therefore, this device cannot meet the needs of circuit boards that require different fixed temperatures.
[0005] To address the aforementioned issues, this application proposes an SMT adhesive curing device. Summary of the Invention
[0006] To address the problems in related technologies, this utility model provides an SMT adhesive curing device that can individually control the temperature of different areas to meet usage requirements.
[0007] Therefore, the specific technical solution adopted by this utility model is as follows: An SMT adhesive curing device includes a workbench, a turntable assembly installed in the middle of the workbench, a support installed on the upper left side of the workbench, a horizontal plate fixedly installed on the right side wall of the support, a lifting rod installed at the bottom of the horizontal plate, an equipment frame fixedly installed at the bottom of the lifting rod, and a curing assembly installed inside the equipment frame. The curing component includes an air duct. One end of the air duct passes through the top wall of the equipment frame and is connected to the air outlet of the fan. The other end of the air duct is connected to an auxiliary pipe. A connecting pipe is connected to the bottom wall of the auxiliary pipe, and three sets of connecting pipes are provided. An electrically controlled valve is installed on the connecting pipe, and a heating device is connected to the bottom end of the connecting pipe.
[0008] As a further embodiment of this utility model, the heating device includes an inlet pipe, the top end of which is connected to a connecting pipe, a guide cover is installed at the bottom end of the inlet pipe, and a heating wire is installed in the inner cavity of the lower section of the inlet pipe.
[0009] As a further embodiment of this utility model, the inlet pipe and the connecting pipe are also provided in three sets, and the heating wires in the inner cavities of the three sets of inlet pipes operate independently.
[0010] As a further embodiment of this utility model, the fan is installed on the top of the equipment frame, and a protective cover is installed on the bottom outer wall of the equipment frame by bolts.
[0011] As a further embodiment of this utility model, the turntable assembly includes a turntable body, the bottom end of which is connected to a drive seat, the drive seat is installed in the upper middle part of the workbench, and the bottom end of the drive seat is connected to the output end of a drive motor.
[0012] As a further embodiment of this utility model, support legs are fixedly installed at the four corners of the bottom of the workbench.
[0013] As a further embodiment of this utility model, a controller is installed on the front side wall of the support, and the controller is electrically connected to the drive motor, the lifting rod, the fan, the electrically controlled valve and the heating device respectively.
[0014] The beneficial effects of this utility model are as follows: This invention utilizes a controller, lifting rod, equipment frame, fixing components, and turntable assembly that work together. During operation, the air duct and auxiliary pipe work together to deliver airflow from the fan into different connecting pipes, which then pass through heating wires inside the inlet pipes to heat the circuit board on the turntable body below. After heating is complete, the heating wires are turned off, and the airflow generated by the fan continues to cool and solidify the circuit board below. During this process, the turntable body rotates at a uniform speed driven by the drive motor and drive base. Furthermore, according to the solidification temperature requirements of the circuit board to be processed, the temperature parameters of the three sets of heating wires can be set separately through the controller. When a particular heating wire is not needed, the corresponding electrically controlled valve needs to be closed, allowing the device to individually control the temperature of different areas to meet usage requirements. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the overall structure of an SMT adhesive curing device according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the curing component structure of an SMT adhesive curing device according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the equipment frame and protective cover of an SMT adhesive curing device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the turntable assembly structure of an SMT adhesive curing device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the lifting rod of an SMT adhesive curing device according to an embodiment of the present invention, in the raised state.
[0017] In the picture: 1. Workbench; 2. Turntable assembly; 21. Turntable body; 22. Drive base; 23. Drive motor; 3. Support; 4. Horizontal plate; 5. Lifting rod; 6. Equipment frame; 7. Curing assembly; 8. Air duct; 9. Fan; 10. Auxiliary pipe; 11. Connecting pipe; 12. Electrically controlled valve; 13. Heating device; 131. Inlet pipe; 132. Guide cover; 133. Heating wire; 14. Protective cover; 15. Support leg; 16. Controller. Detailed Implementation
[0018] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.
[0019] According to an embodiment of the present invention, an SMT adhesive curing device is provided.
[0020] Please refer to the instruction manual appendix. Figure 1-5According to an embodiment of the present invention, an SMT adhesive curing device includes a workbench 1, a turntable assembly 2 installed in the middle of the workbench 1, a support 3 installed on the upper left side of the workbench 1, a horizontal plate 4 fixedly installed on the right side wall of the support 3, a lifting rod 5 installed at the bottom of the horizontal plate 4, an equipment frame 6 fixedly installed at the bottom of the lifting rod 5, and a curing assembly 7 installed inside the equipment frame 6. The curing assembly 7 includes an air duct 8, one end of which passes through the top wall of the equipment frame 6 and is connected to the air outlet of a fan 9. The fan 9 is installed at the top of the equipment frame 6. A protective cover 14 is bolted to the bottom outer wall of the equipment frame 6. The other end of the air duct 8 is connected to an auxiliary pipe 10, and the bottom wall of the auxiliary pipe 10 is... A connecting pipe 11 is connected, and three sets of the connecting pipe 11 are provided. An electrically controlled valve 12 is installed on the connecting pipe 11. A heating device 13 is connected to the bottom end of the connecting pipe 11. The heating device 13 includes an inlet pipe 131. The top end of the inlet pipe 131 is connected to the connecting pipe 11. A guide cover 132 is installed at the bottom end of the inlet pipe 131. A heating wire 133 is installed in the lower section of the inner cavity of the inlet pipe 131. The inlet pipe 131 is also provided in three sets corresponding to the connecting pipe 11, and the heating wires 133 in the three sets of inlet pipe 131 operate independently. A controller 16 is installed on the front side wall of the support 3. The controller 16 is electrically connected to the drive motor 23, the lifting rod 5, the fan 9, the electrically controlled valve 12 and the heating device 13 respectively. The device works in conjunction with the controller 16, lifting rod 5, equipment frame 6, fixing components, and turntable assembly 2. During use, the air duct 8 and auxiliary pipe 10 work together to send the airflow from the fan 9 into different connecting pipes 11, and then through the heating wire 133 in the inlet pipe 131, to heat the circuit board on the turntable body 21 below. After heating is completed, the heating wire 133 is turned off, and the airflow generated by the fan 9 can continue to cool and solidify the circuit board below. During this process, the turntable body 21 rotates at a constant speed under the drive of the drive motor 23 and drive base 22. In addition, according to the curing temperature requirements of the circuit board to be processed, the temperature parameters of the three sets of heating wires 133 can be set separately through the controller 16. When a certain heating wire 133 is not needed to work, the corresponding electric control valve 12 needs to be closed, so that the device can control the temperature of different areas individually to meet the usage requirements.
[0021] In one embodiment, please refer to the appendix to the specification. Figure 1 , Figure 4 and Figure 5As a further embodiment of this utility model, the turntable assembly 2 includes a turntable body 21, and a drive seat 22 is drivenly connected to the bottom end of the turntable body 21. The drive seat 22 is installed in the upper middle part of the workbench 1, and the output end of the drive motor 23 is drivenly connected to the bottom end of the drive seat 22. In use, the drive motor 23 operates, driving the turntable body 21 to rotate at a uniform speed through the drive seat 22 connected to it.
[0022] In one embodiment, please refer to the appendix to the specification. Figure 1 and Figure 5 As a further embodiment of this utility model, support legs 15 are fixedly installed at the four corners of the bottom of the workbench 1. The support legs 15 can provide good support for the workbench 1.
[0023] Workflow: In use, first install the circuit board onto the turntable body 21, then drive the motor 23 to work, which drives the turntable body 21 to rotate at a constant speed through the drive seat 22 connected to it. Then, according to the temperature requirements of the circuit board, set the temperature parameters of the three sets of heating wires 133 through the controller 16. Then, the lifting rod 5 works, which drives the equipment frame 6 to move downward to the predetermined position. Then, the fan 9 works, and the airflow from the fan 9 is sent to different connecting pipes 11 through the air duct 8 and the auxiliary pipe 10. Then, through the heating wires 133 in the inlet pipe 131, the circuit board on the turntable body 21 below can be heated. After heating is completed, the heating wires 133 are turned off, and the airflow generated by the fan 9 can continue to cool and solidify the circuit board below. When a certain heating wire 133 is not needed to work, the corresponding electric control valve 12 needs to be closed.
[0024] It should be noted that the specific models and specifications of the lifting rod 5, fan 9, electrically controlled valve 12, heating wire 133, drive motor 23 and controller 16 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.
[0025] The power supply and operating principle of the lifting rod 5, fan 9, electrically controlled valve 12, heating wire 133, drive motor 23 and controller 16 are clear to those skilled in the art and will not be described in detail here.
[0026] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. An SMT adhesive curing device, comprising a worktable (1), characterized in that: A turntable assembly (2) is installed in the middle of the workbench (1). A support (3) is installed on the upper left side of the workbench (1). A horizontal plate (4) is fixedly installed on the right side wall of the support (3). A lifting rod (5) is installed at the bottom of the horizontal plate (4). An equipment frame (6) is fixedly installed at the bottom of the lifting rod (5). A curing assembly (7) is installed inside the equipment frame (6). The curing component (7) includes a duct (8), one end of which passes through the top wall of the equipment frame (6) and is connected to the air outlet of the fan (9). The other end of the duct (8) is connected to an auxiliary pipe (10). A connecting pipe (11) is connected to the bottom wall of the auxiliary pipe (10), and three sets of connecting pipes (11) are provided. An electrically controlled valve (12) is installed on the connecting pipe (11), and a heating device (13) is connected to the bottom end of the connecting pipe (11).
2. The SMT adhesive curing device according to claim 1, characterized in that: The heating device (13) includes an inlet pipe (131), the top end of which is connected to a connecting pipe (11), a guide cover (132) is installed at the bottom end of the inlet pipe (131), and a heating wire (133) is installed in the lower section of the inner cavity of the inlet pipe (131).
3. The SMT adhesive curing device according to claim 2, characterized in that: The inlet pipe (131) is corresponding to the connecting pipe (11), and three sets are also provided, and the heating wires (133) in the inner cavity of the three sets of inlet pipes (131) operate independently.
4. The SMT adhesive curing device according to claim 1, characterized in that: The fan (9) is installed on the top of the equipment frame (6), and a cover (14) is installed on the bottom outer wall of the equipment frame (6) by bolts.
5. The SMT adhesive curing device according to claim 1, characterized in that: The turntable assembly (2) includes a turntable body (21), and a drive seat (22) is connected to the bottom end of the turntable body (21). The drive seat (22) is installed in the middle of the upper end of the workbench (1), and the output end of the drive motor (23) is connected to the bottom end of the drive seat (22).
6. The SMT adhesive curing device according to claim 1, characterized in that: The workbench (1) is fixedly installed with support legs (15) at the four corners of its bottom end.
7. The SMT adhesive curing device according to claim 5, characterized in that: A controller (16) is installed on the front side wall of the support (3). The controller (16) is electrically connected to the drive motor (23), the lifting rod (5), the fan (9), the electric valve (12), and the heating device (13).
Citation Information
Patent Citations
SMT (Surface Mount Technology) adhesive curing device
CN218244010U