Glue-filling shell and power supply device

Abstract

The application relates to the technical field of power supply, in particular to a glue-filling shell and a power supply device. The glue-filling shell comprises a bottom plate, a first surrounding edge and a second surrounding edge; the first surrounding edge is arranged on a first surface of the bottom plate and extends along the edge of the first surface; the second surrounding edge is arranged on the first surface of the bottom plate and is spaced from the edge of the first surface; and the first and second surrounding edges are connected at the head and tail. The first surrounding edge is used for surrounding the periphery of a to-be-cooled part, and the second surrounding edge is used for surrounding a core element on the to-be-cooled part, so that the to-be-cooled part is conveniently filled with glue. Since one end of the first and second surrounding edges is connected to the bottom plate, the bending resistance of the first and second surrounding edges is enhanced, the glue overflow problem during glue filling is improved, and manual glue removal in the later stage is reduced; no metal box is needed, no additional safety treatment is needed, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a potting shell and a power supply device. Background Technology

[0002] Industrial laser power supplies typically use potting compound to protect their internal core components. This not only enhances weather resistance but also increases the heat dissipation area of ​​the core components, thereby improving the power supply's heat dissipation.

[0003] In related technologies, the core component of the power supply is the circuit board. A barrier is erected around the circuit board and at the core components, and then potting compound is applied to the entire circuit board. Thermal adhesive is used at the core components to enhance heat dissipation. Alternatively, the core components can be immersed in a metal box filled with thermal adhesive, then a barrier is erected around the circuit board before final potting.

[0004] The fence is circular and has poor bending resistance. It is easy to bend during glue application, resulting in glue overflow, which requires manual glue removal later. In addition, when using metal boxes, the metal boxes need to be protected according to safety regulations, which increases production costs. Utility Model Content

[0005] The embodiments of this application aim to provide a potting shell and a power supply device, so as to at least improve the problems of glue overflow and the need for additional safety regulations during the potting of the power supply device.

[0006] In order to solve the above-mentioned technical problems, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide a potting shell, the potting shell including a base plate, a first rim and a second rim; the first rim is disposed on a first surface of the base plate and extends along the edge of the first surface; the second rim is disposed on a first surface of the base plate, the second rim is spaced from the edge of the first surface, and the second rim is connected end to end.

[0007] In some embodiments, the base plate has a first through hole, and the second perimeter extends along the edge of the first through hole.

[0008] In some embodiments, the base plate is provided with a second through hole.

[0009] In some embodiments, the base plate has a notch, and at the notch in the base plate, the first perimeter extends along the edge of the notch.

[0010] In some embodiments, the potting shell includes a first positioning post disposed on the first surface.

[0011] In some embodiments, the base plate includes a second surface opposite to the first surface, and the potting shell includes a second positioning post disposed on the second surface.

[0012] In some embodiments, along the thickness direction of the base plate, the height of the first perimeter is lower than the height of the second perimeter.

[0013] In some embodiments, the first perimeter and / or the second perimeter are perpendicular to the base plate.

[0014] In some embodiments, the base plate is rectangular.

[0015] In some embodiments, the second perimeter is in the shape of a rectangular tube.

[0016] In some embodiments, the first perimeter and / or the second perimeter are integrally formed with the base plate.

[0017] Secondly, embodiments of this application provide a power supply device, the power supply device including a potting shell as described in any embodiment of the first aspect.

[0018] The potting housing and power supply device of this application embodiment have a first surrounding edge for encircling the periphery of the component to be heat-dissipated, and a second surrounding edge for encircling the core component on the component to be heat-dissipated, facilitating potting of the component. Since one end of the first and second surrounding edges is connected to the base plate, the bending resistance of the first and second surrounding edges is enhanced, improving the problem of glue overflow during potting, reducing the need for manual glue removal later, and lowering production costs. No metal box is required, and no additional safety regulations are needed, further reducing production costs.

[0019] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a schematic diagram of the structure of the potting shell according to an embodiment of this application; Figure 2 This is a structural schematic diagram of the potting shell from another perspective of an embodiment of this application.

[0022] The reference numerals in the detailed embodiments are as follows: 100. Glue-filled shell; 1. Base plate; 11. First surface; 12. Second surface; 13. First through hole; 14. Second through hole; 15. Notch; 2. First perimeter; 3. Second perimeter; 4. First positioning post; 5. Second positioning post; 6. Mounting ear; 61. Third through hole. Detailed Implementation

[0023] To facilitate understanding of this application, the following description, in conjunction with the accompanying drawings and specific embodiments, will provide a more detailed account. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0025] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0026] In the description of the embodiments of this application, the terms "first," "second," etc., are used to define components merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0028] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0029] Firstly, please refer to Figure 1 and Figure 2 This application provides a potting shell 100, which includes a base plate 1, a first perimeter 2, and a second perimeter 3. The first perimeter 2 is located on a first surface 11 of the base plate 1 and extends along the edge of the first surface 11. The second perimeter 3 is located on the first surface 11 of the base plate 1, spaced apart from the edge of the first surface 11, and the ends of the second perimeter 3 are connected. The first perimeter 2 is used to surround the periphery of the component to be heat-dissipated, and the second perimeter 3 is used to surround the core component on the component to be heat-dissipated, facilitating potting of the component. The ends of the second perimeter 3 are connected, that is, the second perimeter 3 forms a ring to separate the inner and outer sides of the second perimeter 3.

[0030] In this embodiment, the component to be cooled is a circuit board, and the core component is an electrical component on the circuit board that generates significant heat. In other embodiments, the component to be cooled can be other electronic components that do not include a circuit board, such as a transformer module or a rectifier module.

[0031] Different adhesives can be poured into the area enclosed by the first perimeter 2 and the area enclosed by the second perimeter 3. For example, thermal adhesive can be poured into the area enclosed by the second perimeter 3, while ordinary adhesive or adhesive with relatively poor heat dissipation effect can be poured into the area enclosed by the first perimeter 2, thereby enhancing the heat dissipation effect on the core components and reducing the waste of thermal adhesive.

[0032] When in use, the potting housing 100 has its first side 11 facing the circuit board, and the side of the circuit board with electrical components facing the potting housing 100. The two sides are interlocked, and the second perimeter 3 abuts against the circuit board, thereby separating its inner and outer sides to allow different adhesives to be poured onto both sides of the second perimeter 3. Please refer to [link to relevant documentation]. Figure 2 The base plate 1 includes a second surface 12 opposite to the first surface 11. The heat sink is in close contact with the second surface 12 of the potting shell 100 to dissipate heat from the potting shell 100 and the circuit board.

[0033] In related technologies, barriers made of Mylar sheets are used to surround the outer perimeter of the circuit board and the core components to facilitate glue application. These barriers are ring-shaped and have poor bending resistance, easily bending under glue pressure during application and causing glue overflow, requiring manual removal later, increasing production costs. Barriers around the core components can also be made of metal boxes, which have good bending resistance, but require safety protection, increasing production costs. In this embodiment, since one end of the first perimeter 2 and the second perimeter 3 are connected to the base plate 1, the bending resistance of the first perimeter 2 and the second perimeter 3 is enhanced, improving the glue overflow problem during application, reducing manual removal later, and lowering production costs. No metal box is needed, no additional safety protection is required, further reducing production costs.

[0034] In some embodiments, the first perimeter 2 and / or the second perimeter 3 are integrally formed with the base plate 1. For example, the base plate 1, the first perimeter 2, and the second perimeter 3 are integrally injection molded, which reduces production costs and labor installation costs compared to the fence made by manual bending, and improves the glue dispensing efficiency and assembly efficiency of the power supply device.

[0035] In this embodiment, the first perimeter 2 is connected end to end to confine the adhesive inside the first perimeter 2. In other embodiments, the first perimeter 2 may also have an opening, for example, the first perimeter 2 may not be connected end to end. This opening may correspond to the housing of the power supply device, so that the adhesive partially covers the housing of the power supply device, allowing heat dissipation through the housing of the power supply device, while simultaneously bonding and fixing the potting shell 100 to the housing.

[0036] In some embodiments, the potting shell 100 is made of PA6+30%GF and manufactured using a potting process. PA6+30%GF is an engineering plastic made of polyamide 6 (nylon 6) reinforced with 30% glass fiber. It has excellent high-temperature resistance (heat distortion temperature 250℃+), high strength (tensile strength 140-180MPa), and good dimensional stability, and is widely used in automotive engine parts, electrical components, and other fields. Moreover, its electrical properties meet international safety standards and UL94 (the fire resistance rating standard for flammability testing of plastic parts for equipment and electrical appliances, belonging to the fire resistance performance evaluation system for plastic materials) flame retardant rating standards, and can replace insulating materials such as Mylar sheets. The potting shell 100 itself has insulation properties, and the base plate 1, the first surrounding edge 2, and the second surrounding edge 3 all have insulation properties that meet safety requirements.

[0037] For the aforementioned base plate 1, please refer to Figure 1 and Figure 2 The base plate 1 can be flat to fit a flat circuit board, reducing the gap between it and the circuit board and enhancing the overall structural compactness of the potting housing 100 and the circuit board. In some embodiments, the base plate 1 is rectangular to fit a rectangular circuit board. Correspondingly, the heat sink is rectangular flat to fit the potting housing 100.

[0038] In some embodiments, please refer to Figure 1 and Figure 2 The base plate 1 is provided with a first through hole 13, and a second perimeter 3 extends along the edge of the first through hole 13. After the second perimeter 3 abuts against the circuit board, glue can be poured into the area enclosed by the second perimeter 3 through the first through hole 13; and the heat dissipation glue in this area is connected to the heat sink through the first through hole 13 to enhance the heat dissipation effect on the core components.

[0039] In some embodiments, please refer to Figure 1 and Figure 2 The second perimeter 3 is rectangular. Correspondingly, the second through hole 14 is rectangular. Components in the power supply device that generate significant heat include a filter inductor, an iron core, and a coil. The filter inductor is typically square in shape; the coil, wound around the iron core, is square or cylindrical in shape. Along the direction perpendicular to the circuit board, the projection of the cylindrical coil and the iron core onto the circuit board is square. The second perimeter 3 is rectangular to accommodate the filter inductor, coil, and iron core. In other embodiments, the second perimeter 3 may also be cylindrical, prismatic, or have a cross-section that is a closed shape formed by connecting curves and straight lines end-to-end, or have a concave cross-section (a shape with recesses or holes inside).

[0040] In some embodiments, there are multiple first through holes 13, and at least one first through hole 13 is provided with a second perimeter 3. Optionally, there are two first through holes 13, and each of the two first through holes 13 is provided with a second perimeter 3.

[0041] In some embodiments, please refer to Figure 1 and Figure 2 The base plate 1 is provided with a second through hole 14. After the circuit board and the potting shell 100 are fastened together, potting compound can be applied to the area enclosed by the first surrounding edge 2 through the second through hole 14; and the heat-dissipating compound in this area is connected to the heat sink through the second through hole 14, enhancing the heat dissipation effect on the circuit board. In this embodiment, the second through hole 14 is rectangular. In other embodiments, the second through hole 14 is circular or polygonal, or a closed shape formed by connecting the beginning and end of a curve and a straight line, or a concave shape. Optionally, there may be multiple second through holes 14.

[0042] In some embodiments, please refer to Figure 1 and Figure 2The base plate 1 has a notch 15, and a first surrounding edge 2 extends along the edge of the notch 15. The notch 15 is used to avoid mounting holes on the housing of the power supply device or mounting holes on the circuit board. The first surrounding edge 2 extending along the edge of the notch 15 avoids mounting holes, improving the problem of adhesive covering the mounting holes and reducing the need for adhesive removal after potting, thus lowering production costs. Optionally, the notch 15 is semi-circular or quarter-circular; or it is a shape where a semi-circle and a rectangle connect, with the rectangle connecting to the semi-circle at a straight line segment, and the two endpoints of the rectangle coinciding with the two endpoints of the semi-circle; or it is a shape where a quarter-circle and a rectangle connect, with the rectangle connecting to the quarter-circle at a straight line segment, and the two endpoints of the rectangle coinciding with two endpoints of the quarter-circle. In other embodiments, the notch 15 can also be rectangular, polygonal, etc. Optionally, notches 15 are provided at all four corners of the base plate 1, and notches 15 are provided in the middle of the two long sides of the base plate 1.

[0043] The position, number, and shape of the notch 15 can be adaptively adjusted according to different circuit boards and housings, for example, by changing the injection mold to reduce the production cost when the potting housing 100 has multiple models.

[0044] In some embodiments, please refer to Figure 1 The potting housing 100 includes a first positioning post 4 disposed on the first surface 11. The first positioning post 4 is used to abut against the circuit board, the circuit board body, or electrical components on the circuit board, thereby limiting the distance between the circuit board and the base plate 1, improving the problem of circuit board damage caused by mutual compression between the circuit board and the base plate 1; and improving the problem of insufficient glue filling the gap between the circuit board and the potting housing 100 due to the small gap between the circuit board and the base plate 1. Optionally, the first positioning post 4 is cylindrical. Optionally, there are multiple first positioning posts 4, which are arranged at intervals along the first surface 11. Wherein, along the thickness direction of the base plate 1, the height of the first positioning post 4 is less than the height of the first perimeter 2, so that the edge of the circuit board can abut against the inner wall of the first perimeter 2, for example, electrical components or positioning parts on the circuit board abut against the inner wall of the first perimeter 2, enhancing the limiting effect on the circuit board. There is no need to fix the circuit board to the potting housing 100 with screws or glue, simplifying the potting process and reducing potting costs. Optionally, the first positioning post 4 is integrally formed with the base plate 1, for example, by integral injection molding.

[0045] In some embodiments, please refer to Figure 2The potting housing 100 includes a second positioning post 5, which is disposed on the second surface 12. The second positioning post 5 is used to position the relative position between the heat sink and the potting housing 100. The heat sink is correspondingly provided with positioning holes, and the second positioning post 5 is inserted into the positioning holes to position the relative position between the heat sink and the potting housing 100. Optionally, the second positioning post 5 is cylindrical. Optionally, there are multiple second positioning posts 5, which are arranged at intervals along the second surface 12. This eliminates the need to fix the heat sink and the potting housing 100 relative to each other using screws or glue, simplifying the power supply assembly process and reducing production costs. Optionally, the second positioning post 5 is integrally formed with the base plate 1, for example, by integral injection molding.

[0046] In some embodiments, please refer to Figure 1 Along the thickness direction of the base plate 1, the height of the first perimeter 2 is lower than the height of the second perimeter 3. This ensures that the second perimeter 3 abuts against the circuit board, improving the problem of adhesive overflow caused by gaps between the second perimeter 3 and the circuit board.

[0047] In some embodiments, please refer to Figure 1 The first perimeter 2 and / or the second perimeter 3 are perpendicular to the base plate 1. This facilitates the inspection and manufacturing of the potting shell 100, for example, by facilitating the draft test of the first perimeter 2 and / or the second perimeter 3. Furthermore, along the thickness direction of the base plate 1, the area occupied by the projection of the first perimeter 2 and / or the second perimeter 3 on the base plate 1 is reduced, the area of ​​the avoidance area provided on the circuit board to avoid the first perimeter 2 and / or the second perimeter 3 is reduced, and the board density (the number of electrical components per unit area of ​​the circuit board) is increased.

[0048] In some embodiments, please refer to Figure 1 The potting housing 100 includes a mounting ear 6, which is located on the inner wall of one side of the base plate 1 of the second perimeter 3. The mounting ear 6 is used to connect to the circuit board. For example, the mounting ear 6 has a third through hole 61, through which a screw passes to connect to the circuit board. This pre-fixes the relative position of the potting housing 100 and the circuit board, facilitating potting and improving the problem of glue overflow between the second perimeter 3 and the circuit board.

[0049] Secondly, embodiments of this application provide a power supply device (not shown), which includes a potting shell 100 as described in any embodiment of the first aspect. The power supply device possesses the structural features and beneficial effects of the potting shell 100, which will not be elaborated here. The power supply device further includes a core component, a heat sink, and a casing. The core component and the heat sink are located on the side where the first surface 11 and the second surface 12 of the potting shell 100 are located, respectively. The casing covers the side of the core component facing away from the potting shell 100. During potting, the casing, core component, and potting shell 100 are first assembled in sequence; then, potting is performed through the first through-hole 13 and the second through-hole 14, with a more thermally conductive adhesive, such as a thermally conductive adhesive, being poured through the first through-hole 13; finally, the heat sink is assembled and the adhesive is allowed to cure.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A potting shell, characterized in that, include: Base plate; A first perimeter is provided on the first surface of the base plate, and the first perimeter extends along the edge of the first surface; The second perimeter is provided on the first surface of the base plate, and the second perimeter is spaced apart from the edge of the first surface, with the two ends of the second perimeter connected.

2. The potting shell according to claim 1, characterized in that, The base plate is provided with a first through hole, and the second surrounding edge extends along the edge of the first through hole; And / or, the base plate is provided with a second through hole.

3. The potting shell according to claim 1, characterized in that, The base plate has a notch, and at the notch in the base plate, the first perimeter extends along the edge of the notch.

4. The potting shell according to claim 1, characterized in that, The potting shell includes a first positioning post, which is located on the first surface.

5. The potting shell according to claim 1, characterized in that, The base plate includes a second surface opposite to the first surface, and the potting shell includes a second positioning post, which is disposed on the second surface.

6. The potting shell according to claim 1, characterized in that, Along the thickness direction of the base plate, the height of the first perimeter is lower than the height of the second perimeter.

7. The potting shell according to claim 1, characterized in that, The first perimeter and / or the second perimeter are perpendicular to the base plate.

8. The potting shell according to claim 1, characterized in that, The base plate is rectangular; And / or, the second perimeter is rectangular tubular.

9. The potting shell according to any one of claims 1 to 8, characterized in that, The first perimeter and / or the second perimeter are integrally formed with the base plate.

10. A power supply device, characterized in that, Includes the potting shell as described in any one of claims 1 to 9.

Images