A control device

Abstract

The application relates to electric control technology and provides a control device. The control device comprises a shell, a plastic shell, the shell is provided with an inner cavity; a circuit board is located in the inner cavity; a connector is connected with the circuit board and comprises a male end shielding shell; a solder pin is arranged at one end of the male end shielding shell, the circuit board is provided with a first through hole corresponding to the solder pin, the solder pin is inserted into the first through hole so that the solder pin is partially located on the side of the circuit board away from the male end shielding shell, and the solder pin is welded with the circuit board. The control device provided by the application can solve the grounding problem of the connector.

Description

Technical Field

[0001] This application relates to electronic control technology, and more particularly to a control device. Background Technology

[0002] As electronic products move towards integration, lightweight design, and lower cost, plastic housings are gradually replacing traditional metal housings as the mainstream choice due to their advantages such as light weight, low cost, and high design flexibility. However, the lack of conductivity in plastic materials makes grounding the connector a design challenge.

[0003] In related technologies, a common approach to solve the grounding problem of connectors is to embed a thin metal liner inside the plastic housing.

[0004] However, this solution requires the metal liner to be formed through complex processes such as deep drawing and stretching, and then injection molded integrally with the plastic shell as an insert. This process demands extremely high mold precision, resulting in high mold costs and long processing cycles. Furthermore, the bonding strength between the metal liner and the plastic is limited, making it prone to delamination or detachment. Utility Model Content

[0005] This application provides a control device that can solve the grounding problem of connectors.

[0006] This application provides a control device, including:

[0007] The housing is made of plastic and has an internal cavity.

[0008] Circuit board, located inside the cavity;

[0009] Connectors, for connection to circuit boards, include:

[0010] Male-side shielding shell;

[0011] The solder foot is located at one end of the male terminal shield. The circuit board has a first through hole corresponding to the solder foot. The solder foot is inserted into the first through hole so that the solder foot part is located on the side of the circuit board away from the male terminal shield. The solder foot is soldered to the circuit board.

[0012] In some embodiments, the connector includes connector pins, a portion of which is located within the male end shielding shell. The circuit board is provided with a second through hole corresponding to the connector pins. The connector pins are inserted into the second through hole so that a portion of the connector pins is located on the side of the circuit board away from the male end shielding shell. The connector pins are soldered to the circuit board.

[0013] The solder pads and connector pins on the side of the circuit board away from the male shield are at the same height.

[0014] In some embodiments, the surface of the solder pads is provided with a tin plating layer.

[0015] In some embodiments, the surface of the male end shielding shell is provided with a nickel plating layer.

[0016] In some embodiments, the number of solder feet is multiple, and the solder feet are arranged circumferentially around the male end shield.

[0017] In some embodiments, the solder feet are integrally formed with the male terminal shielding shell.

[0018] In some embodiments, the end of the solder foot away from the male shielding shell is the first end, and the end of the solder foot facing the male shielding shell is the second end. A tin plating layer is provided on the end face of the first end and the side face between the first end and the second end.

[0019] In some embodiments, the solder feet are aluminum solder feet, and the male terminal shielding shell is an aluminum shielding shell.

[0020] In some embodiments, the solder feet and connector pins are soldered to the circuit board by wave soldering.

[0021] In some embodiments, a female shielding shell is further included, which is configured to be inserted into the male shielding shell, and the surface of the female shielding shell is provided with a nickel plating layer.

[0022] The control device provided in this application includes a housing, a circuit board, and a connector. The connector includes a male shield and solder pads. The solder pads are located at one end of the male shield. The circuit board has a first through-hole corresponding to the solder pads. The solder pads are inserted into the first through-hole so that the solder pad portion is located on the side of the circuit board away from the male shield. The solder pads are soldered to the circuit board. Thus, by providing the solder pads and the first through-hole, a reliable connection between the solder pads and the circuit board is achieved, solving the grounding problem of the connector. Compared to related technologies that require a metal inner liner for grounding, this application does not require a metal inner liner, therefore the overall structure is simpler, requires no complex molds, has better manufacturability, and offers a significant cost advantage. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 This is a schematic diagram of the structure of the plastic shell and the metal liner in the related technology;

[0025] Figure 2 This is a schematic diagram illustrating the connection between the shielding shell and the circuit board in related technologies.

[0026] Figure 3 This is a schematic diagram of the controller provided in this application;

[0027] Figure 4This is a schematic diagram of the structure of the male terminal shielding shell in the controller provided in this application;

[0028] Figure 5 A partial structural diagram of the male terminal shielding shell and circuit board in the controller provided in this application;

[0029] Figure 6 A partial structural diagram of the solder pads, circuit board, and connector pins in the controller provided in this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10 - Plastic casing;

[0032] 20-Metal lining;

[0033] 30 - Shielding shell;

[0034] 40 - Circuit board;

[0035] 100 - Housing;

[0036] 200 - Circuit board;

[0037] 300-Connector;

[0038] 310 - Male-end shielding shell;

[0039] 320 - Solder foot;

[0040] 330 - Connector pins.

[0041] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0042] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0043] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0044] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0045] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0046] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] The upgrading and iteration of electronic power supply products are becoming increasingly integrated and lightweight, with the integration of plastic housings and plastic connectors becoming a trend. However, plastic housings do not have electrical conductivity, so grounding the connector shielding shell has become a challenge.

[0051] Figure 1 This is a schematic diagram of the structure of the plastic shell and the metal liner in the related technology.

[0052] See Figure 1 As shown, in the related technology, a metal liner 20 is added under the plastic housing 10 to replace the original method of grounding the metal housing and the connector's shielding shell, thereby achieving electromagnetic shielding at the connector position.

[0053] However, the metal liner 20 has poor machinability. In order to match the shielding shell of the connector, deep drawing and stretching are unavoidable, making the process more complicated. At the same time, it needs to be injection molded as an insert, requiring high mold precision, which leads to higher costs.

[0054] Figure 2 This is a schematic diagram of the connection between the shielding shell and the circuit board in related technologies.

[0055] See Figure 2 As shown, in related technologies, the shielding shell 30 of the connector is extended above the circuit board 40, and a flat flange is made. This flange is then soldered to the circuit board 40 to achieve conductivity between the shielding shell 30 and the circuit board 40, thus completing the shielding.

[0056] However, soldering the flange of the connector's shielding shell 30 to the circuit board 40 introduces a flange bending process, increasing manufacturing time. Furthermore, ensuring the soldering effect between the flange and the circuit board 40 requires controlling the precision of the shielding shell 30, increasing the difficulty of cost control.

[0057] To address the grounding issue of connectors, this application provides a control device including a housing, a circuit board, and a connector. The connector includes a male shield and solder pads. The solder pads are located at one end of the male shield. The circuit board has a first through-hole corresponding to the solder pads. The solder pads are inserted into the first through-hole so that the solder pad portion is located on the side of the circuit board away from the male shield, and the solder pads are soldered to the circuit board. Thus, by providing the solder pads and the first through-hole, a reliable connection between the solder pads and the circuit board is achieved, solving the connector grounding problem. Compared to related technologies that require a metal inner liner for grounding, this embodiment does not require a metal inner liner or a bending / flanging process. Therefore, the overall structure is simpler, requires no complex molds, has better manufacturability, and offers a significant cost advantage.

[0058] Figure 3 A schematic diagram of the controller provided in this application.

[0059] See Figure 3 As shown, this application provides a control device. In some embodiments, the control device includes a housing 100.

[0060] The housing 100 is a plastic housing. Due to its advantages such as light weight, low cost, and high design flexibility, plastic housings are gradually replacing traditional metal housings and becoming the mainstream choice.

[0061] The housing 100 has an inner cavity. The inner cavity of the housing 100 provides space for mounting components such as the circuit board 200.

[0062] In some embodiments, the control device includes a circuit board 200, wherein the circuit board 200 is located in the cavity.

[0063] Specifically, circuit board 200 can be a PCB (Printed Circuit Board).

[0064] In some embodiments, the control device includes a connector 300. The connector 300 is connected to the circuit board 200. The connector 300 can be used to connect to an external power source. The connector 300 can be inserted into the housing 100.

[0065] The connector 300 includes a female connection component and a male connection component.

[0066] When connector 300 is in use, the female connection component is plugged into the male connection component, and the pins of connector 300 in the male connection component are inserted into the crimp terminals in the female connection component.

[0067] Figure 4 This is a schematic diagram of the structure of the male-end shielding shell in the controller provided in this application. Figure 5 This is a partial structural diagram of the male terminal shielding shell and circuit board in the controller provided in this application. Figure 6 A partial structural diagram of the solder pads, circuit board, and connector pins in the controller provided in this application.

[0068] See Figures 4 to 6 As shown, the male connector assembly includes a male shielding shell 310.

[0069] In some embodiments, the male connector assembly includes a solder pad 320 disposed at one end of the male shield 310. The circuit board 200 has a first through hole corresponding to the solder pad 320. The solder pad 320 is inserted into the first through hole such that a portion of the solder pad 320 is located on the side of the circuit board 200 opposite to the male shield 310, and the solder pad 320 is soldered to the circuit board 200.

[0070] It should be noted that the solder joints of the solder pads 320 and the circuit board 200 are located on the side of the circuit board 200 away from the male shielding shell 310. The solder pads 320 are metal solder pads, which pass through the first through hole on the circuit board 200 and form a mechanical fixation and electrical connection with the pads of the circuit board 200 on the back side of the circuit board 200 by soldering (wave soldering or manual soldering).

[0071] It is understood that the control device provided in this application embodiment includes a housing 100, a circuit board 200, and a connector 300. The connector 300 includes a male shielding shell 310 and solder feet 320. Solder feet 320 are disposed at one end of the male shielding shell 310. The circuit board 200 has a first through-hole corresponding to the solder feet 320. The solder feet 320 are inserted into the first through-hole so that a portion of the solder feet 320 is located on the side of the circuit board 200 facing away from the male shielding shell 310. The solder feet 320 are soldered to the circuit board 200. Thus, by providing the solder feet 320 and the first through-hole, a reliable connection between the solder feet 320 and the circuit board 200 is achieved, solving the grounding problem of the connector 300. Furthermore, the overall structure is relatively simple, requiring no complex molds, has good manufacturability, and offers significant cost advantages.

[0072] See Figure 5 and Figure 6 As shown, in some embodiments, the male connector assembly includes a connector pin 330. The connector pin 330 is partially located within the male shielding housing 310. The circuit board 200 has a second through-hole corresponding to the connector pin 330. The connector pin 330 is inserted into the second through-hole such that a portion of the connector pin 330 is located on the side of the circuit board 200 facing away from the male shielding housing 310. The connector pin 330 is soldered to the circuit board 200.

[0073] It should be noted that the solder joints between the connector pins 330 and the circuit board 200 are located on the side of the circuit board 200 opposite to the male shielding shell 310. These connector pins 330 pass through the second through hole on the circuit board 200 and form a mechanical fixation and electrical connection with the pads of the circuit board 200 on the back side of the circuit board 200 by soldering (wave soldering or manual soldering).

[0074] Understandably, connector pins 330 and solder pads 320 can be soldered in the same process, improving soldering efficiency.

[0075] In some embodiments, the solder pads 320 and connector pins 330 located on the side of the circuit board 200 opposite to the male shielding shell 310 are at the same height. This facilitates the simultaneous wave soldering of the connector pins 330 and solder pads 320, making the process more convenient.

[0076] In some embodiments, the surface of the solder foot 320 is provided with a tin plating layer.

[0077] Understandably, by applying a tin plating layer, the surface energy for soldering can be reduced, thereby improving soldering efficiency and yield. The tin layer is highly compatible with molten solder in terms of materials and chemical composition, significantly reducing the surface energy required for soldering, allowing the solder to easily wet and spread. Good solderability means that during reflow or wave soldering, soldering time can be shorter and the required soldering temperature can be relatively lower, thus reducing thermal damage to the circuit board and improving production soldering yield.

[0078] The surface of solder foot 320 can be plated with tin by electroplating.

[0079] In some embodiments, the surface of the male end shielding shell 310 is provided with a silver plating layer.

[0080] It is understandable that by setting a silver plating layer, conductivity can be improved, surface contact resistance can be reduced, and the electromagnetic shielding effect of the male terminal shielding shell 310 can be improved.

[0081] Among them, the surface of the male end shielding shell 310 can be formed with a silver plating layer by electroplating process.

[0082] In some embodiments, the surface of the male end shielding shell 310 is provided with a nickel plating layer.

[0083] Understandably, by adding a nickel plating layer, the electromagnetic shielding effect of the male terminal shielding shell 310 can be improved by utilizing the magnetic permeability of the nickel plating layer. Moreover, the cost of the nickel plating layer is relatively low.

[0084] Among them, the surface of the male end shielding shell 310 can be formed with a nickel plating layer by electroplating process.

[0085] In some embodiments, there are multiple solder feet 320, which are spaced circumferentially around the male shield 310. By providing multiple solder feet 320, all of which are soldered to the circuit board 200, the connection strength and grounding reliability can be improved.

[0086] For example, the number of solder feet 320 can be 6, 8, 10, 12 or 14, etc. This embodiment does not make a specific limitation, and the number of solder feet 320 can be set as needed.

[0087] The number of first through holes is multiple, and each of the multiple first through holes is set in a one-to-one correspondence with a multiple welding foot 320.

[0088] Specifically, solder foot 320 is in the shape of a flat sheet.

[0089] In some embodiments, the number of connector pins 330 is at least one, and the number of second through holes is at least one. The connector pins 330 and the second through holes are provided in a one-to-one correspondence.

[0090] For example, the number of connector pins 330 can be 1, 2, 3 or 4, etc. This embodiment does not make a specific limitation, and the number of connector pins 330 can be set as needed.

[0091] In some embodiments, the solder foot 320 and the male shielding shell 310 are integrally formed. This eliminates the need for assembly between the solder foot 320 and the male shielding shell 310, improving their processing efficiency. The solder foot 320 and the male shielding shell 310 can be made of the same material.

[0092] In some embodiments, the end of the solder foot 320 facing away from the male shielding shell 310 is the first end, and the end of the solder foot 320 facing the male shielding shell 310 is the second end. A tin plating layer is provided on the end face of the first end and the side surface between the first and second ends. That is, see [link to documentation]. Figure 5 As shown, the bottom surface and four sides of the solder pad 320 are all provided with a tin plating layer. In this way, the tin plating layer has a large area, resulting in a better soldering effect between the solder pad 320 and the circuit board 200.

[0093] In some embodiments, solder feet 320 are made of aluminum. This results in lower cost and lighter weight for solder feet 320.

[0094] In some embodiments, the male shielding shell 310 is an aluminum shielding shell. This results in a lower cost and lighter weight for the aluminum shielding shell.

[0095] In some embodiments, the solder feet 320 and the connector pins 330 are soldered onto the circuit board 200 by wave soldering.

[0096] Understandably, wave soldering is a parallel processing technology. Circuit board 200 can complete the soldering of all through-hole components in a single wave of solder. Solder leads 320 and connector pins 330 are soldered to circuit board 200 via wave soldering, resulting in significantly higher production efficiency than manual soldering or selective soldering.

[0097] In some embodiments, the solder feet 320 and the connector pins 330 are laser soldered onto the circuit board 200.

[0098] Understandably, laser welding offers high precision. This improves welding accuracy and enhances grounding reliability.

[0099] In some embodiments, the female connection assembly includes a female shielding shell configured to plug into the male shielding shell 310.

[0100] In some embodiments, the surface of the female end shielding shell is provided with a silver plating layer.

[0101] It is understandable that adding a silver plating layer can improve conductivity, reduce surface contact resistance, and enhance the electromagnetic shielding effect of the mother end shielding shell.

[0102] The surface of the female end shield can be plated with silver through an electroplating process.

[0103] In some embodiments, the surface of the female end shielding shell is provided with a nickel plating layer.

[0104] Understandably, by adding a nickel plating layer, the electromagnetic shielding effect of the mother-end shielding shell can be improved by utilizing the magnetic permeability of the nickel plating layer. Moreover, the cost of the nickel plating layer is relatively low.

[0105] The surface of the mother end shield can be plated with a nickel layer by electroplating.

[0106] In some embodiments, the female terminal connection assembly includes a wire clamping terminal and a shock-absorbing ring. The wire clamping terminal is disposed inside the female terminal shielding shell, and the shock-absorbing ring is disposed inside the female terminal shielding shell and abuts against the female terminal shielding shell. The shock-absorbing ring is used to limit the wire. One end of the wire is fixed to the wire clamping terminal and electrically connected to the wire clamping terminal.

[0107] Control devices can be used in electrical power supply products, such as industrial power supplies, communication power supplies, consumer electronics power supplies, or motor controllers. They can also be used in industrial automation equipment, such as PLCs (Programmable Logic Controllers), frequency converters, and servo drives, requiring high electromagnetic compatibility (EMC) within a plastic housing to effectively prevent interference with industrial signals. Alternatively, they can be used in consumer electronics products, such as chargers, adapters, and smart home appliance control modules, requiring lightweight design to reduce product weight and meet miniaturization requirements. Or, they can be used in communication equipment, such as base station power supplies and optical module housings, requiring high shielding effectiveness within a plastic housing to effectively prevent signal crosstalk.

[0108] It should be noted that, since the control device of the above embodiments is adopted, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0109] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A control device, characterized in that, include: The housing (100) is a plastic housing and has an inner cavity; Circuit board (200) is located in the inner cavity; A connector (300), connected to the circuit board (200), includes: Male-end shielding shell (310); A solder foot (320) is provided at one end of the male end shielding shell (310). The circuit board (200) is provided with a first through hole corresponding to the solder foot (320). The solder foot (320) is inserted into the first through hole so that part of the solder foot (320) is located on the side of the circuit board (200) away from the male end shielding shell (310). The solder foot (320) is soldered to the circuit board (200).

2. The control device according to claim 1, characterized in that, The connector (300) further includes a connector pin (330), a portion of which is located inside the male shielding shell (310). The circuit board (200) is provided with a second through hole corresponding to the connector pin (330). The connector pin (330) is inserted into the second through hole so that a portion of the connector pin (330) is located on the side of the circuit board (200) away from the male shielding shell (310). The connector pin (330) is soldered to the circuit board (200). The solder pads (320) and connector pins (330) located on the side of the circuit board (200) opposite to the male shield (310) are at the same height.

3. The control device according to claim 1, characterized in that, The surface of the solder foot (320) is provided with a tin plating layer.

4. The control device according to claim 1, characterized in that, The surface of the male end shielding shell (310) is provided with a nickel plating layer.

5. The control device according to any one of claims 1 to 4, characterized in that, The number of the solder feet (320) is multiple, and the solder feet (320) are arranged circumferentially around the male end shielding shell (310).

6. The control device according to claim 5, characterized in that, The welding foot (320) is integrally formed with the male end shielding shell (310).

7. The control device according to claim 5, characterized in that, The end of the solder foot (320) facing away from the male end shielding shell (310) is the first end, and the end of the solder foot (320) facing the male end shielding shell (310) is the second end. The end face of the first end and the side face between the first end and the second end are both provided with a tin plating layer.

8. The control device according to any one of claims 1 to 4, characterized in that, The solder foot (320) is an aluminum solder foot, and the male end shielding shell (310) is an aluminum shielding shell.

9. The control device according to claim 2, characterized in that, The solder feet (320) and the connector pins (330) are soldered to the circuit board (200) by wave soldering.

10. The control device according to any one of claims 1 to 4, characterized in that, The connector (300) also includes a female shielding shell configured to be inserted into the male shielding shell (310), the surface of which is provided with a nickel plating layer.

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