A novel mounting structure of internal PCB of an eddy current sensor

Abstract

The utility model discloses a novel installation structure of internal PCB of eddy current sensor, including sensor casing, the inside bottom fixed connection of sensor casing has the positioning center positioning column, prevents rotating positioning column and a plurality of gap cooperation post, the sensor casing is assembled with the PCB circuit board, the top one side of PCB circuit board is equipped with the center positioning hole of the penetration to the bottom. In the utility model, through adopting the quick insertion type mechanical positioning structure of center positioning column, preventing rotating positioning column and gap cooperation post combination, and cooperate epoxy resin filling package, effectively overcome the equipment input big, the rivet maintenance cost high, the slow production rhythm's deficiency of traditional hot riveting fixed mode, this structure not only has saved the hot riveting station and related equipment investment, reduced production process cost and maintenance demand significantly, and through one time pressure equipment can realize the complete restraint of PCB six degrees of freedom, guarantees the high accuracy, high reliability and high consistency of installation.

Description

Technical Field

[0001] This utility model relates to the field of eddy current sensor technology, and in particular to a novel mounting structure for the internal PCB of an eddy current sensor. Background Technology

[0002] Currently, mainstream eddy current sensors typically use a PCB thermal riveting method to fix the internal PCB and housing. The positioning posts on the housing are thermally melted and deformed into an inverted bowl-shaped structure, which is then attached to the PCB surface. This achieves the installation and fixation of the PCB to the sensor housing. Resin is then poured onto the PCB for sealing, or a cover plate is welded to complete the internal manufacturing of the sensor. Since the accuracy of an eddy current sensor is closely related to the relative position and planar tilt of the internal PCB to the target wheel, achieving high precision and robust reliability in the PCB mounting and fixing to the housing is crucial.

[0003] Hot riveting requires investment in hot riveting equipment and fixed installation stations. If infrared hot melt welding is used, the welding rivet head needs regular maintenance and cleaning, resulting in high maintenance costs. In addition, if hot air riveting is used, the production cycle is relatively slow, and multiple riveting operations are required for multiple fixed positioning columns. Therefore, the production and manufacturing costs are all high, which is not conducive to the low-cost competitiveness of new energy vehicles.

[0004] To address this, we propose a novel mounting structure for the internal PCB of an eddy current sensor. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a novel mounting structure for the internal PCB of an eddy current sensor.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a novel PCB mounting structure for an eddy current sensor, comprising a sensor housing, wherein a positioning center positioning post, an anti-rotation positioning post, and several clearance fitting posts are fixedly connected to the bottom of the sensor housing, and a PCB circuit board is assembled inside the sensor housing, wherein a central positioning hole extending to the bottom is provided on one side of the top of the PCB circuit board, and the central positioning hole matches the positioning center positioning post, and an anti-rotation positioning groove and several clearance fitting grooves are provided on the edge of the PCB circuit board, wherein the anti-rotation positioning groove matches the anti-rotation positioning post, and the clearance fitting groove matches the clearance fitting post;

[0007] The sensor housing is filled with epoxy resin, and the epoxy resin is located above the PCB circuit board.

[0008] A wire harness assembly is soldered to one side of the top of the PCB circuit board.

[0009] Furthermore, a matching target impeller is provided below the sensor housing to ensure the relative positional accuracy between the sensor and the target component.

[0010] Furthermore, a number of embedded rings are fixedly embedded inside the sensor housing, and the sensor housing and the number of embedded rings are integrally formed by injection molding, which significantly enhances the overall structural strength and durability.

[0011] Furthermore, the sensor housing, the positioning center positioning post, the anti-rotation positioning post, and several clearance-fitting posts are designed as a single unit, which reduces the number of parts and assembly steps, and improves the overall dimensional stability and production consistency.

[0012] Furthermore, a mounting groove is provided on one side of the top of the sensor housing, and the mounting groove is assembled with the mounting frame of the wiring harness assembly through an interference fit, ensuring the firmness of the wiring harness connection.

[0013] Furthermore, the outer surface of the PCB circuit board is fitted with eddy current coils and processing chips, achieving a high degree of integration between sensing and processing circuits.

[0014] Furthermore, the sensor housing is fixed to the PCB circuit board via PRESS-FIT quick-connect, which further simplifies the assembly process, improves production efficiency, and avoids the adverse effects of thermal stress on electronic components.

[0015] The beneficial effects of this utility model are:

[0016] In use, this utility model employs a quick-connect mechanical positioning structure that combines a central positioning post, an anti-rotation positioning post, and a clearance-fitting post, along with epoxy resin filling and encapsulation. This effectively overcomes the shortcomings of traditional hot riveting fixing methods, such as high equipment investment, high riveting head maintenance costs, and slow production cycle. This structure not only eliminates the investment in hot riveting stations and related equipment, significantly reducing production process costs and maintenance requirements, but also achieves complete constraint of all six degrees of freedom of the PCB through a single press-fit, ensuring high precision, high reliability, and high consistency in installation. At the same time, it improves production efficiency and product maintainability, making it highly suitable for applications such as new energy vehicles that have strict requirements for cost and performance. Attached Figure Description

[0017] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a schematic diagram of the overall exploded three-dimensional structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention in the form of a partial explosion.

[0020] The attached figures are labeled as follows:

[0021] 1. Target impeller blade; 2. Embedded ring; 3. Epoxy resin; 4. Sensor housing; 41. Positioning center positioning post; 42. Clearance fit post; 43. Anti-rotation positioning post; 5. PCB circuit board; 51. Center positioning hole; 52. Clearance fit groove; 53. Anti-rotation positioning groove; 6. Wiring harness assembly. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1-2 As shown, a novel eddy current sensor internal PCB mounting structure is disclosed, comprising a sensor housing 4. A positioning center post 41, an anti-rotation positioning post 43, and several clearance-fitting posts 42 are fixedly connected to the bottom inner part of the sensor housing 4. The sensor housing 4, the positioning center post 41, the anti-rotation positioning post 43, and the clearance-fitting posts 42 are integrated into a single unit. A PCB circuit board 5 is mounted inside the sensor housing 4. A central positioning hole 51 extending to the bottom is opened on one side of the top of the PCB circuit board 5, and the central positioning hole 51 matches the positioning center post 41. An anti-rotation positioning groove 53 and several clearance-fitting grooves 52 are opened on the edge of the PCB circuit board 5, and the anti-rotation positioning groove 53 matches the anti-rotation positioning post 43, and the clearance-fitting grooves 52 match the clearance-fitting posts 42. The sensor housing 4 and the PCB circuit board 5 are fixed together by a PRESS-FIT quick-connect method.

[0024] The sensor housing 4 is filled with epoxy resin 3, which is located above the PCB circuit board 5. The epoxy resin 3 forms a robust sealing and protective layer that can effectively block corrosive media such as moisture and salt spray, while also strengthening the overall structure to resist vibration and impact, significantly improving the long-term reliability and service life of the sensor in harsh environments.

[0025] A wire harness assembly 6 is soldered to one side of the top of the PCB circuit board 5. A mounting groove is provided on one side of the top of the sensor housing 4, and the mounting groove and the mounting bracket of the wire harness assembly 6 are assembled by interference fit.

[0026] The sensor housing 4 has a matching target impeller 1 at its bottom, and the target impeller 1 is fixed to the motor rotor at the client by PRESS-FIT.

[0027] Several embedded rings 2 are fixedly embedded inside the sensor housing 4, and the sensor housing 4 and the several embedded rings 2 are integrally formed by injection molding.

[0028] The outer surface of PCB circuit board 5 is covered with eddy current coils and processing chips. Directly mounted on the surface of PCB circuit board 5, it achieves the shortest path connection of the core components of the sensor, reduces signal attenuation and external electromagnetic interference, and optimizes signal quality.

[0029] Positioning and anti-rotation principles:

[0030] The sensor housing 4 is equipped with a positioning center positioning post 41 and an anti-rotation positioning post 43. The center positioning hole 51 on the PCB circuit board 5 cooperates with the positioning center positioning post 41 to achieve accurate positioning of the PCB circuit board 5 in the plane and constrain its translational degree of freedom; the anti-rotation positioning groove 53 cooperates with the anti-rotation positioning post 43 to prevent the PCB circuit board 5 from rotating, thereby jointly constraining the three degrees of freedom of the PCB circuit board 5 in the plane.

[0031] Fixed and quick-connect assembly principle:

[0032] Several clearance-fitting posts 42 on the sensor housing 4 and clearance-fitting grooves 52 on the PCB circuit board 5 are quick-fitted together via PRESS-FIT. The clearance-fitting posts 42 are designed with an inverted snap-fit ​​structure. When the PCB circuit board 5 is pressed into the sensor housing 4, the inverted snap-fit ​​structure elastically deforms and then recovers, locking the PCB circuit board 5 and restricting its upward movement. At the same time, the bottoms of all the positioning posts together form the support plane of the PCB circuit board 5, restricting the downward movement of the PCB circuit board 5 and controlling the other three degrees of freedom of the PCB circuit board 5.

[0033] Six degrees of freedom fully constrained:

[0034] Through the above structural combination, the six spatial degrees of freedom of the PCB circuit board 5 are completely constrained after installation, realizing high-precision and high-rigidity mechanical fixation, ensuring the relative position and attitude stability between the eddy current coil and the target impeller 1, and guaranteeing the measurement accuracy of the sensor.

[0035] Integrated packaging and signal conduction:

[0036] After the PCB is installed, epoxy resin 3 is filled on top for sealing and protection, enhancing environmental resistance. The wiring harness assembly 6 is fixed to the housing mounting slot by interference fit and soldered to the PCB to achieve electrical connection, completing the internal integration of the sensor.

[0037] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A novel mounting structure for the internal PCB of an eddy current sensor, comprising a sensor housing (4), characterized in that: The sensor housing (4) has a fixed connection to a positioning center positioning post (41), an anti-rotation positioning post (43), and several clearance fitting posts (42) at its inner bottom. The sensor housing (4) is equipped with a PCB circuit board (5). The top side of the PCB circuit board (5) has a central positioning hole (51) that extends to the bottom and matches the positioning center positioning post (41). The edge of the PCB circuit board (5) has an anti-rotation positioning groove (53) and several clearance fitting grooves (52). The anti-rotation positioning groove (53) matches the anti-rotation positioning post (43), and the clearance fitting groove (52) matches the clearance fitting post (42). The sensor housing (4) is filled with epoxy resin (3), and the epoxy resin (3) is located above the PCB circuit board (5); A wire harness assembly (6) is soldered to one side of the top of the PCB circuit board (5).

2. The mounting structure of the internal PCB of the novel eddy current sensor according to claim 1, characterized in that: The sensor housing (4) is provided with a matching target impeller blade (1) below it.

3. The mounting structure of the internal PCB of the novel eddy current sensor according to claim 1, characterized in that: The sensor housing (4) is fixedly embedded with several embedded rings (2), and the sensor housing (4) and the several embedded rings (2) are integrally formed by injection molding.

4. The mounting structure of the internal PCB of a novel eddy current sensor according to claim 1, characterized in that: The sensor housing (4) is integrated with the positioning center positioning post (41), the anti-rotation positioning post (43), and several clearance fit posts (42).

5. The mounting structure of the internal PCB of a novel eddy current sensor according to claim 1, characterized in that: The sensor housing (4) has a mounting groove on one side of its top, and the mounting groove is assembled with the mounting frame of the wire harness assembly (6) by an interference fit.

6. The mounting structure of the internal PCB of a novel eddy current sensor according to claim 1, characterized in that: The outer surface of the PCB circuit board (5) is fitted with an eddy current coil and a processing chip.

7. The mounting structure of the internal PCB of a novel eddy current sensor according to claim 1, characterized in that: The sensor housing (4) is fixed to the PCB circuit board (5) by PRESS-FIT quick-connect method.

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