Manipulation device

Abstract

The present disclosure relates to a handling device (1) for handling component carrier structures (200, 300, 400) having different sizes during manufacturing. The handling device (1) comprises an abutment surface (11, 12, 13) configured to position a component carrier structure (200, 300, 400) at a predetermined position on or in the handling device (1), and a movable positioning device (20) configured to be arranged at different positions on the handling device (1), thereby defining different holding areas, each holding area being dimensioned for at least one specific size of a component carrier structure (200, 300, 400).

Description

Technical Field

[0001] This disclosure relates to a manipulator for manufacturing component carrier structures, and more specifically to an adjustable manipulator for adapting component carrier structures of different sizes. Background Technology

[0002] Component carrier structures, such as printed circuit boards (PCBs), substrates, and interposers, play a crucial role in modern electronics manufacturing. These structures provide mechanical support and electrical connections for various electronic components, enabling the formation of complex electronic devices. With technological advancements, the need for manufacturing process flexibility is growing to accommodate the different sizes and configurations of component carrier structures.

[0003] During the manufacturing process, manipulators are used to securely hold and position the component carrier structure for various operations such as forming, assembly, testing, and inspection. Traditional manipulators are often designed for specific dimensions, thus limiting their versatility in handling various component carrier structure dimensions.

[0004] Figure 5 A control device based on the prior art is shown.

[0005] The actuating device includes a square or rectangular plate-like portion with a central region. This plate-like portion includes a recessed area within the central region, defined by abutment surfaces. These abutment surfaces extend along the four sides of the recessed area, thus forming a square configuration. The abutment surfaces are designed to position and constrain component carrier structures of the same shape and size arranged within the recessed area.

[0006] Existing control mechanisms have limitations in adapting to component carrier structures of different sizes. The fixed configuration of the contact surface restricts the control mechanism to component carrier structures of a single size and shape. This lack of adaptability necessitates the use of multiple control mechanisms, each customized to the specific dimensions of the component carrier structure.

[0007] Existing technology designs may involve the production, storage, and management of multiple control devices to accommodate various component carrier structural dimensions. This approach may lead to increased costs, storage requirements, and manufacturing process complexity.

[0008] One problem associated with existing control devices is their limited adaptability to different component carrier structural dimensions. Many control devices are designed for specific dimensions, requiring manufacturers to maintain multiple dedicated units to accommodate different product lines. This lack of flexibility leads to increased costs, storage requirements, and production line complexity.

[0009] Another challenge is the difficulty in quickly and accurately adjusting the control mechanism for different component carrier structural dimensions. Some existing solutions require significant time to reconfigure the control mechanism, such as replacing parts or using tools to adjust positioning elements. This can lead to production delays and increase the likelihood of human error during setup.

[0010] Furthermore, many existing manipulators lack precision in positioning and securing component carrier structures of varying sizes. This can lead to misalignment during manufacturing, resulting in defects or reduced product quality.

[0011] It has been recognized that the control mechanism needs to overcome one or more of these problems. Utility Model Content

[0012] This invention aims to introduce a series of concepts in a simplified form, which will be further described in the detailed description below.

[0013] In a first aspect, a manipulation device is provided for manipulating component carrier structures of different sizes during manufacturing. The manipulation device includes: an abutment surface configured to position the component carrier structure at a predetermined location on or within the manipulation device; and a movable positioning device configured to be arranged at different locations on the manipulation device to define different holding regions, each holding region being sized for at least one component carrier structure of a specific size.

[0014] This control device allows for flexible and precise positioning of component carrier structures of various sizes, thereby improving manufacturing efficiency and reducing the need for multiple dedicated control devices, providing adaptability to accommodate component carrier structures of various sizes; the adaptability design of the control device in this application allows a single device to accommodate multiple component carrier structure sizes; this adaptability can reduce the need for multiple dedicated control devices, thereby potentially saving costs, simplifying inventory management and improving the efficiency of the manufacturing process.

[0015] The operating device may also include a plate-like portion having a central region that is at least partially defined by an abutment surface and defines a holding area for receiving the component carrier structure.

[0016] The plate-shaped section provides a stable base for the operating device, while effectively utilizing space to accommodate component carrier structures of different sizes.

[0017] The movable positioning device may include at least one pin-shaped positioning member.

[0018] Pin-shaped positioning components allow for precise and adjustable positioning of the component carrier structure within the operating device.

[0019] The pin-shaped locating member can be configured to be inserted into the through hole from the first surface of the plate-shaped portion.

[0020] This configuration allows for easy insertion and removal of positioning components, facilitating rapid adjustment to accommodate different component carrier structural dimensions.

[0021] The pin-shaped locating member can be configured to be inserted into the through hole along the insertion axis by force.

[0022] The insertion of force ensures the secure fitting of the positioning components, thereby maintaining the stability of the component's load-bearing structure during handling and manufacturing.

[0023] The pin-shaped positioning member may include a first flat extension configured to mate with an inner flat extension of the through hole.

[0024] The matching of this flat extension enhances the stability and alignment of the positioning component within the through hole, thereby improving the overall positioning accuracy.

[0025] The free end of the pin-shaped positioning member may include a flat extension that is larger than the flat extension of the through hole, so as to form a detachable connection between the movable positioning device and the operating device when the movable positioning device is inserted into the through hole.

[0026] The large, flat extension at the free end forms a robust and detachable connection, allowing for easy adjustment and removal of the positioning device while ensuring stability during use.

[0027] The pin-shaped positioning member may include a plurality of columnar bodies spaced apart from each other and arranged in a circumferential array, wherein at least one columnar body, and in particular all columnar bodies, is configured to have radial elastic deflection.

[0028] The radial elastic deflection of the columnar body allows for a tight fit within the through hole while accommodating slight variations in hole size, thereby enhancing the versatility of the positioning component.

[0029] Each columnar body in the columnar body can be constructed as an elongated body with a tapered free end, the tapered end including a stepped structure abutting against the second surface of the plate-like portion.

[0030] The tapered free end with a stepped structure facilitates easy insertion of the positioning member, while providing a firm stop against the plate-like portion to ensure consistent positioning and also provides a snap-fit ​​connection.

[0031] The movable positioning device may include a head portion extending axially outside the pin-shaped positioning member, the head portion having a second external flat extension that is larger than the first flat extension.

[0032] The larger head portion provides a gripping surface for easy manipulation of the positioning device and to prevent over-insertion into the through-hole.

[0033] The pin-shaped positioning component can extend vertically from the bottom surface of the head portion.

[0034] This vertical arrangement ensures proper alignment and stability of the positioning components when they are inserted into the through holes.

[0035] The central vertical axis of the pin-shaped positioning component can be radially offset from the central axis of the head portion by a certain distance.

[0036] The eccentric arrangement allows for fine adjustment during positioning by rotating the head portion, thereby allowing for proper abutment of the head portion, particularly one sidewall of the head portion, against the side of the component carrier structure located on or within the control device. This is because the distance between the center of the pin-shaped positioning member (and preferably the center of the through hole) and one or more sides of the head portion is different.

[0037] The pin-shaped positioning member can be configured such that, with the movable positioning device inserted into the through hole, the free end of the pin-shaped positioning member protrudes beyond the second surface of the plate-shaped portion, such that the stepped structure abuts against the second surface of the plate-shaped portion, and the bottom surface of the head portion abuts against the first surface of the plate-shaped portion.

[0038] This configuration ensures that the movable positioning device is positioned in a snap-fit, secure, and stable manner through contact points defined on the two surfaces of the plate-like portion.

[0039] The head portion can be constructed as a prism-shaped body with a set of sidewalls along the circumferential direction.

[0040] The prismatic body design of the head portion provides multiple sidewalls, thereby allowing visual confirmation of the orientation of the positioning member and / or allowing the use of appropriate sidewalls, especially when the distances between the multiple side surfaces and the center of the pin-shaped positioning member (preferably the center of the through hole) are different.

[0041] The pin-shaped positioning member is configured to define different distances between the corresponding columnar body of the pin-shaped positioning member and the corresponding sidewall of the head portion adjacent to the columnar body.

[0042] The varying distances between the columnar body and the sidewalls create a unique positioning profile that interacts with the side surface of the component carrier structure, allowing for precise rotational adjustment of the positioning device and preventing accidental rotation.

[0043] The actuation device may include a plurality of through holes extending from a first surface of the plate-like portion through the actuation device to a second surface, the through holes being configured to engage with a movable positioning device at different locations.

[0044] Multiple through holes provide flexibility for positioning the movable positioning device, thereby accommodating various component and carrier structural dimensions.

[0045] Multiple vias can be configured as an array of vias surrounding a central region.

[0046] The array of through-holes surrounding the central area allows for the positioning of multiple movable positioning devices in a symmetrical and balanced manner.

[0047] Multiple through holes can be configured as polyhedral openings to engage with at least one pin-shaped locating member.

[0048] The polyhedral opening provides multiple contact surfaces for the pin-shaped positioning member, thereby enhancing stability and allowing for precise rotational adjustment; in the preferred case where at least one or each of the elongated bodies abuts against a side of the polyhedral opening, and more preferably in the case where at least one or each of the elongated bodies is flexible, it provides a safe and timely means of rotating the movable positioning device (involving appropriate deformation of the elongated bodies with elastic deformation) to a new rotational position.

[0049] Multiple through holes can be configured as quadrilateral openings to engage with at least one pin-shaped locating member; preferably, the surface extension of the pin-shaped locating member is also quadrilateral, more preferably matching the shape and size of the through holes.

[0050] The quadrilateral opening provides four different contact surfaces, thus balancing ease of insertion with stability of rotation.

[0051] Multiple through holes can be configured as hexagonal openings to engage with at least one pin-shaped locating member; preferably, the surface extension of the pin-shaped locating member is also hexagonal, more preferably matching the shape and size of the through holes.

[0052] The hexagonal opening provides six contact surfaces, thus providing enhanced rotational positioning.

[0053] The movable positioning device and the corresponding through hole can be configured such that: the movable positioning device, in the inserted state, can rotate in the through hole by applying a rotational force to the head portion, thereby enabling it to abut against the component carrier structure in the lateral direction to restrict the component carrier structure onto or within the operating device.

[0054] Rotational adjustability allows for easy fine-tuning of the positioning device's position, thereby achieving precise lateral constraint on the component's carrier structure.

[0055] The abutting surface can be configured to abut all the flat sides of the component carrier structure except for the flat side that abuts against the movable positioning device. Alternatively, the abutting surface can be configured to abut some of the flat sides of the component carrier structure, while the other flat sides of the component carrier structure (especially the remaining flat sides) abut against the movable positioning device.

[0056] This configuration ensures full support and alignment of the component carrier structure on multiple sides, thereby enhancing stability during handling and manufacturing.

[0057] The abutting surface may include multiple abutting sub-parts configured to abut against three of the four flat sides of the component carrier structure.

[0058] Using multiple abutment sections allows for a secure positioning of the component carrier structure while leaving a side accessible to movable positioning devices.

[0059] The abutting surface may at least partially define the recess of the support structure for the inserted component.

[0060] The recessed design helps to securely hold the component carrier structure in place and provides protection during handling and manufacturing processes. The recessed design also allows for shaping, assembly, testing, and inspection of the component carrier structure from both the top and bottom sides.

[0061] In a second aspect, a method for manipulating a component carrier structure using a manipulating device is provided. The method includes: positioning the component carrier structure against an abutment surface of the manipulating device; and inserting a movable positioning device into a through-hole of the manipulating device to define a holding region sized for the component carrier structure.

[0062] This method provides a systematic approach for securely positioning component carrier structures of various sizes, thereby improving handling efficiency and reducing the risk of damage during the manufacturing process.

[0063] According to an aspect of this disclosure, a manipulation device is provided for manipulating component carrier structures of different sizes during manufacturing. The manipulation device includes: an abutment surface configured to position the component carrier structure at a predetermined position on the manipulation device or to position the component carrier structure at a predetermined position within the manipulation device; and a movable positioning device configured to be arranged at different positions on the manipulation device to define different holding regions, each holding region being sized for at least one component carrier structure of a specific size.

[0064] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a carrier for the mechanical and / or electronic aspects of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board composed of different types of component carriers of the above types.

[0065] In the context of this application, the term "stacked structure" may specifically refer to an arrangement of multiple planar layers installed in parallel with each other in an up-down manner.

[0066] In the context of this application, the term "layer structure" may specifically refer to a continuous layer, a graphical layer, or a plurality of discontinuous islands within a common plane.

[0067] In the context of this application, the term "main surface of a body" may specifically refer to one of the two largest opposing surfaces of a body. Main surfaces can be connected by circumferential sidewalls. The thickness of a body, such as a stacked component, may be defined by the distance between the two largest opposing main surfaces.

[0068] In one embodiment, the component carrier is configured to consist of one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0069] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed by laminating multiple electrically conductive layer structures and multiple electrically insulating layer structures, for example, by applying pressure and / or providing heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, so-called prepreg, or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example, by laser drilling or mechanical drilling, and partially or completely filling the holes with an electrically conductive material (particularly copper), thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, i.e., so-called vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive electro-optical circuit boards (EOCBs). In addition to being able to embed one or more components, printed circuit boards are typically configured to house one or more components on one or both opposite surfaces of a board-shaped printed circuit board. The one or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB may include resin with reinforcing fibers, such as glass fiber.

[0070] In the context of this application, the term "substrate" can specifically refer to a small component carrier, particularly an IC substrate. An IC substrate can be a relatively small component carrier relative to a PCB, on which one or more components can be mounted, and which can serve as a connection medium between one or more chips and another PCB. For example, an IC substrate can have approximately the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of a chip-scale package (CSP)). More specifically, an IC substrate can be understood as a carrier for electrical connections or electrical networks, and a component carrier with a relatively high density of lateral and / or vertically arranged connectors, comparable to a printed circuit board (PCB). Lateral connectors are, for example, conductive paths, while vertical connectors can be, for example, drilled holes. These lateral and / or vertical connectors can be particularly arranged within the IC substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated or unaccommodated components (e.g., bare wafers), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. In the context of this application, the term "substrate" specifically facilitates electrical connection and / or heat dissipation and / or provides mechanical strength. Therefore, in the context of this application, the term "substrate" is specifically used as a synonym for "IC substrate." It should be noted that the term "substrate" should not be confused with the term "base," which is typically used in the context of wafers, where "base" generally refers to a base material used in wafer fabrication on which devices or circuits are built, and on which the base material forms a foundation layer supporting the electronic or photonic structures integrated into the wafer. This is not the meaning of "substrate" in the context of this application.

[0071] The substrate or interlayer may comprise an inorganic layer structure or a layer of at least one of the following, or a layer of an inorganic layer structure comprising at least one of the following: glass; silicon (Si); and / or a photosensitive or dry-etchable organic material, such as an epoxy-based laminate (e.g., an epoxy-based laminate film); or a polymer compound (which may or may not include photosensitive and / or thermosensitive molecules), such as polyimide or polybenzoxazole as an electrical insulating material.

[0072] In embodiments, at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins; bismaleimide triazine resins; polyphenylene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing structures made of, for example, glass (multilayer glass)—such as meshes, fibers, spheres, or other types of filler particles—can also be used to form composites. The semi-cured resin combined with the reinforcing agent, such as fibers impregnated with the aforementioned resins, is called a prepreg. These prepregs are typically named according to their properties, such as FR4 or FR5, which describe their flame-retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (e.g., epoxy-based films) or photosensitive dielectrics, can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be used as electrical insulation structures in component carriers.

[0073] In an embodiment, at least one conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. While copper is generally preferred, other materials or their coating schemes, particularly those coated with superconducting materials or conductive polymers, are also possible, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0074] At least one component may be selected from the following: non-electrically conductive inlays, electrically conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), optical guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS inlay) with or without an insulating material coating, which may be embedded or surface-mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to improve heat exchange capacity. In addition, components can be active electronic components (having at least one implemented pn junction), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, storage devices (such as DRAM or another data memory), filters, integrated circuits (such as field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (such as field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulators. Gate field-effect transistors (IGFETs), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound, are used in optoelectronic interface elements, light-emitting diodes (LEDs), optical connectors, voltage converters (e.g., DC / DC or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can be embedded within component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnets (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, the component can also be an IC substrate, an interposer, or another component carrier, such as a board-in-board configuration. Components may be surface-mounted onto a component carrier and / or embedded within the component carrier. Furthermore, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

[0075] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a multilayer composite structure that is stacked and connected together by applying pressure and / or heat.

[0076] After the internal layer structure of the component carrier has been processed, one or more additional electrically insulating and / or electrically conductive layer structures can be used (particularly by lamination) to symmetrically or asymmetrically cover one or both opposing main surfaces of the processed layer structure. In other words, lamination can continue until the desired number of layers is obtained.

[0077] After the stacked structure of the electrical insulation layer and the electrical conductivity layer is formed, the surface of the obtained layer structure or component carrier can be treated.

[0078] Specifically, regarding surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the laminate or component carrier. For example, such a solder resist can be formed over the entire main surface, and the solder resist layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to electronic peripherals. The surface portions of the component carrier still covered with solder resist, particularly those containing copper, can be effectively protected against oxidation or corrosion.

[0079] Regarding surface treatment, a surface treatment portion can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. This surface treatment portion can be an electrically conductive covering material on the exposed electrically conductive layer structure (e.g., pads, conductive traces, etc., particularly including or made of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) may be oxidized, resulting in lower reliability of the component carrier. The surface treatment portion can then be formed, for example, as a joint between a surface-mounted component and the component carrier. The surface treatment portion functions to protect the exposed electrically conductive layer structure (especially copper circuitry) and enables a connection process with one or more components, for example, by soldering. Examples of suitable materials for the surface treatment portion are organic solderable corrosion inhibitors (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, etc.

[0080] In the context of this application, the term "inorganic layer structure" may specifically refer to a layer structure comprising inorganic materials, such as inorganic compounds. In particular, the dielectric material of the inorganic layer structure, or even the entire inorganic layer structure, may be made solely of inorganic materials or at least substantially solely of inorganic materials. In another embodiment, the inorganic layer structure may include an inorganic dielectric material and additionally include another dielectric material. The inorganic compound may be a compound without carbon-hydrogen bonds, or it may be a compound of non-organic nature. In examples, the inorganic layer structure may include glass, such as silicon-based glass, particularly soda-lime glass, and / or borosilicate glass and / or aluminosilicate glass and / or lithium silicate glass and / or alkali-free glass. In another example, the inorganic layer structure may include ceramic materials, such as aluminum nitride and / or alumina and / or silicon nitride and / or boron nitride and / or tungsten-containing ceramic materials. However, in another example, the inorganic layer structure may include semiconductor materials, such as silicon and / or germanium and / or silicon oxide and / or germanium oxide and / or silicon carbide and / or gallium nitride. In another embodiment, the inorganic layer structure may include (elemental) metals and / or metal alloys, such as copper and / or tin and / or bronze. However, in another embodiment, the inorganic layer structure may include inorganic materials not listed in the above examples, such as MoS2, CuGaO2, AgAlO2, LiGaTe2, AgInSe2, CuFeS2, and BeO.

[0081] It should be noted that the reference numerals in the claims should not be interpreted as limiting the scope of the claims.

[0082] The implementation of this utility model is not limited to the preferred embodiments shown in the accompanying drawings and described above. Instead, various modifications using the illustrated solutions and based on the principles of this utility model are possible, the scope of which is defined by the appended claims. Attached Figure Description

[0083] The following figures illustrate non-restrictive and non-exhaustive examples.

[0084] Figure 1 A perspective view of the operating device according to aspects of this disclosure is shown.

[0085] Figure 2 An embodiment is shown. Figure 1 A top view of the control mechanism.

[0086] Figure 3 An orthographic view of an actuating device configured for a first component carrier structure according to aspects of this disclosure is shown.

[0087] Figure 4 An orthographic view of a maneuvering device configured for a second component carrier structure according to an embodiment is shown.

[0088] Figure 5 An orthographic view of a prior art plate-shaped manipulation device is shown.

[0089] Figure 6 Various orthogonal views of a movable positioning device according to aspects of this disclosure are shown.

[0090] Figure 7 An embodiment is shown. Figure 6 Additional view of the movable positioning device.

[0091] The same reference numerals are used in all the accompanying drawings to indicate similar features. Detailed Implementation

[0092] according to Figure 1 and Figure 2 The manipulation device 1 for manipulating the component carrier structure during manufacturing includes a plate-like portion 100 having a first surface 101 and a second surface 102. The plate-like portion 100 preferably includes a central region, which is at least partially defined by the abutment surfaces 11, 12, 13, and defines a holding region for accommodating the component carrier structure.

[0093] The plate-shaped portion 100 preferably includes abutment surfaces 11, 12, and 13, each abutment surface comprising a first abutment portion 11, a second abutment portion 12, and a third abutment portion 13. These abutment portions 11, 12, and 13 are arranged in a U-shape along three sides of the plate-shaped portion 100 to position and constrain the component carrier structure disposed within the operating device 1. Multiple abutment portions may be provided on each side of the plate-shaped portion 100.

[0094] The plate-shaped portion 100 preferably includes a plurality of through holes 110, which are preferably arranged in a pattern along the periphery of the plate-shaped portion 100. The through holes 110 extend from a first surface 101 to a second surface 102 of the plate-shaped portion 100. The through holes 110 are preferably square, and the side length is preferably 4 mm.

[0095] Preferably, a recess 120 is formed in the central region of the plate-like portion 100. Preferably, the recess 120 is partially defined by abutment surfaces 11, 12, and 13, which preferably include a plurality of abutment sub-parts: a first abutment portion 11, a second abutment portion 12, and a third abutment portion 13. These abutment sub-parts are configured to abut against three of the four flat sides of the component carrier structure. The abutment surfaces 11, 12, and 13 at least partially define the recess 120 into which the component carrier structure can be inserted.

[0096] The through holes 110 are preferably arranged in an array along multiple sides of the plate-like portion 100. The arrangement of the through holes 110 provides multiple mounting positions for the positioning device to accommodate component carrier structures of various sizes.

[0097] Figure 3 and Figure 4 An orthogonal view of the operating device according to various embodiments is shown.

[0098] Figure 3 A manipulator 1 is shown, configured to accommodate a component carrier structure 200 of the first dimension. Figure 4 The same actuating device 1 is shown, configured to accommodate component carrier structures 300 of different sizes. The movable positioning device 20 can be inserted into different through holes 110 to adjust the holding area according to the size of the manipulated component carrier structure, while the abutment portion is configured to abut against three of the four flat sides of the component carrier structures 200, 300.

[0099] The through-hole 110 is preferably designed as a polyhedral opening to engage with the pin-shaped positioning member 21 of the movable positioning device 20. In some examples, the through-hole 110 is configured as a quadrilateral opening to engage with the quadrilateral pin-shaped positioning member 21.

[0100] Figure 6 and Figure 7 Detailed views of the components of the operating device 1 are shown, with particular attention to the movable positioning device 20 and its engagement features.

[0101] The movable positioning device 20 includes a pin-shaped positioning member 21 extending from the head portion 22. The pin-shaped positioning member 21 includes a plurality of columnar bodies 211 arranged in a circumferential array. The head portion 22 is configured as a prism-shaped body and includes sidewalls 221 extending along its circumferential portion.

[0102] The movable positioning device 20 and the corresponding through hole 110 are configured such that the movable positioning device 20 can rotate in the through hole 110 in the inserted state by applying a rotational force to the head portion 22. This rotation causes the sidewall 221 of the head portion 22 to abut against the sidewall of the component support structure 200, 300 in the lateral direction, thereby constraining the component support structure 200, 300 in the operating device 1.

[0103] The rotation of the movable positioning device 20 involves the deformation of the cylindrical body 211, which has elastic deflection. Due to the shape matching between the pin-shaped positioning member 21 and the through hole 110, the movable positioning device 20 reaches a new rotational position.

[0104] Figure 6Various orthogonal views (A to D) of the movable positioning device 20 with a quadrilateral shape are shown, while Figure 7 Additional views (A to C) of a movable positioning device 20 having a hexagonal shape are shown. Other embodiments of the movable positioning device with pin-shaped positioning members and / or head portions of different shapes are also possible.

[0105] exist Figure 6 In the middle, the pin-shaped positioning member 21 preferably includes a plurality of columnar bodies 211, which are arranged in a circumferential array to define a flat extension of a quadrilateral shape; while Figure 7 In this configuration, a plurality of columnar bodies 211 are arranged in a circumferential array, thereby defining a flat extension of a hexagonal shape. The columnar bodies 211 are spaced apart from each other and are configured to have radial elastic deflection. Each columnar body 211 is preferably configured as an elongated body with a tapered free end. The tapered end includes a stepped structure 2111 configured to abut against the second surface 102 of the plate-like portion 100.

[0106] exist Figure 6 In the middle, the head portion 22 is preferably constructed as a quadrilateral with four sidewalls 221, while Figure 7 In the middle, the head portion 22 has a hexagonal shape with six sidewalls 221.

[0107] The central vertical axis c' of the pin-shaped positioning member 21 is radially offset from the central axis C of the head portion 22. This eccentric arrangement results in different lateral distances between each columnar body 211 of the pin-shaped positioning member 21 and its corresponding adjacent sidewall 221 of the head portion 22. These different distances allow for the use of appropriate sidewalls 221 of the head portion 22 to constrain the nearest sidewall of the component carrier structure.

[0108] The columnar body 211 of the pin-shaped positioning member 21 is designed to engage with the inner surface of the through hole, thereby providing a secure fit while allowing for rotational adjustment of the movable positioning device 20.

[0109] Figure 6 View A shows a perspective view of the movable positioning device 20. This view incorporates the aforementioned elements, thus showing the overall three-dimensional structure.

[0110] Figure 6B is another perspective view of the movable positioning device 20. The head portion 22 is shown above the pin-shaped positioning member 21. The columnar body 211 of the pin-shaped positioning member 21 is visible, extending downward from the head portion 22. The stepped structure 2111 located at the free end of each columnar body 211 is clearly shown.

[0111] Figure 6 Figure C shows a bottom view of the movable positioning device 20. This view emphasizes the eccentric arrangement of the pin-shaped positioning member 21 relative to the head portion 22. The central vertical axis c' of the pin-shaped positioning member 21 is clearly offset from the central axis C of the head portion 22. This offset causes a change in the distance between each columnar body 211 and the adjacent sidewall 221 of the head portion 22. The quadrilateral shapes of both the head portion 22 and the pin-shaped positioning member 21, and their offset arrangement, are very evident.

[0112] Figure 6 Figure D shows a top view of the movable positioning device 20. The head portion 22 is shown as a square with four sidewalls 221. Preferably, four numbers (0, 1, 2, 3) are provided on the top of the head portion, each number preferably representing a different eccentricity between the corresponding (closest) sidewall and the center of the pin-shaped positioning member (e.g., from "0" representing the lowest eccentricity to "3" representing the highest eccentricity), to refine the correct rotational positioning of the movable positioning member 21 taking into account the actual shape of the component carrier structure to be held in or on the operating device 1.

[0113] Figure 7 Figure A shows a top view of the hexagonal movable positioning device 20. The head portion 22 is shown as a hexagon with six sidewalls 221.

[0114] Figure 7 B is a perspective view of the movable positioning device 20. The head portion 22 is shown above the pin-shaped positioning member 21. The columnar body 211 of the pin-shaped positioning member 21 is visible, extending downward from the head portion 22. The stepped structure 2111 located at the free end of each columnar body 211 is clearly shown.

[0115] Figure 7Figure C shows a bottom view of the movable positioning device 20. This view clearly shows six columnar bodies 211 arranged in a hexagonal pattern. The stepped structures 2111 located at the free ends of the columnar bodies 211 are visible. The eccentric arrangement of the pin-shaped positioning members 21 relative to the head portion 22 is visible, wherein the central vertical axis c' of the pin-shaped positioning members 21 is significantly offset from the central axis C of the head portion 22, resulting in a variation in the distance between each columnar body 211 and the adjacent sidewall 221 of the head portion 22. The pin-shaped positioning members 21 are visible as smaller, off-center hexagons within the head portion 22.

[0116] Features of any of the examples or embodiments described above can be combined to form other examples or embodiments without losing the intended effect. It should be understood that the descriptions of the embodiments or examples provided above are merely illustrative, and various modifications can be made by those skilled in the art. Furthermore, those skilled in the art will recognize that multiple additional modifications and combinations of the aspects are also possible. Therefore, the described aspects are intended to cover all changes, modifications, and variations falling within the scope of the appended claims.

Claims

1. A control device (1) for manipulating component carrier structures (200, 300, 400) of different sizes during manufacturing, characterized in that, The operating device (1) includes: Abutment surfaces (11, 12, 13) are configured to position the component carrier structures (200, 300, 400) at predetermined positions on the operating device (1) or to position the component carrier structures (200, 300, 400) at predetermined positions within the operating device (1); and A movable positioning device (20) is configured to be arranged at different positions on the operating device (1) to define different holding areas, each holding area being sized for at least one specific size of the component carrier structure (200, 300, 400).

2. The operating device according to claim 1, characterized in that, The operating device further includes a plate-shaped portion (100) having a central region defined at least in part by the abutment surfaces (11, 12, 13) and defining the retaining region for accommodating the component carrier structures (200, 300, 400).

3. The operating device according to claim 2, characterized in that, The movable positioning device (20) includes at least one pin-shaped positioning component (21).

4. The operating device according to claim 3, characterized in that, The pin-shaped positioning member (21) is configured to be inserted from the first surface (101) of the plate-shaped portion (100) into the through hole (110).

5. The operating device according to claim 4, characterized in that, The pin-shaped positioning member (21) is configured to be inserted into the through hole (110) by force along the insertion axis.

6. The operating device according to claim 4 or 5, characterized in that, The pin-shaped positioning member (21) includes a first flat extension configured to match an internal flat extension of the through hole (110).

7. The operating device according to claim 6, characterized in that, The free end of the pin-shaped positioning member (21) includes a flat extension larger than the internal flat extension of the through hole (110) to form a detachable connection between the movable positioning device (20) and the operating device (1) when the movable positioning device (20) is inserted into the through hole (110).

8. The operating device according to claim 6, characterized in that, The pin-shaped positioning member (21) includes a plurality of columnar bodies (211) spaced apart from each other and arranged in a circumferential array, and at least one of the columnar bodies (211) is configured to have radial elastic deflection.

9. The operating device according to claim 6, characterized in that, The pin-shaped positioning member (21) includes a plurality of columnar bodies (211) spaced apart from each other and arranged in a circumferential array, and all the columnar bodies (211) are configured to have radial elastic deflection.

10. The operating device according to claim 8 or 9, characterized in that, Each of the columnar bodies (211) is constructed as an elongated body with a tapered free end, the tapered free end including a stepped structure (2111) abutting against the second surface (102) of the plate-like portion (100).

11. The operating device according to claim 10, characterized in that, The movable positioning device (20) includes a head portion (22) that extends axially outside the pin-shaped positioning member (21) and has a second external flat extension that is larger than the first flat extension.

12. The operating device according to claim 11, characterized in that, The pin-shaped positioning member (21) extends vertically from the bottom surface of the head portion (22).

13. The operating device according to claim 11 or 12, characterized in that, The central vertical axis (c') of the pin-shaped positioning member (21) is radially offset from the central axis (C) of the head portion (22).

14. The operating device according to claim 11, characterized in that, The pin-shaped positioning member (21) is configured such that, with the movable positioning device (20) inserted into the through hole (110), the free end of the pin-shaped positioning member (21) protrudes beyond the second surface (102) of the plate-shaped portion (100), such that the stepped structure (2111) abuts against the second surface (102) of the plate-shaped portion (100), and the bottom surface of the head portion (22) abuts against the first surface (101) of the plate-shaped portion (100).

15. The operating device according to claim 11 or 12, characterized in that, The head portion (22) is constructed as a prismatic body having a group of sidewalls (221) along the circumferential direction.

16. The operating device according to claim 15, characterized in that, The pin-shaped positioning member (21) is configured to define different distances between the corresponding columnar body of the pin-shaped positioning member (21) and the corresponding sidewall of the head portion adjacent to the columnar body.

17. The operating device according to claim 4 or 5, characterized in that, The operating device (1) also includes a plurality of through holes (110) extending from a first surface (101) of the plate portion (100) through the operating device (1) to a second surface (102) of the plate portion (100), the through holes (110) being configured to engage with the movable positioning device (20) at different locations.

18. The operating device according to claim 17, characterized in that, The plurality of the vias (110) are configured as an array of vias surrounding the central region.

19. The operating device according to claim 17, characterized in that, The plurality of the through holes (110) are configured as polyhedral openings to engage with at least one of the pin-shaped positioning members (21).

20. The operating device according to claim 17, characterized in that, The plurality of the through holes (110) are configured as quadrilateral openings to engage with at least one of the pin-shaped positioning members (21).

21. The operating device according to claim 17, characterized in that, The plurality of the through holes (110) are configured as hexagonal openings to engage with at least one of the pin-shaped positioning members.

22. The operating device according to claim 11 or 12, characterized in that, The movable positioning device (20) and the corresponding through hole (110) are configured such that the movable positioning device (20) can rotate in the through hole in the inserted state by applying a rotational force to the head portion (22), thereby being able to abut against the component carrier structure (200, 300, 400) in the lateral direction to constrain the component carrier structure (200, 300, 400) on the operating device (1) or to constrain the component carrier structure (200, 300, 400) in the operating device (1).

23. The operating device according to any one of claims 1 to 5, characterized in that, The abutting surfaces (11, 12, 13) are configured to abut against all flat sides of the component carrier structure (200, 300, 400) except for the flat side that abuts against the movable positioning device (20).

24. The operating device according to any one of claims 1 to 5, characterized in that, The abutting surfaces (11, 12, 13) include a plurality of abutting sub-parts configured to abut against three of the four flat sides of the component carrier structure (200, 300, 400).

25. The operating device according to any one of claims 1 to 5, characterized in that, The abutting surfaces (11, 12, 13) at least partially define a recess (120), into which the component carrier structures (200, 300, 400) are inserted.

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