Waterproof and pressure-resistant circuit board

Abstract

The utility model relates to circuit board field discloses a waterproof pressure -resisting circuit board, including the bottom mounting frame for bottom support, the top of bottom mounting frame is pasted with upside mounting frame, the both sides of upside mounting frame's top are all fixedly connected with the wire seal cover, the inside of bottom mounting frame is provided with circuit mainboard, the inside of circuit mainboard is equipped with a plurality of through -inserting mouth, the inside of bottom mounting frame is installed with lower support subassembly, upside mounting frame's inside is installed with upper pressure -resisting subassembly, to be used for realizing the support protection of circuit mainboard, the outside of bottom mounting frame is installed with extrusion connection subassembly. In the utility model, the rigidity of overall structure is strengthened while providing the buffer, prevents the bending deformation of circuit board, realizes the pressure -resisting effect of " the combination of rigidity and flexibility", realizes the all -round sealed protection to circuit mainboard, improves the long -term work stability under the bad environment such as humid, dusty etc.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more particularly to a waterproof and pressure-resistant circuit board. Background Technology

[0002] As a core component of electronic devices, the reliability of circuit boards directly affects the stable operation of the entire device. In industrial applications, circuit boards are often deployed in harsh environments characterized by high temperatures, humidity, dust, and potential mechanical vibration or external pressure. Traditional circuit boards have simple structures and limited protection capabilities, making it difficult to maintain long-term stability and service life under such complex conditions.

[0003] Currently, conventional protective measures focus on single waterproof or mechanical protection. In terms of pressure resistance, rigid supports are usually only set at the bottom of the circuit board, lacking effective buffering and stress distribution mechanisms. When subjected to uneven vertical pressure or impact, the circuit board is prone to bending, component desoldering, or even board cracking. In terms of waterproofing, simple sealant coating or sealing ring pressing is often used, but these are prone to aging and cracking under long-term vibration or alternating hot and cold temperatures, leading to seal failure. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a waterproof and pressure-resistant circuit board. This board provides cushioning while enhancing the rigidity of the overall structure, preventing bending and deformation of the circuit board, achieving a pressure-resistant effect that combines rigidity and flexibility. It also provides comprehensive sealing protection for the main circuit board and improves long-term operational stability in harsh environments such as humid and dusty conditions.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A waterproof and pressure-resistant circuit board includes a bottom mounting frame for bottom support, an upper mounting frame attached to the top of the bottom mounting frame, wire sealing sleeves fixedly connected to both sides of the top of the upper mounting frame, a circuit board disposed inside the bottom mounting frame, the circuit board having multiple through-holes inside, a lower support assembly installed inside the bottom mounting frame, an upper anti-pressure assembly installed inside the upper mounting frame for supporting and protecting the circuit board, and a compression connection assembly installed on the outer side of the bottom mounting frame for waterproof protection of the circuit board.

[0007] Furthermore, the extrusion connection assembly includes a sealing groove at the top of the bottom mounting frame, and a hot melt sealing strip is fixedly connected to the bottom of the upper mounting frame, with the outside of the hot melt sealing strip filling the inside of the sealing groove.

[0008] Furthermore, the extrusion connection assembly also includes connecting bolts that pass through both sides of the upper mounting frame. Each connecting bolt has a fixed cap at its top end, and both sides of the bottom end of the bottom mounting frame have connecting caps fixedly connected. The external threads of the connecting bolts are connected to the middle of the connecting caps.

[0009] Furthermore, the upper anti-compression component includes an upper support frame located inside the upper mounting frame, an upper soft rubber pad is fixedly connected to the bottom end of the upper support frame, and a plurality of upper support columns are fixedly connected to the bottom end of the upper support frame.

[0010] Furthermore, the lower support assembly includes a bottom support frame plate located inside the lower side of the bottom mounting frame. A bottom soft rubber pad is fixedly connected to the top of the bottom support frame plate, and multiple lower support sleeves are fixedly connected to the top of the bottom support frame plate. The outer side of the lower support sleeve is inserted into the inside of the insertion port, and the outer side of the upper support column is respectively inserted into the inside of the lower support sleeve.

[0011] Furthermore, the bottom end of the upper soft rubber pad is attached to the top of the circuit board.

[0012] Furthermore, the top of the bottom soft rubber pad is attached to the bottom of the circuit board.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, a three-dimensional mechanical protection system is formed by setting up upper and lower supporting components. When subjected to external pressure, the force is transmitted to the bottom soft rubber pad through the upper soft rubber pad, the upper supporting column, and the lower supporting sleeve. This series of elastic elements can effectively absorb and disperse impact energy, avoid stress concentration and hard damage to the circuit board. The interpenetrating structure of the supporting column and the supporting sleeve not only provides buffering but also enhances the rigidity of the overall structure, prevents the circuit board from bending and deforming, and achieves a pressure-resistant effect that combines rigidity and flexibility.

[0015] 2. In this utility model, by setting a hot melt sealing strip at the bottom of the upper mounting frame and pressing it with the sealing groove of the bottom mounting frame to form a continuous, uniform and reliable sealing barrier, the possibility of moisture and dust intruding from the joint surface is fundamentally eliminated. Combined with the wire sealing sleeves on both sides, all-round sealing protection of the circuit board is achieved, improving the long-term working stability in harsh environments such as humid and dusty conditions. Attached Figure Description

[0016] Figure 1 This is an overall view of a waterproof and pressure-resistant circuit board proposed in this utility model;

[0017] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 This is a circuit board assembly diagram of a waterproof and pressure-resistant circuit board proposed in this utility model;

[0019] Figure 4 This utility model provides a bottom mounting frame mechanism diagram for a waterproof and pressure-resistant circuit board.

[0020] Figure 5 This is a diagram of the upper mounting frame mechanism for a waterproof and pressure-resistant circuit board proposed in this utility model.

[0021] Legend:

[0022] 1. Bottom mounting frame; 2. Upper mounting frame; 3. Wire sealing sleeve; 4. Fixing cap; 5. Connecting bolt; 6. Connecting cap; 7. Sealing groove; 8. Circuit board; 9. Insertion port; 10. Bottom support frame plate; 11. Bottom soft rubber pad; 12. Lower support sleeve; 13. Upper support column; 14. Upper soft rubber pad; 15. Upper support frame; 16. Hot melt sealing strip. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figure 1 , Figure 4 and Figure 5 This utility model provides an embodiment of a waterproof and pressure-resistant circuit board, including a bottom mounting frame 1 for bottom support, an upper mounting frame 2 attached to the top of the bottom mounting frame 1, and wire sealing sleeves 3 fixedly connected to both sides of the top of the upper mounting frame 2. (Refer to...) Figure 3The bottom mounting frame 1 has a circuit board 8 inside, with multiple insertion slots 9 inside. A lower support assembly is installed inside the bottom mounting frame 1, and an upper anti-compression assembly is installed inside the upper mounting frame 2 to support and protect the circuit board 8. A compression connection assembly is installed on the outside of the bottom mounting frame 1 to provide waterproof protection for the circuit board 8. The upper anti-compression assembly includes an upper support frame 15 located inside the upper mounting frame 2. An upper soft rubber pad 14 is fixedly connected to the bottom end of the upper support frame 15. The lower support assembly includes a bottom support frame plate 10 located inside the lower side of the bottom mounting frame 1. A bottom soft rubber pad 11 is fixedly connected to the top of the bottom support frame plate 10. A plurality of lower support sleeves 12 are fixedly connected to the top of the bottom support frame plate 10. The outside of the lower support sleeves 12 is inserted into the inside of the insertion port 9. The outside of the upper support columns 13 are respectively inserted into the inside of the lower support sleeves 12. The bottom end of the upper soft rubber pad 14 is attached to the top of the circuit board 8. The top end of the bottom soft rubber pad 11 is attached to the bottom end of the circuit board 8.

[0025] The circuit board 8 is protected by both an upper pressure-resistant component and a lower support component. The lower support component consists of a bottom support frame 10, a bottom soft rubber pad 11, and multiple lower support sleeves 12. These lower support sleeves 12 pass through the insertion holes 9 on the circuit board 8 and interlock with the upper support columns 13 of the upper pressure-resistant component, forming a support system arranged vertically. When external pressure is applied to the circuit board, the upper support frame 15 transfers the load to the upper support columns 13 through the upper soft rubber pads 14, and then distributes it to the lower support sleeves 12 and the bottom soft rubber pads 11. The soft rubber material, with its elastic deformation capability, can effectively absorb and buffer impact energy, preventing the circuit board 8 from being damaged by instantaneous high voltage. At the same time, the interlocking structure between the support sleeves and support columns also enhances the overall rigidity, thereby effectively suppressing the risk of bending or breakage.

[0026] Reference Figure 2 , Figure 4 and Figure 5 The extrusion connection assembly includes a sealing groove 7 at the top of the bottom mounting frame 1, a hot melt sealing strip 16 fixedly connected to the bottom of the upper mounting frame 2, the outside of the hot melt sealing strip 16 filling the inside of the sealing groove 7, and the extrusion connection assembly also includes connecting bolts 5 inserted on both sides of the upper mounting frame 2, a fixing cap 4 fixedly connected to the top of each connecting bolt 5, and connecting caps 6 fixedly connected to both sides of the bottom of the bottom mounting frame 1, with the external threads of the connecting bolt 5 connected to the middle of the connecting cap 6;

[0027] The circuit board 8 is encapsulated between the bottom mounting frame 1 and the upper mounting frame 2, and sealed using a compression connection assembly. Specifically, a pre-installed hot-melt sealing strip 16 at the bottom of the upper mounting frame 2 fills the sealing groove 7 at the top of the bottom mounting frame 1. During the pressing process of the upper and lower frames, the hot-melt sealing strip is preheated and melted, fully filling the sealing groove and solidifying after cooling, thus forming a continuous and dense waterproof barrier, effectively preventing moisture, dust, and other contaminants from entering the circuit. In addition, wire sealing sleeves 3 are integrated on both sides of the upper mounting frame 2 to guide wires through and seal the interface, ensuring the waterproof performance of external connection parts. Connecting bolts 5 are inserted from both sides of the upper mounting frame 2 and threaded into the connecting caps 6 at the bottom of the bottom mounting frame 1. During tightening, the upper and lower frames are tightly pressed together, ensuring not only a full fit between the sealing assembly and the support assembly, but also providing stable mechanical fixation for the overall structure.

[0028] Working principle: The circuit board 8 is encapsulated between the bottom mounting frame 1 and the upper mounting frame 2, and sealed by a compression connecting assembly. Specifically, the hot-melt sealing strip 16 fixed at the bottom of the upper mounting frame 2 fills the sealing groove 7 opened at the top of the bottom mounting frame 1. When the upper and lower frames are pressed together, the hot-melt sealing strip is preheated and melted, filling and solidifying the space between the sealing groove 7 to form a continuous and tight waterproof barrier, effectively preventing moisture, dust and other contaminants from entering the internal circuit. The connecting bolts 5 pass through both sides of the upper mounting frame 2 and are threaded into the connecting caps 6 at the bottom of the bottom mounting frame 1. When the connecting bolts are tightened, the upper and lower frames are pressed together, ensuring that the sealing assembly and the support assembly fit tightly, while providing stable mechanical fixation. The circuit board 8 is protected by both the upper anti-compression assembly and the lower support assembly. The lower support assembly includes a bottom support frame plate 10, a bottom soft rubber pad 11 and multiple lower support sleeves 12. The lower support sleeve 12 passes through the insertion port 9 on the circuit board 8 and intersects with the upper support column 13 of the upper anti-pressure component, forming a vertical support system. When external pressure is applied to the circuit board, the upper support frame 15 transmits the pressure to the upper support column 13 through the upper soft rubber pad 14, and distributes it to the lower support sleeve 12 and the bottom soft rubber pad 11. The soft rubber material has elastic deformation characteristics, which can absorb and buffer impact energy, preventing the circuit board 8 from being damaged by instantaneous high voltage. At the same time, the interlocking structure of the support sleeve and support column enhances the overall rigidity, preventing bending or breakage.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A waterproof and pressure-resistant circuit board, characterized in that, The device includes a bottom mounting frame (1) for bottom support, an upper mounting frame (2) attached to the top of the bottom mounting frame (1), wire sealing sleeves (3) fixedly connected to both sides of the top of the upper mounting frame (2), a circuit board (8) provided inside the bottom mounting frame (1), multiple insertion holes (9) provided inside the circuit board (8), a lower support assembly installed inside the bottom mounting frame (1), an upper anti-compression assembly installed inside the upper mounting frame (2) for supporting and protecting the circuit board (8), and a compression connection assembly installed outside the bottom mounting frame (1) for waterproofing the circuit board (8).

2. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The extrusion connection assembly includes a sealing groove (7) at the top of the bottom mounting frame (1), and a hot melt sealing strip (16) is fixedly connected to the bottom of the upper mounting frame (2), with the outside of the hot melt sealing strip (16) filling the inside of the sealing groove (7).

3. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The extrusion connection assembly also includes connecting bolts (5) that are inserted on both sides of the upper mounting frame (2). The top of each connecting bolt (5) is fixedly connected to a fixing cap (4). Both sides of the bottom end of the bottom mounting frame (1) are fixedly connected to connecting caps (6). The external threads of the connecting bolts (5) are connected to the middle of the connecting caps (6).

4. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The upper anti-compression component includes an upper support frame (15) located inside the upper mounting frame (2). The bottom end of the upper support frame (15) is fixedly connected to an upper soft rubber pad (14), and the bottom end of the upper support frame (15) is fixedly connected to a plurality of upper support columns (13).

5. A waterproof and pressure-resistant circuit board according to claim 4, characterized in that: The lower support assembly includes a bottom support frame plate (10) located on the lower side inside the bottom mounting frame (1). A bottom soft rubber pad (11) is fixedly connected to the top of the bottom support frame plate (10). A plurality of lower support sleeves (12) are fixedly connected to the top of the bottom support frame plate (10). The outside of the lower support sleeves (12) is inserted into the inside of the insertion port (9). The outside of the upper support column (13) is respectively inserted into the inside of the lower support sleeve (12).

6. A waterproof and pressure-resistant circuit board according to claim 4, characterized in that: The bottom end of the upper soft rubber pad (14) is attached to the top of the circuit board (8).

7. A waterproof and pressure-resistant circuit board according to claim 5, characterized in that: The top of the bottom soft rubber pad (11) is attached to the bottom of the circuit board (8).

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