High frequency microwave printed circuit board

CN224844396UActive Publication Date: 2026-10-09CHANGZHOU PC SPECIALTIES
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Patent Information

Application Number
CN202522347389.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-05
Publication Date
2026-10-09
Estimated Expiration
2035-11-05

AI Technical Summary

Technical Problem

[0004]本实用新型的目的在于提供一种高频微波印制线路板,以解决安装范围单一以及散热效果受限的问题

Benefits of technology

本实用新型通过设置限位组件便于扩大对线路板本体的安装使用范围,通过两组定位板、连接盘和第一固定栓等便于根据线路板本体的尺寸,对两个限位架之间的距离进行调节,并通过调整固定板的高度,便于对不同厚度的线路板本体进行限位和固定,扩大使用范围,通过设置散热组件方便提高散热效率,通过过滤网和三个散热扇的配合提高散热均匀效果,在外部环境温度较高时,通过第一支撑管、U形管和第二支撑管等实现冷却液的流动,并在散热扇的配合下,增强散热效果。

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Abstract

The utility model relates to the technical field of circuit board, and disclose a kind of high-frequency microwave printed circuit board, including installation frame, still including the connecting plate being set in the front surface of installation frame, the bottom of installation frame is provided with support frame, the utility model is convenient to enlarge the installation use range of circuit board body by setting limiting component, the distance between two limiting frames is adjusted according to the size of circuit board body by two groups of locating plate, connecting disc and first fixed peg etc., and by adjusting the height of fixed plate, it is convenient to limit and fix the circuit board body of different thickness, enlarge the use range, it is convenient to improve the heat dissipation efficiency by setting heat dissipation component, improve the heat dissipation uniform effect by the cooperation of filter screen and three heat dissipation fans, when external environment temperature is higher, the flow of coolant is realized by first support pipe, U-shaped pipe and second support pipe etc., and under the cooperation of heat dissipation fan, enhance the heat dissipation effect.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high-frequency microwave printed circuit board. Background Technology

[0002] Circuit boards serve as the support platform for electronic components. Through printed conductive lines and pads, electrical connections and mechanical fixation between electronic components are achieved. High-frequency microwave printed circuit boards are special circuit boards designed specifically for high-frequency signals and microwave frequency bands. Their core task is to efficiently transmit high-frequency signals.

[0003] A high-frequency microwave printed high-density HDI circuit board with patent application number 202222991093.1 facilitates the installation and positioning of the circuit board by setting a mounting bracket and a limiting plate. The rotation of the fan blades improves the heat dissipation efficiency of the circuit board. However, the dimensions of the mounting bracket and the limiting plate are fixed during use, which is not convenient for supporting and limiting circuit boards of different thicknesses and specifications, thus limiting the scope of installation and use. At the same time, the heat dissipation through the fan blades depends on the ambient temperature. When the external ambient temperature is high, the heat dissipation capacity is limited, which affects the service life. Utility Model Content

[0004] The purpose of this invention is to provide a high-frequency microwave printed circuit board to solve the problems of limited installation range and limited heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-frequency microwave printed circuit board, including a mounting frame, and further comprising: A connecting plate is provided on the front surface of the mounting frame, and a support frame is provided at the bottom of the mounting frame; A limiting component is provided inside the mounting frame. The limiting component includes a fixed frame that is fixedly connected inside the mounting frame. A positioning plate is slidably connected to the inner side of the fixed frame. A connecting plate is fixedly connected to one end of the positioning plate. A limiting frame is fixedly connected to the front surface of the connecting plate. A first anti-slip pad is fixedly connected inside the limiting frame. A heat dissipation assembly is installed inside the support frame. The heat dissipation assembly includes a filter screen installed inside the support frame. A first support tube is fixedly connected inside the support frame. A U-shaped tube is connected inside the first support tube. A second support tube is connected inside the U-shaped tube. A cooling fan is installed at the bottom of the inner cavity of the support frame.

[0006] Preferably, the limiting frame has a first fixing bolt inside, and a first nut is threadedly connected to the outer side of the first fixing bolt.

[0007] Preferably, a fixing plate is fixedly connected to the bottom of the first fixing bolt, and a second anti-slip pad is fixedly connected to the bottom of the fixing plate.

[0008] Preferably, the top of the first anti-slip pad is provided with a circuit board body, and the other end of the positioning plate is fixedly connected to a second fixing bolt, and the outer side of the second fixing bolt is threaded with a second nut.

[0009] Preferably, the outer side of the positioning plate is slidably connected to the inside of the mounting frame, and through slots are provided on both sides of the mounting frame.

[0010] Preferably, a cooling box is fixedly connected to the front surface of the support frame, and the interior of the cooling box is in communication with the interior of the second support tube.

[0011] Preferably, a water pump is fixedly connected to one side of the cooling tank, and a connecting pipe is connected inside the water pump, with the inside of the connecting pipe communicating with the inside of the cooling tank.

[0012] Preferably, the interior of the first support pipe is connected to the interior of the water pump, and a support is fixedly connected to the bottom of the support frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model expands the installation and usage range of the circuit board body by setting a limiting component. The distance between the two limiting frames can be adjusted according to the size of the circuit board body by using two sets of positioning plates, connecting plates, and first fixing bolts. By adjusting the height of the fixing plate, it is easy to limit and fix circuit boards of different thicknesses, thus expanding the scope of use. The heat dissipation component improves heat dissipation efficiency. The combination of filter screen and three cooling fans improves the uniformity of heat dissipation. When the external ambient temperature is high, the flow of coolant is realized through the first support pipe, U-shaped pipe and second support pipe, and the heat dissipation effect is enhanced with the help of cooling fans. Attached Figure Description

[0014] Figure 1 A schematic diagram of a preferred embodiment of the high-frequency microwave printed circuit board provided by this utility model; Figure 2 A schematic diagram of the limiting component structure provided by this utility model; Figure 3 This is a schematic diagram of the second fixing bolt and through groove provided by this utility model from another perspective. Figure 4 A schematic diagram of the heat dissipation component structure provided by this utility model.

[0015] In the diagram: 1. Mounting frame; 2. Connecting plate; 3. Support frame; 4. Limiting component; 41. Fixing frame; 42. Positioning plate; 43. Connecting disc; 44. Limiting frame; 45. First anti-slip pad; 5. Heat dissipation component; 51. Filter screen; 52. First support pipe; 53. U-shaped pipe; 54. Second support pipe; 55. Cooling fan; 6. First fixing bolt; 7. First nut; 8. Fixing plate; 9. Second anti-slip pad; 10. Circuit board body; 11. Second fixing bolt; 12. Second nut; 13. Through slot; 14. Cooling box; 15. Water pump; 16. Connecting pipe; 17. Support. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-4 As shown, a high-frequency microwave printed circuit board includes a mounting frame 1, a connecting plate 2 disposed on the front surface of the mounting frame 1, the mounting frame 1 and the connecting plate 2 being hinged for easy opening and closing control, a support frame 3 disposed at the bottom of the mounting frame 1, and the mounting frame 1 and the support frame 3 being fixedly mounted by bolts; a limiting component 4 disposed inside the mounting frame 1, the limiting component 4 including a fixed frame 41 fixedly connected inside the mounting frame 1, a positioning plate 42 slidably connected to the inner side of the fixed frame 41, a connecting plate 43 fixedly connected to one end of the positioning plate 42, a limiting frame 44 fixedly connected to the front surface of the connecting plate 43, the limiting frame 44 being easily and flexibly moved under the support of the connecting plate 43, the positioning plate 42 and the fixed frame 41, thereby facilitating the adjustment of the distance between the two limiting frames 44, a first anti-slip pad 45 fixedly connected inside the limiting frame 44; and a heat dissipation component 5 disposed inside the support frame 3, the heat dissipation component 5 including A filter screen 51 is installed inside the support frame 3. The filter screen 51 is supported by the support frame 3 and can be pulled out of the support frame 3 for easy cleaning. The filter screen 51 filters the blowing air. A first support pipe 52 is fixedly connected inside the support frame 3. A U-shaped pipe 53 is connected inside the first support pipe 52. A second support pipe 54 is connected inside the U-shaped pipe 53. The first support pipe 52 and the second support pipe 54 are supported and fixed by the support frame 3. One end of the U-shaped pipe 53 is fixed to the first support pipe 52 and the other end is fixed to the second support pipe 54. The first support pipe 52, the U-shaped pipe 53 and the second support pipe 54 are connected to each other to facilitate the flow of coolant. At the same time, a cooling fan 55 is installed at the bottom of the inner cavity of the support frame 3. The cooling efficiency is improved by the three cooling fans 55 working together with the flow of coolant.

[0018] refer to Figure 1 , Figure 2 and Figure 3 As shown, the limiting frame 44 has a first fixing bolt 6 inside, and a first nut 7 is threadedly connected to the outside of the first fixing bolt 6. A fixing plate 8 is fixedly connected to the bottom of the first fixing bolt 6, and a second anti-slip pad 9 is fixedly connected to the bottom of the fixing plate 8. The circuit board body 10 is set on the top of the first anti-slip pad 45. The position of the fixing plate 8 can be easily adjusted by the two sets of first fixing bolts 6 and first nuts 7. With the cooperation of the first anti-slip pad 45 and the second anti-slip pad 9, it is easy to fix the circuit board body 10 of different thicknesses, which enhances the anti-slip and stability effect while reducing clamping damage to the circuit board body 10. The other end of the positioning plate 42 is fixedly connected to a second fixing bolt 11, and a second nut 12 is threadedly connected to the outside of the second fixing bolt 11. The outside of the positioning plate 42 is slidably connected to the inside of the mounting frame 1. With the cooperation of the second fixing bolt 11 and the second nut 12, it is easy to fix the position of the adjusted positioning plate 42, connecting plate 43 and limiting frame 44. Through slots 13 are opened on both sides of the mounting frame 1 to facilitate the flow of heat dissipation airflow.

[0019] refer to Figure 1 and Figure 4 As shown, a cooling tank 14 is fixedly connected to the front surface of the support frame 3. The cooling tank 14 facilitates the storage of coolant. The interior of the cooling tank 14 is connected to the interior of the second support pipe 54. A water pump 15 is fixedly connected to one side of the cooling tank 14. A connecting pipe 16 is connected to the interior of the water pump 15. The interior of the connecting pipe 16 is connected to the interior of the cooling tank 14. The interior of the first support pipe 52 is connected to the interior of the water pump 15. The coolant in the cooling tank 14 is easily transported to the first support pipe 52 through the water pump 15 and the connecting pipe 16. A support 17 is fixedly connected to the bottom of the support frame 3. The support frame 3 is supported by two supports 17.

[0020] Working Principle: During use, the control positioning plate 42 slides under the support of the mounting frame 1 and, fixed by the connecting plate 43, drives the limit frame 44 to move. The distance between the two limit frames 44 is adjusted according to the size of the circuit board body 10. The connecting plate 2 is opened, and the circuit board body 10 is inserted into the inner side of the two limit frames 44 and placed on top of the first anti-slip pad 45. The two limit frames 44 support the circuit board body 10. Two sets of second fixing bolts 11 and second nuts 12 fix the two positioning plates 42 to the mounting frame 1, thereby fixing the position of the two limit frames 44 and enhancing the support stability. Two sets of first fixing bolts 6 and first nuts 7 respectively drive the two fixing plates 8 to descend, causing the fixing plates 8 to bring the second anti-slip pad 9 into contact with the top of the circuit board body 10. With the cooperation of the limit frames 44 and the first anti-slip pad 45, the circuit board body 10 is moved. The circuit board body 10 is clamped and fixed, and the control connecting plate 2 is closed. The first anti-slip pad 45 and the second anti-slip pad 9 enhance the anti-slip and stability effect while reducing clamping damage to the circuit board body 10. This facilitates the fixing of circuit board bodies 10 of different thicknesses, expanding the installation and application range. The airflow is filtered by the filter screen 51, and the three cooling fans 55 facilitate the acceleration of airflow and improve the heat dissipation uniformity. When the external temperature is high, the coolant in the cooling box 14 is transported through the connecting pipe 16 to the first support pipe 52, the U-shaped pipe 53 and the second support pipe 54, and then flows back to the cooling box 14 through the second support pipe 54, realizing the circulation of coolant. This reduces the internal temperature of the support frame 3, and the three cooling fans 55 are activated to blow the cooled air upwards, promoting better heat dissipation.

[0021] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-frequency microwave printed circuit board, comprising a mounting frame, characterized in that, Also includes: A connecting plate is disposed on the front surface of the mounting frame, and a support frame is disposed at the bottom of the mounting frame; a limiting component is disposed inside the mounting frame, the limiting component including a fixed frame fixedly connected inside the mounting frame, a positioning plate slidably connected to the inner side of the fixed frame, a connecting plate fixedly connected to one end of the positioning plate, a limiting frame fixedly connected to the front surface of the connecting plate, and a first anti-slip pad fixedly connected inside the limiting frame; a heat dissipation component is disposed inside the support frame, the heat dissipation component including a filter screen disposed inside the support frame, a first support tube fixedly connected inside the support frame, a U-shaped tube communicating with the inside of the first support tube, a second support tube communicating with the inside of the U-shaped tube, and a cooling fan disposed at the bottom of the inner cavity of the support frame.

2. The high-frequency microwave printed circuit board according to claim 1, characterized in that: The limiting frame has a first fixing bolt inside, and a first nut is threadedly connected to the outside of the first fixing bolt.

3. A high-frequency microwave printed circuit board according to claim 2, characterized in that: A fixing plate is fixedly connected to the bottom of the first fixing bolt, and a second anti-slip pad is fixedly connected to the bottom of the fixing plate.

4. The high-frequency microwave printed circuit board according to claim 1, characterized in that: The top of the first anti-slip pad is provided with a circuit board body, and the other end of the positioning plate is fixedly connected to a second fixing bolt, and the outer side of the second fixing bolt is threaded with a second nut.

5. A high-frequency microwave printed circuit board according to claim 1, characterized in that: The outer side of the positioning plate is slidably connected to the inside of the mounting frame, and through slots are provided on both sides of the mounting frame.

6. A high-frequency microwave printed circuit board according to claim 1, characterized in that: A cooling box is fixedly connected to the front surface of the support frame, and the interior of the cooling box is in communication with the interior of the second support tube.

7. A high-frequency microwave printed circuit board according to claim 6, characterized in that: A water pump is fixedly connected to one side of the cooling tank, and a connecting pipe is connected inside the water pump, with the inside of the connecting pipe connected to the inside of the cooling tank.

8. A high-frequency microwave printed circuit board according to claim 1, characterized in that: The interior of the first support pipe is connected to the interior of the water pump, and a support is fixedly connected to the bottom of the support frame.

Citation Information

Patent Citations

  • High-frequency microwave printed high-density HDI circuit board

    CN219019108U