VC module with high heat dissipation efficiency

Abstract

The application discloses a VC module with high heat dissipation efficiency, which comprises a lower bottom bin, a fixing plate is arranged correspondingly on the lower bottom bin, the lower bottom bin is a concave cavity, a supporting column and a capillary structure assembly are arranged in the concave cavity, and a detection plate setting plate is arranged on one side of the lower bottom bin. The application realizes an efficient evaporation-condensation heat conduction process through the circulation of liquid driven by a capillary core. The capillary structure assembly has strong capillary force and liquid backflow capacity, greatly improves the heat conduction speed, and relies on the capillary structure to drive the circulation of liquid without depending on a pump or other external power source. The application has low energy consumption and low noise, has higher energy efficiency ratio and lower environmental impact compared with a traditional air cooling / liquid cooling system, the surface of the lower bottom bin is provided with microstructures to enhance wettability and capillary action, the condensate backflow efficiency is further improved, and the overall heat dissipation performance is improved. The concave cavity of the lower bottom bin provides stable mounting space for the supporting column and the capillary structure.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to a high-efficiency heat dissipation VC module. Background Technology

[0002] As electronic devices evolve towards higher performance and greater integration, chip power consumption and heat flux density have increased significantly. Traditional air cooling or metal heat sinks are no longer sufficient to meet the ever-growing heat dissipation demands. Therefore, vapor chambers (VCs), as efficient heat dissipation components based on the principle of phase change heat transfer, have been widely used in high-power-density electronic devices.

[0003] In existing technologies, such as the "finned heat sink" patent with publication number CN202496165U, the structure mainly consists of a solid component composed of an aluminum substrate and a counterweight. Heat is transferred to the fins through the aluminum substrate, and then the fins dissipate heat through convection. Although this structure achieves basic heat conduction, the overall heat dissipation efficiency is low because the aluminum substrate only conducts heat and lacks an internal circulation mechanism. In addition, the solid component composed of the aluminum substrate and the counterweight is relatively heavy, which is not conducive to lightweight and thin design, and the uneven heat distribution easily forms local hot spots, affecting the stability and lifespan of the equipment. Summary of the Invention

[0004] The technical problem to be solved by this application is to overcome the existing defects and provide a VC module with high-efficiency heat dissipation, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, this application provides the following technical solution: a high-efficiency heat dissipation VC module, including a lower compartment, a fixing plate correspondingly disposed in the lower compartment, the lower compartment being a concave cavity for placing support columns and capillary structure components, a detection plate mounting plate disposed on one side of the lower compartment, a guide groove for placing test tubes disposed on the detection plate mounting plate, a pressure plate corresponding to the detection plate mounting plate disposed on the fixing plate, and a heat-conducting plate matrix group on the fixing plate.

[0006] As a preferred technical solution of this application, the heat-conducting plate matrix group includes a plurality of uniformly distributed heat-conducting plates, and the heat-conducting plates are fixedly connected to the fixing plate by welding or bonding.

[0007] As a preferred technical solution of this application, the number of heat-conducting plates in the heat-conducting plate matrix group is 4-16, the thickness of the heat-conducting plates is 0.5-2mm, and the spacing between the heat-conducting plates is 2-10mm.

[0008] As a preferred technical solution of this application, the support column is disposed at the bottom of the concave cavity of the lower compartment and is fixedly connected to the lower compartment. There are multiple support columns, which are symmetrically distributed along the inner wall of the concave cavity.

[0009] As a preferred technical solution of this application, the capillary structure component includes a capillary core and a liquid-absorbing core, wherein the capillary core is disposed inside the liquid-absorbing core and the capillary core is made of a porous metal material.

[0010] As a preferred technical solution of this application, the porous metal material is sintered copper powder, foamed copper or metal mesh structure, with a porosity of 60%-80%.

[0011] As a preferred technical solution of this application, the lower compartment is made of a metal material with a high thermal conductivity, wherein the metal material is copper, aluminum or their alloy.

[0012] As a preferred technical solution of this application, the thickness of the lower compartment is 1-3mm.

[0013] Compared with the prior art, the beneficial effects of this application are as follows: This application achieves a highly efficient evaporation-condensation heat transfer process by driving liquid circulation through a capillary wick. The capillary structure component has strong capillary force and liquid reflux capability, which greatly improves the heat transfer speed. Relying on the capillary structure to drive liquid circulation, it does not depend on pumps or other external power sources, resulting in low energy consumption and low noise. Compared with traditional air-cooled / liquid-cooled systems, it has a higher energy efficiency ratio and lower environmental impact. The microstructure set on the surface of the lower chamber enhances wettability and capillary action, further accelerating the condensate reflux efficiency and improving the overall heat dissipation performance. The lower chamber adopts a concave cavity to provide a stable installation space for the support column and capillary structure. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this application. Figure 1 ; Figure 2 This is a schematic diagram of the structure of this application. Figure 2 ; Figure 3 This is the main view of this application; Figure 4 This is a schematic diagram of the lower storage structure.

[0015] In the diagram: 1 Heat conduction plate matrix group, 2 Detection plate mounting plate, 3 Lower bottom chamber, 4 Fixing plate, 5 Pressure cover plate, 6 Support column. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application (for ease of description and understanding, hereinafter referred to as...), Figure 3(The above is described above). All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0017] Please see Figure 1-4 This application provides a technical solution: a high-efficiency heat dissipation VC module, including a lower compartment 3, wherein a fixing plate 4 is correspondingly provided on the lower compartment 3.

[0018] The lower compartment 3 has a concave structure, that is, the middle is recessed to form a receiving space, and the bottom and side walls of the concave cavity form a semi-enclosed space for installing the support column 6.

[0019] Specifically, the support column 6 is located at the bottom of the concave cavity of the lower bottom compartment 3 and is fixedly connected to the lower bottom compartment 3. There are multiple support columns 6, which are symmetrically distributed along the inner wall of the concave cavity.

[0020] More specifically, the support columns 6 are installed at the bottom of the concave cavity of the lower compartment 3; they are fixedly connected to the lower compartment 3 by welding, bonding or integral molding, etc., and there are multiple of them, usually more than four, and the layout is symmetrically distributed along the inner wall of the concave cavity, such as rectangular, circular or regular polygonal arrangement.

[0021] To prevent deformation or collapse of the upper and lower plates inside the VC module due to steam pressure or external load, maintain the stability of the internal structure of the cavity, ensure unobstructed steam flow path, provide a support platform for the capillary core and liquid suction core, and prevent displacement or compression during assembly or operation, some heat can be directly conducted to the lower chamber 3 through the support column 6, improving the overall heat dissipation efficiency; it also strengthens the module as a whole, improves its pressure resistance and bending resistance, and is especially suitable for thin and light equipment.

[0022] The cavity is also equipped with capillary structure components.

[0023] The capillary structure component includes a capillary core and a liquid-absorbing core, wherein the capillary core is disposed inside the liquid-absorbing core and is made of a porous metal material.

[0024] More specifically, the capillary structure component is the core functional component in the heat dissipation module that enables liquid circulation and return. The capillary core is nested inside the liquid-absorbing core and has a mesh, columnar, or porous structure with a large number of micropores. It is usually manufactured using a sintering molding process to ensure structural stability and capillary force consistency. It is located outside the capillary core and constitutes the main body of the entire capillary structure component. It is usually made of porous material or fabric structure and has a large liquid storage space. It can cover the bottom of the VC cavity or wrap the capillary core to form a composite structure.

[0025] More specifically, the porous metal material is sintered copper powder, copper foam, or a metal mesh structure with a porosity of 60%-80%.

[0026] A test plate mounting plate 2 is provided on one side of the lower compartment 3. The test plate mounting plate 2 is provided with a guide groove for placing test tubes. The fixing plate 4 is provided with a pressure cover plate corresponding to the test plate mounting plate 2.

[0027] The test plate mounting plate 2 is a structure extending from the edge of the lower chamber 3. It is usually located on one side of the VC module and has a linear guide groove structure on its surface to accommodate the test tube and provide an interface area for testing. This facilitates real-time monitoring of the internal pressure parameters. The pressure plate is set on the fixing plate 4 and corresponds to the position of the test plate mounting plate 2 in the lower chamber 3. After assembly, the test plate mounting plate 2 is pressed and fixed to ensure that it will not loosen. This protects the test tube in the guide groove and enhances the structural stability and sealing of the entire VC module.

[0028] The heat-conducting plate matrix group 1 is located on the fixed plate 4.

[0029] Specifically, the heat-conducting plate matrix group 1 includes multiple uniformly distributed heat-conducting plates, and the heat-conducting plates are fixedly connected to the fixing plate 4 by welding or bonding.

[0030] More specifically, the number of heat-conducting plates in the heat-conducting plate matrix group 1 is 4-16, the thickness of the heat-conducting plates is 0.5-2mm, and the spacing between the heat-conducting plates is 2-10mm.

[0031] Furthermore, the lower chamber 3 is made of a metal material with high thermal conductivity, such as copper, aluminum, or their alloys.

[0032] Furthermore, the thickness of the lower chamber 3 is 1-3 mm, and the surface is provided with microstructures to enhance capillary action.

[0033] The inner surface of the lower compartment 3 is processed at the microscale to form grooves, protrusions, honeycomb textures or other regular / irregular surface structures, which can be manufactured by etching, laser processing, electrochemical deposition, imprinting and other methods.

[0034] It enhances capillary action, increases the contact area between the liquid and the surface, improves the capillary wick's ability to absorb and reflux condensate, enhances the surface's hydrophilicity, makes the working liquid easier to adhere and flow, accelerates the liquid replenishment rate during evaporation and condensation, improves overall heat transfer efficiency, provides a basis for the bonding of capillary wicks or wicks, and enhances assembly stability.

[0035] In use: The lower chamber 3 is made of a high thermal conductivity metal material (such as copper or aluminum) with a thickness of 1-3mm; the surface is formed with microstructures (such as grooves, honeycomb textures, etc.) through etching, laser processing, etc., to enhance capillary action. The middle part is designed as a concave cavity structure to accommodate the support columns 6 and capillary structure components. According to design requirements, multiple support columns 6 are arranged at the bottom of the concave cavity, and the support columns 6 are symmetrically distributed; the support columns 6 are firmly fixed to the lower chamber 3 by welding, bonding, or integral molding; the support columns 6 play the roles of structural support, space maintenance, heat transfer assistance, and enhancing compressive strength. The microstructure surface is laid and adhered to the lower chamber 3. The microstructure enhances wettability and liquid reflux efficiency, improving overall heat transfer performance. The test tube is placed in the groove in the lower chamber 3. The test plate mounting plate 2 extending from the lower chamber 3 corresponds to the pressure plate on the fixing plate 4. The fixing plate 4 is welded to the lower chamber 3. At this time, liquid is injected into it through the test tube for testing. After the requirements are met, the tongue plate and pressure plate are cut off and resealed to form a complete VC module. The heat conduction plate is fixed to the fixing plate 4 by welding or bonding. The heat conduction plate expands the heat dissipation area and improves the heat dissipation effect.

[0036] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation VC module, characterized in that: Includes a lower chamber (3), the lower chamber (3) is provided with a fixed plate (4), the lower chamber (3) is a cavity, the cavity is used to place the support column (6) and capillary structure components, a detection plate mounting plate (2) is provided on one side of the lower chamber (3), the detection plate mounting plate (2) is provided with a guide groove for placing the test tube, the fixed plate (4) is provided with a pressure plate (5) corresponding to the detection plate mounting plate (2), and a heat-conducting plate matrix group (1) is provided on the fixed plate (4).

2. The high-efficiency heat dissipation VC module according to claim 1, characterized in that: The heat-conducting plate matrix group (1) includes multiple uniformly distributed heat-conducting plates, and the heat-conducting plates are fixedly connected to the fixing plate (4) by welding or bonding.

3. The high-efficiency heat dissipation VC module according to claim 2, characterized in that: The number of heat-conducting plates in the heat-conducting plate matrix group (1) is 4-16, the thickness of the heat-conducting plates is 0.5-2mm, and the spacing between the heat-conducting plates is 2-10mm.

4. The high-efficiency heat dissipation VC module according to claim 1, characterized in that: The support column (6) is set at the bottom of the cavity of the lower bottom chamber (3) and is fixedly connected to the lower bottom chamber (3). There are multiple support columns (6) and they are symmetrically distributed along the inner wall of the cavity.

5. The high-efficiency heat dissipation VC module according to claim 1, characterized in that: The capillary structure assembly includes a capillary core and a liquid-absorbing core, wherein the capillary core is disposed inside the liquid-absorbing core and is made of a porous metal material.

6. The high-efficiency heat dissipation VC module according to claim 5, characterized in that: The porous metal material is sintered copper powder, copper foam, or a metal mesh structure, with a porosity of 60%-80%.

7. The high-efficiency heat dissipation VC module according to claim 1, characterized in that: The lower chamber (3) is made of a metal material with high thermal conductivity, namely copper, aluminum or their alloys.

8. A high-efficiency heat dissipation VC module according to claim 1 or 7, characterized in that: The thickness of the lower compartment (3) is 1-3 mm.

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