Automotive controller and vehicle

Abstract

The application discloses an automobile controller and a vehicle, and belongs to the technical field of vehicles. The automobile controller comprises a shell, a power module and a liquid cooling module; the power module is installed in the shell; the liquid cooling module comprises a body, a heat conduction part and a flow guide plate; the body is installed in the shell, and the body is provided with a flow channel; the heat conduction part is arranged on the outer surface of the body and is in heat conduction connection with the power module; and the flow guide plate is arranged in the flow channel and is connected to one side of the body away from the heat conduction part. According to the application, the body of the liquid cooling module is arranged in the shell, so that the overall volume of the automobile controller is reduced; and the flow guide plate arranged in the flow channel can make the cooling liquid in the flow channel be more evenly distributed, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more particularly to an automobile controller and a vehicle. Background Technology

[0002] With the development of automotive intelligence, there are more and more intelligent control modules in cars, and more and more computing chips in these modules. These high-power computing chips generate more and more heat, requiring adequate heat dissipation. Therefore, automotive controllers with excellent heat dissipation performance have become an urgent need. Utility Model Content

[0003] This application provides an automobile controller and vehicle to at least partially solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, an automotive controller is provided, including a housing, a power module, and a liquid cooling module; the power module is installed inside the housing; the liquid cooling module includes a body, a heat-conducting part, and a guide plate; the body is installed inside the housing and has a flow channel; the heat-conducting part is disposed on the outer surface of the body and is thermally connected to the power module; the guide plate is disposed inside the flow channel and connected to the side of the body away from the heat-conducting part.

[0005] According to a second aspect of this application, a vehicle is provided, including the vehicle controller described above.

[0006] In the vehicle controller of this application embodiment, by placing the body of the liquid cooling module inside the housing, the heat dissipation effect of the vehicle controller is better, and by using the guide plate provided in the flow channel, the coolant in the flow channel can be distributed more evenly, thereby increasing the heat dissipation effect.

[0007] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0009] Figure 1 This is an overall schematic diagram of the vehicle controller in this application; Figure 2 This is an installation diagram of this application; Figure 3 This is a schematic diagram of the liquid cooling module in this application; Figure 4 This is a schematic diagram of the ontology in this application; Figure 5 This is a schematic diagram of the carrier plate in this application; Figure 6 This is a schematic diagram of the main cover plate in this application; Figure 7 This is a schematic diagram of the side cover in this application; Figure 8 This is a schematic diagram of the connection hole in this application.

[0010] Explanation of reference numerals in the attached figures: 1. Shell; 11. Support plate; 111. Wiring groove; 112. Reinforcing rib; 113. Supporting heat dissipation part; 12. Main cover plate; 121. First groove; 13. Side cover plate; 131. Second groove; 14. Connecting hole; 2. Power module; 3. Liquid cooling module; 31. Body; 311. Flow channel; 312. Bottom plate; 313. Side wall; 3131. Step groove; 3132. First guide surface; 3133. Third guide surface; 3134. Fourth guide surface; 3135. Transition guide surface; 314. Cover plate; 315. First connecting part; 316. Second connecting part; 32. Heat conducting part; 33. Guide plate; 331. Second guide surface; 34. Liquid inlet; 35. Liquid outlet; 4. Circuit module. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0012] In the current technological context, with the rapid development of automotive intelligence, the number of integrated intelligent control modules in automobiles has increased significantly, and the number of embedded computing chips in these modules is also increasing. High-power computing chips, in particular, generate significantly more heat due to their high-efficiency operation, making heat dissipation increasingly crucial. To meet this demand, the cooling system not only needs to have excellent heat dissipation performance but also must excel in terms of size, weight, and cost—that is, achieving small size, light weight, and low cost.

[0013] One common approach to existing heat dissipation solutions is to use small fans to cool high-power computing chips. However, this fan-based cooling method offers relatively limited overall cooling performance and is accompanied by significant noise, making it difficult to meet the requirements for high efficiency and quiet operation. Another approach is to employ a large, encapsulated liquid cooling plate structure. This design integrates the liquid cooling structure with the casing, top cover, and other components through integral molding. While it provides excellent heat dissipation performance, its overall structure is complex, resulting in a large product size, increased weight, and higher manufacturing costs. Therefore, this solution is unsuitable for space-constrained environments requiring embedded structures.

[0014] To address these challenges, developing innovative heat dissipation technologies has become crucial. These new technologies need to reduce noise while maintaining superior heat dissipation performance, and achieve lightweight and low-cost manufacturing within a compact space to meet the diverse needs of modern automotive intelligent control modules. Through continuous technological innovation and optimized design, more competitive solutions can be provided, driving the automotive industry towards a more efficient and intelligent future.

[0015] In view of this, please refer to Figure 1 This application provides an automotive controller designed to overcome at least one of the aforementioned technical problems.

[0016] Please see Figure 2 and Figure 3 The automotive controller includes a housing 1, a power module 2, and a liquid-cooled module 3, with the power module 2 installed within the housing 1. (See also...) Figure 4 The liquid cooling module 3 includes a body 31, a heat-conducting part 32, and a guide plate 33. The body 31 is installed inside the housing 1 and has a flow channel 311. The heat-conducting part 32 is disposed on the outer surface of the body 31 and is thermally connected to the power module 2. To enhance the heat conduction effect, a heat-conducting medium, such as thermal grease or a phase change plate, can be placed between the heat-conducting part 32 and the power module 2. The guide plate 33 is disposed in the flow channel 311 and connected to the side of the body 31 away from the heat-conducting part 32. The guide plate 33 is used to divide and guide the coolant in this section of the flow channel 311, thereby enhancing the heat dissipation effect. By placing the guide plate 33 on the side of the body 31 away from the heat-conducting part 32, the heat dissipation path is shorter, which can further enhance the heat dissipation effect. The guide plate 33 can also play a similar heat dissipation role as a heat sink fin. In other embodiments, the guide plate 33 can also be placed in other positions within the flow channel 311 according to actual needs, but the heat dissipation effect will be slightly worse.

[0017] The automotive controller in this embodiment achieves better heat dissipation by housing the liquid cooling module 3 body 31 inside the housing 1. This compact design not only saves space but also enhances installation flexibility. Furthermore, the carefully designed guide vanes 33 within the internal flow channels 311 effectively guide the coolant to flow evenly, significantly improving heat dissipation. Overall, this design greatly improves the thermal management performance of the automotive controller, ensuring its stability and efficiency under high loads.

[0018] Please see Figure 4 In some embodiments, the body 31 includes a base plate 312, a side wall 313, and a cover plate 314. A heat-conducting part 32 and a flow guide plate 33 are connected to both sides of the base plate 312. The side wall 313 is connected to the base plate 312, and the cover plate 314 is mounted on the side wall 313, constraining the flow channel 311 with the base plate 312 and the side wall 313. This structure allows for a smaller body 31, making it more suitable for embedded heat dissipation structures, and simplifies manufacturing.

[0019] Please see Figure 4 In some embodiments, a stepped groove 3131 is provided on the side of the sidewall 313 away from the bottom plate 312, and a cover plate 314 is disposed in the stepped groove 3131 and connected to the sidewall 313 to cover the flow channel 311, thereby achieving high installation positioning accuracy of the cover plate 314. Of course, in other embodiments, other forms of installation structures can also be provided, such as placing a guide plate 33 on the cover plate 314, or placing a guide plate 33 on both the bottom plate 312 and the cover plate 314.

[0020] Please see Figure 2 In some embodiments, the sidewall 313 and the base plate 312 are an integral structure, eliminating the possibility of leakage between the sidewall 313 and the base plate 312. The cover plate 314 is installed on the sidewall 313 by friction stir welding. The friction stir welding process also eliminates the possibility of leakage between the sidewall 313 and the cover plate 314. The choice of friction stir welding process takes into account both the processing difficulty and the connection reliability.

[0021] Please see Figure 4 In some embodiments, the liquid cooling module 3 further includes an inlet 34 and an outlet 35. The sidewall 313 has a first guide surface 3132, and the guide plate 33 has a second guide surface 331. Both the first guide surface 3132 and the second guide surface 331 extend toward the outlet 35. The guide plate 33 is provided on the bottom plate 312 away from the heat-conducting part 32, so that the volume of this section of the flow channel 311 can be made larger, increasing the heat conduction efficiency. Through the guiding effect of the first guide surface 3132 and the second guide surface 331 on the coolant, the coolant in this section of the flow channel 311 can flow more smoothly toward the outlet 35, preventing dead zones with low coolant flow rates and improving the heat conduction effect.

[0022] Please see Figure 4 In some embodiments, the liquid cooling module 3 includes multiple guide plates 33, which are spaced apart and connected to the base plate 312 to further increase the diversion of coolant, resulting in better heat conduction. The metal guide plates 33 can also play a similar heat conduction role as heat dissipation fins, further increasing the heat dissipation effect.

[0023] Please see Figure 4 In some embodiments, the sidewall 313 further includes a third guide surface 3133, a fourth guide surface 3134, and a transition guide surface 3135, with the third guide surface 3133 and the fourth guide surface 3134 arranged opposite to each other. The third guide surface 3133 extends toward the first guide surface 3132, and the transition guide surface 3135 connects the first guide surface 3132 and the third guide surface 3133. At least a portion of the fourth guide surface 3134 extends toward the transition guide surface 3135. The third guide surface 3133 and the fourth guide surface 3134 may be positioned at the liquid inlet 34, allowing the coolant to flow directly to the section of the flow channel 311 with the guide plate 33, which plays a major heat dissipation role, thereby increasing the heat dissipation effect. The fourth guide surface 3134 may be partially extended toward the guide plate 33, enhancing the flow diversion effect of the guide plate 33.

[0024] Please see Figure 3 In some embodiments, the power module 2 is equipped with a computing chip, and the shape of the heat-conducting part 32 is adapted to the computing chip, with the heat-conducting part 32 and the computing chip being thermally connected. The liquid cooling module 3 is made of a metal with good thermal conductivity, such as copper or aluminum. The shape of the heat-conducting part 32 is set to be adapted to the computing chip, so that the heat generated by the computing chip can be directly conducted to the heat-conducting part 32 and then carried away by the coolant. Optionally, the height of the heat-conducting part 32 can be determined according to the mounting distance between the computing chip and the base plate 312, and the thickness of the heat-conducting medium needs to be reserved so that computing chips of different thicknesses can have good contact with the heat-conducting part 32 and obtain a better heat dissipation effect.

[0025] Please see Figure 3 In some embodiments, a circuit module 4 is also included. The circuit module 4 is installed inside the housing 1 and is electrically connected to the power module 2. Specifically, both the power module 2 and the circuit module 4 are circuit boards. The computing chip, which generates more heat, is placed on the power module 2, while other circuits, which generate less heat, are placed on the circuit module 4. Compared to a single circuit board, the separate circuit boards can reduce the overall size of the vehicle controller and are suitable for heat dissipation of high-power computing chips in small spaces.

[0026] Please see Figure 2 , Figure 3In some embodiments, the main body 31 is provided with a first connecting part 315, which is connected to the circuit module 4, so that the size of the split circuit board in the thickness direction of the car controller is smaller, which can effectively reduce the overall volume of the car controller.

[0027] Please see Figure 5 In some embodiments, the housing 1 includes a support plate 11. The support plate 11 has a wiring groove 111 on the side facing the power module 2. The support plate 11 includes several reinforcing ribs 112, some of which are used to form the wiring groove 111. Some of the cables used to connect the power module 2 can be laid in the wiring groove 111, and the reinforcing ribs 112 can make the support plate 11 stronger, making it easier to install the vehicle controller on the vehicle through the support plate 11.

[0028] Please see Figure 2 In some embodiments, the main body 31 is provided with a second connecting part 316, which is connected to the power module 2, and the power module 2 is connected to the support plate 11. The power module 2 and the liquid cooling module 3 can be connected to the support plate 11, which has a higher strength, making the connection more stable.

[0029] Please see Figure 5 In some embodiments, the support plate 11 is provided with a heat dissipation section 113, which is thermally connected to the computing chip on the power module 2. Computing chips can be arranged on both sides of the power module 2. On the side of the power module 2 closer to the liquid cooling module 3, computing chips with higher heat generation can be arranged, and the active cooling of the liquid cooling module 3 will dissipate heat from these chips. On the side of the power module 2 closer to the support plate 11, computing chips with lower heat generation can be arranged, and the heat dissipation section 113 on the support plate 11 will passively dissipate heat from these chips. Of course, a corresponding thermally conductive medium can also be provided between the heat dissipation section 113 and the computing chip on the power module 2. The support plate 11 can be made of a material with good heat dissipation, such as copper, aluminum, or a composite material made of substrates such as polyphenylene sulfide, polyamide, polycarbonate, polypropylene, polyphthalamide, polyetheretherketone, etc., and fillers such as aluminum nitride, silicon carbide, alumina, graphite, fibrous high thermal conductivity carbon powder, and flake high thermal conductivity carbon powder.

[0030] Please see Figure 6 , Figure 7 In some embodiments, the housing 1 includes a main cover plate 12 and a side cover plate 13. The main cover plate 12 has two first grooves 121 adapted to the outer contours of the liquid inlet 34 and the liquid outlet 35, and the side cover plate 13 has two second grooves 131 adapted to the outer contours of the liquid inlet 34 and the liquid outlet 35. Please refer to [link to relevant documentation]. Figure 8The side cover plate 13 is installed on the main cover plate 12 so that the first groove 121 and the second groove 131 cooperate to constrain the connecting hole 14. The connecting hole 14 is adapted to the liquid inlet 34 or the liquid outlet 35, which facilitates the installation of the liquid inlet 34 and the liquid outlet 35. In other embodiments, the side cover plate 13 can also connect the main cover plate 12 and the support plate 11 at the same time.

[0031] Accordingly, this application also provides a vehicle, including the vehicle controller described in the above embodiments.

[0032] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0034] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0035] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A car controller, characterized in that, include: Shell (1); The power module (2) is installed inside the housing (1); Liquid cooling module (3), including: The body (31) is installed inside the housing (1), and the body (31) has a flow channel (311); A heat-conducting part (32) is disposed on the outer surface of the body (31), and the heat-conducting part (32) is thermally connected to the power module (2); A guide plate (33) is disposed in the flow channel (311) and connected to the side of the body (31) away from the heat-conducting part (32).

2. The vehicle controller according to claim 1, characterized in that, The body (31) includes: The base plate (312) has the heat-conducting part (32) and the flow guide plate (33) connected to both sides of the base plate (312); Sidewall (313), connected to the base plate (312); A cover plate (314) is mounted on the side wall (313) and constrains the flow channel (311) together with the bottom plate (312) and the side wall (313).

3. The vehicle controller according to claim 2, characterized in that, The sidewall (313) away from the bottom plate (312) has a stepped groove (3131), and the cover plate (314) is disposed in the stepped groove (3131) and connected to the sidewall (313) to cover the flow channel (311).

4. The vehicle controller according to claim 3, characterized in that, The side wall (313) and the bottom plate (312) are an integral structure; the cover plate (314) is installed on the side wall (313) by friction stir welding.

5. The vehicle controller according to claim 2, characterized in that, The liquid cooling module (3) further includes a liquid inlet (34) and a liquid outlet (35). The side wall (313) has a first flow guide surface (3132), and the flow guide plate (33) has a second flow guide surface (331). Both the first flow guide surface (3132) and the second flow guide surface (331) extend toward the liquid outlet (35).

6. The vehicle controller according to claim 5, characterized in that, The liquid cooling module (3) includes a plurality of guide plates (33), which are spaced apart and are all connected to the base plate (312).

7. The vehicle controller according to claim 5, characterized in that, The sidewall (313) also has a third flow guide surface (3133), a fourth flow guide surface (3134) and a transition flow guide surface (3135), wherein the third flow guide surface (3133) and the fourth flow guide surface (3134) are disposed opposite to each other; the third flow guide surface (3133) extends toward the first flow guide surface (3132), and the transition flow guide surface (3135) connects the first flow guide surface (3132) and the third flow guide surface (3133), and at least a portion of the fourth flow guide surface (3134) extends toward the transition flow guide surface (3135).

8. The vehicle controller according to claim 1, characterized in that, The power module (2) is equipped with a computing chip, and the shape of the heat-conducting part (32) is adapted to the computing chip. The heat-conducting part (32) and the computing chip are thermally connected.

9. The vehicle controller according to claim 8, characterized in that, It also includes a circuit module (4), which is installed inside the housing (1) and is electrically connected to the power module (2).

10. The vehicle controller according to claim 9, characterized in that, The main body (31) is provided with a first connecting part (315), which is connected to the circuit module (4).

11. The vehicle controller according to claim 1, characterized in that, The housing (1) includes a support plate (11), and the support plate (11) has a wiring groove (111) on the side facing the power module (2). The support plate (11) includes a plurality of reinforcing ribs (112), and some of the reinforcing ribs (112) are used to form the wiring groove (111).

12. The vehicle controller according to claim 11, characterized in that, The main body (31) is provided with a second connecting part (316), the second connecting part (316) is connected to the power module (2), and the power module (2) is connected to the carrier plate (11).

13. The vehicle controller according to claim 11, characterized in that, The support plate (11) is provided with a heat dissipation part (113), which is thermally connected to the computing chip on the power module (2).

14. The vehicle controller according to claim 5, characterized in that, The housing (1) includes: The main cover plate (12) is provided with two first grooves (121) that are adapted to the outer contours of the liquid inlet (34) and the liquid outlet (35); The side cover plate (13) is provided with two second grooves (131) that are adapted to the outer contours of the liquid inlet (34) and the liquid outlet (35); The side cover plate (13) is installed on the main cover plate (12) so that the first groove (121) and the second groove (131) cooperate to constrain the connecting hole (14), which is adapted to the liquid inlet (34) or the liquid outlet (35).

15. A vehicle, characterized in that, Including the vehicle controller as described in any one of claims 1 to 14.

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