Power supply device and electric appliance
Patent Information
- Application Number
- CN202521944729.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-10
AI Technical Summary
对于风冷散热方式，外界粉尘易于经进出风口进入电源壳体内部导致元器件故障，而对于水冷的散热方式，需增设水冷管路和液体驱动装置，导致成本大大增加
[0014]本申请实施例的有益效果是：本申请实施例提供的电源装置，顶壳设有容纳槽，电路板上作为主要发热器件的第一功率器件设于容纳槽，底盖封盖所述容纳槽，并且在所述电路板与所述顶壳和所述底盖之间的间隙填充有导热材料，导热材料起到将容纳槽内元器件的热量传递至顶壳的作用，还有利于阻止外界粉尘与容纳槽的元器件接触。进一步的，顶壳设置散热鳍片，用于对顶壳进行散热，且散热鳍片分布于第一侧壁、顶壁和第二侧壁，散热鳍片的表面积较大，有利于进一步提高散热效果。本申请实施例提供的电源装置，相较于传统的电源装置的风冷式和水冷式的散热方案，在满足散热需求的同时，成本较低，且有利于减少外界粉尘进入壳体内部导致元器件故障的问题。
Smart Images
Figure CN224844438U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power supply technology, and in particular to a power supply device and electrical equipment. Background Technology
[0002] With the development of technology, the demand for power supplies is increasing, but power supply cooling has always been a critical issue in power supply design. Excessive heat can affect the lifespan and operating efficiency of the power supply. Currently, DC-DC (direct-to-direct-current) power supplies mainly employ two cooling methods: one is air cooling through air inlets and outlets on the power supply casing, and the other is adding water cooling channels to dissipate heat from the power supply casing. For air cooling, external dust can easily enter the power supply casing through the air inlets and outlets, causing component failure. For water cooling, additional water cooling pipes and liquid drive devices are required, significantly increasing costs. Utility Model Content
[0003] In view of the problems existing in the background art, the purpose of this application is to provide a power supply device and electrical equipment that overcomes or at least partially solves the above problems.
[0004] According to a first aspect of this application, a power supply device is provided, including a bottom cover, a circuit board, a top shell, and a thermally conductive material. The circuit board is equipped with a first power device. The top shell has a receiving groove for accommodating the circuit board, and the top shell is connected to the bottom cover, such that the bottom cover seals the receiving groove. The thermally conductive material fills the gap between the circuit board and the top shell and the bottom cover. The top shell includes a top wall, a first side wall, and a second side wall. Along a first direction, the first and second side walls are disposed opposite each other. Along a second direction, the first and second side walls are located between the top wall and the bottom cover. The surface of the top shell facing away from the receiving groove is provided with heat dissipation fins. The heat dissipation fins are located on the first side wall, the top wall, and the second side wall. There are multiple heat dissipation fins, which are arranged sequentially and at intervals along a third direction. The first direction, the second direction, and the third direction are mutually perpendicular.
[0005] In one or more of the above optional embodiments, the thickness of the heat dissipation fins gradually decreases along the direction from the bottom cover to the top wall.
[0006] In one or more of the above optional embodiments, along the direction from the bottom cover to the top wall, the thickness of the starting end of the heat dissipation fins on the top wall is d1, and the thickness of the ending end of the heat dissipation fins on the top wall is d2, where 0.5≤d2 / d1≤0.7.
[0007] In one or more of the above optional embodiments, the power supply device includes a first heat sink, a first sidewall including a first portion and a second portion connected together, the thickness of the first portion being greater than the thickness of the second portion, the first heat sink abutting the surface of the first portion located in the receiving groove, and the housing of the first power device abutting the surface of the first heat sink facing away from the first portion; and / or, the circuit board is provided with a second power device, the power supply device includes a second heat sink, a second sidewall including a third portion and a fourth portion connected together, the thickness of the third portion being greater than the thickness of the fourth portion, the second heat sink abutting the surface of the third portion located in the receiving groove, and the housing of the second power device abutting the surface of the second heat sink facing away from the third portion.
[0008] In one or more of the above optional embodiments, a thermally conductive layer is provided between the first power device and the first heat sink, and the thermally conductive layer is made of a thermal interface material; and / or a thermally conductive layer is provided between the second power device and the second heat sink, and the thermally conductive layer is made of a thermal interface material.
[0009] In one or more of the above optional embodiments, the circuit board is disposed opposite to the top wall along the direction from the bottom cover to the top wall, and the power supply device includes an inductor and a transformer. The first power device, the second power device, the inductor and the transformer are disposed on the side of the circuit board facing away from the top wall.
[0010] In one or more of the above optional embodiments, the top shell includes a third sidewall and a fourth sidewall disposed opposite to each other along a third direction. The third sidewall and the fourth sidewall are connected between the top wall and the bottom cover. The third sidewall is provided with a mounting hole that extends through in a second direction. The power supply device also includes a sealing plug and a connecting cable. The sealing plug is disposed in the mounting hole and has a wire through hole. A sealing layer is provided in the wire through hole. Along the axial direction of the mounting hole, the thickness of the sealing layer is less than the depth of the mounting hole. The sealing layer is made of a flexible material, and the connecting cable passes through the sealing layer.
[0011] In one or more of the above optional embodiments, the sealing plug is provided with a mounting groove, the mounting groove is disposed around the sealing plug, and the periphery of the mounting hole is engaged in the mounting groove.
[0012] In one or more of the above optional embodiments, the bottom cover surface facing the circuit board is provided with conductive foam; and / or the top cover surface is covered with a ceramic layer.
[0013] According to a second aspect of this application, an electrical appliance is provided, including the power supply device described above.
[0014] The beneficial effects of this application embodiment are as follows: The power supply device provided in this application embodiment has a receiving groove in the top shell, a first power device, which is the main heat-generating component on the circuit board, is located in the receiving groove, the receiving groove is sealed by the bottom cover, and the gap between the circuit board and the top shell and the bottom cover is filled with a thermally conductive material. The thermally conductive material plays a role in transferring the heat of the components in the receiving groove to the top shell, and also helps to prevent external dust from contacting the components in the receiving groove. Furthermore, the top shell is provided with heat dissipation fins for heat dissipation of the top shell, and the heat dissipation fins are distributed on the first side wall, the top wall and the second side wall. The heat dissipation fins have a large surface area, which helps to further improve the heat dissipation effect. Compared with the traditional air-cooled and water-cooled heat dissipation solutions of power supplies, the power supply device provided in this application embodiment meets the heat dissipation requirements while having a lower cost, and helps to reduce the problem of external dust entering the shell and causing component failure. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0016] Figure 1 A perspective view of a power supply device provided in an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of a power supply device provided in an embodiment of this application; Figure 3 An exploded view of a power supply device provided in an embodiment of this application; Figure 4 A schematic diagram of a power supply device provided in an embodiment of this application when viewed in a direction opposite to the first direction; Figure 5 for Figure 4 A cross-sectional view of section AA with the thermally conductive material hidden in the middle; Figure 6 for Figure 4 A cross-sectional view of the BB section after the thermally conductive material is hidden. Figure 7 A schematic diagram of the sealing plug of a power supply device as viewed along a third direction, provided in an embodiment of this application; Figure 8 for Figure 7 A cross-sectional view at point CC. Detailed Implementation
[0017] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "inner," and similar expressions used in this specification are for illustrative purposes only.
[0018] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0019] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0020] Please see Figures 1-3 The power supply device 1000 includes a top shell 1, a bottom cover 2, a circuit board 3, and a thermally conductive material M. The circuit board 3 is equipped with a first power device 5. The top shell 1 has a receiving groove a that accommodates the circuit board 3. The top shell 1 is connected to the bottom cover 2, which seals the receiving groove a. The thermally conductive material M fills the gap between the circuit board 3 and the top shell 1 and the bottom cover 2. The top shell 1 includes a top wall 12, a first side wall 13, and a second side wall 14. Along a first direction X, the first side wall 13 and the second side wall 14 are arranged opposite each other. Along a second direction Y, the first side wall 13 and the second side wall 14 are located between the top wall 12 and the bottom cover 2. The surface of the top shell 1 facing away from the receiving groove a is provided with heat dissipation fins 11. The heat dissipation fins 11 are located on the first side wall 13, the top wall 12, and the second side wall 14. Multiple heat dissipation fins 11 are arranged sequentially at intervals along a third direction Z. The first direction X, the second direction Y, and the third direction Z are mutually perpendicular.
[0021] The power supply device 1000 provided in this embodiment has a receiving groove a on the top shell 1. A first power device 5, which is the main heat-generating component on the circuit board 3, is located in the receiving groove a. The receiving groove a is sealed by the bottom cover 2. A thermally conductive material M is filled in the gap between the circuit board 3 and the top shell 1 and the bottom cover 2. The thermally conductive material M transfers the heat of the components in the receiving groove a to the top shell 1 and also helps to prevent external dust from contacting the components in the receiving groove a. Furthermore, the top shell 1 is provided with heat dissipation fins 11 for heat dissipation. The heat dissipation fins 11 are distributed on the first side wall 13, the top wall 12, and the second side wall 14. The heat dissipation fins 11 have a large surface area, which helps to further improve the heat dissipation effect. Compared with the traditional air-cooled and water-cooled heat dissipation solutions of power supply devices 1000, the power supply device 1000 provided in this embodiment meets the heat dissipation requirements while having a lower cost and helps to reduce the problem of external dust entering the casing and causing component failure.
[0022] In some implementations, the heat dissipation fins 11 are continuously distributed on the first sidewall 13, the top wall 12, and the second sidewall 14.
[0023] In some embodiments, the thermally conductive material M is a thermally conductive potting compound.
[0024] In some embodiments, the top shell 1 and the bottom cover 2 are made of metal.
[0025] In some embodiments, the top shell 1 and the bottom cover 2 are made of aluminum alloy material, among others.
[0026] Please see Figure 4 In some embodiments, the thickness d1 of the heat dissipation fins 11 gradually decreases along the direction from the bottom cover 2 to the top wall 12. Here, the thickness d1 is the length dimension of the heat dissipation fins 11 in the third direction Z. By setting the thickness d1 of the heat dissipation fins 11 to gradually decrease along the direction from the bottom cover 2 to the top wall 12, compared with the uniform thickness of the heat dissipation fins 11 along the direction from the bottom cover 2 to the top wall 12, when the same number of heat dissipation fins 11 are set in the same space, the part of the heat dissipation fins 11 located on the top wall 12 has a smaller thickness, and the cross-section of the heat dissipation channel 11 between adjacent heat dissipation fins 11 located on the top wall 12 is larger. When using natural convection for heat dissipation, it is beneficial to improve the heat exchange effect between the part of the heat dissipation fins 11 located on the top wall 12 and the air. In addition, the part of the heat dissipation fins 11 located on the first side wall 13 and the second side wall 14 retains a larger thickness than the part of the heat dissipation fins 11 located on the top wall 12, which is beneficial to increase the contact area with the first side wall 13 and the second side wall 14 and accelerate the absorption of heat from the first side wall 13 and the second side wall 14.
[0027] In some embodiments, along the direction from the bottom cover to the top wall, the thickness of the starting end of the heat dissipation fins on the top wall is d1, and the thickness of the ending end of the heat dissipation fins on the top wall is d2, where 0.5 ≤ d2 / d1 ≤ 0.7. Setting the ratio between the thickness d2 of the ending end of the heat dissipation fin 11 and the thickness d1 of the starting end of the heat dissipation fin 11 to be greater than or equal to 0.5 helps to reduce the problem of increased thermal resistance and decreased heat dissipation efficiency due to an excessively large difference between d1 and d2, resulting in a small cross-sectional area for the heat conduction path and difficulty in transferring heat to the ending end of the heat dissipation fin 11. It also helps to ensure that the ending end of the heat dissipation fin 11 has sufficient mechanical strength. Setting the ratio between the thickness d2 of the ending end of the heat dissipation fin 11 and the thickness d1 of the starting end of the heat dissipation fin 11 to be less than or equal to 0.7 helps to improve the heat dissipation effect of heat dissipation at the ending end of the heat dissipation fin 11 after heat absorption at the starting end of the heat dissipation fin 11.
[0028] Please see Figure 3 , Figure 5 and Figure 6 In some embodiments, the power supply device 1000 includes a first heat sink 4, and a first sidewall 13 includes a first portion 131 and a second portion 132 connected together. The thickness d2 of the first portion 131 is greater than the thickness d3 of the second portion 132. The first heat sink 4 abuts against the surface of the first portion 131 located in the receiving groove a, and the housing of the first power device 5 abuts against the surface of the first heat sink 4 facing away from the first portion 131. By setting the first sidewall 13 to have a thickness d2 of the first portion 131 greater than the thickness d3 of the second portion 132, and by having the first heat sink 4 abut against the first portion 131, the thicker first portion 131 has a higher heat capacity. When absorbing heat from the first power device 5, this helps to reduce the problem of the first power device 5 failing due to a sudden temperature rise. The thinner second portion 132 helps to reduce weight and material usage, thereby reducing costs.
[0029] In some embodiments, the first heat sink 4 includes a first surface and a second surface disposed opposite to each other along a first direction X. Along the direction from the second sidewall 14 to the first sidewall 13, the first surface is attached to the surface of the first sidewall 13 facing the second sidewall 14. Along the direction from the first sidewall 13 to the second sidewall 14, the housing of the first power device 5 is attached to the second surface.
[0030] In some embodiments, a thermally conductive layer is provided between the first power device 5 and the first heat sink 4, and the thermally conductive layer is made of a thermal interface material. In some embodiments, the thermal interface material is thermally conductive silicone grease.
[0031] In some embodiments, the first heat sink 4 is screwed to the first sidewall 13.
[0032] In some embodiments, the circuit board 3 is provided with a second power device 7, the power supply device 1000 includes a second heat sink 6, and the second sidewall 14 includes a third portion 141 and a fourth portion 142 connected to each other. The thickness d4 of the third portion 141 is greater than the thickness d5 of the fourth portion 142. The second heat sink 6 abuts against the surface of the third portion 141 located in the receiving groove a, and the housing of the second power device 7 abuts against the surface of the second heat sink 6 facing away from the third portion 141. By setting the second sidewall 14 so that the thickness d4 of the third portion 141 is greater than the thickness d5 of the fourth portion 142, and the second heat sink 6 abuts against the third portion 141, the thicker third portion 141 has a higher heat capacity. When absorbing heat from the second power device 7, it is beneficial to delay the problem of the second power device 7 failing due to a sudden temperature rise. The thinner fourth portion 142 is beneficial to reduce weight and material to reduce costs. On the other hand, the first power device 5 and the second power device 7 are respectively provided on the first sidewall 13 and the second sidewall 14. Compared with concentrating the power devices in the same area, it is beneficial to disperse the heat source and reduce the problem of local overheating.
[0033] In some embodiments, the second heat sink 6 includes a third surface and a fourth surface disposed opposite to each other along a first direction X. Along the direction from the first sidewall 13 to the second sidewall 14, the third surface is attached to the surface of the second sidewall 14 facing the first sidewall 13. Along the direction from the first sidewall 13 to the second sidewall 14, the housing of the second power device 7 is attached to the fourth surface.
[0034] In some embodiments, a thermally conductive layer is provided between the second power device 7 and the second heat sink 6, and the thermally conductive layer is made of a thermal interface material. In some embodiments, the thermal interface material is thermally conductive silicone grease.
[0035] In some embodiments, the second heat sink 6 is screwed to the second sidewall 14.
[0036] It is understandable that the first power device 5 and the second power device 7 can be selected according to actual needs. The first power device 5 and the second power device 7 can be the same or different types of power devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) or insulated-gate bipolar transistors (IGBTs).
[0037] In some embodiments, along the direction Z from the bottom cover 2 to the top wall 12, the circuit board 3 is disposed opposite to the top wall 12, and the power supply device 1000 includes an inductor 8 and a transformer 9. The first power device 5, the second power device 7, the inductor 8 and the transformer 9 are disposed on the side of the circuit board 3 facing away from the top wall 12.
[0038] Please see Figure 3 , Figure 7 and Figure 8In some embodiments, the top shell 1 includes a third sidewall 15 and a fourth sidewall 16 disposed opposite each other along a third direction Z, the third sidewall 15 and the fourth sidewall 16 being connected between the top wall 12 and the bottom cover 2.
[0039] In some embodiments, the top shell 1 is integrally formed using a high-pressure die-casting process.
[0040] In some embodiments, the third sidewall 15 is provided with a mounting hole 151, which penetrates the third sidewall 15. The power supply device 1000 also includes a sealing plug 10 and a connecting cable (not shown). The sealing plug 10 is disposed in the mounting hole 151 and has a wire-passing hole 101. A sealing layer 102 is provided inside the wire-passing hole 101. Along the axial direction of the mounting hole 151, the thickness of the sealing layer 102 is less than the depth of the wire-passing hole 101. The sealing layer 102 is made of a flexible material, and the connecting cable passes through the sealing layer 102. Before wire passing through, the sealing layer 102 seals the wire-passing hole 101. During wire passing, the cable pierces the sealing layer 102 and passes through it. By providing a sealing layer 102 inside the wire-passing hole 101, the sealing effect between the cable and the sealing plug 10 is improved.
[0041] In some embodiments, the sealing plug 10 and the sealing layer 102 are made of, but are not limited to, silicone.
[0042] In some embodiments, the sealing plug 10 is provided with a mounting groove 103, which surrounds the sealing plug 10, and the periphery of the mounting hole 151 is engaged in the mounting groove 103.
[0043] Please see Figure 5 In some embodiments, conductive foam (not shown) is provided on the surface of the bottom cover 2 facing the circuit board 3. The conductive foam is used to perform electromagnetic shielding. By adding conductive foam to the surface of the bottom cover 2 facing the circuit board 3, the electromagnetic shielding performance can be improved, and the thickness of the bottom cover 2 can be appropriately reduced, which is beneficial for weight reduction and production cost reduction.
[0044] In some embodiments, the surface of the top shell is covered with a ceramic layer, which improves corrosion resistance while also providing good heat dissipation efficiency.
[0045] In some embodiments, the ceramic layer is formed by micro-arc oxidation, and the thickness of the ceramic layer is 20-30 μm.
[0046] Based on the same inventive concept, this application also provides an electrical device, including the power supply device 1000 in any of the above embodiments.
[0047] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A power supply device, characterized in that, include: Bottom cover; The circuit board is equipped with a first power device; The top shell has a receiving groove for accommodating the circuit board, and the top shell is connected to the bottom cover so that the bottom cover seals the receiving groove. Thermally conductive material is used to fill the gap between the circuit board and the top and bottom covers. The top shell includes a top wall, a first side wall, and a second side wall. Along a first direction, the first side wall and the second side wall are arranged opposite to each other. Along a second direction, the first side wall and the second side wall are located between the top wall and the bottom cover. The surface of the top shell facing away from the receiving groove is provided with heat dissipation fins. The heat dissipation fins are located on the first side wall, the top wall, and the second side wall. There are multiple heat dissipation fins, and the multiple heat dissipation fins are arranged sequentially at intervals along a third direction. The first direction, the second direction, and the third direction are all perpendicular to each other.
2. The power supply device according to claim 1, characterized in that, The thickness of the heat dissipation fins gradually decreases along the direction from the bottom cover to the top wall.
3. The power supply device according to claim 2, characterized in that, Along the direction from the bottom cover to the top wall, the thickness of the starting end of the heat dissipation fins located on the top wall is d1, and the thickness of the ending end of the heat dissipation fins located on the top wall is d2, where 0.5≤d2 / d1≤0.
7.
4. The power supply device according to claim 1, characterized in that, The power supply device includes a first heat sink, the first sidewall includes a first part and a second part connected to each other, the thickness of the first part is greater than the thickness of the second part, the first heat sink abuts against the surface of the first part located in the receiving groove, and the housing of the first power device abuts against the surface of the first heat sink facing away from the first part. And / or, The circuit board is provided with a second power device, the power supply device includes a second heat sink, the second sidewall includes a third part and a fourth part connected to each other, the thickness of the third part is greater than the thickness of the fourth part, the second heat sink abuts against the surface of the third part located in the receiving groove, and the housing of the second power device abuts against the surface of the second heat sink facing away from the third part.
5. The power supply device according to claim 4, characterized in that, A thermally conductive layer is provided between the first power device and the first heat sink, and the thermally conductive layer is made of a thermal interface material; and / or A thermally conductive layer is provided between the second power device and the second heat sink, and the thermally conductive layer is made of a thermal interface material.
6. The power supply device according to claim 5, characterized in that, Along the direction from the bottom cover to the top wall, the circuit board is disposed opposite to the top wall, and the power supply device includes an inductor and a transformer. The first power device, the second power device, the inductor, and the transformer are disposed on the side of the circuit board facing away from the top wall.
7. The power supply device according to claim 1, characterized in that, The top shell includes a third sidewall and a fourth sidewall disposed opposite to each other along the third direction. The third sidewall and the fourth sidewall are connected between the top wall and the bottom cover. The third sidewall is provided with a mounting hole that extends through the second direction. The power device also includes a sealing plug and a connecting cable. The sealing plug is disposed in the mounting hole and has a wire through hole. A sealing layer is provided in the wire through hole. Along the axial direction of the mounting hole, the thickness of the sealing layer is less than the depth of the mounting hole. The sealing layer is made of a flexible material, and the connecting cable passes through the sealing layer.
8. The power supply device according to claim 7, characterized in that, The sealing plug is provided with a mounting groove, which surrounds the sealing plug, and the periphery of the mounting hole is engaged with the mounting groove.
9. The power supply device according to claim 1, characterized in that, The bottom cover has conductive foam on the surface facing the circuit board; and / or The surface of the top shell is covered with a ceramic layer.
10. An electrical appliance, characterized in that, Includes the power supply device as described in any one of claims 1-9.